TWI436475B - Optical module and manufacturing method thereof - Google Patents

Description

Optical module and manufacturing method thereof

The present invention relates to an optical module, and more particularly to an optical module having better imaging quality and smaller size.

In some special fields (such as biomedical or stereoscopic optics), it is often necessary to use multiple camera modules, such as 3D cameras or medical diagnostic instruments. Among them, these multiple camera modules are mostly assembled by a single camera module assembly. Therefore, there are usually problems such as an excessively large overall volume and a small reduction in the distance between the cameras, and a complicated process. In other words, how to provide an optical module that is small in size, simple in process steps, and that can accurately control the spacing between cameras (or imaging systems) is a subject worthy of study.

The present invention provides an optical module that can sense the functions of a plurality of pictures and has a small size.

The invention further provides a method for fabricating an optical module, which can produce the above optical module and has a relatively simple manufacturing step.

The invention provides an optical module adapted to receive a first beam and a second beam, respectively. The optical module includes a substrate, a first photo sensor, a second photo sensor, a first imaging system, and a second imaging system. The first photo sensor is disposed on the substrate. The second photo sensor is disposed on the substrate. The first imaging system is positioned above the first photosensor and the first beam is transmitted to the first photosensor through the first imaging system. The first imaging system includes a first transparent substrate and at least one first optical component, and at least one first optical component is disposed on the first transparent substrate. The second imaging system is located above the second photosensor and the second beam is transmitted to the second photosensor through the second imaging system. The second imaging system includes a second transparent substrate and at least one second optical component, and at least one second optical component is disposed on the second transparent substrate.

In an embodiment of the invention, the first transparent substrate and the second transparent substrate substantially share the same transparent substrate. In an embodiment of the invention, the optical module further includes a gap layer. The gap layer is disposed between the first transparent substrate and the substrate and between the second transparent substrate and the substrate to maintain a first between the first transparent substrate and the substrate and between the second transparent substrate and the substrate a gap and a second gap. In an embodiment of the invention, at least one first optical component is located in the first gap and at least one second optical component is located in the second gap. The first light beam is transmitted to the first light sensor through the first transparent substrate, the first optical element and the first gap, and the second light beam passes through the second transparent substrate, the second optical element and the second gap Transfer to the second photo sensor.

In an embodiment of the present invention, the first imaging system further includes a third transparent substrate disposed between the first transparent substrate and the substrate, and the third transparent substrate and the second transparent substrate share the same transparent substrate. . In an embodiment of the invention, the optical module further includes an optical film disposed on the third transparent substrate. In an embodiment of the invention, the optical film comprises an infrared light blocking plate, a low pass filter or a high pass filter.

In an embodiment of the invention, the optical module further includes a plurality of gap layers disposed between the third transparent substrate and the substrate, between the second transparent substrate and the substrate, and the first transparent substrate and the third transparent substrate. Between the optical substrates, a first gap and a second are respectively maintained between the first transparent substrate and the third transparent substrate, between the second transparent substrate and the substrate, and between the third transparent substrate and the substrate. The gap and a third gap. At least one first optical element is located in the first gap and at least one second optical element is located in the second gap. In an embodiment of the present invention, the first light beam passing through the first transparent substrate, the first optical element, and the first gap is sequentially passed through the optical film, the third transparent substrate, and the third gap to the third gap. The first light sensor.

In an embodiment of the invention, the second transparent substrate is located between the first transparent substrate and the substrate. The first transparent substrate has a first opening to expose a portion of the second transparent substrate located above the second photo sensor, and the second transparent substrate has a second opening to expose the first light A portion of the first light transmissive substrate above the sensor.

In an embodiment of the invention, the first photo sensor and the second photo sensor comprise a complementary metal oxide semiconductor (CMOS) photo sensor or a charge coupled device. , CCDs).

The invention further provides a method for fabricating an optical module, which comprises the following steps. First, a substrate having at least one light sensing array is provided, wherein each light sensing array includes at least a first photo sensor and a second photo sensor. Then, a first gap layer is disposed on the substrate, wherein the first gap layer has a plurality of first openings to expose the first photo sensor and the second photo sensor in each of the light sensing arrays. Thereafter, at least one lens substrate is provided on the first gap layer to form a first imaging system and a second imaging system respectively on the first photo sensor and the second photo sensor.

In an embodiment of the invention, when the at least one lens substrate comprises a first lens substrate, the first lens substrate comprises a first transparent substrate, at least one first optical component and at least one second optical component. The first optical component and the second optical component are disposed on the first transparent substrate and respectively correspond to the first photo sensor and the second photo sensor to respectively constitute the first imaging system and the second imaging system. The first gap layer is disposed between the first lens substrate and the substrate to maintain a first gap between the first photo sensor and the first light transmissive substrate, and the second photo sensor and the first light transmissive substrate A second gap is maintained between. In an embodiment of the invention, the first optical element is located in the first gap and the second optical element is located in the second gap.

In an embodiment of the invention, when at least one lens substrate comprises a first lens substrate and a second lens substrate, the manufacturing method further comprises providing a second gap layer. The second gap layer is located between the first lens substrate and the second lens substrate, and the second lens substrate is located between the first gap layer and the substrate. The second gap layer has a plurality of openings respectively located above the first photo sensor and the second photo sensor in each of the photo sensing arrays. The first lens substrate includes a first transparent substrate and at least one first optical component, and the second lens substrate includes a second transparent substrate and at least one second optical component. The first optical component and the second optical component are respectively disposed on the first transparent substrate and the second transparent substrate and respectively correspond to the first photo sensor and the second photo sensor to respectively constitute the first imaging system and the first Two imaging systems. The first gap layer is disposed between the second lens substrate and the substrate to maintain a third gap between the first photo sensor and the second light transmissive substrate, and the second photo sensor and the second light transmissive substrate A second gap is maintained between. The second gap layer is located between the first lens substrate and the second lens substrate to maintain a first gap between the first lens substrate and the second lens substrate.

In an embodiment of the invention, the first optical element is located in the first gap and the second optical element is located in the second gap.

In an embodiment of the invention, the manufacturing method further comprises forming an optical film on the second transparent substrate, wherein the optical film comprises an infrared light blocking film, a low pass filter or a high pass filter.

In an embodiment of the invention, the manufacturing method further includes forming a third opening on the second transparent substrate to expose the first photo sensor, wherein the first gap communicates with the third gap through the third opening.

Based on the above, the optical module of the present invention configures at least two photosensors on the same substrate, and each of the photo sensors is provided with an independent imaging system to enable the light beams from the outside to be imaged separately. In the detector, the optical module can simultaneously sense at least two types of image frames. In other words, the optical module of the present invention has a function of sensing a plurality of pictures. In addition, since the optical module adopts a wafer level structure, the optical module can strictly control the relative position of each photo sensor and its associated imaging system and reduce the overall volume. In addition, the method for fabricating an optical module provided by the present invention has a relatively simple manufacturing process in addition to the above-described optical module.

The above described features and advantages of the present invention will be more apparent from the following description.

First embodiment

1 is a partial cross-sectional view showing an optical module according to a first embodiment of the present invention. Referring to FIG. 1, the optical module 100 of the present embodiment is adapted to receive a first light beam L1 and a second light beam L2, respectively, wherein the first light beam L1 and the second light beam L2 may have the same or different image information. The light beam, and the embodiment is illustrated by two light beams, but is not limited thereto, and the number of image beams that the optical module can receive depends on the number of light sensors configured. In other words, the number of the two photo sensors is exemplified in the embodiment, but the number of the photo sensors may be two or more.

Referring to FIG. 1 , the optical module 100 includes a substrate 110 , a first photo sensor 120 , a second photo sensor 130 , a first imaging system 140 , and a second imaging system 150 . The first photo sensor 120 and the second photo sensor 130 are disposed on the substrate 110 . In this embodiment, the substrate 110 is, for example, a substrate of a semiconductor substrate, and the first photo sensor 120 and the second photo sensor 130 may be a complementary metal oxide semiconductor (CMOS) sense. A detector or a charge coupled device (CCDs).

The first imaging system 140 is located above the first photo sensor 120, and the first light beam L1 is transmitted to the first photo sensor 120 through the first imaging system 140, as illustrated in FIG. The first imaging system 140 includes a first transparent substrate 142 and at least one first optical component 144 , wherein at least one first optical component 144 is disposed on the first transparent substrate 142 . In this embodiment, the first transparent substrate 142 is, for example, a glass substrate, and the first optical component 144 is, for example, a lens, wherein the lens may be a convex lens as shown in FIG. 1 , and the convex surface of the convex lens is a back surface. The direction toward the first light-transmitting substrate 142. However, in other embodiments not shown, the first optical element 144 can also be designed with a concave lens, depending on the needs and design of the user.

In addition, the second imaging system 150 is located above the second photo sensor 130 , and the second light beam L2 is transmitted to the second photo sensor 130 through the second imaging system 150 . The second imaging system 150 includes a second transparent substrate 152 and at least one second optical component 154 , wherein at least one second optical component 154 is disposed on the second transparent substrate 152 . In this embodiment, the second transparent substrate 152 is, for example, a glass substrate, and the second optical component 154 is, for example, a lens, wherein the lens may be a convex lens as shown in FIG. 1 , and the convex surface of the convex lens is a back surface. The direction toward the second transparent substrate 152. However, in other embodiments not shown, the second optical component 154 can also be designed with a concave lens depending on the needs and design of the user.

In the optical module 100, the first transparent substrate 142 and the second transparent substrate 152 substantially share the same transparent substrate 102a, that is, the first transparent substrate 142 and the second transparent substrate 152 belong to the same block. The light substrate 102a is as shown in FIG. Thus, the first optical element 144 and the second optical element 154 can be simultaneously fabricated on the same transparent substrate 102a at the time of fabrication to form a structure as shown in FIG. In the present embodiment, the substrate on which the first optical element 144 and the second optical element 154 are formed on the same transparent substrate 102a can be regarded as a lens substrate 102.

In addition, the optical module 100 further includes a gap layer 160, wherein the gap layer 160 is disposed between the first transparent substrate 142 and the substrate 110 and between the second transparent substrate 152 and the substrate 110 for the first light transmission. A first gap S1 and a second gap S2 are respectively maintained between the substrate 142 and the substrate 110 and between the second transparent substrate 152 and the substrate 110, as shown in FIG. In this embodiment, the material of the gap layer 160 may be a light-transmitting or non-transmissive material, and preferably a light-transmissive material. Additionally, the thickness of the gap layer 160 may depend on the imaging distance required by the first imaging system 140 and the second imaging system 150.

With reference to FIG. 1 , the first optical component 144 and the second optical component 154 are respectively located in the first gap S1 and the second gap S2 , and the first light beam L1 with image information can pass through the first transparent substrate 142 , An optical element 144 and the first gap S1 are transmitted to the first photo sensor 120, and the second light beam L2 with another image information is passed through the second transparent substrate 152, the second optical element 154, and the second gap. S2 is passed to the second photo sensor 130. In this way, the optical module 100 can sense two kinds of picture information respectively.

Based on the above, the optical module 100 of the present embodiment is configured to dispose the first photo sensor 120 and the second photo sensor 130 on the same substrate 110, and use the independent imaging systems 140, 150 to transmit the light beam L1. L2 is respectively formed on the first photo sensor 120 and the second photo sensor 130, so that the optical module 100 can simultaneously sense two image frames.

In addition, when the optical module 100 is provided with more light sensors on the substrate 110 and each is equipped with an independent optical system to respectively form multiple light beams on the light sensors, the optical module can be The 100 has multi-screen sensing capabilities that can be applied to 3D cameras or medical diagnostic instruments. In addition, when the optical module 100 is applied to a 3D camera or a medical diagnostic instrument, the optical module 100 is based on a wafer level structure, so that the relative position of each photosensor and its associated imaging system can be strictly controlled. It can also reduce the overall size of the 3D camera or medical diagnostic instrument and simplify its circuit design.

Based on the above, the present invention further provides a method of fabricating the optical module 100 described above, which is described below.

2A to 2C are flowcharts showing the fabrication of the optical module according to the first embodiment of the present invention. Please refer to FIG. 2A . First, a substrate 210 having at least one light sensing array 212 is provided. Each of the light sensing arrays 212 includes at least the first photo sensor 120 and the second photo sensor 130 described above. In this embodiment, the number of the light sensing arrays 212 is multiple, and a plurality of virtual dividing lines 214 may be disposed between the light sensing arrays 212 to facilitate subsequent cutting processes. The respective optical modules can be formed by cutting according to the dividing line 214.

Next, a gap layer 220 is provided, and the gap layer 220 is disposed on the substrate 210, as shown in FIG. 2B, wherein the gap layer 220 has a plurality of openings 222, and the openings 222 can be exposed in each of the light sensing arrays 212. The first photo sensor 120 and the second photo sensor 130. In the present embodiment, the gap layer 220 is, for example, the aforementioned gap layer 160.

Then, a lens substrate 102 is provided on the gap layer 220, and the substrate 210, the gap layer 220 and the lens substrate 102 are assembled, and respectively formed on the first photo sensor 120 and the second photo sensor 130. The aforementioned first imaging system 140 and second imaging system 150 are as shown in FIGS. 1 and 2C. In this embodiment, after the substrate 210, the gap layer 220, and the lens substrate 102 are respectively provided, after the three members are aligned, and the cutting process is performed along the separation line 214, a plurality of The optical module 100 is illustrated in FIG.

According to the above manufacturing method, the method for fabricating the optical module 100 only needs to separately provide a required substrate having a light sensing array, a gap layer having an opening exposing the light sensing array, and having corresponding to each photosensor. The optical module 100 shown in FIG. 1 can be formed by aligning the lens substrates of the optical system and then aligning the components. In other words, if the method of fabricating the optical module 100 is applied to a 3D camera or a medical diagnostic instrument, the module process for manufacturing a 3D camera or a medical diagnostic instrument can be shortened.

Second embodiment

3 is a partial cross-sectional view showing an optical module according to a second embodiment of the present invention. Referring to FIG. 3, the optical module 300 of the present embodiment is similar in structure to the optical module 100, except that the first imaging system 140a further includes a third transparent substrate 146, wherein the third transparent substrate 146 The first transparent substrate 142 and the second transparent substrate 152 substantially share the same transparent substrate 103a. In other words, the optical module 300 of the present embodiment has two lens substrates 101 and 103, wherein the lens substrate 103 is located between the lens substrate 101 and the substrate 110, and the lens substrate 101 is the first transparent substrate 142 and the first optical component. The combination of 144, and the lens substrate 103 is a combination of the second transparent substrate 152, the second optical element 154, and the third transparent substrate 146.

In this embodiment, the optical module 300 further includes a plurality of gap layers 310, wherein the gap layers 310 are disposed between the first transparent substrate 142 and the third transparent substrate 146, and the second transparent substrate 152 and the substrate 110 are disposed. Between the third transparent substrate 146 and the substrate 110, and between the first transparent substrate 142 and the third transparent substrate 146, between the second transparent substrate 152 and the substrate 110, and the third light transmission. A first gap S1, a second gap S2 and a third gap S3 are maintained between the substrate 146 and the substrate 110, wherein the first optical element 144 of the first imaging system 140a is located in the first gap S1, and the second imaging system The second optical element 154 of 150 is located in the second gap S2 as shown in FIG.

In addition, in order to improve the imaging quality or optical characteristics of the optical module 300, the optical module 300 further includes an optical film 320, wherein the optical film 320 is disposed on the transparent substrate 103a, as shown in FIG. In the embodiment, the optical film 320 is, for example, an infrared light blocking film, a low pass filter or a high pass filter. In detail, the first light beam L1 passing through the first transparent substrate 142, the first optical element 144 and the first gap S1 may sequentially pass through the optical film 320, the third transparent substrate 146 and the third gap S3. Transfer to the first photo sensor 120. The second light beam L2 can be sequentially transmitted to the second photo sensor 130 through the optical film 320, the second transparent substrate 152, the second optical element 154, and the second gap S2. Therefore, the optical module 300 of the present embodiment can also be separately used with the independent imaging systems 140a, 150 to respectively form the first photo sensor 120 and the second photo sensor 130, thereby enabling the optical mode. Group 300 can simultaneously sense two image frames. If the optical film 320 is disposed on the third transparent substrate 146 and is not disposed on the second transparent substrate 152, the second light beam L2 can be sequentially passed through. The second transparent substrate 152 , the second optical element 154 and the second gap S2 are transmitted to the second photo sensor 130 .

It is worth mentioning that since the first optical element 144 and the second optical element 154 are disposed on different transparent substrates, the distance between the first optical element 144 and the second optical element 154 relative to the substrate 110 may be different. As such, the first optical element 144 and the second optical element 154 can respectively use lenses of different focal lengths, and the light beams L1, L2 can be preferably imaged on the first photo sensor 120 and the second photo sensor 130.

Based on the above, the optical module 300 of the present embodiment is similar in structure to the optical module 100, and the concepts adopted by the two are similar. Therefore, the optical module 300 also has the advantages mentioned in the optical module 100 described above. I won't go into details.

In addition, this embodiment also proposes a method of fabricating the optical module 300 described above, which is described below.

Since the optical module 300 has two lens substrates 101 and 103, the present embodiment can provide FIG. 3 separately after providing the substrate 210 having the at least one light sensing array 212, as compared with the manufacturing method of the optical module 100. The gap layer 310, the lens substrate 103, the optical film 320, the gap layer 310, and the lens substrate 101 are shown, and these members are sequentially disposed on the substrate 210, and these members are aligned. In this way, the optical module 300 can be formed as shown in FIG. 3 , and the detailed description of the steps and description can refer to and apply the manufacturing method of the optical module 100 of the previous embodiment, and details are not described herein again.

Similarly, since the method of fabricating the optical module 300 is similar to the method of fabricating the optical module 100, the method of fabricating the optical module 300 of the present embodiment also has the advantages described in the foregoing method of fabricating the optical module 100. This will not be repeated.

Third embodiment

4 is a partial cross-sectional view showing an optical module according to a third embodiment of the present invention. Referring to FIG. 4, the optical module 400 of the present embodiment is similar in structure to the optical module 300, except that the second transparent substrate 152 is located between the first transparent substrate 142 and the substrate 110, and is first. The transparent substrate 142 has a first opening P1 to expose a portion of the second transparent substrate 142 located above the second photo sensor 130, and the second transparent substrate 152 has a second opening P2 to expose A portion of the first light transmissive substrate 142 is located above the first photo sensor 120. In other words, the optical module 400 of the present embodiment has two lens substrates 105, 107, wherein the lens substrate 107 is located between the lens substrate 105 and the substrate 110, and the lens substrate 105 is composed of the first transparent substrate 142 and the first optical component. The combination of 144, and the lens substrate 107 is a combination of the second transparent substrate 152 and the second optical element 154, as shown in FIG.

In this embodiment, the optical module 400 further includes a plurality of gap layers 410, wherein the gap layers 410 are disposed between the lens substrate 107 and the substrate 110 and between the lens substrate 105 and the lens substrate 107 to respectively A first between the light substrate 142 and the second transparent substrate 152, between the second photo sensor 130 and the second transparent substrate 152, and between the first photo sensor 120 and the second transparent substrate 152 a gap S1, a second gap S2 and a third gap S3, wherein the first optical element 144 of the first imaging system 140a is located in the first gap S1, and the second optical element 154 of the second imaging system 150a is located in the second gap In S2, as shown in FIG. Further, the first gap S1 communicates with the third gap S3 through the second opening P2 described above.

In this embodiment, the first light beam L1 passing through the first transparent substrate 142, the first optical element 144, and the first gap S1 may be sequentially transmitted to the first light through the second opening P2 and the third gap S3. Sensor 120. The second light beam L2 can be transmitted to the second photo sensor 130 through the first opening P1, the second transparent substrate 152, the second optical element 154 and the second gap S2. Therefore, the optical module 400 of the present embodiment also uses the respective independent imaging systems 140a, 150a to image the light beams L1, L2 on the first photo sensor 120 and the second photo sensor 130, respectively, to enable optical The module 400 can simultaneously sense two kinds of image frames.

Similarly, since the distance between the first optical element 144 and the second optical element 154 is different from the substrate 110, the first optical element 144 and the second optical element 154 can also adopt different focal length lenses, respectively, so that the light beams L1, L2 It can be preferably imaged on the first photo sensor 120 and the second photo sensor 130.

Based on the above, the optical module 400 of the present embodiment is similar in structure to the optical module 300, and the concepts adopted by the two are similar. Therefore, the optical module 400 also has the advantages mentioned in the optical module 300 described above. I won't go into details.

In addition, this embodiment also proposes a method of fabricating the optical module 400 described above, which is described below.

Since the optical module 400 has two lens substrates 105 and 107, similar to the manufacturing method of the optical module 300, in the present embodiment, after the substrate 210 having the at least one light sensing array 212 is provided, the method of FIG. 4 can be separately provided. The gap layer 410, the lens substrate 107, the gap layer 410, and the lens substrate 105 are shown, and these members are sequentially disposed on the substrate 210, and these members are aligned. In this way, the optical module 400 can be formed as shown in FIG. 4 , and the detailed steps and descriptions of the optical module 100 or 300 of the previous embodiment can be referred to, and will not be described herein.

Similarly, since the method of fabricating the optical module 400 is similar to the method of fabricating the optical module 300, the method of fabricating the optical module 400 of the present embodiment also has the advantages described by the method of fabricating the optical module 100, 300. I will not repeat them here.

In addition, in order to improve the imaging quality or optical characteristics of the optical module 400, the optical module 400a may further include an optical film 420, wherein the optical film 420 is disposed on the second transparent substrate 152, as shown in FIG. Show. In the embodiment, the optical film 420 is, for example, an infrared light blocking film, a low pass filter or a high pass filter. In detail, the first light beam L1 sequentially passing through the first transparent substrate 142 , the first optical element 144 and the first gap S1 may be transmitted to the first photo sensor 120 through the optical film 420 . The second light beam L2 can be sequentially transmitted to the second photo sensor 130 through the optical film 420, the second transparent substrate 152, the second optical element 154, and the second gap S2. In other words, the optical module 400a of the present embodiment can also be used separately with the independent imaging systems 140a, 150a to respectively form the first photo sensor 120 and the second photo sensor 130, thereby enabling the optical mode. Group 400a can simultaneously sense two image frames.

In summary, the optical module of the present invention configures at least two photosensors on the same substrate, and each of the photo sensors is provided with an independent imaging system so that beams from the outside can be separately imaged. On these sensors, the optical module can simultaneously sense at least two types of image frames. In other words, the optical module of the present invention has a function of sensing a plurality of pictures, and thus can be applied to a 3D camera or a medical diagnostic instrument.

In addition, since the optical module is a wafer-level structure, when the optical module is applied to a 3D camera or a medical diagnostic instrument, the relative position of each photosensor and its associated imaging system can be strictly controlled and reduced. The overall size of the 3D camera or medical diagnostic instrument and the simplification of its circuit design.

In addition, the method for fabricating an optical module provided by the present invention only needs to separately provide a required substrate having a light sensing array, a gap layer having an opening exposing the light sensing array, and having an optical corresponding to each photosensor. The lens substrate of the system, even an optical film which can improve the imaging quality or optical characteristics of the optical module, and then align these components to form a plurality of optical modules. In other words, the method for fabricating the optical module provided by the present invention has a relatively simple fabrication step.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 300, 400. . . Optical module

101, 102, 103, 105, 107. . . Lens substrate

102a. . . Light transmissive substrate

103a. . . Light transmissive substrate

110. . . Substrate

120. . . First light sensor

130. . . Second light sensor

140, 140a. . . First imaging system

142. . . First transparent substrate

144. . . First optical component

146. . . Third transparent substrate

150, 150a. . . Second imaging system

152. . . Second transparent substrate

154. . . Second optical component

160, 220, 310, 410. . . Gap layer

210. . . Substrate

212. . . Light sensing array

214. . . Separation line

222. . . Opening

320. . . Optical diaphragm

L1. . . First beam

L2‧‧‧second beam

P1‧‧‧ first opening

P2‧‧‧ second opening

S1‧‧‧First gap

S2‧‧‧Second gap

S3‧‧‧ third gap

1 is a partial cross-sectional view showing an optical module according to a first embodiment of the present invention.

2A to 2C are flowcharts showing the fabrication of the optical module according to the first embodiment of the present invention.

3 is a partial cross-sectional view showing an optical module according to a second embodiment of the present invention.

4 is a partial cross-sectional view showing an optical module according to a third embodiment of the present invention.

FIG. 5 is a partial cross-sectional view of an optical module according to another embodiment of the present invention.

100. . . Optical module

102. . . Lens substrate

102a. . . Light transmissive substrate

110. . . Substrate

120. . . First light sensor

130. . . Second light sensor

140. . . First imaging system

142. . . First transparent substrate

144. . . First optical component

150. . . Second imaging system

152. . . Second transparent substrate

154. . . Second optical component

160. . . Gap layer

L1. . . First beam

L2. . . Second beam

S1. . . First gap

S2. . . Second gap

Claims (16)

An optical module, configured to receive a first light beam and a second light beam, respectively, comprising: a substrate; a first photo sensor disposed on the substrate; a second photo sensor disposed on the substrate a first imaging system is disposed above the first photo sensor, and the first light beam is transmitted to the first photo sensor through the first imaging system, the first imaging system includes a first a transparent substrate and at least one first optical component, wherein the at least one first optical component is disposed on the first transparent substrate; a second imaging system is located on the second photosensor, and the second The light beam is transmitted to the second light sensor through the second imaging system, the second imaging system includes a second transparent substrate and at least one second optical component, wherein the at least one second optical component is disposed in the first And a gap layer disposed between the first transparent substrate and the substrate and between the second transparent substrate and the substrate to respectively be respectively disposed on the first transparent substrate and the substrate And maintaining a second between the second transparent substrate and the substrate a gap and a second gap, wherein the at least one first optical component is located in the first gap, the at least one second optical component is located in the second gap, and the first light beam passes through the first transparent substrate, The first optical element and the first gap are transmitted to the first photo sensor, and the second light beam is transmitted to the first light transmissive substrate, the second optical element, and the second gap Two light sensors. The optical module of claim 1, wherein the first transparent substrate and the second transparent substrate substantially share the same transparent substrate. The optical module of claim 1, wherein the first imaging system further comprises a third transparent substrate disposed between the first transparent substrate and the substrate, and the third transparent substrate is The second transparent substrate shares the same transparent substrate. The optical module of claim 3, further comprising an optical film disposed on the third transparent substrate. The optical module of claim 4, wherein the optical film comprises an infrared light blocking film, a low pass filter or a high pass filter. The optical module of claim 3, further comprising a plurality of gap layers disposed between the third transparent substrate and the substrate, between the second transparent substrate and the substrate, and the first Between the transparent substrate and the third transparent substrate, between the first transparent substrate and the third transparent substrate, between the second transparent substrate and the substrate, and the third transparent substrate Holding a first gap, a second gap and a third gap with the substrate, wherein the at least one first optical component is located in the first gap, and the at least one second optical component is located in the second gap . The optical module of claim 6, wherein the first light-transmitting substrate, the first optical element, and the first light beam of the first gap pass through the optical film sequentially, The third transparent substrate and the third gap are transmitted to the first photo sensor. The optical module of claim 1, wherein the The first transparent substrate has a first opening to expose a portion of the second transparent substrate above the second photo sensor. And the second transparent substrate has a second opening to expose a portion of the first transparent substrate above the first photo sensor. The optical module of claim 1, wherein the first photo sensor and the second photo sensor comprise a complementary metal oxide semiconductor (CMOS) photo sensor or A charge coupled device (CCDs). A method for fabricating an optical module includes: providing a substrate having at least one light sensing array, wherein each of the light sensing arrays includes at least a first photo sensor and a second photo sensor; Configuring a first gap layer on the substrate, wherein the first gap layer has a plurality of first openings to expose the first light sensor and the second light sensor in each of the light sensing arrays; Providing at least one lens substrate on the first gap layer to form a first imaging system and a second imaging system respectively on the first photo sensor and the second photo sensor, wherein the at least one When the lens substrate includes a first lens substrate, the first lens substrate includes a first transparent substrate, at least one first optical component and at least one second optical component, and the first optical component and the second optical component are disposed on the first optical component The first light-transmissive substrate and the first light sensor and the second light sensor respectively are configured to respectively constitute the first imaging system and the second imaging system, and the first gap layer is located at the first Between a lens substrate and the substrate, respectively The first optical sensor and the first light-transmissive A first gap is maintained between the substrates and a second gap is maintained between the second photosensor and the first transparent substrate. The method of fabricating an optical module according to claim 10, wherein the first optical component is located in the first gap and the second optical component is located in the second gap. The method of manufacturing the optical module of claim 10, wherein when the at least one lens substrate comprises a first lens substrate and a second lens substrate, the manufacturing method further comprises providing a second gap layer. Between the first lens substrate and the second lens substrate, the second lens substrate is located between the first gap layer and the substrate, the second gap layer has a plurality of openings, wherein the openings are respectively located Above the first photo sensor and the second photo sensor in the light sensing array, the first lens substrate comprises a first transparent substrate and at least one first optical component, and the second lens substrate comprises a second transparent substrate and at least one second optical component, wherein the first optical component and the second optical component are respectively disposed on the first transparent substrate and the second transparent substrate and respectively correspond to the first light a sensor and the second photo sensor to respectively form the first imaging system and the second imaging system, and the first gap layer is located between the second lens substrate and the substrate to respectively respectively a light sensor and the second through Holding a third gap between the substrate and maintaining a second gap between the second photo sensor and the second transparent substrate, the second gap layer is located between the first lens substrate and the second lens substrate A first gap is maintained between the first lens substrate and the second lens substrate. Production of an optical module as described in claim 12 The method wherein the first optical component is in the first gap and the second optical component is in the second gap. The method of fabricating the optical module of claim 12, further comprising forming an optical film on the second transparent substrate, wherein the optical film comprises an infrared light blocking film and a low pass filter. Or a high pass filter. The method of manufacturing the optical module of claim 12, further comprising forming a third opening on the second transparent substrate to expose the first photo sensor, wherein the first gap is transparent The third opening is in communication with the third gap. The method for fabricating an optical module according to claim 10, wherein the first photo sensor and the second photo sensor comprise a complementary metal oxide semiconductor (CMOS) light sensation. A detector or a charge coupled device (CCDs).