TWI445614B - Mold and method of making optical microlens array using the same - Google Patents

Mold and method of making optical microlens array using the same Download PDF

Info

Publication number
TWI445614B
TWI445614B TW98119302A TW98119302A TWI445614B TW I445614 B TWI445614 B TW I445614B TW 98119302 A TW98119302 A TW 98119302A TW 98119302 A TW98119302 A TW 98119302A TW I445614 B TWI445614 B TW I445614B
Authority
TW
Taiwan
Prior art keywords
mark
micro
optical lens
lens array
manufacturing
Prior art date
Application number
TW98119302A
Other languages
Chinese (zh)
Other versions
TW201043429A (en
Inventor
Sei Ping Louh
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW98119302A priority Critical patent/TWI445614B/en
Publication of TW201043429A publication Critical patent/TW201043429A/en
Application granted granted Critical
Publication of TWI445614B publication Critical patent/TWI445614B/en

Links

Description

模仁以及微光學透鏡陣列之製造方法 Mould and manufacturing method of micro-optical lens array

本發明涉及光學元件之製造領域,尤其涉及一種用於壓印成型微光學透鏡陣列之模仁以及微光學透鏡陣列之製造方法。 The present invention relates to the field of manufacturing optical components, and more particularly to a mold for imprinting a micro-optical lens array and a method of fabricating the micro-optical lens array.

隨著光電產品之發展,微光學透鏡因為可在小面積產生光學效果,已成為光電產業需求甚廣之基礎元件。例如液晶顯示器之背光板即使用光學透鏡陣列,以達到使背光均勻化之效果。因此利用各種製程製造微光學元件之技術已經成為各界競相發展之技術。 With the development of optoelectronic products, micro-optical lenses have become the basic components of the optoelectronic industry because they can produce optical effects in a small area. For example, a backlight panel of a liquid crystal display uses an optical lens array to achieve an effect of uniformizing the backlight. Therefore, the technology of manufacturing micro-optical components by various processes has become a technology that has been developed in various fields.

目前,有不少製造微光學透鏡陣列之方法,其中,壓印成型微光學透鏡之方法一般是在一基板,例如矽晶圓上塗布成型材料,利用預先制做好之微光學透鏡模具壓於該成型材料之上,經過固化後在矽晶圓上形成微光學透鏡陣列。一般地,在壓印過程中都存在將模仁與矽晶圓對準之步驟,以提高產品之精確度與品質,例如,在模仁與矽晶圓上分別製造對準標記,然後將兩個對準標記對準即可。 At present, there are many methods for manufacturing micro-optical lens arrays, wherein the method of embossing a micro-optical lens is generally to apply a molding material on a substrate, such as a ruthenium wafer, and press it with a pre-made micro-optical lens mold. On top of the molding material, a micro-optical lens array is formed on the tantalum wafer after curing. Generally, in the imprint process, there are steps of aligning the mold core with the germanium wafer to improve the accuracy and quality of the product, for example, manufacturing alignment marks on the mold core and the germanium wafer, respectively, and then Just align the alignment marks.

惟,由於微光學透鏡模仁以及位於其上之對準標記通常係利用超精密加工技術製造得到,其線寬在100微米左右,而在矽晶圓上製造之標記係採用微影製程(lithography)製造,其尺寸可精確到1微米,因此兩個標記相差兩個數量級,導致微光學透鏡模 仁與矽晶圓無法精確對準;另外,在製造微光學透鏡時無法預知偏差到底有多大,只能在生產製造完畢之後根據矽晶圓上之產品分佈測算出製造時之位置偏差,繼而在下一次生產時將這種偏差考慮進去,以便盡可能將模仁與矽晶圓對準。但這種方法顯然帶來較高之次品率,產品之合格率難以到達量產之要求。 However, since the micro-optical lens mold and the alignment marks located thereon are usually manufactured by ultra-precision processing technology, the line width is about 100 μm, and the mark made on the germanium wafer is lithography. Manufactured, the size can be accurate to 1 micron, so the two marks differ by two orders of magnitude, resulting in a micro-optical lens mode Ren and 矽 wafers cannot be precisely aligned; in addition, when manufacturing micro-optical lenses, it is impossible to predict how large the deviation is. Only after the production is completed, the position deviation during manufacturing can be calculated according to the product distribution on the 矽 wafer, and then This deviation is taken into account in one production to align the mold and the wafer as much as possible. However, this method obviously brings a high defect rate, and the qualification rate of the product is difficult to reach the requirements of mass production.

有鑒於此,有必要提供一種壓印成型微光學透鏡陣列之模仁以及微光學透鏡陣列之製造方法。 In view of the above, it is necessary to provide a mold for an imprinted micro-optical lens array and a method of manufacturing the micro-optical lens array.

一種微光學透鏡陣列之製造方法,其包括以下步驟:提供一模仁,該模仁具有第一表面,該第一表面具有採用微影製程製作之第一標記,以及採用超精密加工方式製作之複製結構及第二標記;測得該第二標記相對該第一標記之偏移量;提供一基板,該基板具有一第二表面;於該第二表面採用微影製程製作第三標記,該第三標記在該第二表面之位置與該第一標記在該第一表面之位置相同;先將該第三標記與該第一標記對準;再根據該偏移量移動該基板以使該第三標記與該第二標記對準;於該複製結構所在區域或該基板上施加成型材料,並壓印成型該微光學透鏡陣列。 A method of manufacturing a micro-optical lens array, comprising the steps of: providing a mold core having a first surface having a first mark made by a lithography process and being fabricated by ultra-precision processing Copying the structure and the second mark; measuring an offset of the second mark from the first mark; providing a substrate having a second surface; and forming a third mark on the second surface by using a lithography process, The third mark is located at the second surface at the same position as the first mark at the first surface; the third mark is first aligned with the first mark; and the substrate is moved according to the offset to make the The third mark is aligned with the second mark; a molding material is applied to the area where the replication structure is located or the substrate, and the micro-optical lens array is embossed.

一種模仁,其具有第一表面,該第一表面具有採用微影製程製作之第一標記,以及採用超精密加工方式製作之模穴及第二標記。 A mold core having a first surface having a first mark made by a lithography process and a cavity and a second mark made by an ultra-precision process.

本發明提供之微光學透鏡陣列之製造方法在一模仁之表面製作兩種標記,這兩種標記之精確度不同,因此可以使基板上之對準標記與兩種標記逐次對準,以達到提高對準精確度之目的。本發明提供之模仁之表面具有兩種標記,這兩種標記之精確度不同,因此可以使基板上之對準標記與兩種標記逐次對準,以達到提高對 準精確度之目的。 The manufacturing method of the micro-optical lens array provided by the invention makes two kinds of marks on the surface of the mold core, and the precision of the two kinds of marks is different, so that the alignment marks on the substrate and the two marks can be sequentially aligned to improve For the purpose of alignment accuracy. The surface of the mold provided by the invention has two kinds of marks, and the precision of the two kinds of marks is different, so that the alignment mark on the substrate can be sequentially aligned with the two marks to achieve an improved pair. The purpose of quasi-accuracy.

10‧‧‧金屬板 10‧‧‧Metal plates

12‧‧‧第一表面 12‧‧‧ first surface

21‧‧‧第一標記 21‧‧‧ first mark

14‧‧‧模穴陣列 14‧‧‧ cavity array

140‧‧‧模穴 140‧‧‧ cavity

20‧‧‧模仁 20‧‧‧Men

22‧‧‧第二標記 22‧‧‧second mark

30‧‧‧基板 30‧‧‧Substrate

23‧‧‧第三標記 23‧‧‧ third mark

32‧‧‧第二表面 32‧‧‧second surface

50‧‧‧橫臂 50‧‧‧ cross arm

51‧‧‧橫線 51‧‧‧ horizontal line

43‧‧‧第三標記 43‧‧‧ third mark

60‧‧‧縱臂 60‧‧‧ longitudinal arm

61‧‧‧縱線 61‧‧‧ vertical line

70‧‧‧區域 70‧‧‧ area

圖1係本發明第一實施例提供之形成有第一標記之金屬板之俯視圖。 1 is a plan view of a metal plate formed with a first mark according to a first embodiment of the present invention.

圖2係圖1之金屬板進一步加工所形成之模仁之俯視圖。 Figure 2 is a top plan view of the mold core formed by further processing of the metal sheet of Figure 1.

圖3係本發明第一實施例提供之具有第三標記之基板之俯視圖。 3 is a plan view of a substrate having a third mark according to a first embodiment of the present invention.

圖4係本發明第一實施例提供之模仁與基板對準之效果圖。 4 is an effect diagram of alignment of a mold core with a substrate according to a first embodiment of the present invention.

圖5係本發明第二實施例提供之第三標記之放大示意圖。 Figure 5 is an enlarged schematic view showing a third mark provided by the second embodiment of the present invention.

下面將結合附圖對本發明作進一步詳細說明。 The invention will now be described in further detail with reference to the accompanying drawings.

請參閱圖1,本發明第一個製造微光學透鏡陣列之實施例首先提供一金屬板10。該金屬板10具有一個直徑為8吋之圓形第一表面12,在該第一表面12採用微影製程製作兩個第一標記21。每個第一標記21呈“十”字形,理論上第一標記21可以位於該第一表面12之任意一個位置,兩個第一標記21之相對位置關係也可以任意,惟,優選地,兩個第一標記21基本位於該第一表面12之中心,並且相對於該第一表面12之中心對稱設置,這樣的標記容易識別。 Referring to FIG. 1, the first embodiment of the present invention for fabricating a micro-optic lens array first provides a metal plate 10. The metal plate 10 has a circular first surface 12 having a diameter of 8 inches, and two first marks 21 are formed on the first surface 12 by a lithography process. Each of the first marks 21 has a "ten" shape. Theoretically, the first mark 21 can be located at any position of the first surface 12. The relative positional relationship between the two first marks 21 can also be arbitrary, but preferably, two. The first marks 21 are located substantially at the center of the first surface 12 and are symmetrically disposed with respect to the center of the first surface 12, such marks being easily identifiable.

優選地,將採用微影製程製作之第一標記21之線寬控制在10微米至30微米即可。 Preferably, the line width of the first mark 21 produced by the lithography process is controlled to be 10 micrometers to 30 micrometers.

當然,第一標記21之數量不限,除了本發明實施例所顯示之兩個,還可以係一個或者三個、四個等。 Of course, the number of the first marks 21 is not limited, and may be one or three, four, etc., in addition to the two shown in the embodiment of the present invention.

第一標記21之形狀也不限,例如還可以係三角形、正方形等,只要可以起到標記之作用,便於識別與對準即可。 The shape of the first mark 21 is not limited, and may be, for example, a triangle, a square, or the like, as long as it can function as a mark for easy identification and alignment.

該第一標記21在黃光室中採用微影製程製作。 The first mark 21 is fabricated in a yellow light chamber using a lithography process.

請參閱圖2,接下來,將該金屬板10置於超精密加工機臺上進行加工以在第一表面12上製作複製結構,例如模穴陣列14,該模穴陣列14包括多個模穴140,從而形成一模仁20。 Referring to FIG. 2, next, the metal plate 10 is placed on an ultra-precision processing machine for processing to form a replica structure on the first surface 12, such as a cavity array 14, which includes a plurality of cavity portions. 140, thereby forming a mold core 20.

複製結構還可以係凸起結構陣列。 The replication structure can also be an array of raised structures.

一般地,利用超精密加工機台可在直徑為8吋之金屬板10上製作上千個模穴140。 In general, thousands of cavities 140 can be fabricated on a metal plate 10 having a diameter of 8 turns using an ultra-precision processing machine.

在制做模穴陣列14之同時,也利用超精密加工機台制做第二標記22。為了便於對準,第二標記22之形狀與第一標記21之形狀及數量均相同,即,表面12設有兩個“十”字形標記。 At the same time as the cavity array 14 is fabricated, the second mark 22 is also fabricated using an ultra-precision processing machine. In order to facilitate alignment, the shape of the second mark 22 is the same as the shape and number of the first mark 21, that is, the surface 12 is provided with two "ten" shaped marks.

第二標記22與模穴陣列14之中心之相對位置關係與第一標記21與表面12之中心之相對位置關係相同。例如,如果每個第一標記21之中心距離第一表面12之中心為2毫米,則每個第二標記22之中心距離模穴陣列14之中心也相距2毫米。 The relative positional relationship between the second mark 22 and the center of the cavity array 14 is the same as the relative positional relationship between the first mark 21 and the center of the surface 12. For example, if the center of each of the first marks 21 is 2 mm from the center of the first surface 12, the center of each of the second marks 22 is also 2 mm apart from the center of the cavity array 14.

理想情況下,模穴陣列14之中心與第一表面12之中心重合,同樣地,第二標記22之中心與第一標記21之中心也應該重合,惟,由於超精密加工機台之精確度所限,模穴陣列14之中心與第一表面12之中心大致有十幾或者幾十微米之偏移量,這與第一標記21與第二標記22之間之偏移量相同。偏移量可以這樣測得:以一個標記之中心為原點製作坐標軸,計算出另一個標記之中心到該原點之距離;記錄該偏移量。 Ideally, the center of the cavity array 14 coincides with the center of the first surface 12, and likewise, the center of the second mark 22 and the center of the first mark 21 should coincide, however, due to the precision of the ultra-precision processing machine. The center of the cavity array 14 and the center of the first surface 12 are substantially offset by a factor of ten or tens of micrometers, which is the same as the offset between the first mark 21 and the second mark 22. The offset can be measured by making the coordinate axis from the center of one mark and calculating the distance from the center of the other mark to the origin; recording the offset.

請參閱圖3與圖4,在製造微光學透鏡陣列之前,還要準備基板30,基板30具有一個第二表面32,微光學透鏡陣列製作於該第二表面32。基板30可以係透明基板,例如矽晶圓。 Referring to FIGS. 3 and 4, prior to fabricating the micro-optic lens array, a substrate 30 is also prepared. The substrate 30 has a second surface 32 on which the micro-optical lens array is fabricated. The substrate 30 can be a transparent substrate, such as a germanium wafer.

一般地,在該第二表面32加工形成凹槽陣列以及間於凹槽之間之切割道(圖未示),該凹槽陣列用於確定微光學透鏡之成型位置,其應該與模仁上之模穴陣列對準,否則微光學透鏡可能會成型在預定位置之外,成為殘品或次品。 Generally, the second surface 32 is processed to form an array of grooves and a scribe line (not shown) between the grooves for determining the forming position of the micro-optical lens, which should be on the mold core. The array of holes is aligned, otherwise the micro-optical lens may be formed outside the predetermined position and become a defective or defective product.

基板30之尺寸與模仁10之第一表面12對應,也為8吋。 The size of the substrate 30 corresponds to the first surface 12 of the mold core 10 and is also 8 inches.

在第二表面32製作第三標記23。為方便對準,第三標記23之形狀以及數量與第二標記22、第一標記21之形狀、數量相同,即,第二表面32製作有兩個第三標記23。 A third mark 23 is made on the second surface 32. For convenience of alignment, the shape and number of the third marks 23 are the same as those of the second marks 22 and the first marks 21, that is, the second surface 32 is formed with two third marks 23.

與第一標記21一樣,第三標記23也係採用微影製程製程加工得到,並將其線寬控制在1微米左右,並且,製作時要將第三標記23與第一標記21對準,例如,可以將鐳射光從基板30之下方穿透,映射到模仁20之第三標記23,當鐳射光之光點與該第三標記23對準後,即可在基板30上之光點所在位置進行蝕刻。 Like the first mark 21, the third mark 23 is also obtained by a lithography process, and its line width is controlled to about 1 micrometer, and the third mark 23 is aligned with the first mark 21 during production. For example, the laser light can be penetrated from below the substrate 30 and mapped to the third mark 23 of the mold core 20. When the spot of the laser light is aligned with the third mark 23, the spot on the substrate 30 can be Etching at the location.

雖然第三標記23之精度在1微米左右,第一標記21之精度在10微米到30微米之間,但只相差一個數量級,因此可以實現較精確之對準。 Although the accuracy of the third mark 23 is about 1 micrometer, the accuracy of the first mark 21 is between 10 micrometers and 30 micrometers, but only one order of magnitude difference, so that a more precise alignment can be achieved.

然後,再依照先前記錄之第二標記22相對於第一標記21之偏移量,將該第三標記23移動相同之偏移量,使得該第三標記23與第二標記22對準。這種對準,可以使位於基板上之第三標記23先與第一標記21、第二標記22逐次對準,因此可以達到提高對準精確度 之目的。 Then, according to the previously recorded offset of the second mark 22 relative to the first mark 21, the third mark 23 is moved by the same offset so that the third mark 23 is aligned with the second mark 22. This alignment enables the third mark 23 on the substrate to be sequentially aligned with the first mark 21 and the second mark 22, thereby improving alignment accuracy. The purpose.

將上述基板30與模仁20對準後,便可在模仁20或基板30上塗布成型材料,然後用模仁20壓印成型材料以製造微光學透鏡陣列。 After the substrate 30 is aligned with the mold core 20, a molding material can be applied to the mold core 20 or the substrate 30, and then the molding material is embossed with the mold core 20 to fabricate a micro-optical lens array.

請參閱圖5,本發明第二實施例提供之位於基板(圖未示)之表面之第三標記43包括相互垂直之橫臂50與縱臂60,橫臂50包括多條相互平行之橫線51,縱臂60包括多條相互平行之縱線61,相當於第三標記43由多個交叉之“十”字組成,而且,橫線51與縱線61之線寬為1微米,且每兩條相鄰之橫線51之間距為1微米,每兩條相鄰之縱線61之間距為1微米。在本實施例中,橫線51與縱線61各有5條,則每一臂之臂寬在9微米左右。 Referring to FIG. 5, a third mark 43 on the surface of the substrate (not shown) according to the second embodiment of the present invention includes a cross arm 50 and a trailing arm 60 which are perpendicular to each other, and the cross arm 50 includes a plurality of horizontal lines parallel to each other. 51, the trailing arm 60 includes a plurality of longitudinal lines 61 which are parallel to each other, and the third mark 43 is composed of a plurality of intersecting "ten" characters, and the line width of the horizontal line 51 and the vertical line 61 is 1 micrometer, and each The distance between two adjacent horizontal lines 51 is 1 micrometer, and the distance between each two adjacent vertical lines 61 is 1 micrometer. In the present embodiment, there are five horizontal lines 51 and one vertical line 61, and the arm width of each arm is about 9 micrometers.

將第三標記43設計成這種結構之好處在於:既沒有改變其精確度又擴展了其在各個臂之長度,使得第三標記43之每一方向之寬度擴展到10微米左右,以與線寬在10微米到30微米之間之第一標記21之對準,這種對準之結果將更精確。 The advantage of designing the third indicia 43 in such a configuration is that it does not change its accuracy and extends its length in each arm so that the width of each direction of the third indicia 43 is extended to about 10 microns to match the line. With the alignment of the first mark 21 between 10 microns and 30 microns wide, the result of this alignment will be more accurate.

再將第三標記43移動已知之偏移量,使其與第二標記22對準。如此,對準精度被控制在1微米左右。然後,便可進行後續之塗布成型材料及壓印成型透鏡陣列工序。 The third indicia 43 is then moved a known offset to align it with the second indicia 22. Thus, the alignment accuracy is controlled to about 1 micrometer. Then, the subsequent coating molding material and the embossed lens array process can be performed.

優選地,該橫臂50之中心區域及該縱臂60之中心區域,也即該橫臂50與縱臂60相互交叉之區域70留白,即,不進行蝕刻,從而減少對透明晶圓之加工時間,而且由於內部為空,更容易使其與第二標記對準。 Preferably, the central region of the cross arm 50 and the central region of the trailing arm 60, that is, the region 70 where the cross arm 50 and the trailing arm 60 intersect each other are left white, that is, no etching is performed, thereby reducing the transparent wafer. Processing time, and because the interior is empty, it is easier to align it with the second mark.

當然,區域70也可以被蝕刻,即,分佈有縱橫交叉之蝕刻線。 Of course, the region 70 can also be etched, i.e., etched lines with vertical and horizontal crossings.

21‧‧‧第一標記 21‧‧‧ first mark

22‧‧‧第二標記 22‧‧‧second mark

23‧‧‧第三標記 23‧‧‧ third mark

Claims (10)

一種微光學透鏡陣列之製造方法,其包括以下步驟:提供一模仁,該模仁具有第一表面,該第一表面具有採用微影製程製作之第一標記,以及採用超精密加工方式製作之複製結構及第二標記;測得該第二標記相對該第一標記之偏移量;提供一基板,該基板具有一第二表面;於該第二表面採用微影製程製作第三標記,該第三標記在該第二表面之位置與該第一標記在該第一表面之位置相同;先將該第三標記與該第一標記對準;再根據該偏移量移動該基板以使該第三標記與該第二標記對準;於該複製結構所在區域或該基板上施加成型材料,並壓印成型該微光學透鏡陣列。 A method of manufacturing a micro-optical lens array, comprising the steps of: providing a mold core having a first surface having a first mark made by a lithography process and being fabricated by ultra-precision processing Copying the structure and the second mark; measuring an offset of the second mark from the first mark; providing a substrate having a second surface; and forming a third mark on the second surface by using a lithography process, The third mark is located at the second surface at the same position as the first mark at the first surface; the third mark is first aligned with the first mark; and the substrate is moved according to the offset to make the The third mark is aligned with the second mark; a molding material is applied to the area where the replication structure is located or the substrate, and the micro-optical lens array is embossed. 如申請專利範圍第1項所述之微光學透鏡陣列之製造方法,其中:先於該第一表面製作該第一標記,再於該第一表面製作該第二標記。 The method of manufacturing a micro-optical lens array according to claim 1, wherein the first mark is formed before the first surface, and the second mark is formed on the first surface. 如申請專利範圍第1項所述之微光學透鏡陣列之製造方法,其中:該第一標記、該第二標記與該第三標記均係“十”字形標記。 The method for manufacturing a micro-optical lens array according to claim 1, wherein the first mark, the second mark and the third mark are both "ten" shaped marks. 如申請專利範圍第1項至第3項中任一項所述之微光學透鏡陣列之製造方法,其中:該第一標記之線寬小於30微米大於10微米,該第三標記之線寬為1微米。 The method for manufacturing a micro-optical lens array according to any one of claims 1 to 3, wherein the line width of the first mark is less than 30 μm and greater than 10 μm, and the line width of the third mark is 1 micron. 如申請專利範圍第1項所述之微光學透鏡陣列之製造方法,其中:該第三標記包括相互垂直之橫臂與縱臂,每條橫臂包括多條橫線,每條縱臂包括多條縱線,該多條縱線相互平行且間距為1微米,該多條橫線相互平行且間距為1微米。 The manufacturing method of the micro-optical lens array of claim 1, wherein the third mark comprises a cross arm and a trailing arm perpendicular to each other, each cross arm comprising a plurality of horizontal lines, each of the trailing arms comprising a plurality of The longitudinal lines are parallel to each other and have a pitch of 1 micrometer, and the plurality of horizontal lines are parallel to each other with a pitch of 1 micrometer. 如申請專利範圍第5項所述之微光學透鏡陣列之製造方法,其中:該縱線與該橫線相交之區域留白。 The method of manufacturing a micro-optical lens array according to claim 5, wherein the region where the vertical line intersects the horizontal line is left white. 如申請專利範圍第1項所述之微光學透鏡陣列之製造方法,其中:該第一標記在黃光室中採用微影製程製作。 The method for manufacturing a micro-optical lens array according to claim 1, wherein the first mark is produced by a lithography process in a yellow light chamber. 一種模仁,其改良在於:該模仁具有第一表面,該第一表面具有採用微影製程製作之第一標記,以及採用超精密加工方式製作之複製結構及第二標記,兩個該第一標記相對於該第一表面之中心對稱設置,該第二標記之形狀及數量與該第一標記之形狀及數量均相同,該第一表面上还包括由多個模穴形成的模穴陣列,該第二標記與該模穴陣列之中心之相對位置關係與第一標記與第一表面之中心之相對位置關係相同。 A mold core, the improvement comprising: the mold core having a first surface, the first surface having a first mark made by a lithography process, and a copy structure and a second mark produced by an ultra-precision machining method, two of the a mark is symmetrically disposed with respect to a center of the first surface, the second mark has the same shape and number as the first mark, and the first surface further includes a cavity array formed by a plurality of cavity The relative positional relationship between the second mark and the center of the cavity array is the same as the relative positional relationship between the first mark and the center of the first surface. 如申請專利範圍第8項所述之模仁,其中:該第一標記之線寬小於30微米大於10微米。 The mold core of claim 8, wherein the first mark has a line width of less than 30 microns and greater than 10 microns. 如申請專利範圍第8項所述之模仁,其中:該第一標記與該第二標記均為“十”字形標記。 The mold core according to claim 8, wherein the first mark and the second mark are both "ten" shaped marks.
TW98119302A 2009-06-10 2009-06-10 Mold and method of making optical microlens array using the same TWI445614B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98119302A TWI445614B (en) 2009-06-10 2009-06-10 Mold and method of making optical microlens array using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98119302A TWI445614B (en) 2009-06-10 2009-06-10 Mold and method of making optical microlens array using the same

Publications (2)

Publication Number Publication Date
TW201043429A TW201043429A (en) 2010-12-16
TWI445614B true TWI445614B (en) 2014-07-21

Family

ID=45000930

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98119302A TWI445614B (en) 2009-06-10 2009-06-10 Mold and method of making optical microlens array using the same

Country Status (1)

Country Link
TW (1) TWI445614B (en)

Also Published As

Publication number Publication date
TW201043429A (en) 2010-12-16

Similar Documents

Publication Publication Date Title
US11460768B2 (en) Pattern formation method, lithography apparatus, lithography system, and article manufacturing method
JP5759195B2 (en) Mold, imprint method and article manufacturing method
CN104170055B (en) Imprinting apparatus, mould, method for stamping and the method manufacturing article
JP5404140B2 (en) Template and semiconductor device manufacturing method
TWI413176B (en) Alignment for edge field nano-imprinting
TWI411521B (en) Imprint apparatus and method of manufacturing article
CN104160477B (en) Method for stamping, imprinting apparatus and use its article manufacturing method
KR101470959B1 (en) Method for manufacturing microstructure, and microstructured die
JP2017204539A (en) Position detector, position detection method, imprint device and manufacturing method of article
CN104122746A (en) Imprint method, imprint apparatus, and method of manufacturing article
TW201404567A (en) Wafer lens, shaping mold for wafer lens, and production method for wafer lens
JP6326916B2 (en) Imprint mold and imprint method
TWI445614B (en) Mold and method of making optical microlens array using the same
JP2003195008A (en) Double-sided microlens array and method of manufacturing the same
CN101900842B (en) Mold core and manufacturing method of micro-optical lens array
TW201609355A (en) Imprint mold, imprint method, wire grid polarizer, and method of manufacturing same
TW201937550A (en) Imprint method, imprint device, mold manufacturing method, and article manufacturing method
JP2011098443A (en) Mold roll for shaped film and method for manufacturing the shaped film using the same
KR102311479B1 (en) Imprinting mold and imprinting method
TWI404624B (en) Molding device for wafer level optical lens and aligning method thereof
JP2022165200A (en) Method for manufacturing imprint mold and template, and drawing system
JP2020177979A (en) Mold manufacturing method, and manufacturing method of goods
JP2017034276A (en) Mold for imprint and imprint method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees