TWI430892B - Printing module used for a three dimensional prototyping apparatus - Google Patents

Printing module used for a three dimensional prototyping apparatus Download PDF

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TWI430892B
TWI430892B TW99127352A TW99127352A TWI430892B TW I430892 B TWI430892 B TW I430892B TW 99127352 A TW99127352 A TW 99127352A TW 99127352 A TW99127352 A TW 99127352A TW I430892 B TWI430892 B TW I430892B
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printing
heating
printing module
heating plates
heater
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TW99127352A
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Chinese (zh)
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TW201208890A (en
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Kwo Yuan Shi
Ya Ching Tung
Ching Sung Lin
Hsien Chung Tai
Chi Feng Huang
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Microjet Technology Co Ltd
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Description

適用於立體成型機構之噴印模組 Printing module suitable for three-dimensional forming mechanism

本案係關於一種噴印模組,尤指一種適用於立體成型機構之噴印模組。 The present invention relates to a printing module, and more particularly to a printing module suitable for a three-dimensional forming mechanism.

快速成型技術(Rapid Prototyping,簡稱RP技術)係為依據建構金字塔層層堆疊成型的概念所發展而成,其主要技術特徵是成型的快捷性,能在不需要任何刀具,模具及卡具的情況下自動、快速將任意複雜形狀的設計方案快速轉換為3D的實體模型。 Rapid Prototyping (RP technology) is developed based on the concept of stacking layers of pyramids. The main technical feature is the rapidity of molding. It can be used without any tools, molds and fixtures. Automatically and quickly convert any complex shape design into a 3D solid model.

目前RP技術發展出利用噴印技術結合載具精密定位技術的方式來生產3D的實體模型,其生產方式係為先將一層粉末舖設於載具上方並利用噴墨列印技術於部分粉末上噴印高黏度膠合劑液體,使膠合劑液體與粉末沾黏並固化,一直重複上述製程層層堆砌即可完成3D的實體模型。 At present, RP technology has developed a 3D solid model by using jet printing technology combined with the precise positioning technology of the carrier. The production method is to first lay a layer of powder on top of the carrier and spray it on part of the powder by inkjet printing technology. The high-viscosity adhesive liquid is printed to make the glue liquid adhere to the powder and solidify. The 3D solid model can be completed by repeating the above process layer stacking.

若將習知平面噴印技術應用在快速立體成型機上,由於習知平面噴印技術的噴液量是噴印在2D圖紙上,所以噴點越小越細緻,解析度也越高,但若應用到3D成型時,2D平面專用的列印噴頭一次所噴出的噴點液量,尚不足以覆蓋一個立體粉末顆粒的表面,會造成色彩飽和度不足,由於3D列印品質的決定除了在噴頭及列印 精度外,最重要的是被噴印物的粉末顆粒大小,請參閱第一圖,其係在微觀下待噴印的粉末顆粒呈現立體表面的結構示意圖,由於,在粉末顆粒11平鋪於建構平台12上待列印時,微觀下待噴印的粉末顆粒11係呈現立體表面,因此所需的噴印液量會遠超過一般進行平面噴印的需求,以習知平面噴印技術應用到3D成型時,待噴印的粉末顆粒11粒徑大小為20-120μm,而一般2D平面專用的列印噴頭在解析度為1200Dpi時其噴墨孔的孔徑大小約為15μm以下,因此,2D平面專用的列印噴頭一次所噴出的噴點液量,液體13僅能覆蓋一個立體粉末顆粒11約1/3表面的面積(如第二圖所示),因此,一般習知的作法係在同一粉末顆粒11上進行多次噴印,才能讓成品顏色鮮艷細緻,如此會造成時間上的浪費、多次噴印導致色彩不連續而造成噴印品質不佳以及列印噴頭壽命相對減短的缺點。 If the conventional flat jet printing technology is applied to a rapid three-dimensional forming machine, since the liquid discharge amount of the conventional flat printing technology is printed on the 2D drawing, the smaller the finer the spray point, the higher the resolution, but the higher the resolution. If applied to 3D molding, the amount of sprayed liquid sprayed by the 2D plane-specific printing nozzle is not enough to cover the surface of a solid powder particle, which will cause insufficient color saturation, due to the decision of 3D printing quality. Spray head and print In addition to the accuracy, the most important thing is the particle size of the powder to be printed. Please refer to the first figure, which is a schematic diagram of the structure of the powder particles to be printed on the microscopic surface, since the powder particles 11 are laid in the construction. When the platform 12 is to be printed, the powder particles 11 to be printed on the microscopic surface present a three-dimensional surface, so the required amount of printing liquid will far exceed the requirements for general printing, and the conventional planar printing technology is applied to In the 3D molding, the particle size of the powder particles 11 to be printed is 20-120 μm, and the printing head dedicated to the 2D plane has a pore size of about 15 μm or less when the resolution is 1200 Dpi. Therefore, the 2D plane is 2D plane. The amount of liquid sprayed by the dedicated print head at one time, the liquid 13 can cover only about 1/3 of the surface area of a solid powder particle 11 (as shown in the second figure). Therefore, the conventional practice is the same. The powder particles 11 are printed multiple times in order to make the finished product bright and delicate, which causes waste of time, multiple printing causes color discontinuity, resulting in poor printing quality and relatively short life of the printing head. .

因此,如何發展一種可改善上述習知技術缺失之適用於立體成型機構之噴印模組,實為目前迫切需要解決之問題。 Therefore, how to develop a printing module suitable for a three-dimensional forming mechanism which can improve the above-mentioned conventional technology is an urgent problem to be solved.

本案之主要目的在於提供一種適用於立體成型機構之噴印模組,俾解決習知使用2D平面專用的列印噴頭一次所噴出的噴點液量,僅能覆蓋一個立體粉末顆粒約1/3表面的面積,需在同一粉末顆粒上進行多次噴印,造成時間上的浪費、多次噴印導致色彩不連續而造成噴印品質不佳以及列印噴頭壽命相對減短等缺點。 The main purpose of the present invention is to provide a printing module suitable for a three-dimensional forming mechanism, which solves the problem that the amount of liquid sprayed by a conventional printing nozzle dedicated to a 2D plane can cover only one third of a solid powder particle. The surface area needs to be printed multiple times on the same powder particle, which causes waste of time, multiple printing causes color discontinuity, resulting in poor printing quality and relatively short printhead life.

為達上述目的,本案之一較廣義實施態樣為提供一種噴印模組,適用於一立體成型機構,該立體成型機構係鋪設粒徑20-120μm的粉末顆粒,該噴印模組至少包含一噴印匣及一噴印控制電路, 其中該噴印匣具有一噴孔片以及一噴印晶片,該噴孔片具有複數個噴孔,其特徵在於:該複數個噴孔之孔徑為15-20μm,當該噴印晶片之驅動電壓控制在12-15伏特,且該噴印控制電路傳送1.4-2.0μs之加熱脈衝電壓至該噴印晶片時,該複數個噴孔噴出直徑大約64-68μm之液滴,以覆蓋該粉末顆粒至少2/3以上的表面積。 In order to achieve the above object, a broader embodiment of the present invention provides a printing module suitable for a three-dimensional forming mechanism for laying powder particles having a particle size of 20-120 μm, and the printing module comprises at least a jet printing and a printing control circuit, Wherein the ink jet print has a spray orifice sheet and a spray print wafer, the spray orifice sheet has a plurality of spray holes, wherein the plurality of spray holes have a pore diameter of 15-20 μm, and the driving voltage of the sprayed wafer is Controlled at 12-15 volts, and the printing control circuit transmits a heating pulse voltage of 1.4-2.0 μs to the printing wafer, the plurality of nozzles eject droplets having a diameter of about 64-68 μm to cover the powder particles at least 2/3 or more surface area.

11、72‧‧‧粉末顆粒 11, 72‧‧‧ powder particles

12、71‧‧‧建構平台 12, 71‧‧‧ Construction platform

13‧‧‧液體 13‧‧‧Liquid

3‧‧‧噴印匣 3‧‧‧Printing 匣

31‧‧‧噴印晶片 31‧‧‧Printing wafer

32‧‧‧電連接片 32‧‧‧Electrical connection piece

33‧‧‧噴孔片 33‧‧‧ orifice sheet

331‧‧‧噴孔 331‧‧‧ orifice

34‧‧‧軸線陣列 34‧‧‧ axis array

35‧‧‧加熱器 35‧‧‧heater

350‧‧‧間隙 350‧‧‧ gap

3511-3513、3511’、3513‧‧‧加熱板 3511-3513, 3511', 3513‧‧‧ heating plate

352、Ain‧‧‧輸入端 352, Ain‧‧‧ input

353、Aout‧‧‧輸出端 353, Aout‧‧‧ output

354‧‧‧導電層 354‧‧‧ Conductive layer

355、355’‧‧‧噴墨區域 355, 355' ‧ ‧ inkjet area

36‧‧‧供墨流道 36‧‧‧Ink flow channel

6‧‧‧噴印控制電路 6‧‧‧Print control circuit

73‧‧‧液滴 73‧‧‧ droplets

R1、R2、R3、R4‧‧‧電阻 R1, R2, R3, R4‧‧‧ resistance

P‧‧‧電源訊號 P‧‧‧Power signal

D‧‧‧資料控制信號 D‧‧‧ data control signal

M‧‧‧開關元件 M‧‧‧ switching components

G‧‧‧接地端 G‧‧‧ Grounding terminal

PD‧‧‧噴印資料信號 PD‧‧‧Printing information signal

MF‧‧‧加熱控制信號 MF‧‧‧heat control signal

PF‧‧‧預熱控制信號 PF‧‧‧Preheat control signal

P1‧‧‧預熱脈衝電壓 P1‧‧‧ preheating pulse voltage

P2‧‧‧加熱脈衝電壓 P2‧‧‧heat pulse voltage

t1、t2‧‧‧時間長度 T1, t2‧‧‧ length of time

Y‧‧‧總寬度 Y‧‧‧ total width

Y1‧‧‧寬度 Y1‧‧‧Width

X‧‧‧長度 X‧‧‧ length

L‧‧‧參考軸線 L‧‧‧ reference axis

第一圖:其係在微觀下待噴印的粉末顆粒呈現立體表面的結構示意圖。 The first figure is a schematic view showing the structure of the powder particles to be printed on the microscopic surface.

第二圖:其係為第一圖所示之粉末顆粒上噴印液體之剖面示意圖。 Second: It is a schematic cross-sectional view of the printing liquid on the powder particles shown in the first figure.

第三圖A:其係為本案較佳實施例之噴印匣之結構示意圖。 Fig. 3A is a schematic view showing the structure of the ink jet cartridge of the preferred embodiment of the present invention.

第三圖B:其係為第三圖A移除噴孔片後之結構示意圖。 Third Figure B: This is a schematic view of the structure after the removal of the orifice sheet in Figure 3A.

第三圖C:其係為第三圖A移除部分噴孔片後之結構示意圖。 Third figure C: It is a schematic structural view of the third figure A after removing a part of the orifice sheet.

第四圖A:其係為第三圖B所示之加熱器示意圖。 Fourth Figure A: This is a schematic diagram of the heater shown in Figure B.

第四圖B:其係為第四圖A之電路圖。 Fourth Figure B: This is a circuit diagram of Figure 4A.

第五圖:其係為第三圖B所示之另一加熱器示意圖。 Figure 5: This is a schematic diagram of another heater shown in Figure B.

第六圖A:其係為噴印模組之噴印控制電路與噴印晶片之連接結構示意圖。 Figure 6 is a schematic view showing the connection structure between the printing control circuit and the printing chip of the printing module.

第六圖B:其係為第六圖A所示之噴印資料信號PD、加熱控制信號MF、預熱控制信號PF之電壓信號波形圖。 FIG. 6B is a waveform diagram of voltage signals of the printing material signal PD, the heating control signal MF, and the preheating control signal PF shown in FIG.

第七圖:其係利用本案之噴印模組於粉末顆粒上噴印液滴之剖面示意圖。 Figure 7 is a schematic cross-sectional view showing the use of the printing module of the present invention to print droplets on powder particles.

第八圖:其係為本案之噴印晶片的驅動電壓及噴孔的噴出速度關係圖。 Figure 8 is a diagram showing the relationship between the driving voltage of the printed wafer and the ejection speed of the nozzle.

體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖示在本質上係當作說明之用,而非用以限制本案。 Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and illustration are in the nature of

本案之噴印模組可適用於一立體成型機構(未圖示),例如:落地型立體成型機構,來建構3D實體模型,且該立體成型機構係於一建構平台71上鋪設一層粒徑20-120μm大小的粉末顆粒72(如第七圖所示),該噴印模組至少包含一噴印匣3(如第三圖A所示)及一噴印控制電路6(如第六圖A所示)。 The printing module of the present invention can be applied to a three-dimensional forming mechanism (not shown), for example, a floor-standing three-dimensional forming mechanism for constructing a 3D solid model, and the three-dimensional forming mechanism is laid on a construction platform 71 with a particle size of 20 a powder particle 72 having a size of 120 μm (as shown in the seventh figure), the printing module comprising at least one printing cartridge 3 (as shown in FIG. 3A) and a printing control circuit 6 (such as the sixth drawing A) Shown).

請參閱第三圖A,其係為本案較佳實施例之噴印匣之結構示意圖。其中第三圖A所示之噴印匣3係為一簡化後之結構示意圖,於本實施例中,噴印匣3係為一長條狀結構且包含噴印晶片31、電連接片32、噴孔片33以及三個軸線陣列34的加熱器35(如第三圖B所示),且噴孔片33上係包含複數個對應於加熱器35的噴孔331。 Please refer to FIG. 3A, which is a schematic structural view of a printing cartridge according to a preferred embodiment of the present invention. The printing cartridge 3 shown in the third figure A is a simplified structural diagram. In the embodiment, the printing cartridge 3 is a long strip structure and includes a printing chip 31 and an electrical connecting sheet 32. The orifice sheet 33 and the heater 35 of the three axis arrays 34 (as shown in FIG. 3B), and the orifice sheet 33 includes a plurality of orifices 331 corresponding to the heaters 35.

請參閱第三圖B及C,其中第三圖B其係為第三圖A移除噴孔片後之結構示意圖,第三圖C其係為第三圖A移除部分噴孔片後之結構示意圖,如圖所示,本實施例之噴印匣3之噴印晶片31的表面上的加熱器35係設置成沿參考軸線L延伸的軸線陣列34,並相對參考 軸線L橫向或側向相互隔離,另外,噴印晶片31上更具有三個與參考軸線L平行的供墨流道36,主要用來傳送不同顏色的墨水,且彼此之間相對參考軸線L的垂直方向並排分隔,進而為對應的三個軸線陣列34的加熱器35提供不同顏色的墨水,每一軸線陣列34可由2排設置於供墨流道36兩側邊之同色墨水加熱器35所組成且均平行於參考軸線L的方向,且2排加熱器35之間以交錯排列的方式設置於供墨流道36的兩側邊,故本實施例之噴印晶片31上係具有2排×3色=6排的加熱器排數。 Please refer to the third figure B and C, wherein the third figure B is the structural diagram of the third figure A after removing the orifice sheet, and the third figure C is the third figure A after removing part of the orifice sheet. Schematic diagram, as shown, the heaters 35 on the surface of the printing die 31 of the printing cartridge 3 of the present embodiment are arranged in an array of axes 34 extending along the reference axis L, and are relatively referenced. The axis L is laterally or laterally isolated from each other. In addition, the inkjet wafer 31 further has three ink supply channels 36 parallel to the reference axis L, mainly for conveying ink of different colors, and relative to each other with respect to the reference axis L. The vertical direction is divided side by side, thereby providing inks of different colors for the heaters 35 of the corresponding three axis arrays 34, and each axis array 34 can be composed of two rows of the same color ink heaters 35 disposed on both sides of the ink supply flow path 36. And both of them are parallel to the direction of the reference axis L, and the two rows of heaters 35 are disposed on both sides of the ink supply flow path 36 in a staggered manner. Therefore, the print wafer 31 of the present embodiment has two rows of x. 3 colors = 6 rows of heater rows.

請參閱第四圖A,其係為第三圖B所示之加熱器示意圖。如圖所示,加熱器35主要包括複數個加熱板3511-3513、輸入端352、輸出端353以及串聯兩相鄰加熱板3511-3512、3512-3513之導電層354。於本實施例中,加熱器35係由三個加熱板3511-3513構成為佳,但不以此為限,且兩相鄰之加熱板3511、3512及加熱板3512、3513之間以間隙350相互區隔,使加熱板3511-3513呈分離並列地設置,而本實施例中的每個加熱板3511、3512、3513之長度X、寬度Y1及厚度(未圖示)實質上相等,亦即加熱板3511-3513可為面積相同且體積相等之矩形電阻層,至於間隙350與複數個加熱板3511-3513之總寬度Y大約等於加熱板3511-3513之長度X,換言之,複數個加熱板3511-3513與其間之間隙350所共同定義出的噴墨區域355係大約為一面積為X×Y之正四邊形噴墨區域355。 Please refer to FIG. 4A, which is a schematic diagram of the heater shown in FIG. As shown, the heater 35 mainly includes a plurality of heating plates 3511-3513, an input end 352, an output end 353, and a conductive layer 354 connected in series with two adjacent heating plates 3511-3512, 3512-3513. In the present embodiment, the heater 35 is preferably formed by three heating plates 3511-3513, but not limited thereto, and a gap 350 is provided between the two adjacent heating plates 3511, 3512 and the heating plates 3512, 3513. Separated from each other, the heating plates 3511-3513 are arranged side by side, and the length X, the width Y1 and the thickness (not shown) of each of the heating plates 3511, 3512, 3513 in this embodiment are substantially equal, that is, The heating plates 3511-3513 may be rectangular resistive layers of the same area and equal volume, and the total width Y of the gap 350 and the plurality of heating plates 3511-3513 is approximately equal to the length X of the heating plates 3511-3513, in other words, the plurality of heating plates 3511 The ink jet region 355 defined by -3513 and the gap 350 therebetween is approximately a positive quadrilateral ink jet region 355 having an area of X x Y.

此外,位於中間之加熱板3512其兩端係分別透過導電層354與加熱板3511及3513電性連接,而加熱板3511相對於與導電層354連接之另一端則與輸入端352相連,至於加熱板3513相對於與導電層354連接之另一端則與輸出端353相連,而輸入端352及輸出端 353可為與導電層354相同之導電材質,換言之,加熱器35相對兩終端的加熱板3511、3513係分別與輸入端352、輸出端353電性連接,且三個加熱板3511-3513之間亦透過導電層354彼此串聯而電性連接。 In addition, the heating plate 3512 in the middle is electrically connected to the heating plates 3511 and 3513 through the conductive layer 354, and the other end of the heating plate 3511 is connected to the input end 352 with respect to the other end connected to the conductive layer 354. The board 3513 is connected to the output end 353 with respect to the other end connected to the conductive layer 354, and the input end 352 and the output end 353 can be the same conductive material as the conductive layer 354. In other words, the heater 35 is electrically connected to the input end 352 and the output end 353 of the heating plates 3511 and 3513 of the two terminals, respectively, and between the three heating plates 3511-3513. The conductive layers 354 are also electrically connected to each other in series.

請參閱第四圖B並配合第四圖A,其中第四圖B係為第四圖A之電路圖,加熱器35之電路包括串聯的複數個電阻R1、R2、R3,其係分別對應於第四圖A中之加熱板3511、3512、3513,而輸入端Ain及輸出端Aout則分別對應於第四圖A中之輸入端352及輸出端353。如第四圖B所示,位於串聯之電阻R1-R3一終端之電阻R1係與輸入端Ain相連並接收電源訊號P,例如:驅動電壓,至於串聯之電阻R1-R3另一終端的電阻R3則可直接接地,或者該電阻R3透過輸出端Aout與開關元件M之汲極端(drain)相連,且開關元件M又透過閘極端(gate)接收一資料控制信號D,並以源極端(source)與接地端G相連,俾以利用開關元件M接收資料控制信號D而控制加熱電路之導通。於一些實施例中,開關元件M可為電晶體,例如:NMOS元件,但不以此為限。 Please refer to FIG. 4B and cooperate with FIG. 4A. FIG. 4B is a circuit diagram of FIG. A. The circuit of the heater 35 includes a plurality of resistors R1, R2 and R3 connected in series, which respectively correspond to the first The heating plates 3511, 3512, and 3513 in FIG. A, and the input terminal Ain and the output terminal Aout correspond to the input terminal 352 and the output terminal 353 in the fourth FIG. As shown in the fourth figure B, the resistor R1 at the terminal of the series resistors R1-R3 is connected to the input terminal Ain and receives the power signal P, for example, the driving voltage, and the resistor R3 of the other terminal of the resistor R1-R3 connected in series. Then, it can be directly grounded, or the resistor R3 is connected to the drain of the switching element M through the output terminal Aout, and the switching element M receives a data control signal D through the gate and is sourced. It is connected to the ground terminal G, and controls the conduction of the heating circuit by receiving the data control signal D by the switching element M. In some embodiments, the switching element M can be a transistor, such as an NMOS device, but is not limited thereto.

當加熱器35欲加熱液體,例如:墨水(未圖示),而進行噴印時,噴印控制電路6將傳送一資料控制信號D以控制開關元件M導通,同時電源訊號P將由加熱器35之輸入端Ain輸入,如此一來,加熱器35之加熱板3511、3512及3513的溫度便可升高,進而將液體加熱以產生微熱氣泡,使液體微熱氣泡由噴墨區域355噴出至粉末顆粒72上以完成噴印的動作。 When the heater 35 is to heat a liquid, such as ink (not shown), to perform printing, the print control circuit 6 will transmit a data control signal D to control the switching element M to be turned on, while the power signal P will be driven by the heater 35. The input terminal Ain is input, so that the temperature of the heating plates 3511, 3512 and 3513 of the heater 35 can be raised, thereby heating the liquid to generate micro-thermal bubbles, so that the liquid micro-thermal bubbles are ejected from the ink-jet region 355 to the powder particles. 72 to complete the printing action.

請參閱第五圖,其係為第三圖B所示之另一加熱器示意圖。如圖所示,加熱器35同樣包括複數個加熱板3511’、3512、3513’、 輸入端352、輸出端353以及串聯兩相鄰加熱板3511’-3512、3512-3513’之導電層354,且加熱器35之複數個加熱板數目亦以三個為佳,而本實施例中加熱板3511’、3512、3513’的配置及其與輸入端352、輸出端353及導電層354彼此間的關係與第四圖A所示之較佳實施例相同,是以不再贅述。於本實施例中,三個加熱板3511’、3512、3513’之寬度Y1及厚度實質上相等,唯分別與輸入端352和輸出端353相連的兩加熱板3511’、3513’朝外之一側邊長度小於位在中間之加熱板3512的長度X,亦即加熱板3512仍為矩形電阻層,但加熱板3511’及3513’實質上則為兩相對應之梯形電阻層,此時與輸入端352、輸出端353電性連接之兩加熱板3511’、3513’其面積實質上小於加熱板3512之面積,而加熱板3511’、3512、3513’與間隙350所共同定義之噴墨區域355’則大致呈正八邊形。 Please refer to the fifth figure, which is a schematic diagram of another heater shown in FIG. As shown, the heater 35 also includes a plurality of heating plates 3511', 3512, 3513', The input end 352, the output end 353, and the conductive layer 354 of two adjacent heating plates 3511'-3512, 3512-3513' are connected in series, and the number of the plurality of heating plates of the heater 35 is preferably three, and in this embodiment The arrangement of the heating plates 3511', 3512, 3513' and their relationship with the input end 352, the output end 353 and the conductive layer 354 are the same as those of the preferred embodiment shown in FIG. A, and will not be described again. In this embodiment, the widths Y1 and thicknesses of the three heating plates 3511', 3512, 3513' are substantially equal, and only one of the two heating plates 3511', 3513' connected to the input end 352 and the output end 353 respectively faces outward. The length of the side is smaller than the length X of the heating plate 3512 located in the middle, that is, the heating plate 3512 is still a rectangular resistance layer, but the heating plates 3511' and 3513' are substantially two corresponding ladder resistance layers, at this time and input. The two heating plates 3511', 3513' electrically connected to the end 352 and the output end 353 have an area substantially smaller than the area of the heating plate 3512, and the ink-jet area 355 defined by the heating plates 3511', 3512, 3513' and the gap 350 are defined. 'There is roughly a regular octagon.

由於位在中間之加熱板3512佔加熱器35大部分的電阻值,且相對大於兩終端之加熱板3511’及3513’的電阻值,故應可理解,當加熱器35進行加熱時,其最高溫區便可集中在噴墨區域355’的中央範圍,以避免三個加熱板3511’、2352、3513’因延遲加熱所可能造成的熱點(hot spot)偏移狀況,並控制液體微熱氣泡使其較容易由加熱器35的中心生長並噴出至粉末顆粒72上。 Since the heating plate 3512 located in the middle accounts for most of the resistance value of the heater 35 and is relatively larger than the resistance values of the heating plates 3511' and 3513' of the two terminals, it should be understood that when the heater 35 is heated, the highest The temperature zone can be concentrated in the central range of the ink-jetting zone 355' to avoid hot spot shifting of the three heating plates 3511', 2352, 3513' due to delayed heating, and to control the liquid micro-thermal bubble. It is relatively easily grown by the center of the heater 35 and ejected onto the powder particles 72.

請參閱第六圖A及B,其中第六圖A係為噴印模組之噴印控制電路與噴印晶片之連接結構示意圖,第六圖B係為噴印資料信號PD、加熱控制信號MF、預熱控制信號PF之電壓信號波形圖,如圖所示,當噴印模組欲執行噴印動作時,噴印控制電路6會藉由傳送噴印資料信號PD、加熱控制信號MF以及預熱控制信號PF至噴印晶片 31來控制加熱器35進行加熱或預熱,其中,預熱控制信號PF以及加熱控制信號MF分別會有預熱脈衝電壓P1及加熱脈衝電壓P2,藉由預熱脈衝電壓P1控制加熱器35先將部份墨水及噴印匣3預熱,再利用加熱脈衝電壓P2將部份液體加熱,使之產生氣泡而將液體噴至對應的粉末顆粒72上。 Please refer to the sixth figure A and B, wherein the sixth figure A is a schematic diagram of the connection structure between the printing control circuit and the printing chip of the printing module, and the sixth drawing B is the printing material signal PD and the heating control signal MF. The voltage signal waveform diagram of the preheating control signal PF is as shown in the figure. When the printing module is to perform the printing operation, the printing control circuit 6 transmits the printing data signal PD, the heating control signal MF and the pre Thermal control signal PF to print wafer 31, the heater 35 is controlled to be heated or preheated, wherein the preheating control signal PF and the heating control signal MF respectively have a preheating pulse voltage P1 and a heating pulse voltage P2, and the heater 35 is controlled by the preheating pulse voltage P1. A part of the ink and the printing paste 3 are preheated, and then a part of the liquid is heated by the heating pulse voltage P2 to generate bubbles to spray the liquid onto the corresponding powder particles 72.

請再參閱第六圖B,當噴印資料信號PD為高電位信號時,加熱器35由加熱控制信號MF控制,以控制加熱器35加熱,相反的,當噴印資料信號PD為低電位信號時,加熱器則改由預熱控制信號PF控制,以控制加熱器35預熱,也就是說,當噴印模組執行噴印動作時,若有列印資料,即噴印資料信號PD為高電位時,噴印模組會藉由加熱控制信號MF使加熱器35對部分液體加熱並產生氣泡,進而將液滴推擠出噴孔片33之噴孔331,反之,若沒有列印資料,即噴印資料信號PD為低電位時,噴印模組會藉由噴印資料信號PD控制加熱器35對部分液體及噴印匣3進行預熱。 Referring to FIG. 6 again, when the printing material signal PD is a high potential signal, the heater 35 is controlled by the heating control signal MF to control the heating of the heater 35. Conversely, when the printing material signal PD is a low potential signal. When the heater is controlled by the preheating control signal PF, the heater 35 is preheated, that is, when the printing module performs the printing operation, if the printing data is printed, the printing data signal PD is At a high potential, the printing module heats the partial liquid by the heater 35 by heating the control signal MF to generate bubbles, thereby pushing the droplets out of the orifice 331 of the orifice 33, and vice versa if no data is printed. When the printing data signal PD is at a low potential, the printing module controls the heater 35 to preheat some of the liquid and the printing cartridge 3 by the printing material signal PD.

加熱控制信號MF以及預熱控制信號PF會隨著噴印模組執行噴印動作時持續傳送,其中預熱脈衝電壓P1的時間長度t1以及加熱脈衝電壓P2的時間長度t2,會依不同的噴印模組型號而有所不同。且噴印模組之控制信號,即噴印資料信號PD、加熱控制信號MF以及預熱控制信號PF之電壓大小會依不同的噴印模組型號而有所以不同。 The heating control signal MF and the preheating control signal PF are continuously transmitted as the printing module performs the printing operation, wherein the time length t1 of the preheating pulse voltage P1 and the time length t2 of the heating pulse voltage P2 are different according to the different spraying The module model is different. The voltages of the control signals of the printing module, that is, the printing data signal PD, the heating control signal MF and the preheating control signal PF may vary depending on the type of the printing module.

請再參閱第三圖A-C、第四圖A-B、第五圖、第六圖A-B及第八圖,本案噴印匣3之噴孔片33所包含之複數個噴孔331之孔徑可為15-20μm,當噴印模組欲執行噴印動作時,噴印控制電路6傳送至噴印晶片31之驅動電壓可為12-15伏特(如第八圖所示),以 及噴印控制電路6可傳送1.4-2.0μs之加熱脈衝電壓至噴印晶片31,可達到使複數個噴孔331以14-16m/s的噴出速度噴出直徑大約64-68μm之液滴73,如此一來,所噴出的液滴73即可覆蓋立體成型機構於建構平台71上所鋪設之粒徑20-120μm大小的粉末顆粒72至少2/3以上的表面積。 Please refer to the third figure AC, the fourth figure AB, the fifth figure, the sixth figure AB and the eighth figure. The apertures 331 included in the orifice plate 33 of the printing sputum 3 of the present invention may have a hole diameter of 15- 20 μm, when the printing module is to perform the printing operation, the driving voltage of the printing control circuit 6 to the printing chip 31 can be 12-15 volts (as shown in the eighth figure), And the printing control circuit 6 can transmit a heating pulse voltage of 1.4-2.0 μs to the printing wafer 31, so that the plurality of nozzle holes 331 can eject droplets 73 having a diameter of about 64-68 μm at a discharge speed of 14-16 m/s. In this way, the ejected liquid droplets 73 can cover the surface area of the powder particles 72 having a particle size of 20-120 μm laid on the construction platform 71 by the three-dimensional forming mechanism at least 2/3 or more.

於本案之實施例中,粉末顆粒72粒徑大小係以70μm為最佳,使得複數個噴孔331以14-16m/s的噴出速度所噴出直徑64-68μm的液滴73可幾乎完全覆蓋粉末顆粒72的表面積(如第七圖所示),本案之噴印模組僅需在同一粉末顆粒72上進行一次噴印,可達到快速噴印、單次噴印可達到良好的噴印品質以及延長噴印匣3壽命等功效。 In the embodiment of the present invention, the particle size of the powder particles 72 is preferably 70 μm, so that the plurality of nozzle holes 331 are ejected at a discharge speed of 14-16 m/s, and the droplets 73 having a diameter of 64-68 μm can almost completely cover the powder. The surface area of the particles 72 (as shown in the seventh figure), the printing module of the present invention only needs to perform one printing on the same powder particle 72, which can achieve rapid printing, single printing, good printing quality and prolonged printing. Spray 匣 3 life and other effects.

綜上所述,本案之適用於立體成型機構之噴印模組係藉由噴印匣之噴孔片所包含之該複數個噴孔之孔徑為15-20μm,對該噴印晶片之驅動電壓為12-15伏特,以及噴印控制電路傳送1.4-2.0μs之加熱脈衝電壓至噴印晶片,俾使複數個噴孔可噴出直徑大約64-68μm之液滴,以覆蓋粒徑20-120μm大小的粉末顆粒的表面積,使得本案之噴印模組僅需在同一粉末顆粒上進行一次噴印,可達到快速噴印、單次噴印可達到良好的噴印品質以及延長噴印匣壽命等功效。 In summary, the printing module applicable to the three-dimensional forming mechanism of the present invention is that the aperture of the plurality of nozzles included in the orifice sheet of the printing cartridge is 15-20 μm, and the driving voltage of the printing chip is 12-15 volts, and the printing control circuit transmits a heating pulse voltage of 1.4-2.0 μs to the printing wafer, so that a plurality of nozzles can eject droplets having a diameter of about 64-68 μm to cover a particle size of 20-120 μm. The surface area of the powder particles makes the printing module of the present invention only need to be printed on the same powder particle once, which can achieve fast printing, single printing to achieve good printing quality and prolong the life of the printing enamel.

本案得由熟知此技術之人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護者。 This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

<AlEx><AlEx> <AlEx><AlEx>

71‧‧‧建構平台 71‧‧‧Building a platform

72‧‧‧粉末顆粒 72‧‧‧ powder particles

73‧‧‧液滴 73‧‧‧ droplets

Claims (5)

一種噴印模組,適用於一立體成型機構,該立體成型機構係鋪設20-120μm的粉末顆粒,該噴印模組至少包含一噴印匣及一噴印控制電路,其中該噴印匣具有一噴孔片以及一噴印晶片,該噴孔片具有複數個噴孔,其特徵在於:該複數個噴孔之孔徑為15-20μm,當該噴印晶片之驅動電壓控制在12-15伏特,且該噴印控制電路傳送1.4-2.0μs之加熱脈衝電壓至該噴印晶片時,該複數個噴孔噴出直徑大約64-68μm之液滴,以覆蓋該粉末顆粒至少2/3以上的表面積,其中該粉末顆粒大小以70μm為最佳。 A printing module is suitable for a three-dimensional forming mechanism for laying 20-120 μm powder particles, the printing module comprises at least one printing cartridge and a printing control circuit, wherein the printing cartridge has a orifice sheet and a printing chip, the orifice sheet having a plurality of orifices, wherein the plurality of orifices have a pore diameter of 15-20 μm, and when the driving voltage of the printing chip is controlled at 12-15 volts And the printing control circuit transmits a heating pulse voltage of 1.4-2.0 μs to the printing wafer, the plurality of nozzles eject droplets having a diameter of about 64-68 μm to cover at least 2/3 of the surface area of the powder particles. Wherein the powder particle size is preferably 70 μm. 如申請專利範圍第1項所述之噴印模組,其中該噴印匣更包含複數個加熱器,每一加熱器係包括複數個加熱板,該複數個加熱板間係分離並列設置並透過一導電層彼此串聯而電性連接,以形成一噴墨區域,且相對兩終端之該加熱板係分別與一輸入端及一輸出端電性連接。 The printing module of claim 1, wherein the printing cartridge further comprises a plurality of heaters, each heater comprises a plurality of heating plates, and the plurality of heating plates are separated and arranged in parallel A conductive layer is electrically connected to each other in series to form an ink-jet region, and the heating plates of the two terminals are electrically connected to an input end and an output end, respectively. 如申請專利範圍第2項所述之噴印模組,其中該噴墨區域實質上為正四邊形,且該複數個加熱板實質上為面積相同之矩形。 The printing module of claim 2, wherein the ink ejection region is substantially a regular quadrilateral, and the plurality of heating plates are substantially rectangular in area. 如申請專利範圍第2項所述之噴印模組,其中該噴墨區域實質上為正八邊形,且與該輸入端及該輸出端電性連接之相對兩終端之該加熱板之面積實質上係小於其餘之該加熱板之面積,俾以避免該加熱器之熱點偏移。 The printing module of claim 2, wherein the ink ejection area is substantially a regular octagon, and the area of the heating plate opposite to the two terminals electrically connected to the input end and the output end is substantially The upper system is smaller than the remaining area of the heating plate to avoid the hot spot offset of the heater. 如申請專利範圍第1項所述之噴印模組,其中於該噴印晶片之驅動電壓為12-15伏特時,該液滴之噴出速度為14-16m/s。 The printing module according to claim 1, wherein the ejection speed of the droplet is 14-16 m/s when the driving voltage of the printing chip is 12-15 volts.
TW99127352A 2010-08-16 2010-08-16 Printing module used for a three dimensional prototyping apparatus TWI430892B (en)

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Publication number Priority date Publication date Assignee Title
TWI633018B (en) * 2014-12-19 2018-08-21 研能科技股份有限公司 Rapid prototyping device using page-width array printing

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MX2016012534A (en) * 2014-03-25 2017-02-23 Dws Srl Improved computer-implemented method for defining the points of development of supporting elements of an object made by means of a stereolithography process.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI633018B (en) * 2014-12-19 2018-08-21 研能科技股份有限公司 Rapid prototyping device using page-width array printing

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