TWI441961B - Hydrophobic conduction appliance with coating chromium carbide ceramic electroplating layer and manufacturing method thereof - Google Patents

Hydrophobic conduction appliance with coating chromium carbide ceramic electroplating layer and manufacturing method thereof Download PDF

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TWI441961B
TWI441961B TW101137377A TW101137377A TWI441961B TW I441961 B TWI441961 B TW I441961B TW 101137377 A TW101137377 A TW 101137377A TW 101137377 A TW101137377 A TW 101137377A TW I441961 B TWI441961 B TW I441961B
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chromium
plating layer
based cermet
chromium carbide
plating
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TW201414883A (en
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Chen En Lu
Ming Der Ger
Ching Yuan Bai
Chun Chieh Tseng
Yen Wei Peng
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Chang Yi Chen
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披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工 具及其製作方法 Hydrophobic conductor coated with chromium carbide-based cermet plating And its making method

本發明為有關於一種披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具及其製作方法,係利用三價鉻電鍍方法將碳化鉻基金屬陶瓷披覆在工具的表面,以供為疏水性導電工具使用,如醫療用電燒手術刀或電池的極板。 The present invention relates to a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer and a method for fabricating the same, which is a method for coating a chromium carbide-based cermet on a surface of a tool by using a trivalent chromium plating method for hydrophobicity. Use of conductive tools, such as medical electrosurgical scalpels or battery plates.

碳化鉻基金屬陶瓷化合物(chromium carbide ceramic or chromium carbide ceramic)具有優良的機械強度與化學穩定性,其有高硬度、高熔點、耐腐蝕性佳之特性,如日本專利JP2010248595揭露在底材上披覆一層45-55wt.%碳化鉻與30-40wt.%鈷(Co)可在1000℃的使用條件下仍能有良好的耐磨性(wear resistance);日本專利JP2003155538揭露碳化矽可用於極硬的模具或如日本專利JP60264332、JP2005231932揭露碳化矽可用於光學玻璃的模仁(mold core)等;因此碳化鉻基金屬陶瓷化合物主要用來當作複合材料的強化媒介與腐蝕環境中的保護層。 The chromium carbide ceramic or chromium carbide ceramic has excellent mechanical strength and chemical stability, and has high hardness, high melting point, and good corrosion resistance, and is disclosed on the substrate as disclosed in Japanese Patent No. JP2010248595. A layer of 45-55wt.% chromium carbide and 30-40wt.% cobalt (Co) can still have good wear resistance under the use condition of 1000 ° C; Japanese Patent JP2003155538 discloses that tantalum carbide can be used for extremely hard A mold or a mold core which can be used for an optical glass, such as a ruthenium carbide, is disclosed in Japanese Patent No. JP 60264332 and JP2005231932; therefore, a chromium carbide-based cermet compound is mainly used as a reinforcing medium for a composite material and a protective layer in a corrosive environment.

習知先前技術可應用於製備碳化鉻層方法,包含有濕式法與乾式法,乾式法如電漿輔助化學沉積 法、氣相沉積法、高能量微弧技術、高溫碳化、低溫碳化、物理氣相沉積(PVD)、粉浴等方法;台灣專利TW I350220、PCT申請號JP00/01342(中國申請號CN00800144.8)或中國專利申請號CN200610068500.4揭露在切削刀具或模具膠結或燒結成碳化鉻粒子,可顯著延長了工模具的使用壽命;台灣專利TW I297365揭露利用碳化鉻粉末材料對工具以濺鍍方式產生含碳化鉻基合金材料;台灣專利公開號TW200523219公開技術於玻璃模造的模仁上披覆包含碳化鉻陶瓷層之多層膜模仁;台灣專利公開號TW200719986採用射頻濺鍍方法沈積碳化鉻等類鑽碳膜,以製作高硬度與高耐磨性、良好之抗腐蝕性、低摩擦係數及長使用壽命的模具;美國專利US5960762使用氣相沉積法(chemical vapor deposition,CVD)以形成碳化鉻(Cr-C)表層;這些以乾式法製備之碳化鉻層,碳化鉻分佈均勻、耐蝕性與耐磨性優異,然而這些方法皆難避免製程技術複雜、設備昂貴或高溫高耗能等缺點,且因Cr-C表層的導電性不佳,不能用於疏水性導電工具。 The prior art can be applied to a method for preparing a chromium carbide layer, including a wet method and a dry method, and a dry method such as plasma-assisted chemical deposition. Method, vapor deposition method, high energy micro-arc technology, high temperature carbonization, low temperature carbonization, physical vapor deposition (PVD), powder bath, etc.; Taiwan patent TW I350220, PCT application number JP00/01342 (China application number CN00800144.8 Or Chinese patent application number CN200610068500.4 discloses that the cutting tool or mold is cemented or sintered into chromium carbide particles, which can significantly extend the service life of the tooling; Taiwan Patent TW I297365 discloses the use of chromium carbide powder material to produce tools by sputtering. Chromium-containing chromium-based alloy material; Taiwan Patent Publication No. TW200523219 discloses a multilayer film mold comprising a chromium carbide ceramic layer on a glass molded mold core; Taiwan Patent Publication No. TW200719986 uses a radio frequency sputtering method to deposit chromium carbide and the like Carbon film for making molds with high hardness and high wear resistance, good corrosion resistance, low friction coefficient and long service life; US Patent No. 5,960,762 uses chemical vapor deposition (CVD) to form chromium carbide (Cr) -C) surface layer; these chromium carbide layers prepared by the dry method have uniform distribution of chromium carbide, excellent corrosion resistance and wear resistance, but these are Process techniques are difficult to avoid complicated, expensive equipment or high-temperature high energy consumption and other shortcomings, and Cr-C due to the conductive surface layer is poor, not the hydrophobic conductive tool.

有別於乾式法,濕式法主要是以電鍍的方法,在工件表面電鍍一層Cr-C層,如日本專利JP59178155在鑄造模具上以六價鉻電鍍方法披覆碳化鉻層以增加模具的耐磨。但傳統之電鍍鉻主要使 用六價鉻(Cr6+)的鉻酸,鉻酸毒性很大(大約是三價鉻的100倍以上),是一種很嚴重的致癌物,以六價鉻鍍鉻後所產生的廢水、生成物在自然界中不能自然降解與排除,在空氣中或飲用水中含六價鉻濃度超過限值時,會造成鼻中隔膜穿孔、嘔吐、侵害腸道和腎臟,且在生物體內會聚積,具有很長的危害潛伏期。世界各國政府均對六價鉻電鍍制定了相關的法律法規,逐步限制六價鉻的使用並降低其排放量。但三價鉻(Cr3+)電鍍毒性低,在裝飾性和功能性上皆可與六價鉻電鍍層媲美。因此,以三價鉻電鍍作為替代傳統六價鉻電鍍,無論是工業應用或環境保護方面,皆具有優勢。 Different from the dry method, the wet method mainly uses a plating method to plate a layer of Cr-C on the surface of the workpiece. For example, Japanese patent JP59178155 coats the chromium carbide layer with a hexavalent chromium plating method on the casting mold to increase the resistance of the mold. mill. However, the traditional electroplating chrome mainly uses hexavalent chromium (Cr 6+ ) chromic acid, which is very toxic (about 100 times more than trivalent chromium). It is a very serious carcinogen. After chrome plating with hexavalent chromium The generated wastewater and products cannot be naturally degraded and eliminated in nature. When the concentration of hexavalent chromium in the air or drinking water exceeds the limit, it will cause perforation of the diaphragm in the nose, vomiting, damage to the intestines and kidneys, and in the organism. It accumulates in the body and has a long incubation period. Governments around the world have enacted relevant laws and regulations on hexavalent chromium plating to gradually limit the use of hexavalent chromium and reduce its emissions. However, trivalent chromium (Cr 3+ ) plating has low toxicity and is comparable to hexavalent chromium plating in both decorative and functional properties. Therefore, the use of trivalent chromium plating as an alternative to traditional hexavalent chromium plating has advantages in both industrial applications and environmental protection.

由於三價鉻電鍍之毒性遠低於六價鉻電鍍,為目前工業界積極開發的方向,如,王玉琴(Yu-Qin Wang)與曹淑紅(Shu-Hong Cao)於電鍍與環保期刊2005年25卷3期,提出「甲酸-甲醇-尿素體系三價鉻鍍鉻工藝的研究(A Study of Formic Acid-Methanol-Urea Trivalent Chromium Plating System)」以甲酸-甲醇-尿素為添加劑之三價鉻溶液電鍍鉻的方法,可改善三價鉻電鍍鉻電鍍層之燒灼現象,可逐漸取代六價鉻的電鍍;又如台灣專利公開號TW200911699使用鹼性的三價鉻電鍍形成氫氧化鉻電鍍層。 Since the toxicity of trivalent chromium plating is much lower than that of hexavalent chromium plating, it is the direction actively developed by the industry today, such as Yu-Qin Wang and Shu-Hong Cao in Electroplating and Environmental Protection Journal 2005 25 In the third phase, the "A Study of Formic Acid-Methanol-Urea Trivalent Chromium Plating System" was proposed to electroplate chromium with a trivalent chromium solution with formic acid-methanol-urea as an additive. The method can improve the cauterization phenomenon of the trivalent chromium electroplated chromium plating layer, and can gradually replace the electroplating of hexavalent chromium; and, as disclosed in Taiwan Patent Publication No. TW200911699, an alkaline chromium trioxide plating layer is used to form a chromium hydroxide plating layer.

如中國專利公開號200810142997.9揭露在含氯 化鉻之三價鉻鍍液中,添加奈米碳管(carbon nanotube,CNT),利用電鍍方法可製備出厚度大於50μm、表面平整、結合性牢固的鉻-奈米碳管的複合電鍍層;日本專利JP04115421則使用碳化鉻加入於電鍍浴中,使碳化鉻與金屬共沉積於被鍍金屬表面;劉育瑋所著:三價鉻-碳合金電鍍層之研究,2005年,係使用電鍍方法形成碳合金電鍍層;又如S.C.Kwona,M.Kima,S.U.Parka,D.Y.Kima,D.Kima,K.S.Nama,Y.Choib於Surface and Coatings Technology Volume 183,Issues 2-3,2004年提出論文:"Characterization of intermediate Cr-C layer fabricated by electrodeposition in hexavalent and trivalent chromium baths",使用27.5A/dm2的電流密度與甲酸為添加劑,雖可電鍍成長出非晶態微結構(amorphous type microstructure)之Cr23C6與Cr7C3碳化鉻層;但前述的先前技術成長出的碳化鉻層,其碳元素之含量太低,約5~8At%(原子數比例atomic percent),導電性不佳,也難以應用於導電要求的導電工具。 For example, Chinese Patent Publication No. 200810142997.9 discloses the addition of a carbon nanotube (CNT) to a chromium chloride-containing trivalent chromium plating solution, and a chromium having a thickness of more than 50 μm, a flat surface, and a strong bond can be prepared by electroplating. - Composite plating of carbon nanotubes; Japanese patent JP04115421 uses chromium carbide to be added to the electroplating bath to co-deposit chromium carbide and metal on the surface of the metal to be plated; Liu Yuxi: Study on the plating of trivalent chromium-carbon alloy In 2005, electroplating was used to form a carbon alloy plating layer; for example, SCKwona, M. Kima, SU Parka, DYKima, D. Kima, KSNama, Y. Choib in Surface and Coatings Technology Volume 183, Issues 2-3, 2004 Presented the paper: "Characterization of intermediate Cr-C layer fabricated by electrodeposition in hexavalent and trivalent chromium baths", using a current density of 27.5 A/dm 2 and formic acid as an additive, although electroplating can grow amorphous microstructure (amorphous type microstructure ) of Cr 23 C 6 and Cr 7 C 3 chromium carbide layer; however, the prior art growing out of the chromium carbide layer, the content of carbon is too low, about 5 ~ 8At% ( Ratio of the number of sub-atomic percent), poor conductivity, it is difficult to be applied to the conductive means a conductive requirements.

導電工具可應用於各種防靜電工具、焊接用的噴嘴、電池電極、電極貼片、醫學工具中的牙醫工具或手術刀等,如日本專利JP2006-000521將碳化鉻材料應用於醫學用途。若使用在醫學的電燒手術刀(Electrosurgical instrument、electrocautery),要達 到組織切割(cutting)、凝血(coagulation)、乾燥(desiccating)、電灼(fulgurating)、生物相容性(biocompatibility)等功能,如第1圖,乃是利用電流產生器92產生100KHz至10MHz無線電波頻率(Radio Frequency,RF)之電流(或採用射頻治療(RF ablation,RFA))時,使用頻率40KHz~1250KHz),經由主電纜線94及電燒手術刀95進入人體,並藉由回流護片92與回流電纜線91產生迴路,電燒手術刀95經人體組織內之阻抗(body impedance)產生高熱,進而破壞組織,達到切割和凝血的目的。另外一種運用係用於電灼,電灼類似射頻治療RFA,是利用電流使加熱器(heater)產生熱能,通過可導熱的手術刀直接將熱傳導到周圍的組織,將組織加熱而燒灼;如中國專利申請號200920190181.3及200710133601.X公開使用導電的手術刀,可對人體內部器官進行切除以及對出血器官進行止血的功能。然而習知技術之電燒手術刀95在表面常披覆鐵弗龍(或含氟的碳氫化合物,fluorinated hydrocarbons)、氮化鉻薄膜(CrN、Cr2N)等,其中,鐵弗龍有釋放含氟毒性氣體的問題,而一般氮化鉻薄膜以CrN為主,但CrN表面接觸角為78°屬親水性質,容易在切割組織時產生沾黏;而Cr2N薄膜其較接近疏水性,其表面接觸角約為101°,但Cr2N薄膜不容易產生。因鐵弗龍、氮化鉻薄膜的導電性 不佳,在使用於電燒手術刀上有其限制。美國專利US5801110揭露使用乾式法之電漿噴塗法(plasma spraying)將碳化鉻陶瓷噴塗於牙醫或手術工具(dental and surgical instruments)上,增加夾持力(gripping ability)與耐磨,但仍因噴塗用的碳化鉻陶瓷,其製造方法相當昂貴、產率低,且表面緻密度不足、導電性及疏水性不佳,而有使用的限制。 The conductive tool can be applied to various antistatic tools, nozzles for welding, battery electrodes, electrode patches, dental tools or scalpels in medical tools, and the like, such as Japanese Patent JP2006-000521, which uses chromium carbide materials for medical purposes. If you use a medical electrosurgical scalpel (Electrosurgical instrument, electrocautery), to achieve tissue cutting, coagulation, desiccating, fulgurating, biocompatibility and other functions, As shown in Fig. 1, when the current generator 92 is used to generate a radio frequency (Radio Frequency, RF) of 100 kHz to 10 MHz (or RF ablation (RFA)), the frequency is 40 kHz to 1250 kHz. The cable 94 and the electrosurgical scalpel 95 enter the human body, and a circuit is generated by the returning guard 92 and the return cable 91. The electrosurgical scalpel 95 generates high heat through the body impedance in the human tissue, thereby destroying the tissue. The purpose of cutting and coagulation. Another application is for electrocautery, electrocautery, similar to RF treatment RFA, which uses electric current to generate heat from a heater. The heat can be directly transmitted to the surrounding tissue through a heat-conductive scalpel, and the tissue is heated and cauterized; Patent Application Nos. 200920190181.3 and 200710133601.X disclose the use of an electrically conductive scalpel for resection of internal organs of the human body and for hemostasis of bleeding organs. However, the electrosurgical scalpel 95 of the prior art is often coated with Teflon (or fluorinated hydrocarbons), a chromium nitride film (CrN, Cr 2 N), etc., among which Teflon has The problem of fluorine-containing toxic gas is released, while the general chromium nitride film is mainly CrN, but the surface contact angle of CrN is 78°, which is hydrophilic, and it is easy to cause sticking when cutting tissue; while the Cr 2 N film is closer to hydrophobicity. The surface contact angle is about 101°, but the Cr 2 N film is not easily produced. Due to the poor conductivity of Teflon and Chromium Nitride films, there are limitations on the use of electrosurgical scalpels. U.S. Patent No. 5,801,110 discloses the use of a dry method for spraying a chromium carbide ceramic onto a dental or surgical instrument to increase the gripping ability and wear resistance, but still due to spraying. The chromium carbide ceramic used is relatively expensive to manufacture, has a low yield, and has insufficient surface density, poor electrical conductivity and hydrophobicity, and has limitations in use.

又在電極材料(contact electrode material)應用方面,如台灣專利TWI372484揭露使用三價鉻鈍化皮膜的燃料電池雙極板,但由於鈍化皮膜雖可使燃料電池雙極板具有導電性,但鈍化皮膜緻密性不足耐腐蝕程度尚不佳;由於碳化鉻材料具有導電及耐腐蝕的特性,如早期的歐洲專利EPO0227973使用熱擴散方法(vacuum interrupter)將250μm將碳化鉻材料滲入多孔的基材中以應用於電極;美國公開專利US 20070117003使用電子束蒸鍍法(electron beam evaporation)將碳化物附著於不鏽鋼板上製成具有導電性、穩定及疏水性的電極,以應用於燃料電池雙極板;但這些乾式製造方法的設備昂貴、需要加高溫、基材受高溫會產生變形等不便。2011年沈詩瑜所著之”以三價鉻電鍍於燃料電池金屬雙極板之研究”所公開的論文摘要揭露使用三價鉻電鍍方法,及2011年謝宇軒所著之”電鍍鉻-碳合金於燃料電池雙極板之機制研究”所公開的論文摘要亦 揭露使用三價鉻電鍍方法,在金屬材料表面電鍍一層鉻碳鍍層,以增加電池雙極板的抗蝕性,但對於雙極板的疏水性特性上仍未解決。 In the application of contact electrode material, for example, Taiwan patent TWI372484 discloses a fuel cell bipolar plate using a trivalent chromium passivation film, but since the passivation film can make the fuel cell bipolar plate conductive, the passivation film is dense. Insufficient corrosion resistance is not good; due to the conductive and corrosion-resistant properties of chromium carbide materials, as in the earlier European patent EPO0227973, a 250 μm chromium carbide material was infiltrated into a porous substrate using a vacuum interrupter. Electrode; US Published Patent US 20070117003 uses electron beam evaporation to attach carbides to stainless steel plates to produce conductive, stable and hydrophobic electrodes for use in fuel cell bipolar plates; The dry manufacturing method is expensive, requires high temperature, and the substrate is deformed by high temperature. The abstract of the paper published by Shen Shiyu in "Study on Trivalent Chromium Electroplating on Fuel Cell Metal Bipolar Plates" in 2011 reveals the use of trivalent chromium plating method, and in 2011, Xie Yuxuan's "Electroplating Chromium-Carbon Alloy for Fuel" Abstract of the published papers on the mechanism of battery bipolar plates It is disclosed that a chromium-carbon plating layer is plated on the surface of a metal material by using a trivalent chromium plating method to increase the corrosion resistance of the battery bipolar plate, but the hydrophobic properties of the bipolar plate are still unresolved.

由於乾式法製作疏水性導電工具係採用高溫製程,除因高溫容易造成回火而破壞工具本身硬度外,乾式法的製作成本高、無法製成高含碳量的導電層與高疏水性的Cr-C層,緻密性較低致工具底材容易溶出,造成生物相容性差等缺點。因此如何以電鍍的濕式法製成高碳含量之疏水性導電工具碳化鉻電鍍層,除具有良好的表面硬度、耐磨、耐腐蝕外,更使其具有導電性(導熱性)且具有疏水性,以應用在疏水性導電工具,此為急迫需要解決的課題。 Because the dry method produces a hydrophobic conductive tool using a high temperature process, in addition to tempering due to high temperature and damaging the hardness of the tool itself, the dry method is expensive to manufacture, and it is impossible to produce a high carbon content conductive layer and a highly hydrophobic Cr. -C layer, the lower compactness causes the tool substrate to be easily dissolved, resulting in poor biocompatibility. Therefore, how to make a high-carbon content hydrophobic conductive tool chromium carbide plating layer by electroplating wet method, in addition to having good surface hardness, wear resistance and corrosion resistance, it has conductivity (thermal conductivity) and is hydrophobic. Sexuality to apply to hydrophobic conductive tools, this is an urgent problem to be solved.

有鑑於上述習知技藝之問題,本發明主要目的為提供一種披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具,該疏水性導電工具包含一工具基材及披覆於該工具基材表層之一碳化鉻基金屬陶瓷電鍍層;該工具基材可為該疏水性導電工具的一部份,例如在疏水性導電工具的工具面或切割面做為電鍍碳化鉻基金屬陶瓷層的工具基材;該工具基材之材料可選自於下列二個群組之一或其組合:(1)導電材質群組:導電陶瓷、鐵、不鏽鋼、銅、鉻、鎳、銀、金或其合金之一或其組合;(2)不導電材質群組:塑 膠、陶瓷、玻璃之一或其組合以電鍍或無電鍍披覆一導電層,該導電層為選自於鐵、銅、鉻、鎳、銀、金或其合金;例如該工具基材為導電材質時,可使用鐵、不鏽鋼、銅、鉻、鎳、銀、金或其合金,也可使用導電陶瓷為該工具基材;若該工具基材為不導電材質如塑膠、陶瓷、玻璃之一或其組合,則在工具基材表面以電鍍或無電鍍披覆一導電層,如披覆一層鐵、銅、鉻、鎳、銀、金或其合金(例如使用無電電鍍鎳),不為所限;該碳化鉻基金屬陶瓷電鍍層係由鉻元素與碳元素所組成,係為非晶相結構以電鍍方式附著在該工具基材的表面,其組成至少包括六碳化二十三鉻(Cr23C6)、二碳化三鉻(Cr3C2)或三碳化七鉻(Cr7C3)之一或其組合;為使披覆碳化鉻基金屬陶瓷電鍍層之疏工具基材具有疏水性及導電性,該碳化鉻基金屬陶瓷電鍍層碳元素之含量範圍為大於15At%;在導電性方面,其比電阻為100mΩ.mm2/m(含)以下(以下比電阻單位簡寫為mΩ),在疏水性方面,在25℃其純水之接觸角大於94度小於120度。 In view of the above problems in the prior art, the main object of the present invention is to provide a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer, the hydrophobic conductive tool comprising a tool substrate and a surface layer coated on the tool substrate a chromium carbide-based cermet plating layer; the tool substrate may be part of the hydrophobic conductive tool, for example, a tool base or a cut surface of a hydrophobic conductive tool as a tool base for plating a chromium carbide-based cermet layer The material of the tool substrate may be selected from one of the following two groups or a combination thereof: (1) conductive material group: conductive ceramic, iron, stainless steel, copper, chromium, nickel, silver, gold or alloy thereof One or a combination thereof; (2) a group of non-conductive materials: one of plastic, ceramic, glass or a combination thereof is coated with a conductive layer by electroplating or electroless plating, the conductive layer being selected from the group consisting of iron, copper, chromium, nickel , silver, gold or alloy thereof; for example, when the tool substrate is a conductive material, iron, stainless steel, copper, chromium, nickel, silver, gold or an alloy thereof may be used, or a conductive ceramic may be used as the tool substrate; Tool substrate is non-conductive material One of plastic, ceramic, glass or a combination thereof is coated with a conductive layer on the surface of the tool substrate by electroplating or electroless plating, such as a layer of iron, copper, chromium, nickel, silver, gold or alloy thereof (for example, using no Electroplating nickel) is not limited; the chromium carbide-based cermet plating layer is composed of chromium element and carbon element, and is an amorphous phase structure which is electroplated to the surface of the tool substrate, and the composition thereof includes at least One or a combination of six carbon trioxide (Cr 23 C 6 ), three carbon trichrome (Cr 3 C 2 ) or three carbonized seven chromium (Cr 7 C 3 ); for plating chromium carbide-based cermet The layer of the tool substrate has hydrophobicity and electrical conductivity. The chromium carbide-based cermet plating layer has a carbon content of more than 15 At%; in terms of conductivity, the specific resistance is 100 mΩ. Below mm 2 /m (inclusive) (hereinafter the specific resistance unit is abbreviated as mΩ), in terms of hydrophobicity, the contact angle of pure water at 25 ° C is greater than 94 degrees and less than 120 degrees.

碳化鉻基金屬陶瓷電鍍層的厚度可由電鍍的時間進行選擇,用以控制不同的導電性、硬度及耐腐蝕性。對於精密的疏水性導電工具的應用,其平均厚度範圍可選擇在0.5μm至15μm之間。 The thickness of the chromium carbide-based cermet plating layer can be selected by the plating time to control different conductivity, hardness and corrosion resistance. For precision hydrophobic conductive tools, the average thickness range can be selected from 0.5 μm to 15 μm.

更進一步,對於非限制性的應用上,該披覆碳 化鉻基金屬陶瓷電鍍層之疏水性導電工具,更具有耐腐蝕性,其線性極化腐蝕電流在1×10-5安培以下;或更具有表面硬度而耐磨,其表面硬度為1500Hv以上。 Further, for non-limiting applications, the hydrophobic conductive tool coated with the chromium carbide-based cermet plating layer is more corrosion resistant, and its linear polarization corrosion current is below 1×10 -5 amps; or It has surface hardness and wear resistance, and its surface hardness is 1500Hv or more.

本發明再一主要目的就為在提供一種以電化學製成披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具的方法,解決昔知技術之Cr-C工具導電性不佳及疏水性不佳等問題。包含下列步驟:S1:提供一工具基材,該工具基材包含有一導電層;若該工具基材為導電材質則具有該導電層,若該工具基材為不導電(如非金屬)則於該工具基材表面以無電鍍或電鍍一層導電層或披覆一層導電層;在實際應用時,該工具基材即為待電鍍的疏水性導電工具或其一部份;S2:配置三價鉻電鍍液,該三價鉻電鍍液係包含:三價鉻鹽、螯合劑及添加劑所形成之水溶液;先將三價鉻鹽溶於水中,再加入螯合劑及添加劑;其中,三價鉻鹽可選用硫酸系三價鉻鹽、氯酸系三價鉻鹽其一;其中,該硫酸系三價鉻鹽係為三價鉻(Cr+3)與硫酸根(SO4 -2)形成的化合物,如硫酸鉻(Cr2(SO4)3);該氯酸系三價鉻鹽係三價鉻(Cr+3)與氯離子(Cl-)、過氯酸離子(ClO4 -)兩者之一或其組合形成的化合物,如氯化鉻(CrCl3.6H2O)、過氯酸鉻 (Cr(ClO4)3);該螯合劑係可選用有機酸及其鹽類;該添加劑係選用無機酸或其銨鹽類之一或其組合;該三價鉻電鍍液之三價鉻(Cr+3)與碳元素之每升莫耳比值為1:5至1:40之間;S3:以電鍍方式,將該工具基材置為陰極,並浸入於三價鉻電鍍液中;於一電鍍溫度條件與一電流密度條件下進行電鍍,於進行該電鍍時,係同時攪拌該三價鉻電鍍液;經預定時間後,於該工具基材的導電層表面上形成一碳化鉻基金屬陶瓷電鍍層;所形成之碳化鉻基金屬陶瓷電鍍層係至少由鉻元素與碳元素所組成,係為非晶相結構,其中碳元素之含量範圍為15At%以上、其比電阻為100mΩ(含)以下使其具有良好的導電性、在25℃其純水之接觸角大於94度使其具有良好的疏水性。 A further main object of the present invention is to provide a method for electrochemically forming a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer, which solves the problem that the prior art Cr-C tool has poor conductivity and hydrophobicity. Good question. The method comprises the following steps: S1: providing a tool substrate, the tool substrate comprises a conductive layer; if the tool substrate is a conductive material, the conductive layer is provided, if the tool substrate is non-conductive (such as non-metal) The surface of the tool substrate is electrolessly plated or plated with a conductive layer or coated with a conductive layer; in practical applications, the tool substrate is a hydrophobic conductive tool to be plated or a part thereof; S2: configuration of trivalent chromium The electroplating solution, the trivalent chromium plating solution comprises: an aqueous solution formed by a trivalent chromium salt, a chelating agent and an additive; the trivalent chromium salt is first dissolved in water, and then a chelating agent and an additive are added; wherein the trivalent chromium salt can be The sulfuric acid trivalent chromium salt and the chloric acid trivalent chromium salt are selected, wherein the sulfuric acid trivalent chromium salt is a compound formed by trivalent chromium (Cr +3 ) and sulfate (SO 4 -2 ). Such as chromium sulfate (Cr 2 (SO 4 ) 3 ); the chloric acid trivalent chromium salt is trivalent chromium (Cr +3 ) and chloride ion (Cl - ), perchloric acid ion (ClO 4 - ) or a combination thereof of a compound, such as chromium (CrCl 3 .6H 2 O) chloride, chromium perchlorate, chromium (Cr (ClO 4) 3) ; the chelating agent based optional Organic acids and salts thereof; the additive is selected one of an inorganic acid or ammonium salts or combinations thereof; mole per liter, the ratio of trivalent chromium plating solution of trivalent chromium (Cr +3) to carbon element ratio of 1 : between 5 and 1:40; S3: electroplating, the tool substrate is placed as a cathode, and immersed in a trivalent chromium plating solution; electroplating is performed under a plating temperature condition and a current density condition. In the electroplating, the trivalent chromium plating solution is simultaneously stirred; after a predetermined time, a chromium carbide-based cermet plating layer is formed on the surface of the conductive layer of the tool substrate; and the formed chromium carbide-based cermet plating layer is formed. It consists of at least chromium and carbon, and is an amorphous phase structure in which the content of carbon is in the range of 15 At% or more, and its specific resistance is 100 mΩ or less, which makes it have good electrical conductivity and is pure at 25 ° C. The contact angle of water is greater than 94 degrees to make it have good hydrophobicity.

又,在步驟S3中,該電流密度條件範圍為10A/dm2至30A/dm2之間;其中,該電鍍溫度條件為操作設定溫度為50℃以下,且電鍍溫度條件為所設定溫度之±3℃以內。其中,碳化鉻基金屬陶瓷電鍍層之碳元素之含量係以原子數比例At%(atomic percent)依據下列方程式所計算, Moreover, in step S3, the current density condition ranges from 10 A/dm 2 to 30 A/dm 2 ; wherein the plating temperature condition is an operation set temperature of 50 ° C or less, and the plating temperature condition is ± of the set temperature Within 3 °C. The carbon element content of the chromium carbide-based cermet plating layer is calculated according to the following equation by the atomic ratio At% (atomic percent).

其中,NC為單位體積中碳化鉻基金屬陶瓷電鍍層之碳元素原子數,Ntot為單位體積中碳化鉻基金屬陶瓷電鍍層之總原子數。 Wherein, N C is the number of carbon atoms of the chromium carbide-based cermet plating layer per unit volume, and N tot is the total atomic number of the chromium carbide-based cermet plating layer per unit volume.

更進一步,若欲獲得機械性能與耐蝕力更佳的披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具,可再進行消除應力步驟,如下:S4:將電鍍形成之碳化鉻基金屬陶瓷電鍍層的工具基材置入一烘箱中,以一消除應力溫度條件進行烘烤;其中該消除應力溫度條件為180℃(含)以上。 Furthermore, if a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer having better mechanical properties and corrosion resistance is obtained, the stress relieving step can be further performed as follows: S4: Plating of a chromium carbide-based cermet formed by electroplating The tool substrate of the layer is placed in an oven and baked at a stress-free temperature condition; wherein the stress-relieving temperature condition is 180 ° C or more.

更進一步,若欲增加表面硬度並提高耐磨性(wear resistance),可於S3步驟或S4步驟後,再進行表面硬化處理步驟,如下:S5:將S3步驟或S4步驟完成的該碳化鉻基金屬陶瓷電鍍層之工具基材置入一火燄爐中,以外焰端1200℃以上的火燄於該碳化鉻基金屬陶瓷電鍍層加熱至少0.5秒。 Further, if it is desired to increase the surface hardness and improve the wear resistance, the surface hardening treatment step may be performed after the step S3 or the step S4, as follows: S5: the chromium carbide base completed in the step S3 or the step S4 The tool substrate of the cermet plating layer is placed in a flame furnace, and a flame of 1200 ° C or higher at the outer flame end is heated on the chromium carbide-based cermet plating layer for at least 0.5 second.

更進一步,該碳化鉻基金屬陶瓷電鍍層之特性可為下列之一或其組合:電鍍層可極薄平均厚度範圍為0.5μm(含)~15μm(含),不影響工具基材工件的機械尺寸;其具有良好的耐蝕特性,線性極化腐蝕 電流在1×10-5安培以下;其具有極佳的硬度與耐磨性(wear resistance),經表面硬化處理後,表面硬度為1500Hv以上。 Further, the characteristics of the chromium carbide-based cermet plating layer may be one or a combination of the following: the plating layer can be extremely thin and the average thickness ranges from 0.5 μm (inclusive) to 15 μm (inclusive), and does not affect the mechanical mechanism of the tool substrate workpiece. Size; it has good corrosion resistance, linear polarization corrosion current is below 1 × 10 -5 amps; it has excellent hardness and wear resistance, after surface hardening, the surface hardness is above 1500Hv.

更進一步,若添加劑係選自於下列添加劑群組之一或其組合:(1)鹵素銨鹽、(2)硼酸及其鹽類,且該三價鉻電鍍液之三價鉻(Cr+3)與碳元素之每升莫耳比值為1:1至1:20之間;則可提高該碳化鉻基金屬陶瓷電鍍層之碳元素之含量範圍使其大於32At%,除其比電阻為100mΩ(含)以下具有良好導電性、其線性極化腐蝕電流為1×10-5安培以下,具有良好的耐腐蝕特性外,可進一步提高其接觸角使其接觸角大於120度,達到超疏水性的特性。 Further, if the additive is selected from one or a combination of the following additive groups: (1) a halogen ammonium salt, (2) a boric acid and a salt thereof, and the trivalent chromium plating solution of the trivalent chromium (Cr +3) ) The ratio of the molar ratio per liter of carbon element is between 1:1 and 1:20; the content of the carbon element of the chromium carbide-based cermet plating layer is increased to be greater than 32 At%, except that the specific resistance is 100 mΩ. (Inclusive) The following has good electrical conductivity, its linear polarization corrosion current is 1×10 -5 ampere or less, and has good corrosion resistance. The contact angle can be further increased to make the contact angle greater than 120 degrees, achieving superhydrophobicity. Characteristics.

承上所述,依本發明之一種披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具及其製作方法,其可具有一或多個下述優點: According to the present invention, a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer according to the present invention and a method for fabricating the same can have one or more of the following advantages:

(1)本發明的披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具可在工具表面形成高含碳量的碳化鉻基金屬陶瓷電鍍層,藉由高含碳量提高電鍍層的導電性與耐蝕性,可改善昔知技術的缺點,以用於導電需求的工具上。再者,本發明的披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具更具有良好的疏水性,且無高溫變質或釋出有機物質或毒物的缺點;又,本發明的披覆碳化鉻基金屬陶瓷電鍍層之 疏水性導電工具除具有導電性外,更具有高耐腐蝕性與耐磨性;可更提高其接觸角達到超疏水性的特性且具有優良的生物相容性,以適用於醫學手術用的工具,如醫療用電燒手術刀用於切割人體組織,可避免器材表面組織的沾黏;或應用於牙科的工具,可避免鑽磨切割器材表面發生組織的沾黏。。 (1) The hydrophobic conductive tool coated with the chromium carbide-based cermet plating layer of the present invention can form a high carbon content chromium carbide-based cermet plating layer on the surface of the tool, and improve the conductivity of the plating layer by high carbon content With corrosion resistance, the shortcomings of the prior art can be improved for tools for electrical conductivity requirements. Furthermore, the hydrophobic conductive tool coated with the chromium carbide-based cermet plating layer of the present invention has better hydrophobicity and has no disadvantage of high temperature deterioration or release of organic substances or poisons; further, the coated chromium carbide of the present invention Base cermet plating In addition to being electrically conductive, the hydrophobic conductive tool has high corrosion resistance and wear resistance; it can improve the contact angle to achieve superhydrophobicity and has excellent biocompatibility for medical surgical tools. For example, medical electric scalpels are used to cut human tissue to avoid sticking of the surface of the device; or tools used in dentistry can avoid tissue sticking on the surface of the drilling and cutting equipment. .

(2)本發明的披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具的製作方法,具有良好的導電性、疏水性及耐腐蝕特性,可適合應用於電池的極板或燃料電池的雙極板;又本發明的披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具的工具基材可使用金屬材質或非金屬材質,更可適用多種需要耐腐蝕、耐磨、可導電、疏水性、生物相容性的工具。 (2) The method for preparing a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer of the present invention has good conductivity, hydrophobicity and corrosion resistance, and can be suitably applied to a battery plate or a fuel cell. The tool substrate of the hydrophobic conductive tool coated with the chromium carbide-based cermet plating layer of the invention can be made of metal material or non-metal material, and can be applied to various requirements requiring corrosion resistance, wear resistance, conductivity, and hydrophobicity. , biocompatible tools.

(3)本發明的披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具的製作方法,係採用三價鉻電鍍,其毒性遠低於六價鉻,可減少環境的負擔,為潔淨的電鍍方法。 (3) The method for preparing the hydrophobic conductive tool coated with the chromium carbide-based cermet plating layer of the present invention is a trivalent chromium plating, which is much less toxic than hexavalent chromium, and can reduce the environmental burden for clean plating. method.

(4)本發明的披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具的製作方法可藉由三價鉻電鍍液的組成與操作條件,可控制碳化鉻基金屬陶瓷電鍍層的膜厚、碳元素比例等,以提供工具基材(被鍍工件)不同的機械性能、疏水性與導電性等,可應用於不同需求的領域。 (4) The method for fabricating a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer of the present invention can control the film thickness of the chromium carbide-based cermet plating layer by the composition and operating conditions of the trivalent chromium plating solution, Carbon ratio, etc., to provide different mechanical properties, hydrophobicity, and electrical conductivity of the tool substrate (the workpiece to be plated), and can be applied to various fields of demand.

(5)本發明的披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具的製作方法可進一步藉由消除應力或增加表面硬度的後處理步驟,可進一步增強疏水性導電工具的碳化鉻基金屬陶瓷電鍍層機械性能,更可應用於高精密的機械工件或模具等。 (5) The method for fabricating the hydrophobic conductive tool of the coated chromium carbide-based cermet plating layer of the present invention can further enhance the chromium carbide-based metal of the hydrophobic conductive tool by further eliminating the stress or increasing the surface hardness of the post-treatment step The mechanical properties of ceramic plating can be applied to high-precision mechanical parts or molds.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式及實施例的詳細說明中,將可清楚的呈現。 The above and other technical contents, features and advantages of the present invention will be apparent from the following description of the drawings and the appended claims.

參閱第2圖,為本發明披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具用於醫學用的手術工具之示意圖;圖中,電燒手術刀11包含手術刀柄11及手術刀刃12,手術刀刃12係利用本發明披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具所製成,係在工具基材121先披覆一層導電層1212,再於導電層1212表面以電鍍覆蓋一層碳化鉻基金屬陶瓷電鍍層122,碳化鉻基金屬陶瓷電鍍層122成分分析如第5圖,係由碳元素1222與鉻元素1221形成非晶相的Cr-C結構。 2 is a schematic view of a surgical tool for medical use of a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer; in the figure, the electrosurgical scalpel 11 includes a surgical blade 11 and a surgical blade 12, The scalpel blade 12 is made of a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer according to the present invention. The tool substrate 121 is first coated with a conductive layer 1212, and then the surface of the conductive layer 1212 is covered with a layer of carbonization. The composition of the chromium-based cermet plating layer 122 and the chromium carbide-based cermet plating layer 122 is as shown in Fig. 5, which is a Cr-C structure in which an amorphous phase is formed by the carbon element 1222 and the chromium element 1221.

參閱第3圖,本發明披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具製作方法之示意圖,係主要利用電化學反應的特點,將工具基材121置為陰 極,工具基材121包含有導電層1212,若該工具基材1211為金屬則具有導電層1212,若該工具基材121為非金屬則於該工具基材1121表面以無電鍍或披覆一導電層1212,在實際應用時,該工具基材1121即為待電鍍的工件;在工具基材1121之導電層1212表面,使三價鉻電鍍液中的螯合劑之碳離子在電場之電化學反應與鉻離子在陰極表面上發生鉻-碳之還原成核反應,而因工具基材121與三價鉻電鍍液之間存在的微小間隙內,三價鉻電鍍液濃度差會產生鉻-碳的擴散作用,使鉻-碳會自然地生長,而形成碳化鉻基金屬陶瓷電鍍層122。陰極化學反應式為:[Cr(H 2 O)6]3++XCOOH → [Cr(H 2 O)5 COOH]2++X -+H 2 O Referring to FIG. 3, a schematic diagram of a method for fabricating a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer according to the present invention mainly utilizes the characteristics of an electrochemical reaction, and the tool substrate 121 is placed as a cathode, and the tool substrate 121 includes The conductive layer 1212 has a conductive layer 1212 if the tool substrate 1211 is metal. If the tool substrate 121 is non-metal, the conductive substrate 1212 is electrolessly plated or coated on the surface of the tool substrate 1121. The tool substrate 1121 is the workpiece to be electroplated; on the surface of the conductive layer 1212 of the tool substrate 1121, the electrochemical reaction of the carbon ions of the chelating agent in the trivalent chromium plating solution with the chromium ions on the cathode surface A chromium-carbon reduction nucleation reaction occurs, and due to the small gap existing between the tool substrate 121 and the trivalent chromium plating solution, the concentration difference of the trivalent chromium plating solution generates a chromium-carbon diffusion effect, so that the chromium-carbon will Naturally grown, a chromium carbide-based cermet plating layer 122 is formed. The cathodic chemical reaction formula is: [C r ( H 2 O ) 6 ] 3+ + XCOOH → [ Cr ( H 2 O ) 5 COOH ] 2+ + X - + H 2 O

[Cr(H 2 O)5 COOH]2+ → [Cr(H 2 O)4 COOH]2++H 2 O [ Cr ( H 2 O ) 5 COOH ] 2+ → [ Cr ( H 2 O ) 4 COOH ] 2+ + H 2 O

[Cr(H 2 O)4 COOH]2++e - → [Cr(H 2 O)4 COOH]+Cr (S) [ Cr ( H 2 O ) 4 COOH ] 2+ + e - → [ Cr ( H 2 O ) 4 COOH ] +Cr ( S )

COOH -HCHOCH 3 OHCOC (S) COOH -HCHOCH 3 OHCOC ( S )

本發明以下實施例使用的工具基材1可使用具有導電性的金屬材料工具基材1121、導電陶瓷工具基材1121,或披覆有導電層1212的非金屬工具基材1121等,不為所限。在後續的實施例為利於瞭解,係使用銅質工具基材(包含鋼鐵材料的工件,在工件的表面電鍍銅)或玻璃工具基材(在玻璃製的工件的表面先以無電鍍一層鎳,做為披覆的導電層)。 陽極可採用碳板或高電位的鈍性金屬板等所製成(如鈦合金、金、鉑等),以下實施例係使用鉑材料為陽極,此為實施例採行的方式之一,但不為所限。 The tool substrate 1 used in the following embodiments of the present invention may use a conductive metal material tool substrate 1121, a conductive ceramic tool substrate 1121, or a non-metal tool substrate 1121 coated with a conductive layer 1212, etc. limit. In the subsequent examples, it is useful to understand that a copper tool substrate (a workpiece containing a steel material, a copper plated on the surface of the workpiece) or a glass tool substrate (on the surface of the glass workpiece, an electroless nickel layer, As a conductive layer for covering). The anode may be made of a carbon plate or a high-potential passive metal plate (such as titanium alloy, gold, platinum, etc.), and the following examples use a platinum material as an anode, which is one of the modes adopted by the embodiment, but Not limited.

本發明之形成碳化鉻基金屬陶瓷電鍍層的三價鉻電鍍液係包含:三價鉻鹽、螯合劑及添加劑所形成之水溶液;三價鉻鹽的來源可為硫酸系三價鉻鹽或氯酸系三價鉻鹽之水溶性鹽;硫酸系三價鉻鹽如硫酸鉻、硫酸鉻銨、硫酸鉻鉀等之一或其組合,氯酸系三價鉻鹽如氯化鉻、過氯酸鉻等之一或其組合;不為所限。 The trivalent chromium plating solution for forming a chromium carbide-based cermet plating layer of the present invention comprises: an aqueous solution formed by a trivalent chromium salt, a chelating agent and an additive; and the source of the trivalent chromium salt may be a trivalent chromium salt of a sulfuric acid or a chlorine. a water-soluble salt of an acid-based trivalent chromium salt; a sulfuric acid-based trivalent chromium salt such as one of or a combination of chromium sulfate, ammonium sulfate, potassium sulfate, or the like, and a trivalent chromium salt such as chromium chloride or perchloric acid. One or a combination of chromium, etc.; not limited.

為進行三價鉻電鍍液的螯合作用及提供電鍍層的碳源,本發明之螯合劑可為可為甲酸(HCOOH)、乙酸(CH3COOH)或其鹽類,如甲酸、甲酸銨(HCOONH4)、甲酸鈉(HCOONa)、乙酸、乙酸銨(CH3COONH4)、乙酸鈉(CH3COONa)之一或其組合,添加螯合劑碳元素總量濃度為介於0.1M與5M之間;當提高螯合劑的相對濃度時,可增加碳化鉻基金屬陶瓷電鍍層的含碳量且可提高導電性。 For the chelation of the trivalent chromium plating solution and the carbon source for providing the plating layer, the chelating agent of the present invention may be formic acid (HCOOH), acetic acid (CH 3 COOH) or a salt thereof such as formic acid or ammonium formate ( HCOONH 4 ), sodium formate (HCOONa), acetic acid, ammonium acetate (CH 3 COONH 4 ), sodium acetate (CH 3 COONa) or a combination thereof, the total concentration of carbon added to the chelating agent is between 0.1M and 5M When the relative concentration of the chelating agent is increased, the carbon content of the chromium carbide-based cermet plating layer can be increased and the conductivity can be improved.

三價鉻電鍍液之添加劑係做為調整電鍍液的添加用途,通常可使用解離度較低的鹽類,使其兼具有緩衝劑(buffer agent)的功能,常用的添加劑為無機酸的鹽類、硫酸鹽類、硼酸(H3BO3)或其鹽類、鹵素鹽類等,如硼酸、硫酸銨((NH4)2SO4)、氯化銨 (NH4Cl)或溴化銨(NH4Br)之一或其組合,且添加劑之添加量濃度為介於0.1M與0.5M之間;當提高添加劑的相對濃度時,可提高碳化鉻基金屬陶瓷電鍍層的耐蝕性。 The additive of the trivalent chromium plating solution is used as an additive for adjusting the plating solution. Generally, a salt having a low degree of dissociation can be used to have a function as a buffer agent, and a commonly used additive is a salt of a mineral acid. Classes, sulfates, boric acid (H 3 BO 3 ) or salts thereof, halogen salts, etc., such as boric acid, ammonium sulfate ((NH 4 ) 2 SO 4 ), ammonium chloride (NH 4 Cl) or ammonium bromide One or a combination of (NH 4 Br), and the additive concentration of the additive is between 0.1 M and 0.5 M; when the relative concentration of the additive is increased, the corrosion resistance of the chromium carbide-based cermet plating layer can be improved.

由於許多商購的化合物可能滲雜有機化合物,將影響三價鉻電鍍液操作與維護上的困難,因此在三價鉻電鍍液中,為降低有機化合物的影響,可係採用有機化合物較少的硫酸鹽類、硼酸或硼酸鹽、氯鹽、溴鹽、銨鹽等;三價鉻電鍍液的配方如表一。 Since many commercially available compounds may be doped with organic compounds, which will affect the operation and maintenance of the trivalent chromium plating solution, in the trivalent chromium plating solution, in order to reduce the influence of the organic compound, it is possible to use less organic compounds. Sulfate, boric acid or borate, chloride salt, bromine salt, ammonium salt, etc.; the formulation of trivalent chromium plating solution is shown in Table 1.

以上濃度以M(mole/l)表示係以每升三價鉻電鍍液之該純物質之莫耳數為計算,其不含不純物之質量;以下皆同。 The above concentration is expressed by M (mole/l) as the molar number of the pure substance per liter of the trivalent chromium plating solution, which does not contain the mass of the impurity; the following are the same.

本發明之疏水性導電工具之碳化鉻基金屬陶瓷 電鍍層122,是由鉻元素1221與碳元素1222所組成,其中含有少量之氧元素或單純鉻元素,且鍍覆在一工具基材121(零件工件本體)之表面。本發明的方法及形成的碳化鉻基金屬陶瓷電鍍層122提供了很高的碳元素含量,改進昔知碳元素1222含量為最高約10At%的技藝。本發明的碳化鉻基金屬陶瓷電鍍層122的組成包括Cr23C6、Cr3C2或Cr7C3之一或其組合,其碳元素1222之含量範圍為15At%以上,又由於本發明之疏水性導電工具之碳化鉻基金屬陶瓷電鍍層122含碳量高,因此導電性良好,其比電阻為100mΩ(含)以下、在25℃其純水之接觸角大於94度、其線性極化腐蝕電流1×10-5安培以下;更具有導電性、耐蝕性、疏水性與耐磨性。 The chromium carbide-based cermet plating layer 122 of the hydrophobic conductive tool of the present invention is composed of a chromium element 1221 and a carbon element 1222, which contains a small amount of oxygen element or simple chromium element, and is plated on a tool substrate 121 ( The surface of the part workpiece. The method of the present invention and the formed chromium carbide-based cermet plating layer 122 provide a high carbon content and improve the conventional carbon element 1222 content of up to about 10 At%. The composition of the chromium carbide-based cermet plating layer 122 of the present invention comprises one or a combination of Cr 23 C 6 , Cr 3 C 2 or Cr 7 C 3 , and the content of the carbon element 1222 is in the range of 15 At% or more. The chromium carbide-based cermet plating layer 122 of the hydrophobic conductive tool has high carbon content, and therefore has good electrical conductivity, and has a specific resistance of 100 mΩ or less, a contact angle of pure water of more than 94 degrees at 25 ° C, and a linear pole thereof. The corrosion current is 1×10 -5 ampere or less; it is more conductive, corrosion resistant, hydrophobic and wear resistant.

若要增加耐蝕性,可將電鍍形成的碳化鉻基金屬陶瓷電鍍層122的工具基材121再經過消除應力之退火處理,其係將電鍍形成碳化鉻基金屬陶瓷電鍍層122之工具基材121置入一烘箱中以一消除應力溫度條件180℃(含)以上進行烘烤至預定的時間。 To increase the corrosion resistance, the tool substrate 121 of the chromium carbide-based cermet plating layer 122 formed by electroplating may be subjected to stress-relieving annealing treatment, which is to form a tool substrate 121 of the chromium carbide-based cermet plating layer 122. It is placed in an oven and baked at a stress relief temperature condition of 180 ° C or more for a predetermined period of time.

若要增加耐磨性,可將電鍍形成的碳化鉻基金屬陶瓷電鍍層122再經過增加表面硬度的步驟,係利用高溫火燄在碳化鉻基金屬陶瓷電鍍層122表面進行快速加溫的熱處理,表面硬度的步驟可在電鍍完成後或在消除應力之退火處理完成之後。本發明的以下實施例係採用氧乙炔燄,但不為所限,氧乙 炔燄係由氧與乙炔混合燃燒所形成的火燄,由燄芯、內燄和外燄組成,當氧氣與乙炔的作用比為1~1.2時所產生的火燄,其內燄心約2760~3500℃,外燄中心約2100℃,外燄端約1250℃。 In order to increase the wear resistance, the step of increasing the surface hardness of the chromium carbide-based cermet plating layer 122 formed by electroplating may be performed by using a high-temperature flame to rapidly heat the surface of the chromium carbide-based cermet plating layer 122. The step of hardness may be after the plating is completed or after the stress-relieving annealing treatment is completed. The following embodiments of the present invention employ an oxyacetylene flame, but are not limited thereto, and oxygen B The acetylene flame is a flame formed by the combustion of oxygen and acetylene. It consists of a flame core, an inner flame and an outer flame. When the ratio of oxygen to acetylene is 1 to 1.2, the flame is generated, and the inner flame is about 2760~3500. °C, the outer flame center is about 2100 ° C, and the outer flame end is about 1250 ° C.

為進一步說明本發明之披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具及其製作方法,以下列實施例進行說明。在下列的實施例中,將說明利用本發明之披覆碳化鉻基金屬陶瓷電鍍層之製作方法製成的疏水性導電工具應用於各種導電工具、手術刀的手術刀刃、燃料電池的雙極板、一般電池的極板或噴霧器噴嘴的微孔板(porous membrane)等,但其應用的領域不為前述實施態樣所限。 To further illustrate the hydrophobic conductive tool of the present invention coated with a chromium carbide-based cermet plating layer and a method for fabricating the same, the following examples are described. In the following embodiments, a hydrophobic conductive tool made by the method for coating a chromium carbide-based cermet plating layer of the present invention will be described for use in various conductive tools, scalpel blades for scalpels, and bipolar plates for fuel cells. The plate of a general battery or a porous membrane of a spray nozzle, etc., but the field of application thereof is not limited by the foregoing embodiments.

<實施例1> <Example 1>

習知使用的焊接噴嘴若要增加使用壽命,常在其表面電鍍六價鉻硬鉻層,使其具有較佳的表面硬度且可以導電;本實施例係採用電鍍所形成的碳化鉻基金屬陶瓷電鍍層之焊接噴嘴,使其具有導電性、疏水性、良好的表面硬度與耐蝕性。請參看第7圖、8圖、第11圖、與第13圖,第7圖係為橫向電鍍層截面圖;第8圖係電鍍層表面形貌圖;第11圖係電鍍層成分圖(縱座標為能量強度與橫座標掃瞄範圍之角度);第13圖係接觸角圖。在本實施例 採用的三價鉻電鍍液為硫酸根電鍍浴,其成份與操作條件如表二,利用此三價鉻電鍍液與操作條件電鍍所形成的碳化鉻基金屬陶瓷電鍍層122如表三。本實施例之疏水性導電工具為銅質的焊接噴嘴,其工具基材1為銅質,電鍍時以電流密度10A/dm2操作溫度為25℃,操作時間為10分鐘;經以掃描式電子顯微鏡觀察工具基材121上的碳化鉻基金屬陶瓷電鍍層122,並以EPMA(ELECTRON PROBE X-RAY MICROANALYZER,電子探測光顯微分析)量測該電鍍層中之碳含量,所得之碳含量約為28At%。所得之碳化鉻基金屬陶瓷電鍍層122明顯較平整,其電鍍層厚鍍約為3μm以下,在導電性上比電阻值約為10mΩ,顯示該電鍍層導電性佳;其純水接觸角為94.9度(在25℃,以下同),顯示其疏水性良好;因電鍍層平整,缺陷較少,該工件零件的耐蝕性高,可提升工件零件的使用壽命,本實施例之電鍍層係未經消除應力及增加表面硬度之後處理,其硬度約為1000Hv;參見第11圖,電鍍層的成分組成包括Cr、Cr23C6、Cr3C2與Cr7C3的混合電鍍層。 In order to increase the service life of the conventional welding nozzle, the hexavalent chromium hard chrome layer is often plated on the surface to have a better surface hardness and can be electrically conductive; in this embodiment, the chromium carbide-based cermet formed by electroplating is used. The welding nozzle of the electroplated layer has electrical conductivity, hydrophobicity, good surface hardness and corrosion resistance. Please refer to Fig. 7, Fig. 8, Fig. 11, and Fig. 13, Fig. 7 is a cross-sectional view of the lateral plating layer; Fig. 8 is a surface topography of the electroplated layer; and Fig. 11 is a composition diagram of the electroplated layer (vertical The coordinates are the angles of the energy intensity and the lateral coordinate scanning range; the 13th is the contact angle diagram. The trivalent chromium plating solution used in this embodiment is a sulfate plating bath, and its composition and operating conditions are as shown in Table 2. The chromium carbide-based cermet plating layer 122 formed by electroplating using the trivalent chromium plating solution and the operating conditions is as follows. three. The hydrophobic conductive tool of this embodiment is a copper welding nozzle, the tool substrate 1 is made of copper, and the current density is 10 A/dm 2 at an operating temperature of 25 ° C, and the operation time is 10 minutes; The chromium carbide-based cermet plating layer 122 on the tool substrate 121 is observed by a microscope, and the carbon content in the plating layer is measured by EPMA (ELECTRON PROBE X-RAY MICROANALYZER), and the carbon content is about It is 28At%. The obtained chromium carbide-based cermet plating layer 122 is obviously flat, and the plating layer is plated to a thickness of about 3 μm or less, and the electrical conductivity is about 10 mΩ, indicating that the plating layer has good conductivity; the pure water contact angle is 94.9. Degree (at 25 ° C, the same below), showing that its hydrophobicity is good; because the plating layer is flat, the defects are less, the workpiece parts have high corrosion resistance, and the service life of the workpiece parts can be improved, and the plating layer of the embodiment is not After the stress is removed and the surface hardness is increased, the hardness is about 1000 Hv; see Figure 11, the composition of the plating layer includes a mixed plating layer of Cr, Cr 23 C 6 , Cr 3 C 2 and Cr 7 C 3 .

其中,耐蝕性測試評比係以AutoLAB阻抗頻譜分析線性極化試驗,其評比標準如下:1級,線性極化腐蝕電流(Linear polarization corrosion current,Amp.)小於1×10-7安培以下、2級,1×10-6安培以下、3級,1×10-5安培以下、4級,1×10-4安培以上;以下各實施例表示方法相同。 Among them, the corrosion resistance test is based on AutoLAB impedance spectrum analysis linear polarization test, the evaluation criteria are as follows: Level 1, linear polarization corrosion current (Amp.) less than 1 × 10 -7 amps or less, level 2 1 × 10 -6 ampere or less, 3 grades, 1 × 10 -5 ampere or less, 4 grades, 1 × 10 -4 ampere or more; the following examples show the same method.

<實施例2> <Example 2>

防靜電承盤可應用於電子製造生產線或火炸藥製造生產線,其導電性與耐腐蝕性要求甚高。習知使用的防靜電承盤常為金屬所製成,例如不鏽鋼或使用於火炸藥製造生產線的鈹銅所製成,但這類材料之疏水性不佳、耐腐蝕性不足。本實施例係採用 玻璃材質的工具基材以電鍍所形成的碳化鉻基金屬陶瓷電鍍層之防靜電承盤,使其具有導電性、疏水性、良好的表面硬度與耐蝕性。在本實施例採用的三價鉻電鍍液為硫酸根電鍍浴,其成份與操作條件如表四,利用此三價鉻電鍍液與操作條件電鍍所形成的碳化鉻基金屬陶瓷電鍍層如表五。本實施例之疏水性導電工具為防靜電承盤,係為玻璃或陶瓷材質表面經無電鍍鍍鎳為工具基材,電鍍時以電流密度30A/dm2操作溫度為25℃,操作時間為30分鐘,以掃描式電子顯微鏡觀察工具基材上碳化鉻基金屬陶瓷電鍍層,並以EPMA量測電鍍層中之碳含量約22.4At%。該硫酸根碳化鉻基金屬陶瓷電鍍層厚度約13μm,在導電性上比電阻值約12mΩ,在導電性上顯示該電鍍層導電性佳;其純水接觸角為98.7度,顯示其疏水性良好;本實施例之耐蝕性經評比為2級,本實施例之電鍍層係未經消除應力及增加表面硬度之後處理,硬度約1000Hv,其成分中電鍍層組成包括Cr、Cr23C6、Cr3C2與Cr7C3之混合電鍍層。 The anti-static retaining plate can be applied to an electronic manufacturing production line or a pyrotechnic manufacturing line, and its electrical conductivity and corrosion resistance are highly demanded. The antistatic trays conventionally used are often made of metal, such as stainless steel or beryllium copper used in the production line of explosives, but such materials are poor in hydrophobicity and insufficient in corrosion resistance. In this embodiment, a glass substrate tool substrate is used to electroplate the formed anti-static disk of the chromium carbide-based cermet plating layer to have conductivity, hydrophobicity, good surface hardness and corrosion resistance. The trivalent chromium plating solution used in this embodiment is a sulfate plating bath, and its composition and operating conditions are as shown in Table 4. The chromium carbide-based cermet plating layer formed by electroplating using the trivalent chromium plating solution and operating conditions is as shown in Table 5. . The hydrophobic conductive tool of the embodiment is an antistatic disk, and the surface of the glass or ceramic material is electroless nickel-plated as a tool substrate, and the current density is 30 A/dm 2 and the operating temperature is 25 ° C, and the operation time is 30. Minutes, the chromium carbide-based cermet plating layer on the tool substrate was observed with a scanning electron microscope, and the carbon content in the plating layer was measured by EPMA to be about 22.4 At%. The sulphate chromium carbide-based cermet plating layer has a thickness of about 13 μm and a specific resistance of about 12 mΩ in electrical conductivity, and the electroplating layer has good conductivity; the pure water contact angle is 98.7 degrees, indicating that the hydrophobicity is good. The corrosion resistance of the present embodiment is evaluated to be 2 grades. The electroplated layer of the present embodiment is processed after the stress is not relieved and the surface hardness is increased, and the hardness is about 1000 Hv. The composition of the plating layer in the composition includes Cr, Cr 23 C 6 , Cr. A mixed plating layer of 3 C 2 and Cr 7 C 3 .

<實施例3> <Example 3>

如前所述,習知的電燒手術刀在表面常披覆鐵弗龍或氮化鉻薄膜,由於鐵弗龍會有釋放含氟毒性氣體的問題、氮化鉻薄膜表面接觸角為78°屬親水性質,容易在切割組織時產生沾黏;再者因鐵弗龍、氮化鉻薄膜的導電性不佳,在使用於電燒手術刀上有其限制。參閱第2圖,為本實施例之疏水性導電工具用於醫學用的手術工具之示意圖;圖中手術刀刃12係在工具基材121以電鍍覆蓋一層碳化鉻基金屬陶瓷電鍍層122,碳化鉻基金屬陶瓷電鍍層122成分分析如第5圖,係由碳元素1222與鉻元素1221形成非晶相的Cr-C結構。 As mentioned above, the conventional electrosurgical scalpel often coats Teflon or chromium nitride film on the surface. Since Teflon has the problem of releasing fluorine-containing toxic gas, the surface contact angle of the chromium nitride film is 78°. It is hydrophilic and easy to stick when cutting tissue. In addition, due to the poor conductivity of Teflon and Chromium Nitride films, there are restrictions on the use of electrosurgical scalpels. 2 is a schematic view of a surgical tool for a medical conductive tool of the present embodiment; the scalpel blade 12 is attached to a tool substrate 121 by plating a layer of chromium carbide-based cermet plating layer 122, chromium carbide. The composition analysis of the base cermet plating layer 122 is as shown in Fig. 5, and is a Cr-C structure in which an amorphous phase is formed by the carbon element 1222 and the chromium element 1221.

在本實施例採用的三價鉻電鍍液為硫酸根電鍍 浴,其成份與操作條件如表六,利用此三價鉻電鍍液與操作條件電鍍所形成的碳化鉻基金屬陶瓷電鍍層122如表七。本實施例之疏水性導電工具為醫學用電燒手術刀1,係以不鏽鋼為工具基材121,電鍍操作參數同實施例1,因電鍍在不鏽鋼上,因此電鍍後以350℃時間60分鐘熱處理以消除應力,再以掃描式電子顯微鏡觀察工具基材121上碳化鉻基金屬陶瓷電鍍層122,並以EPMA量測電鍍層中之碳含量約32.7At%。所得之碳化鉻基金屬陶瓷電鍍層122明顯較平整,其電鍍層厚鍍約8μm以下,在導電性上比電阻值約6mΩ,顯示該電鍍層導電性佳;其純水接觸角為107.4度;因電鍍層平整,缺陷較少,該工件零件的耐蝕性高,可提升工件零件的使用壽命,該電鍍層係未經增加表面硬度後處理,其硬度約1200Hv;電鍍層的成分組成包括Cr、Cr23C6、Cr3C2與Cr7C3的混合電鍍層,電鍍層主要由Cr、C、O組成具有生物相容性,且由於電鍍層緻密覆蓋性良好,工具底材不易溶出有害金屬使電燒手術刀1具有生物相容性。 The trivalent chromium plating solution used in this embodiment is a sulfate plating bath, and its composition and operating conditions are as shown in Table 6. The chromium carbide-based cermet plating layer 122 formed by electroplating using the trivalent chromium plating solution and operating conditions is as shown in the table. Seven. The hydrophobic conductive tool of the present embodiment is a medical electrosurgical scalpel 1 with stainless steel as the tool substrate 121, and the electroplating operation parameters are the same as those in the first embodiment. Since the electroplating is performed on the stainless steel, the electroplating is performed at 350 ° C for 60 minutes after electroplating. To eliminate the stress, the chromium carbide-based cermet plating layer 122 on the tool substrate 121 was observed by a scanning electron microscope, and the carbon content in the plating layer was measured by EPMA to be about 32.7 At%. The obtained chromium carbide-based cermet plating layer 122 is obviously flat, the plating layer is plated to a thickness of about 8 μm or less, and the electrical conductivity is about 6 mΩ, indicating that the plating layer has good conductivity; the pure water contact angle is 107.4 degrees; Because the plating layer is flat and has fewer defects, the workpiece parts have high corrosion resistance and can improve the service life of the workpiece parts. The plating layer is treated without increasing the surface hardness, and the hardness is about 1200Hv; the composition of the plating layer includes Cr, A mixed plating layer of Cr 23 C 6 , Cr 3 C 2 and Cr 7 C 3 , the electroplating layer is mainly composed of Cr, C, O, and has biocompatibility, and since the plating layer has good tight coverage, the tool substrate is not easily dissolved and harmful. The metal makes the electrosurgical scalpel 1 biocompatible.

於實施例1~3,該電鍍層碳含量為高於15At%至33At%之間,該電鍍層導電性維持在5~15mΩ的狀態;在耐蝕性上,參照實施例1~3,該電鍍層耐蝕性能之線性極化腐蝕電流維持在1×10-5至1×10-7(A)之間。對於參照實施例1~3,由於本發明改善昔知電鍍碳化鉻技藝,已大幅提高電鍍層的碳含量,可提升了電鍍層導電性、疏水性、耐腐蝕性,更增加了電鍍層硬度之功效。經實際驗證,使用本實施例之碳化鉻基金屬陶瓷電鍍層122之醫學用電燒手術刀1具有生物相容性,且可減少電流對組織的熱傷害、避免組織燒灼冒煙、電燒手術刀1之手術刀刃12表面不會產生血塊或組織的沾黏。 In Examples 1 to 3, the carbon content of the plating layer is higher than 15 At% to 33 At%, and the conductivity of the plating layer is maintained at 5 to 15 mΩ; in the corrosion resistance, referring to Examples 1 to 3, the plating The linear polarization corrosion current of the layer corrosion resistance is maintained between 1 × 10 -5 and 1 × 10 -7 (A). With reference to the first to third embodiments, the present invention improves the carbon content of the electroplated layer by greatly improving the carbon content of the electroplated layer, thereby improving the electroconductivity, the hydrophobicity, the corrosion resistance of the electroplated layer, and the hardness of the electroplated layer. efficacy. It has been verified that the medical electrosurgical scalpel 1 using the chromium carbide-based cermet plating layer 122 of the present embodiment is biocompatible, and can reduce thermal damage to the tissue caused by current, avoid tissue burning and smoking, and electric burn surgery. The surface of the scalpel blade 12 of the knife 1 does not cause sticking of blood clots or tissues.

<實施例4> <Example 4>

一般的噴霧器係先將液體霧化至微小液滴,再將已霧化的液滴經由噴嘴直接噴灑在指定的表面上,噴霧粒徑約為10~50μm,噴嘴在出口上設有一微孔板(porous membrane),常以PTFE或不鏽鋼等金屬材料所製成。由於PTFE材質的微孔板使用壽命不長,而不鏽鋼製成的微孔板為親水性,使用時霧滴容易堵塞。 A typical atomizer first atomizes a liquid into tiny droplets, and then sprays the atomized droplets directly onto a specified surface via a nozzle. The spray particle size is about 10 to 50 μm, and the nozzle is provided with a microplate at the outlet. (porous membrane), often made of metal materials such as PTFE or stainless steel. Since the microporous plate made of PTFE has a short service life, and the microplate made of stainless steel is hydrophilic, the droplets are easily blocked during use.

對於更微小的霧滴需求,如平均噴霧粒徑在10μm以下,習知的技術係在噴嘴的噴口尖端安裝一超音波產生器,當已霧化的液滴高速撞擊超音波產生器時,立即產生高頻振盪與超音波,噴霧粒徑會因此更加微霧化,而微孔板通常使用金屬製成,且為防蝕目的則電鍍一層鎳層;但實用上,由於微孔板為親水性,使用時霧滴更容易堵塞,再者鎳金屬會溶出於霧-滴內,造成不具生物相容性,無法供給醫學器具使用。 For even smaller droplet requirements, such as an average spray particle size below 10 μm, the conventional technique is to install an ultrasonic generator at the tip of the nozzle of the nozzle, when the atomized droplet hits the ultrasonic generator at high speed, immediately Producing high-frequency oscillations and ultrasonic waves, the spray particle size will be more micro-atomized, and the microplate is usually made of metal, and a nickel layer is plated for the purpose of corrosion prevention; but practically, since the microplate is hydrophilic, When used, the droplets are more likely to clog, and the nickel metal will dissolve in the mist-drop, resulting in non-biocompatibility and inability to be supplied to medical instruments.

如第5圖,係本發明之碳化鉻基金屬陶瓷電鍍層疏水導電工具應用於微孔板3之示意圖,使其具有導電性、疏水性、良好的表面硬度與耐蝕性;且由於碳化鉻基金屬陶瓷電鍍層疏水導電工具所製成的微孔板3不會釋出有害的毒性物質或金屬離子,具有生物相容性,可用於醫學用途。微孔板3之工 具基材31為不鏽鋼所製成,利用四個固定螺孔33固定在噴霧器噴嘴的噴口尖端上;在本實施例係於微孔板3之工具基材31上以電鍍覆蓋一層碳化鉻基金屬陶瓷電鍍層32,碳化鉻基金屬陶瓷電鍍層32係由碳元素321與鉻元素322形成非晶相的Cr-C結構;請參看第9圖、第10圖、第12圖與第14圖,第9圖係為本實施例的電鍍層橫截面圖;第10圖係電鍍層表面形貌圖;第12圖係電鍍層成分結構圖(縱座標為能量強度與橫座標掃瞄範圍之角度);第14圖係接觸角圖。在本實施例採用的三價鉻電鍍液為氯酸根電鍍浴,其成份與操作條件如表八,利用此三價鉻電鍍液與操作條件電鍍所形成的碳化鉻基金屬陶瓷電鍍層32如表九。本實施例之疏水性導電工具亦為不鏽鋼銅質的工具基材31,電鍍時以電流密度10A/dm2操作溫度為25℃,操作時間為10分鐘,電鍍後以350℃熱處理30分鐘以消除應力,再以掃描式電子顯微鏡觀察工具基材31上碳化鉻基金屬陶瓷電鍍層32,並以EPMA量測電鍍層中之碳含量為54.3At%可達約55At%以上。所得之碳化鉻基金屬陶瓷電鍍層32平整,其電鍍層厚鍍約2μm以下,在導電性上比電阻值約2mΩ;其純水接觸角為131.6度,屬於接觸角大於120度的超疏水性;又該電鍍層係未經增加表面硬度之處理,其硬度約1000Hv;電鍍層的成分組成包括Cr、Cr23C6、Cr3C2 與Cr7C3的混合電鍍層。 As shown in Fig. 5, a schematic diagram of the chromium carbide-based cermet electroplating layer hydrophobic conductive tool of the present invention applied to the microplate 3 to have conductivity, hydrophobicity, good surface hardness and corrosion resistance; and due to chromium carbide base The microporous plate 3 made of the cermet electroplated hydrophobic conductive tool does not release harmful toxic substances or metal ions, is biocompatible, and can be used for medical purposes. The tool substrate 31 of the microplate 3 is made of stainless steel and is fixed to the nozzle tip of the atomizer nozzle by four fixing screw holes 33; in the present embodiment, the tool substrate 31 attached to the microplate 3 is covered with electroplating. A layer of chromium carbide-based cermet plating layer 32, a chromium carbide-based cermet plating layer 32 is a Cr-C structure in which an amorphous phase is formed by carbon element 321 and chromium element 322; see Fig. 9, Fig. 10, Fig. 12 Figure 14 is a cross-sectional view of the electroplated layer of the present embodiment; Fig. 10 is a surface topography of the electroplated layer; and Fig. 12 is a structural diagram of the electroplated layer (the ordinate is the energy intensity and the lateral coordinate scan) The angle of the aiming range); Figure 14 is the contact angle diagram. The trivalent chromium plating solution used in this embodiment is a chlorate plating bath, and its composition and operating conditions are as shown in Table 8. The chromium carbide-based cermet plating layer 32 formed by electroplating using the trivalent chromium plating solution and operating conditions is as follows. nine. The hydrophobic conductive tool of this embodiment is also a stainless steel copper tool substrate 31. The electroplating has a current density of 10 A/dm 2 and an operating temperature of 25 ° C, an operation time of 10 minutes, and a heat treatment at 350 ° C for 30 minutes after electroplating to eliminate Stress, and then the chromium carbide-based cermet plating layer 32 on the tool substrate 31 was observed by a scanning electron microscope, and the carbon content in the plating layer was measured by EPMA to be 54.3 At% up to about 55 At% or more. The obtained chromium carbide-based cermet plating layer 32 is flat, the plating layer is plated to a thickness of about 2 μm or less, and the electrical conductivity is about 2 mΩ, and the pure water contact angle is 131.6 degrees, which is a superhydrophobicity with a contact angle of more than 120 degrees. The electroplated layer is treated without increasing the surface hardness, and has a hardness of about 1000 Hv; the composition of the electroplated layer includes a mixed plating layer of Cr, Cr 23 C 6 , Cr 3 C 2 and Cr 7 C 3 .

本實施例之碳化鉻基金屬陶瓷電鍍層32之碳元素321主要來自於螯合劑的碳源,由於碳含量提高,形成之較高碳含量的碳化鉻非晶相結構,可使表面疏水性增加。 The carbon element 321 of the chromium carbide-based cermet plating layer 32 of the present embodiment is mainly derived from the carbon source of the chelating agent, and the carbon content of the chromium carbide amorphous phase structure with higher carbon content formed by the carbon content is increased, and the surface hydrophobicity is increased. .

<實施例5> <Example 5>

參見第4圖,為本實施例製成的電池雙極板之示意圖,燃料電池(fuel cell)是一種經由氫氣、甲烷 或甲醇等燃料與氣體進行燃燒化學反應,釋放出熱能而轉便成電能的電池,燃料電池的主要元件為二片的電池雙極板組成與夾層的化學反應物質層;其中,電池雙極板組成2,如第4圖,在電池雙極板組成2設有許多條狀的流通管道23,供氣體及生成水可以進出,電池雙極板組成2主要功能為將氧化劑與還原劑分開、電流藉由電池雙極板組成2導通至外界、為達較佳效率因化學反應產生的氣體能在流通管道23內均勻快速的流通,且電池雙極板組成2需要能降低熱的累積,因此電池雙極板組成2必須具有導電、耐溫、抗腐蝕、疏水等特性。 Referring to FIG. 4, a schematic diagram of a battery bipolar plate made in the present embodiment, a fuel cell is a type of hydrogen, methane. Or a fuel such as methanol and a gas undergo a combustion chemical reaction to release heat energy and convert it into a battery for electric energy. The main component of the fuel cell is a two-piece battery bipolar plate composed of a chemical reaction substance layer of the interlayer; wherein the battery bipolar plate Composition 2, as shown in Fig. 4, in the battery bipolar plate composition 2 is provided with a plurality of strip-shaped circulation pipes 23 for gas and generated water to enter and exit, and the battery bipolar plate composition 2 is mainly for separating the oxidant from the reducing agent, current By the battery bipolar plate composition 2 is conducted to the outside, gas generated by the chemical reaction for better efficiency can be uniformly and rapidly circulated in the circulation pipe 23, and the battery bipolar plate composition 2 needs to reduce heat accumulation, so the battery The bipolar plate composition 2 must have characteristics such as electrical conductivity, temperature resistance, corrosion resistance, and hydrophobicity.

本實施例製成的電池雙極板組成2係以鍍鎳鋼板為雙極板基材21,於雙極板基材21以三價鉻電鍍浴電鍍形成碳化鉻基金屬陶瓷電鍍層22,電鍍層的成分組成碳元素221與鉻元素222形成的Cr、Cr23C6、Cr3C2與Cr7C3的混合電鍍層。在本實施例採用的三價鉻電鍍液為氯酸根電鍍浴,其成份與操作條件如表十,利用此三價鉻電鍍液與操作條件電鍍所形成的碳化鉻基金屬陶瓷電鍍層122如表十一。本實施例之疏水性導電工具為電池的極板係以鋼板基材鍍鎳為工具基材121,電鍍時以電流密度30A/dm2操作溫度為25℃,操作時間為10分鐘。以掃描式電子顯微鏡觀察工具基材121上碳化鉻基金屬陶瓷電鍍層122,並以EPMA量測電鍍層中之碳含量, 所得之硫酸碳化鉻基金屬陶瓷電鍍層122碳含量約34.2At%,其電鍍層厚鍍約4μm,在導電性上比電阻值約7mΩ,在導電性上顯示該電鍍層導電性佳;其純水接觸角為120.7度,其接觸角為大於120度,屬於超疏水性。該電鍍層係未經後處理,其硬度約750Hv,參見第12圖,其成分中電鍍層組成包括Cr、Cr23C6、Cr3C2與Cr7C3The battery bipolar plate made in this embodiment is composed of a nickel-plated steel plate as a bipolar plate substrate 21, and a chromium carbide-based cermet plating layer 22 is formed on the bipolar plate substrate 21 by a trivalent chromium plating bath. The composition of the layer constitutes a mixed plating layer of Cr, Cr 23 C 6 , Cr 3 C 2 and Cr 7 C 3 formed by the carbon element 221 and the chromium element 222. The trivalent chromium plating solution used in this embodiment is a chlorate plating bath, and its composition and operating conditions are as shown in Table 10. The chromium carbide-based cermet plating layer 122 formed by electroplating using the trivalent chromium plating solution and operating conditions is as follows. eleven. In the hydrophobic conductive tool of the present embodiment, the plate of the battery is plated with nickel as the tool substrate 121, and the operating temperature is 25 ° C at a current density of 30 A/dm 2 and the operation time is 10 minutes. The chromium carbide-based cermet plating layer 122 on the tool substrate 121 is observed by a scanning electron microscope, and the carbon content in the plating layer is measured by EPMA, and the obtained chromium carbide-based cermet plated layer 122 has a carbon content of about 34.2 At%. The plating layer is plated to a thickness of about 4 μm, and has a conductivity of about 7 mΩ. The conductivity of the plating layer is good. The pure water contact angle is 120.7 degrees, and the contact angle is more than 120 degrees. Sex. The plating layer is not post-treated and has a hardness of about 750 Hv. Referring to Figure 12, the composition of the plating layer in the composition includes Cr, Cr 23 C 6 , Cr 3 C 2 and Cr 7 C 3 .

<實施例6> <Example 6>

本實施例如同實施例3,係應用於醫學用電燒手術刀,如第2圖。在本實施例採用的三價鉻電鍍液為氯酸根電鍍浴,其成份與操作條件如表十二,利用此三價鉻電鍍液與操作條件電鍍所形成的碳化鉻基金屬陶瓷電鍍層122如表十三。本實施例係使用於醫學用電燒手術刀1,醫學用電燒手術刀1需要達到超疏水性的要求,本實施例工具基材121為不鏽鋼材質。本實施例與實施例4相同之操作條件,唯一不同的是後處理,電鍍後以350℃時間60分鐘熱處理以消除應力,並以1200℃火燄噴於電鍍層2秒增加表面硬度,再以掃描式電子顯微鏡觀察工具基材121上碳化鉻基金屬陶瓷電鍍層3,並以EPMA量測電鍍層中之碳含量約55At%。所得之碳化鉻基金屬陶瓷電鍍層122平整,其電鍍層厚鍍約2μm,在導電性上比電阻值約3mΩ;其純水接觸角為124.8度,由於接觸角大於120度屬於超疏水性;因電鍍層平整,缺陷較少,該工件零件的耐蝕性高,可提升工件零件的使用壽命,該電鍍層係經後處理,硬度約1500Hv;電鍍層的成分組成包括Cr、Cr23C6、Cr3C2與Cr7C3的混合電鍍層,電鍍層主要由Cr、C、O組成具有生物相容性,且由於電鍍層緻密覆蓋性良好,工具底材不易溶出有害金屬使電燒手術刀1具有生物相容性。 This embodiment is the same as that of the third embodiment, and is applied to a medical electrosurgical scalpel, as shown in Fig. 2. The trivalent chromium plating solution used in this embodiment is a chlorate plating bath, and its composition and operating conditions are as shown in Table 12, and the chromium carbide-based cermet plating layer 122 formed by electroplating using the trivalent chromium plating solution and operating conditions is as Table XIII. This embodiment is used for the medical electrosurgical scalpel 1. The medical electrosurgical scalpel 1 needs to meet the requirement of superhydrophobicity. The tool substrate 121 of the present embodiment is made of stainless steel. The same operating conditions as in the embodiment of the present embodiment, the only difference is the post-treatment, after the electroplating, heat treatment at 350 ° C for 60 minutes to eliminate stress, and sprayed on the electroplated layer at 1200 ° C for 2 seconds to increase the surface hardness, and then scan The chromium carbide-based cermet plating layer 3 on the tool substrate 121 was observed by an electron microscope, and the carbon content in the plating layer was measured by EPMA to be about 55 At%. The obtained chromium carbide-based cermet plating layer 122 is flat, the plating layer is plated to a thickness of about 2 μm, and the electrical conductivity is about 3 mΩ; the pure water contact angle is 124.8 degrees, and the contact angle is more than 120 degrees, which is superhydrophobic; Because the plating layer is flat and has fewer defects, the workpiece parts have high corrosion resistance and can improve the service life of the workpiece parts. The plating layer is post-treated and has a hardness of about 1500Hv; the composition of the plating layer includes Cr, Cr 23 C 6 , Mixed plating layer of Cr 3 C 2 and Cr 7 C 3 , the electroplating layer is mainly composed of Cr, C, O, and has biocompatibility, and because the plating layer has good tight coverage, the tool substrate is not easy to dissolve harmful metals to cause electrocautery operation. Knife 1 is biocompatible.

經實際驗證,使用本實施例之碳化鉻基金屬陶瓷電鍍層之醫學用電燒手術刀,除具導電性佳、耐蝕性佳及生物相容性外,更具有超疏水性,可減少電流對組織的熱傷害、避免組織燒灼冒煙、電燒手術刀表面不會產生血塊或組織的沾黏。 It has been verified that the medical electrosurgical scalpel using the chromium carbide-based cermet plating layer of the present embodiment has super conductivity, good corrosion resistance and biocompatibility, and is superhydrophobic, which can reduce the current resistance. Thermal damage to the tissue, avoiding tissue burning and smoking, and burning of the scalpel surface will not cause blood clots or tissue stickiness.

<實施例7> <Example 7>

在本實施例採用的三價鉻電鍍液為氯酸根電鍍浴,其成份與操作條件如表十四,利用此三價鉻電 鍍液與操作條件電鍍所形成的碳化鉻基金屬陶瓷電鍍層如表十五。本實施例之疏水性導電工具為電極貼片,係以PU塑膠表面無電鍍鎳為工具基材,電鍍時以電流密度30A/dm2操作溫度為25℃,操作時間為60分鐘,電鍍後以350℃熱處理60分鐘以消除應力,再以掃描式電子顯微鏡觀察工具基材上碳化鉻基金屬陶瓷電鍍層,並以EPMA量測電鍍層中之碳含量約55At%。所得之碳化鉻基金屬陶瓷電鍍層平整,其電鍍層厚鍍約15μm,在導電性上比電阻值約83mΩ;其純水接觸角為71.6度;因電鍍層厚度較厚,缺陷較少,該工件零件的耐蝕性高,可提升工件零件的使用壽命,該電鍍層沒經處理硬度約1100Hv;電鍍層的成分組成包括Cr、Cr23C6、Cr3C2與Cr7C3的混合電鍍層。 The trivalent chromium plating solution used in this embodiment is a chlorate plating bath, and its composition and operating conditions are as shown in Table 14. The chromium carbide-based cermet plating layer formed by electroplating using the trivalent chromium plating solution and operating conditions is as follows. fifteen. The hydrophobic conductive tool of the embodiment is an electrode patch, which is made of electroless nickel on the surface of the PU plastic. The operating temperature is 25 ° C at a current density of 30 A/dm 2 and the operation time is 60 minutes. The heat treatment was performed at 350 ° C for 60 minutes to eliminate stress, and the chromium carbide-based cermet plating layer on the tool substrate was observed by a scanning electron microscope, and the carbon content in the plating layer was measured by EPMA to be about 55 At%. The obtained chromium carbide-based cermet plating layer is flat, the plating layer is plated to a thickness of about 15 μm, the electrical conductivity is about 83 mΩ, and the pure water contact angle is 71.6 degrees; since the plating layer is thick, the defects are small, and the defect is small. The workpiece parts have high corrosion resistance and can improve the service life of the workpiece parts. The untreated hardness of the electroplated layer is about 1100Hv; the composition of the electroplated layer includes mixed plating of Cr, Cr 23 C 6 , Cr 3 C 2 and Cr 7 C 3 Floor.

依照實施例1~7,對於不同的應用目的,可使用適合的三價鉻電鍍浴、操作條件、控制電流密度在10A/dm2至50A/dm2之間的適當電流密度及操作時間等,使碳化鉻基金屬陶瓷電鍍層該電鍍層具有最適合使用目的之碳含量,形成符合使用需求的導電性、耐蝕性、疏水性與硬度等物理特性。 According to Embodiments 1-7, suitable trivalent chromium plating baths, operating conditions, suitable current densities of controlled current densities between 10 A/dm 2 and 50 A/dm 2 , and operating times can be used for different application purposes. The chromium carbide-based cermet plating layer has a carbon content which is most suitable for the purpose of use, and forms physical properties such as conductivity, corrosion resistance, hydrophobicity, and hardness in accordance with the use requirements.

如上所述,昔知電鍍鉻技術僅會產生純鉻電鍍層,但因純鉻電鍍層的導電性差及抗耐蝕性的能力較低,不符高精密、要求具有導電性、疏水性、硬度與耐磨性之特性使用。本發明利用三價鉻之鉻化原理將電鍍過程沉積的鉻元素與碳元素之金屬態轉為類陶瓷態,可提高本發明電鍍層之導電性、疏水性與耐蝕性,更適合與各種需要兼具有導電特性與疏水特性且具有陶瓷特性的工具、模具、疏水性導電工具、醫療器材等使用。 As mentioned above, it is known that the chrome plating technique only produces a pure chrome plating layer, but the pure chrome plating layer has low conductivity and corrosion resistance, is not high precision, and requires conductivity, hydrophobicity, hardness and resistance. Use of abrasive properties. The invention utilizes the principle of chromiumation of trivalent chromium to convert the metal state of chromium element and carbon element deposited in the electroplating process into a ceramic-like state, which can improve the conductivity, hydrophobicity and corrosion resistance of the electroplated layer of the invention, and is more suitable for various needs. It is used for tools, molds, hydrophobic conductive tools, medical equipment, etc., which have both conductive and hydrophobic properties and have ceramic properties.

以上所述僅為舉例性,而非為限制性者。任何 未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. any Equivalent modifications or variations of the present invention are intended to be included within the scope of the appended claims.

1‧‧‧電燒手術刀 1‧‧‧Electric Burning Scalpel

11‧‧‧手術刀柄 11‧‧‧Surgical handle

12‧‧‧手術刀刃 12‧‧‧Surgical blade

121‧‧‧工具基材 121‧‧‧Tool substrate

1212‧‧‧導電層 1212‧‧‧ Conductive layer

122‧‧‧碳化鉻基金屬陶瓷電鍍層 122‧‧‧Chromium carbide based cermet plating

1222‧‧‧碳元素 1222‧‧‧carbon elements

1221‧‧‧鉻元素 1221‧‧‧Chromium

2‧‧‧電池雙極板組成 2‧‧‧Battery bipolar plate composition

21‧‧‧雙極板基材 21‧‧‧Bipolar plate substrate

22‧‧‧碳化鉻基金屬陶瓷電鍍層 22‧‧‧Chromium carbide-based cermet plating

221‧‧‧碳元素 221‧‧‧carbon elements

222‧‧‧鉻元素 222‧‧‧Chromium

23‧‧‧流通管道 23‧‧‧Circulation pipeline

3‧‧‧微孔板 3‧‧‧Microplate

31‧‧‧工具基材 31‧‧‧Tool substrate

32‧‧‧碳化鉻基金屬陶瓷電鍍層 32‧‧‧Chromium carbide-based cermet plating

321‧‧‧碳元素 321‧‧‧carbon elements

322‧‧‧鉻元素 322‧‧‧Chromium

33‧‧‧固定螺孔 33‧‧‧Fixed screw holes

91‧‧‧回流電纜線 91‧‧‧Return cable

92‧‧‧回流護片 92‧‧‧Return guard

93‧‧‧電流產生器 93‧‧‧current generator

94‧‧‧主電纜線 94‧‧‧Main cable

95‧‧‧電燒手術刀 95‧‧‧Electric Burning Scalpel

S1~S5‧‧‧方法步驟 S1~S5‧‧‧ method steps

第1圖為昔知技術之導電手術刀示意圖;第2圖為本發明披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具應用於手術刀之示意圖;第3圖為本發明披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具製作方法之示意圖;第4圖為本發明披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具應用於燃料電池雙極板之示意圖;第5圖為本發明披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具應用於微孔板之示意圖;第6圖為碳化鉻基金屬陶瓷電鍍層成分分析圖,輔助說明表三之碳化鉻基金屬陶瓷電鍍層的化學成分;第7圖為碳化鉻基金屬陶瓷電鍍層橫截面圖,輔助說明表二之碳化鉻基金屬陶瓷電鍍層層的橫截面微結構態樣;第8圖為碳化鉻基金屬陶瓷電鍍層表面形貌圖,輔助說明表二之碳化鉻基金屬陶瓷電鍍層 的表面形貌;第9圖為碳化鉻基金屬陶瓷電鍍層橫截面圖,輔助說明表八之碳化鉻基金屬陶瓷電鍍層的橫截面微結構態樣;第10圖為碳化鉻基金屬陶瓷電鍍層表面形貌圖,輔助說明表八之碳化鉻基金屬陶瓷電鍍層的表面形貌;第11圖為實施例1至3之碳化鉻基金屬陶瓷電鍍層成分分析圖,輔助說明表三、五與七之碳化鉻基金屬陶瓷電鍍層的化學成分;第12圖為實施例4至7之碳化鉻基金屬陶瓷電鍍層成分分析圖,輔助說明表九、十一、十三與十五之碳化鉻基金屬陶瓷電鍍層的化學成分;第13圖為碳化鉻基金屬陶瓷電鍍層接觸角圖輔助說明表三之接觸角;以及第14圖為碳化鉻基金屬陶瓷電鍍層接觸角圖輔助說明表九之接觸角。 1 is a schematic view of a conductive scalpel of the prior art; FIG. 2 is a schematic view of a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer applied to a scalpel according to the present invention; and FIG. 3 is a cladding chromium carbide of the present invention. Schematic diagram of a method for fabricating a hydrophobic conductive tool of a base metal ceramic plating layer; FIG. 4 is a schematic view showing a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer applied to a fuel cell bipolar plate; The invention discloses a schematic diagram of a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer applied to a microporous plate; and FIG. 6 is a composition analysis diagram of a chromium carbide-based cermet plating layer, which assists in explaining a chromium carbide-based cermet plating layer of Table 3. The chemical composition; Figure 7 is a cross-sectional view of the chromium carbide-based cermet plating layer, which assists in explaining the cross-sectional microstructure of the chromium carbide-based cermet plating layer of Table 2; Figure 8 is the chromium carbide-based cermet plating. Layer surface topography, auxiliary description of the chromium carbide-based cermet coating of Table 2. The surface topography; Figure 9 is a cross-sectional view of the chromium carbide-based cermet plating layer, which assists in explaining the cross-sectional microstructure of the chromium carbide-based cermet plating layer of Table 8; Figure 10 is the chromium carbide-based cermet plating. The surface topography of the layer is used to explain the surface morphology of the chromium carbide-based cermet plating layer of Table 8. The eleventh figure is the composition analysis of the chromium carbide-based cermet plating layer of Examples 1 to 3. And the chemical composition of the chrome-plated cermet plating layer of the seven; the 12th is the composition analysis diagram of the chromium carbide-based cermet plating layer of Examples 4 to 7, which assists in the carbonization of Tables 9, 11, 13, and 15. The chemical composition of the chromium-based cermet plating layer; the 13th is the contact angle of the chromium carbide-based cermet plating layer to help explain the contact angle of Table 3; and the 14th is the chrome-plated cermet plating layer contact angle diagram. The contact angle of the nine.

1‧‧‧電燒手術刀(Electrosurgical blade) 1‧‧‧Electrosurgical blade

11‧‧‧手術刀柄(Blade holder) 11‧‧‧Surgical holder

12‧‧‧手術刀刃(Blade edge) 12‧‧‧Surgical Blade (Blade edge)

121‧‧‧工具基材(substrate) 121‧‧‧Tool substrate (substrate)

1212‧‧‧導電層(conductivity layer) 1212‧‧‧Conductivity layer

122‧‧‧碳化鉻基金屬陶瓷電鍍層(chromium carbide ceramic electroplating layer) 122‧‧‧Chromium carbide ceramic electroplating layer

1222‧‧‧碳元素(carbon atom) 1222‧‧‧carbon atom

1221‧‧‧鉻元素(chromium atom) 1221‧‧‧chromium atom

Claims (11)

一種披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具,包含一工具基材及披覆於該工具基材表層之一碳化鉻基金屬陶瓷電鍍層;其中,該工具基材之材料選自於下列群組之一或其組合:(1)導電材質:導電陶瓷、鐵、不鏽鋼、銅、鉻、鎳、銀、金或其合金之一或其組合;(2)不導電材質:塑膠、陶瓷、玻璃之一或其組合,並以電鍍或無電鍍披覆一導電層,該導電層為選自於鐵、銅、鉻、鎳、銀、金或其合金;其中,該碳化鉻基金屬陶瓷電鍍層係經由電鍍形成非晶相結構附著在該工具基材表面,其成份係由鉻元素與碳元素所組成、至少包括六碳化二十三鉻(Cr23C6)、二碳化三鉻(Cr3C2)或三碳化七鉻(Cr7C3)之一或其組合;該碳化鉻基金屬陶瓷電鍍層碳元素之含量範圍為大於15At%;該披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具,其比電阻為100mΩ.mm 2 /m(含)以下,在25℃其純水之接觸角大於94度、小於120度。 A hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer, comprising: a tool substrate and a chromium carbide-based cermet plating layer coated on a surface layer of the tool substrate; wherein the material of the tool substrate is selected from the group consisting of In one or a combination of the following groups: (1) conductive material: one or a combination of conductive ceramics, iron, stainless steel, copper, chromium, nickel, silver, gold or alloys thereof; (2) non-conductive material: plastic, One or a combination of ceramics or glass, and coating a conductive layer by electroplating or electroless plating, the conductive layer being selected from the group consisting of iron, copper, chromium, nickel, silver, gold or alloys thereof; wherein the chromium carbide-based metal The ceramic plating layer is adhered to the surface of the tool substrate by electroplating to form an amorphous phase structure, and the composition thereof is composed of chromium element and carbon element, and at least includes chromium trichloride (Cr 23 C 6 ) and tri-chromium tri-carbon. One or a combination of (Cr 3 C 2 ) or hexachromic (Cr 7 C 3 ); the chromium carbide-based cermet plating layer has a carbon content of more than 15 At%; the coated chromium carbide-based cermet plating The layer of hydrophobic conductive tool has a specific resistance of 100mΩ . Below mm 2 /m (inclusive), the contact angle of pure water at 25 ° C is greater than 94 degrees and less than 120 degrees. 如申請專利範圍第1項所述之披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之碳化鉻基金屬陶瓷電鍍層,其線性極化腐蝕電流 1×10-5安培以下。 A chromium carbide-based cermet plating layer of a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer as described in claim 1 has a linear polarization corrosion current of 1 × 10 -5 ampere or less. 如申請專利範圍第2項所述之披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之碳化鉻基金屬陶瓷電鍍層,當該碳化鉻基金屬陶瓷電鍍層碳元素之含量範圍大於32At%時,在25℃其純水之接觸角大於120度。 The chromium carbide-based cermet plating layer of the hydrophobic conductive tool coated with the chromium carbide-based cermet plating layer according to claim 2, when the content of the carbon element of the chromium carbide-based cermet plating layer is greater than 32 At% At 25 ° C, the contact angle of its pure water is greater than 120 degrees. 如申請專利範圍第1項所述之披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之碳化鉻基金屬陶瓷電鍍層,其平均厚度範圍在0.5μm至15μm之間。 A chromium carbide-based cermet plating layer of a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer as described in claim 1 has an average thickness ranging from 0.5 μm to 15 μm. 如申請專利範圍第1項所述之碳化鉻基金屬陶瓷電鍍層,其表面硬度為1500Hv以上。 The chromium carbide-based cermet plating layer described in claim 1 has a surface hardness of 1500 Hv or more. 一種披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之製造方法,用於一工具基材披覆一碳化鉻基金屬陶瓷電鍍層,係包含下列步驟:提供一工具基材,該工具基材為表面至少包含有一導電層;以該工具基材為陰極,並浸入於一三價鉻電鍍液中;以電鍍方式於一電鍍溫度條件與一電流密度條件下進行電鍍,於該工具基材上形成一碳化鉻基金屬陶瓷電鍍層; 其中,該三價鉻電鍍液至少包含:一三價鉻鹽、一螯合劑及一添加劑所形成之水溶液;其中,該三價鉻鹽為一硫酸系三價鉻鹽或一氯酸系三價鉻鹽兩者之一;其中,該硫酸系三價鉻鹽係包含三價鉻(Cr+3)與硫酸根(SO4 -2)形成的化合物,該氯酸系三價鉻鹽係包含三價鉻(Cr+3)與氯離子(Cl-)、過氯酸離子(ClO4 -)兩者之一或其組合形成的化合物;其中,該螯合劑係選用有機酸及其鹽類,添加該螯合劑總量碳元素濃度為介於0.1M與5M之間;該添加劑係選用無機酸或其銨鹽類,且該添加劑之添加量濃度為介於0.2M與1M之間;該三價鉻電鍍液之三價鉻(Cr+3)與碳元素之每升莫耳比值為1:1至1:20之間;所形成之該碳化鉻基金屬陶瓷電鍍層係由鉻元素與碳元素所組成,係為非晶相結構,且披覆在該工具基材之該導電層表面,其成份由鉻元素與碳元素所組成、為非晶相結構,至少包括六碳化二十三鉻(Cr23C6)、二碳化三鉻(Cr3C2)或三碳化七鉻(Cr7C3)之一或其組合;其中,碳元素之含量範圍為大於15At%;該披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之比電阻為100mΩ.mm2/m(含)以下、 在25℃其純水接觸角大於94度、小於120度。 A method for manufacturing a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer for coating a tool substrate with a chromium carbide-based cermet plating layer, comprising the steps of: providing a tool substrate, the tool base The surface of the material comprises at least one conductive layer; the tool substrate is used as a cathode, and is immersed in a trivalent chromium plating solution; electroplating is performed on a plating temperature condition and a current density condition on the tool substrate. Forming a chromium carbide-based cermet plating layer; wherein the trivalent chromium plating solution comprises at least: an aqueous solution formed by a trivalent chromium salt, a chelating agent, and an additive; wherein the trivalent chromium salt is a sulfuric acid system a trivalent chromium salt or a monovalent chromium salt of monochloro acid; wherein the sulfuric acid trivalent chromium salt comprises a compound formed by trivalent chromium (Cr +3 ) and sulfate (SO 4 -2 ), The chloric acid-based trivalent chromium salt comprises a compound formed by one or a combination of trivalent chromium (Cr +3 ) and chloride ion (Cl ), perchloric acid ion (ClO 4 ); wherein the chelate The mixture is selected from organic acids and salts thereof, and the total amount of the chelating agent is added. The concentration of the carbon element is between 0.1 M and 5 M; the additive is selected from the group consisting of inorganic acids or ammonium salts thereof, and the additive concentration of the additive is between 0.2 M and 1 M; the third of the trivalent chromium plating solution The chrome (Cr +3 ) and the carbon element have a molar ratio of 1:1 to 1:20; the chromium carbide-based cermet plating layer is composed of chromium and carbon. An amorphous phase structure, which is coated on the surface of the conductive layer of the tool substrate, and whose composition is composed of chromium element and carbon element, and has an amorphous phase structure, and includes at least hexachlorochrome (Cr 23 C 6 ) Or one or a combination of trichromium (Cr 3 C 2 ) or hexachromic (Cr 7 C 3 ); wherein the content of carbon is in the range of more than 15 At%; the coated chromium carbide-based cermet coating The hydrophobic conductive tool has a specific resistance of 100mΩ. mm 2 / m (inclusive), which at 25 deg.] C pure water contact angle greater than 94 degrees and less than 120 degrees. 一種披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之製造方法,用於一工具基材披覆一碳化鉻基金屬陶瓷電鍍層,係包含下列步驟:提供一工具基材,該工具基材為表面至少包含有一導電層;以該工具基材為陰極,並浸入於一三價鉻電鍍液中;以電鍍方式於一電鍍溫度條件與一電流密度條件下進行電鍍,於該工具基材上形成一碳化鉻基金屬陶瓷電鍍層;其中,該三價鉻電鍍液至少包含:一三價鉻鹽、一螯合劑及一添加劑所形成之水溶液;其中,該三價鉻鹽為一硫酸系三價鉻鹽或一氯酸系三價鉻鹽兩者之一;其中,該硫酸系三價鉻鹽係包含三價鉻(Cr+3)與硫酸根(SO4 -2)形成的化合物,該氯酸系三價鉻鹽係包含三價鉻(Cr+3)與氯離子(Cl-)、過氯酸離子(ClO4 -)兩者之一或其組合形成的化合物;其中,該螯合劑係選用有機酸及其鹽類,添加該螯合劑總量碳元素濃度為介於0.1M與5M之間;該添加劑係選自於下列添加劑群組之一或其組合:(1)鹵素銨鹽、(2)硼酸及其鹽類, 且該添加劑之添加量濃度為介於0.1M與1M之間;該三價鉻電鍍液之三價鉻(Cr+3)與碳元素之每升莫耳比值為1:1至1:20之間;所形成之該碳化鉻基金屬陶瓷電鍍層係披覆在該工具基材之該導電層表面,其成份由鉻元素與碳元素所組成、為非晶相結構,至少包括六碳化二十三鉻(Cr23C6)、二碳化三鉻(Cr3C2)或三碳化七鉻(Cr7C3)之一或其組合;其中,碳元素之含量範圍為大於32At%;該披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之比電阻為100mΩ.mm2/m(含)以下、其線性極化腐蝕電流1×10-5安培以下、其純水接觸角大於120度。 A method for manufacturing a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer for coating a tool substrate with a chromium carbide-based cermet plating layer, comprising the steps of: providing a tool substrate, the tool base The surface of the material comprises at least one conductive layer; the tool substrate is used as a cathode, and is immersed in a trivalent chromium plating solution; electroplating is performed on a plating temperature condition and a current density condition on the tool substrate. Forming a chromium carbide-based cermet plating layer; wherein the trivalent chromium plating solution comprises at least: an aqueous solution formed by a trivalent chromium salt, a chelating agent, and an additive; wherein the trivalent chromium salt is a sulfuric acid system a trivalent chromium salt or a monovalent chromium salt of monochloro acid; wherein the sulfuric acid trivalent chromium salt comprises a compound formed by trivalent chromium (Cr +3 ) and sulfate (SO 4 -2 ), The chloric acid-based trivalent chromium salt comprises a compound formed by one or a combination of trivalent chromium (Cr +3 ) and chloride ion (Cl ), perchloric acid ion (ClO 4 ); wherein the chelate Mixtures are selected from organic acids and their salts, and the total amount of the chelating agent is added. The carbon element concentration is between 0.1 M and 5 M; the additive is selected from one or a combination of the following additive groups: (1) a halogen ammonium salt, (2) a boric acid and a salt thereof, and the additive is added. The concentration is between 0.1 M and 1 M; the trivalent chromium (Cr +3 ) of the trivalent chromium plating solution and the molar ratio of the carbon element per liter are between 1:1 and 1:20; The chromium carbide-based cermet plating layer is coated on the surface of the conductive layer of the tool substrate, and the composition thereof is composed of chromium element and carbon element, and is an amorphous phase structure, and at least includes hexachlorochrome (Cr 23 ) One or a combination of C 6 ), trichromium (Cr 3 C 2 ) or hexachromic (Cr 7 C 3 ); wherein the content of carbon is in the range of more than 32 At%; the coated chromium carbide-based metal The specific resistance of the hydrophobic conductive tool of the ceramic plating layer is 100mΩ. Below mm 2 /m (inclusive), its linear polarization corrosion current is 1 × 10 -5 ampere or less, and its pure water contact angle is greater than 120 degrees. 如申請專利範圍第6項及第7項中任一項所述之披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之製造方法,進一步包含一消除應力步驟,該消除應力步驟為將電鍍形成該碳化鉻基金屬陶瓷電鍍層之該工具基材置入一烘箱中以一消除應力溫度條件進行烘烤;其中該消除應力溫度條件為180℃(含)以上。 The method for manufacturing a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer according to any one of claims 6 to 7, further comprising a stress relieving step of plating The tool substrate forming the chromium carbide-based cermet plating layer is placed in an oven for baking at a stress-relieving temperature condition; wherein the stress-relieving temperature condition is 180 ° C or more. 如申請專利範圍第6項及第7項中任一項所述之所述之披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之製造方法,進一步包含一增加 表面硬度步驟,該增加表面硬度步驟為將該碳化鉻基金屬陶瓷電鍍層之工具基材置入一火燄中,以外焰端1200℃以上的火燄於該碳化鉻基金屬陶瓷電鍍層加熱至少0.5秒。 The method for manufacturing a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer according to any one of claims 6 to 7, further comprising an increase a surface hardness step of placing the tool substrate of the chromium carbide-based cermet plating layer in a flame, and heating the flame at a temperature of 1200 ° C or higher at the outer flame end for at least 0.5 seconds on the chromium carbide-based cermet plating layer. . 如申請專利範圍第6項及第7項中任一項所述之披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之製造方法,其中,該電流密度條件範圍為10A/dm2至30A/dm2之間;其中,該電鍍溫度條件為所設定溫度之±3℃以內。 The method for producing a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer according to any one of claims 6 to 7, wherein the current density condition ranges from 10 A/dm 2 to 30 A. / dm between 2; wherein the temperature of the plating temperature is set within ± 3 ℃ is. 如申請專利範圍第6項所述之披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之製造方法,其中,該披覆碳化鉻基金屬陶瓷電鍍層之疏水性導電工具之線性極化腐蝕電流1×10-5安培以下。 The method for producing a hydrophobic conductive tool coated with a chromium carbide-based cermet plating layer according to claim 6, wherein the linear conductive corrosion of the hydrophobic conductive tool coated with the chromium carbide-based cermet plating layer The current is 1 × 10 -5 amps or less.
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