TWI434230B - Image defect instpection system and method - Google Patents

Image defect instpection system and method Download PDF

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TWI434230B
TWI434230B TW99111319A TW99111319A TWI434230B TW I434230 B TWI434230 B TW I434230B TW 99111319 A TW99111319 A TW 99111319A TW 99111319 A TW99111319 A TW 99111319A TW I434230 B TWI434230 B TW I434230B
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TW201135668A (en
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Chinsheng Chen
Chienliang Huang
Chunwei Yeh
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Univ Nat Taipei Technology
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影像瑕疵檢測系統以及方法Image flaw detection system and method

本發明是有關於一種瑕疵檢測系統以及方法,且特別是有關於一種影像瑕疵檢測系統以及方法。The present invention relates to a flaw detection system and method, and more particularly to an image flaw detection system and method.

近年來,在製程中為了維持較佳良率,瑕疵檢測成本佔有相當大的比重。但瑕疵檢測所使用之相關設備大部分還是由國外廠商所提供,其投資成本相當的昂貴。如此具有重要性、技術性與高價值之檢測設備,完全被國外廠商所掌握,不僅令國內相關業者必須斥資鉅額資金購置使用,且在實際應用上,需要調整設備以及適應製程。上述調整往往因地緣關係而得不到立即且完善的技術服務。於是,造成產能及良率之降低,且嚴重耽誤產品交貨時程且提高製造成本。In recent years, in order to maintain a good yield in the process, the cost of testing has a considerable proportion. However, most of the related equipment used in the detection of cockroaches is still provided by foreign manufacturers, and the investment cost is quite expensive. Such an important, technical and high-value testing equipment is completely controlled by foreign manufacturers. Not only does the domestic related industry have to spend huge sums of money to purchase and use, but in practical applications, it needs to adjust equipment and adapt to the process. The above adjustments often result in immediate and perfect technical services due to geographical relationships. As a result, the production capacity and yield are reduced, and the product delivery schedule is seriously delayed and the manufacturing cost is increased.

此外,大面積影像之瑕疵檢測包含許多高運算量且資料低關聯性之程式。先前技術多半藉由電腦之中央處理元件(Central Processing Unit,CPU)處理大面積影像之瑕疵檢測之程式。然而,目前CPU之核心數較少,限制了CPU同時處理的瑕疵檢測之程式數量,增加了瑕疵檢測程式所需的執行時間。In addition, the detection of large-area images contains many programs with high computational complexity and low correlation of data. Most of the prior art processes the detection of large-area images by the central processing unit (CPU) of the computer. However, at present, the number of cores of the CPU is small, which limits the number of programs that the CPU processes at the same time, and increases the execution time required for the detection program.

因此,本發明之一態樣是在提供一種影像瑕疵檢測系統,用以藉由具有較多核心(core)之圖形處理元件(Graphic Processing Unit,GPU),平行處理一待測影像之多個區塊。影像瑕疵檢測系統包含一圖形處理元件以及一中央處理元件。圖形處理元件包含數個圖形處理核心。中央處理元件電性連接圖形處理元件。中央處理元件包含一影像取得模組、一影像分割模組、一圖形處理元件驅動模組以及一瑕疵群聚模組。影像取得模組取得一待測影像。影像分割模組將待測影像分為數個待測區塊。圖形處理元件驅動模組驅動圖形處理核心平行處理待測區塊,藉此使圖形處理核心自待測區塊,取得數個瑕疵點。瑕疵群聚模組將瑕疵點群聚為至少一瑕疵群組。Therefore, an aspect of the present invention provides an image detection system for processing a plurality of regions of a to-be-tested image in parallel by a graphic processing unit (GPU) having a plurality of cores. Piece. The image detection system includes a graphics processing component and a central processing component. The graphics processing component contains several graphics processing cores. The central processing component is electrically coupled to the graphics processing component. The central processing component includes an image acquisition module, an image segmentation module, a graphics processing component driver module, and a clustering module. The image acquisition module obtains an image to be tested. The image segmentation module divides the image to be tested into a plurality of blocks to be tested. The graphics processing component driving module drives the graphics processing core to process the block to be tested in parallel, thereby enabling the graphics processing core to obtain a plurality of defects from the block to be tested. The 瑕疵 clustering module groups the points into at least one group.

本發明之另一態樣是在提供一種影像瑕疵檢測方法,用以藉由電腦中具有較多核心之圖形處理元件,平行處理一待測影像之多個區塊。影像瑕疵檢測方法包含以下步驟:取得一待測影像至一電腦。其中,電腦包含一中央處理元件以及一圖形處理元件,圖形處理元件包含數個圖形處理核心。將待測影像分為數個待測區塊。藉由圖形處理核心平行處理待測區塊,以自待測區塊取得數個瑕疵點。藉由中央處理元件將瑕疵點群聚為至少一瑕疵群組。Another aspect of the present invention provides an image detection method for processing a plurality of blocks of a to-be-tested image in parallel by a graphics processing component having a plurality of cores in a computer. The image detection method includes the following steps: obtaining an image to be tested to a computer. The computer includes a central processing component and a graphics processing component, and the graphics processing component includes a plurality of graphics processing cores. The image to be tested is divided into several blocks to be tested. The block to be tested is processed in parallel by the graphics processing core to obtain a plurality of defects from the block to be tested. The points are clustered into at least one group by a central processing element.

由上述本發明實施方式可知,應用本發明具有下列優點。由於圖形處理元件具有較中央處理元件多之核心,因此將自待測影像取得多個瑕疵點之運算藉由圖形處理元件處理,可使得較多之瑕疵點運算同時於各核心處理。在本發明之一實施例應用於面板瑕疵檢測時,待測面板之尺寸越大,拍攝待測面板而取得之待測影像可分割出之區塊數越多,因此同時藉由圖形處理元件之多個核心平行處理可大大地縮短面板瑕疵檢測之執行時間。另外,在本發明所檢測之待測影像之資料量越高時,待測影像可分割出之區塊數越多,因此同時藉由圖形處理元件之多個核心平行處理亦可大量減少瑕疵檢測之執行時間。此外,藉由電腦之中央處理元件以及其顯示卡之圖形處理元件即可進行影像瑕疵檢測,所需硬體成本較為低廉。另外,可藉由多個瑕疵點所群聚成之瑕疵群組,輔助判斷影像上瑕疵產生之原因。It will be apparent from the above-described embodiments of the present invention that the application of the present invention has the following advantages. Since the graphics processing component has more cores than the central processing component, the operation of acquiring multiple defects from the image to be tested is processed by the graphics processing component, so that more processing operations can be performed simultaneously on each core. When the embodiment of the present invention is applied to the panel 瑕疵 detection, the larger the size of the panel to be tested, the more the number of blocks that can be divided by the image to be tested obtained by taking the panel to be tested, and thus the graphics processing component Multiple core parallel processing can greatly reduce the execution time of panel defects. In addition, the higher the amount of data of the image to be tested detected by the present invention, the more the number of blocks that can be divided into the image to be tested, so that the parallel processing of the plurality of cores of the graphics processing component can also greatly reduce the detection of defects. Execution time. In addition, image defect detection can be performed by the central processing unit of the computer and the graphics processing component of the display card, and the required hardware cost is relatively low. In addition, it is possible to determine the cause of the occurrence of defects on the image by grouping a plurality of defects into groups.

請參照第1圖,其繪示依照本發明一實施方式的一種影像瑕疵檢測系統之功能方塊圖。影像瑕疵檢測系統藉由具有較多核心之圖形處理元件,平行處理一待測影像之多個區塊。Please refer to FIG. 1 , which is a functional block diagram of an image detection system according to an embodiment of the invention. The image detection system processes a plurality of blocks of a to-be-tested image in parallel by a graphics processing component having more cores.

影像瑕疵檢測系統100包含一圖形處理元件110以及一中央處理元件120。圖形處理元件110包含數個圖形處理核心112、113、...、11n。中央處理元件120電性連接圖形處理元件110。中央處理元件120包含一影像取得模組121、一影像分割模組122、一圖形處理元件驅動模組123以及一瑕疵群聚模組124。影像取得模組121取得一待測影像。The image detection system 100 includes a graphics processing component 110 and a central processing component 120. Graphics processing component 110 includes a plurality of graphics processing cores 112, 113, ..., 11n. The central processing component 120 is electrically coupled to the graphics processing component 110. The central processing component 120 includes an image acquisition module 121, an image segmentation module 122, a graphics processing component driver module 123, and a clustering module 124. The image acquisition module 121 obtains an image to be tested.

其中,影像瑕疵檢測系統100可應用於面板瑕疵檢測。因此,影像瑕疵檢測系統100可包含與中央處理元件120電性連接之一拍攝元件140。如此一來,可藉由拍攝元件拍攝一待測面板200,以取得待測影像。然而,在其他實施例中,影像瑕疵檢測系統100可包含多個拍攝元件,用以對待測面板200進行拍攝,並不限於本實施例。如此一來,影像取得模組121可自拍攝元件140取得一待測面板之待測影像。然而,在其他實施例中,可使拍攝元件拍攝其他待測物,而取得待測影像,並不限於本實施例。The image flaw detection system 100 can be applied to panel flaw detection. Accordingly, the image detection system 100 can include an imaging element 140 that is electrically coupled to the central processing component 120. In this way, a panel 200 to be tested can be taken by the imaging component to obtain an image to be tested. However, in other embodiments, the image detection system 100 may include a plurality of imaging elements for capturing the panel 200 to be tested, and is not limited to the embodiment. In this way, the image acquisition module 121 can obtain the image to be tested of the panel to be tested from the imaging component 140. However, in other embodiments, the imaging element may be caused to capture other objects to be tested to obtain an image to be tested, and is not limited to the embodiment.

此外,影像瑕疵檢測系統100可包含與中央處理元件120電性連接之一資料傳輸介面130。其中,資料傳輸介面130可為匯流排、網路卡或其他資料傳輸介面。如此一來,影像取得模組121可透過資料傳輸介面130,自其他裝置取得待測影像。In addition, the image detection system 100 can include a data transmission interface 130 electrically coupled to the central processing component 120. The data transmission interface 130 can be a bus, a network card or other data transmission interface. In this way, the image acquisition module 121 can obtain the image to be tested from other devices through the data transmission interface 130.

影像分割模組122將待測影像分為數個待測區塊。圖形處理元件驅動模組123驅動圖形處理核心112、113、...、11n平行處理待測區塊,藉此使圖形處理核心112、113、...、11n分別自各待測區塊,取得數個瑕疵點。其中,圖形處理元件驅動模組123可藉由計算統一設備架構(Compute Unified Device Architecture,CUDA)或其他驅動多核心之圖形處理元件110之架構,驅動圖形處理核心112、113、...、11n。此外,圖形處理核心112、113、...、11n係藉由拉普拉斯運算(Laplacian)、平滑運算(Smoothing)、適應性二值化運算(Adaptive thresholding)或其他影像處理方式,自待測區塊取得數個瑕疵點。The image segmentation module 122 divides the image to be tested into a plurality of blocks to be tested. The graphics processing component driving module 123 drives the graphics processing cores 112, 113, ..., 11n to process the blocks to be tested in parallel, thereby obtaining the graphics processing cores 112, 113, ..., 11n from the respective blocks to be tested. A few defects. The graphics processing component driver module 123 can drive the graphics processing cores 112, 113, ..., 11n by computing the architecture of a Compute Unified Device Architecture (CUDA) or other graphics processing component 110 that drives multiple cores. . In addition, the graphics processing cores 112, 113, ..., 11n are self-contained by Laplacian, Smoothing, Adaptive thresholding, or other image processing methods. The test block has several defects.

瑕疵群聚模組124將瑕疵點群聚為至少一瑕疵群組。其中,瑕疵群聚模組124可先藉由運行長度編碼(Running Length Encoding,RLE),將相鄰之瑕疵點組成數個瑕疵線段。接下來,瑕疵群聚模組124藉由物件表(blob table),將瑕疵線段中相連者組成數個瑕疵物件。然後,瑕疵群聚模組124根據瑕疵物件的空間關係,將瑕疵物件群聚為至少一瑕疵群組。如此一來,即可取得待測影像上之瑕疵群組。The 瑕疵 clustering module 124 clusters the defects into at least one group. The 瑕疵 clustering module 124 can first form a plurality of 瑕疵 line segments by running length encoding (RLE). Next, the 瑕疵 clustering module 124 forms a plurality of objects in the 瑕疵 line segment by means of a blob table. Then, the 瑕疵 clustering module 124 groups the objects into at least one group according to the spatial relationship of the objects. In this way, the group on the image to be tested can be obtained.

圖形處理元件110可包含電性連接圖形處理核心112、113、...、11n之一記憶體111。其中,影像分割模組122可將待測影像分為多個待測區塊後,將待測區塊分別儲存至記憶體111之多個儲存區塊。如此一來,各圖形處理核心112、113、...、11n可自記憶體111之各儲存區塊,取得待測影像之各待測區塊,以進行處理。The graphics processing component 110 can include a memory 111 that is electrically coupled to one of the graphics processing cores 112, 113, ..., 11n. The image segmentation module 122 can divide the image to be tested into a plurality of storage blocks of the memory 111 after dividing the image to be tested into a plurality of blocks to be tested. In this way, each graphics processing core 112, 113, ..., 11n can obtain each of the to-be-tested blocks of the image to be tested from the storage blocks of the memory 111 for processing.

此外,影像分割模組122可將待測影像直接儲存至記憶體111,並根據待測影像存於記憶體之影像儲存位址,計算各待測區塊之區塊儲存位址。各圖形處理核心112、113、...、11n根據區塊儲存位址,自記憶體111取得各待測區塊,以進行處理。如此一來,影像分割模組122不需實際分割待測影像,即可模擬將待測影像分為多個待測區塊。In addition, the image segmentation module 122 can directly store the image to be tested to the memory 111, and calculate the block storage address of each block to be tested according to the image storage address of the image to be tested. Each of the graphics processing cores 112, 113, ..., 11n obtains each of the blocks to be tested from the memory 111 for processing according to the block storage address. In this way, the image segmentation module 122 can simulate dividing the image to be tested into multiple blocks to be tested without actually dividing the image to be tested.

請參照第2圖,其係依照本發明另一實施方式的一種影像瑕疵檢測方法之流程圖。影像瑕疵檢測方法藉由電腦中具有較多核心之圖形處理元件,平行處理一待測影像之多個區塊。Please refer to FIG. 2, which is a flowchart of an image detection method according to another embodiment of the present invention. The image detection method parallelly processes a plurality of blocks of a to-be-tested image by using a graphics processing component having more cores in the computer.

影像瑕疵檢測方法300包含以下步驟:在步驟310中,取得一待測影像至一電腦。電腦包含一中央處理元件以及一圖形處理元件,圖形處理元件包含數個圖形處理核心。The image detection method 300 includes the following steps: In step 310, an image to be tested is obtained to a computer. The computer includes a central processing component and a graphics processing component, and the graphics processing component includes a plurality of graphics processing cores.

在步驟320中,將待測影像分為數個待測區塊。接下來,藉由各圖形處理核心平行處理各待測區塊(步驟330),以自待測區塊取得多個瑕疵點(步驟340)。其中,圖形處理核心可藉由拉普拉斯運算、平滑運算、適應性二值化運算或其他影像處理方式,平行處理待測區塊(步驟330),以自待測區塊取得瑕疵點(步驟340)。In step 320, the image to be tested is divided into a plurality of blocks to be tested. Next, each of the blocks to be tested is processed in parallel by each graphics processing core (step 330) to obtain a plurality of defects from the block to be tested (step 340). The graphics processing core may process the block to be tested in parallel by using a Laplacian operation, a smoothing operation, an adaptive binarization operation, or other image processing methods (step 330) to obtain a defect from the block to be tested ( Step 340).

在步驟350中,藉由中央處理元件將瑕疵點群聚為至少一瑕疵群組。其中,中央處理元件可先藉由運行長度編碼,將相鄰之瑕疵點組成數個瑕疵線段。接下來,中央處理元件藉由物件表,將瑕疵線段中相連者組成數個瑕疵物件。然後,中央處理元件根據瑕疵物件的空間關係,將瑕疵物件群聚為至少一瑕疵群組。如此一來,即可藉由中央處理元件將瑕疵點群聚為至少一瑕疵群組(步驟350)。In step 350, the points are grouped into at least one group by a central processing element. The central processing component may first be encoded by running length, and the adjacent defects are formed into a plurality of 瑕疵 line segments. Next, the central processing component forms a number of objects by connecting the connected segments by the object table. Then, the central processing component groups the objects into at least one group according to the spatial relationship of the objects. In this way, the defects can be clustered into at least one group by the central processing component (step 350).

其中,步驟310可有多個實施方式。在一實施例中,可在步驟310前,拍攝一待測面板,以取得待測面板之待測影像(步驟310)。如此一來,可藉由影像瑕疵檢測方法300進行面板檢測。然而,在其他實施例中,可在步驟310前,拍攝其他待測物,以取得待測物之待測影像(步驟310),並不限於本實施例。There are multiple embodiments of step 310. In an embodiment, before the step 310, a panel to be tested may be taken to obtain an image to be tested of the panel to be tested (step 310). In this way, the panel detection can be performed by the image detection method 300. However, in other embodiments, before the step 310, other objects to be tested may be taken to obtain an image to be tested of the object to be tested (step 310), and is not limited to the embodiment.

在另一實施例中,電腦可包含一資料傳輸介面,而待測影像係透過資料傳輸介面所取得(步驟310)。其中,資料傳輸介面可為匯流排、網路卡或其他資料傳輸介面。如此一來,可透過資料傳輸介面,自其他裝置取得待測影像。In another embodiment, the computer can include a data transmission interface, and the image to be tested is obtained through the data transmission interface (step 310). The data transmission interface can be a bus, a network card or other data transmission interface. In this way, the image to be tested can be obtained from other devices through the data transmission interface.

在又一實施例中,可取得一待測圖檔,並自待測圖檔擷取待測圖檔之一原始影像資料(raw data),以作為待測影像。其中,待測圖檔之格式可為位元映像(bitmap,bmp)、聯合照相專家群(joint photographic experts group,jpeg)或其他圖檔格式。In another embodiment, a to-be-tested image file can be obtained, and raw data of one of the to-be-tested image files is taken from the image to be tested as the image to be tested. The format of the image to be tested may be a bitmap (bmp), a joint photographic experts group (jpeg) or other image format.

第3圖係第2圖中將待測影像分為數個區塊(步驟320),並藉由各圖形處理核心平行處理各待測區塊(步驟330)之一實施例。其中,圖形處理元件更包含一記憶體。將待測影像分為待測區塊(步驟320),並藉由圖形處理核心平行處理待測區塊(步驟330)包含:在步驟410中,將待測影像存入圖形處理元件之記憶體。Figure 3 is a diagram in which the image to be tested is divided into a plurality of blocks in step 2 (step 320), and an embodiment of each block to be tested (step 330) is processed in parallel by each graphics processing core. The graphics processing component further includes a memory. Dividing the image to be tested into the block to be tested (step 320), and processing the block to be tested in parallel by the graphics processing core (step 330) includes: in step 410, storing the image to be tested into the memory of the graphics processing component .

在步驟420中,取得待測影像存於記憶體之一影像儲存位址。In step 420, the image to be tested is stored in an image storage address of the memory.

在步驟430中,根據影像儲存位址,計算多個待測區塊之區塊儲存位址。In step 430, the block storage address of the plurality of blocks to be tested is calculated according to the image storage address.

在步驟440中,使各圖形處理核心分別自記憶體之區塊儲存位址取得待測區塊,以平行處理各待測區塊。如此一來,僅需計算待測影像之各待測區塊之區塊儲存位址,即可模擬分割待測影像。然而,在其他實施例中,可將待測影像實際分為多個待測區塊,並不限於本實施例。In step 440, each graphics processing core obtains the to-be-tested block from the block storage address of the memory to process each of the to-be-tested blocks in parallel. In this way, the block storage address of each block to be tested of the image to be tested can be calculated, and the image to be tested can be simulated. However, in other embodiments, the image to be tested may be actually divided into a plurality of blocks to be tested, and is not limited to the embodiment.

由上述本發明實施方式可知,應用本發明具有下列優點。由於圖形處理元件具有較中央處理元件多之核心,因此將自待測影像取得多個瑕疵點之運算藉由圖形處理元件處理,可使得較多之瑕疵點運算同時於各核心處理。在本發明之一實施例應用於面板瑕疵檢測時,待測面板之尺寸越大,拍攝待測面板而取得之待測影像可分割出之區塊數越多,因此同時藉由圖形處理元件之多個核心平行處理可大大地縮短面板瑕疵檢測之執行時間。另外,在本發明所檢測之待測影像之資料量越高時,待測影像可分割出之區塊數越多,因此同時藉由圖形處理元件之多個核心平行處理亦可大量減少瑕疵檢測之執行時間。此外,藉由電腦之中央處理元件以及其顯示卡之圖形處理元件即可進行影像瑕疵檢測,所需硬體成本較為低廉。另外,可藉由多個瑕疵點所群聚成之瑕疵群組,輔助判斷影像上瑕疵產生之原因。It will be apparent from the above-described embodiments of the present invention that the application of the present invention has the following advantages. Since the graphics processing component has more cores than the central processing component, the operation of acquiring multiple defects from the image to be tested is processed by the graphics processing component, so that more processing operations can be performed simultaneously on each core. When the embodiment of the present invention is applied to the panel 瑕疵 detection, the larger the size of the panel to be tested, the more the number of blocks that can be divided by the image to be tested obtained by taking the panel to be tested, and thus the graphics processing component Multiple core parallel processing can greatly reduce the execution time of panel defects. In addition, the higher the amount of data of the image to be tested detected by the present invention, the more the number of blocks that can be divided into the image to be tested, so that the parallel processing of the plurality of cores of the graphics processing component can also greatly reduce the detection of defects. Execution time. In addition, image defect detection can be performed by the central processing unit of the computer and the graphics processing component of the display card, and the required hardware cost is relatively low. In addition, it is possible to determine the cause of the occurrence of defects on the image by grouping a plurality of defects into groups.

雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100...影像瑕疵檢測系統100. . . Image detection system

110...圖形處理元件110. . . Graphics processing component

111...記憶體111. . . Memory

112、113、...、11n...圖形處理核心112, 113, ..., 11n. . . Graphics processing core

120...中央處理元件120. . . Central processing component

121...影像取得模組121. . . Image acquisition module

122...影像分割模組122. . . Image segmentation module

123...圖形處理元件驅動模組123. . . Graphics processing component driver module

124...瑕疵群聚模組124. . .瑕疵 clustering module

130...資料傳輸介面130. . . Data transmission interface

140...拍攝元件140. . . Shooting component

200...待測面板200. . . Panel to be tested

300...影像瑕疵檢測方法300. . . Image detection method

310~350...步驟310~350. . . step

410~440...步驟410~440. . . step

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

第1圖繪示依照本發明一實施方式的一種影像瑕疵檢測系統之功能方塊圖。FIG. 1 is a functional block diagram of an image detection system according to an embodiment of the invention.

第2圖係依照本發明另一實施方式的一種影像瑕疵檢測方法之流程圖。2 is a flow chart of an image detection method according to another embodiment of the present invention.

第3圖係第2圖中將待測影像分為數個區塊(步驟320),並藉由各圖形處理核心平行處理各待測區塊(步驟330)之一實施例。Figure 3 is a diagram in which the image to be tested is divided into a plurality of blocks in step 2 (step 320), and an embodiment of each block to be tested (step 330) is processed in parallel by each graphics processing core.

100...影像瑕疵檢測系統100. . . Image detection system

110...圖形處理元件110. . . Graphics processing component

111...記憶體111. . . Memory

112、113、...、11n...圖形處理核心112, 113, ..., 11n. . . Graphics processing core

120...中央處理元件120. . . Central processing component

121...影像取得模組121. . . Image acquisition module

122...影像分割模組122. . . Image segmentation module

123...圖形處理元件驅動模組123. . . Graphics processing component driver module

124...瑕疵群聚模組124. . .瑕疵 clustering module

130...資料傳輸介面130. . . Data transmission interface

140...拍攝元件140. . . Shooting component

200...待測面板200. . . Panel to be tested

Claims (12)

一種影像瑕疵檢測系統,包含:一圖形處理元件,包含:複數個圖形處理核心;以及一中央處理元件,電性連接該圖形處理元件,包含:一影像取得模組,取得一待測影像;一影像分割模組,將該待測影像分為複數個待測區塊;一圖形處理元件驅動模組,驅動該些圖形處理核心平行處理該些待測區塊,藉此使該些圖形處理核心分別自該些待測區塊,取得複數個瑕疵點;以及一瑕疵群聚模組,將該些瑕疵點群聚為至少一瑕疵群組。An image detection system includes: a graphics processing component, comprising: a plurality of graphics processing cores; and a central processing component electrically coupled to the graphics processing component, comprising: an image acquisition module to obtain an image to be tested; The image segmentation module divides the image to be tested into a plurality of blocks to be tested; a graphics processing component driving module drives the graphics processing cores to process the blocks to be tested in parallel, thereby enabling the graphics processing cores A plurality of defects are obtained from the blocks to be tested, and a clustering module is clustered into at least one group. 如請求項1所述之影像瑕疵檢測系統,其中該圖形處理元件更包含:一記憶體,電性連接該些圖形處理核心,其中該影像分割模組將該些待測區塊儲存至該記憶體,該圖形處理元件驅動模組控制該些圖形處理核心分別自該記憶體取得該些待測區塊,以平行處理該些待測區塊。The image detection device of claim 1, wherein the graphics processing component further comprises: a memory, electrically connected to the graphics processing core, wherein the image segmentation module stores the to-be-tested blocks to the memory The graphics processing component driving module controls the graphics processing cores to respectively obtain the to-be-tested blocks from the memory to process the to-be-tested blocks in parallel. 如請求項1所述之影像瑕疵檢測系統,更包含:至少一拍攝元件,電性連接該中央處理元件,拍攝一待測物,以取得該待測影像。The image detection system of claim 1, further comprising: at least one imaging component electrically connected to the central processing component to capture an object to be tested to obtain the image to be tested. 如請求項1所述之影像瑕疵檢測系統,更包含:一資料傳輸介面,電性連接該中央處理元件,其中該影像取得模組係透過該資料傳輸介面取得該待測影像。The image detection system of claim 1, further comprising: a data transmission interface electrically connected to the central processing component, wherein the image acquisition module obtains the image to be tested through the data transmission interface. 如請求項1所述之影像瑕疵檢測系統,其中該圖形處理元件驅動模組藉由計算統一設備架構驅動該些圖形處理核心。The image detection system of claim 1, wherein the graphics processing component driver module drives the graphics processing cores by computing a unified device architecture. 一種影像瑕疵檢測方法,包含:取得一待測影像至一電腦,其中該電腦包含一中央處理元件以及一圖形處理元件,該圖形處理元件包含複數個圖形處理核心;將該待測影像分為複數個待測區塊;藉由該些圖形處理核心平行處理該些待測區塊,以自該些待測區塊,取得複數個瑕疵點;以及藉由該中央處理元件將該些瑕疵點群聚為至少一瑕疵群組。An image detection method includes: obtaining a to-be-tested image to a computer, wherein the computer includes a central processing component and a graphics processing component, the graphics processing component includes a plurality of graphics processing cores; and the image to be tested is divided into plural The blocks to be tested are processed in parallel by the graphics processing cores to obtain a plurality of defects from the blocks to be tested; and the group of nodes are obtained by the central processing component Gather into at least one group. 如請求項6所述之影像瑕疵檢測方法,其中該圖形處理元件更包含一記憶體,將該待測影像分為該些待測區塊,並藉由該些圖形處理核心平行處理該些待測區塊之步驟包含:將該待測影像存入該圖形處理元件之該記憶體;取得該待測影像存於該記憶體之一影像儲存位址;根據該影像儲存位址,計算該些待測區塊之複數個區塊儲存位址;以及使該些圖形處理核心自該些區塊儲存位址,取得該些待測區塊,以平行處理該些待測區塊。The image detection device of claim 6, wherein the graphics processing component further comprises a memory, the image to be tested is divided into the to-be-tested blocks, and the graphics processing cores are processed in parallel by the graphics processing cores. The step of measuring the block includes: storing the image to be tested in the memory of the graphics processing component; obtaining the image to be tested and storing the image storage address in the memory; calculating the image according to the image storage address And storing a plurality of blocks of the block to be tested; and causing the graphics processing cores to store the addresses from the blocks, and acquiring the blocks to be tested to process the blocks to be tested in parallel. 如請求項6所述之影像瑕疵檢測方法,其中藉由該中央處理元件將該些瑕疵點群聚為該瑕疵群組包含:將該些瑕疵點中相鄰者組成複數個瑕疵線段;將該些瑕疵線段中相連者組成複數個瑕疵物件;以及根據該些瑕疵物件的空間關係,將該些瑕疵物件合併為該瑕疵群組。The image detection method of claim 6, wherein the grouping of the defects into the group by the central processing component comprises: forming a neighboring one of the plurality of defects into a plurality of line segments; The connected ones of the plurality of segments form a plurality of objects; and according to the spatial relationship of the objects, the objects are merged into the group. 如請求項6所述之影像瑕疵檢測方法,其中藉由該些圖形處理核心平行處理該些待測區塊包含:藉由該些圖形處理核心,對該些待測區塊進行拉普拉斯運算、平滑運算以及適應性二值化運算,以自該些待測區塊取得該些瑕疵點。The image detection method of claim 6, wherein the parallel processing of the to-be-tested blocks by the graphics processing core comprises: performing Laplace on the to-be-tested blocks by using the graphics processing cores Operations, smoothing operations, and adaptive binarization operations to obtain the defects from the blocks to be tested. 如請求項6所述之影像瑕疵檢測方法,其中取得該待測影像包含:取得一待測圖檔;自該待測圖檔擷取該待測圖檔之一原始影像資料;以及令該原始影像資料作為該待測影像。The image detection method of claim 6, wherein the obtaining the image to be tested comprises: obtaining a to-be-tested image file; capturing the original image data of the image to be tested from the image to be tested; and The image data is used as the image to be tested. 如請求項6所述之影像瑕疵檢測方法,更包含:拍攝一待測物,以取得該待測影像。The image detection method of claim 6, further comprising: capturing an object to be tested to obtain the image to be tested. 如請求項6所述之影像瑕疵檢測方法,其中該電腦更包含一資料傳輸介面,且該待測影像係透過該資料傳輸介面所取得。The image detection method of claim 6, wherein the computer further comprises a data transmission interface, and the image to be tested is obtained through the data transmission interface.
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