TWI423411B - - Google Patents
Info
- Publication number
- TWI423411B TWI423411B TW099101079A TW99101079A TWI423411B TW I423411 B TWI423411 B TW I423411B TW 099101079 A TW099101079 A TW 099101079A TW 99101079 A TW99101079 A TW 99101079A TW I423411 B TWI423411 B TW I423411B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Image Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099101079A TW201125091A (en) | 2010-01-15 | 2010-01-15 | Method for detecting wiring location of wire rack. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099101079A TW201125091A (en) | 2010-01-15 | 2010-01-15 | Method for detecting wiring location of wire rack. |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201125091A TW201125091A (en) | 2011-07-16 |
TWI423411B true TWI423411B (en) | 2014-01-11 |
Family
ID=45047329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099101079A TW201125091A (en) | 2010-01-15 | 2010-01-15 | Method for detecting wiring location of wire rack. |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201125091A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI818614B (en) * | 2022-07-04 | 2023-10-11 | 日商新川股份有限公司 | Semiconductor device manufacturing apparatus and manufacturing method |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4864514A (en) * | 1986-09-02 | 1989-09-05 | Kabushiki Kaisha Toshiba | Wire-bonding method and apparatus |
JPH02250340A (en) * | 1989-03-24 | 1990-10-08 | Marine Instr Co Ltd | Wire bonding |
JPH0472637A (en) * | 1990-07-12 | 1992-03-06 | Rohm Co Ltd | Bonding apparatus for integrated circuit |
JPH063124A (en) * | 1992-06-19 | 1994-01-11 | Tdk Corp | Equipment of visual inspection of wire bonding |
JPH0835474A (en) * | 1994-07-26 | 1996-02-06 | Ngk Spark Plug Co Ltd | Secondary voltage waveform detector for internal combustion engine |
TW560022B (en) * | 2001-10-26 | 2003-11-01 | Esec Trading Sa | Method for the calibration of a wire bonder |
US6709967B2 (en) * | 1996-05-28 | 2004-03-23 | Micron Technology, Inc. | Laser wire bonding for wire embedded dielectrics to integrated circuits |
US6886734B2 (en) * | 1996-12-13 | 2005-05-03 | Micron Technology, Inc. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
TW200607031A (en) * | 2004-08-11 | 2006-02-16 | Advanced Semiconductor Eng | Method for auto checking wire bonding parameters |
EP1069608B1 (en) * | 1999-01-22 | 2007-03-14 | Seiko Epson Corporation | Wire bonding method, semiconductor device and wire bonding device |
-
2010
- 2010-01-15 TW TW099101079A patent/TW201125091A/en not_active IP Right Cessation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4864514A (en) * | 1986-09-02 | 1989-09-05 | Kabushiki Kaisha Toshiba | Wire-bonding method and apparatus |
JPH02250340A (en) * | 1989-03-24 | 1990-10-08 | Marine Instr Co Ltd | Wire bonding |
JPH0472637A (en) * | 1990-07-12 | 1992-03-06 | Rohm Co Ltd | Bonding apparatus for integrated circuit |
JPH063124A (en) * | 1992-06-19 | 1994-01-11 | Tdk Corp | Equipment of visual inspection of wire bonding |
JPH0835474A (en) * | 1994-07-26 | 1996-02-06 | Ngk Spark Plug Co Ltd | Secondary voltage waveform detector for internal combustion engine |
US6709967B2 (en) * | 1996-05-28 | 2004-03-23 | Micron Technology, Inc. | Laser wire bonding for wire embedded dielectrics to integrated circuits |
US6886734B2 (en) * | 1996-12-13 | 2005-05-03 | Micron Technology, Inc. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
EP1069608B1 (en) * | 1999-01-22 | 2007-03-14 | Seiko Epson Corporation | Wire bonding method, semiconductor device and wire bonding device |
TW560022B (en) * | 2001-10-26 | 2003-11-01 | Esec Trading Sa | Method for the calibration of a wire bonder |
TW200607031A (en) * | 2004-08-11 | 2006-02-16 | Advanced Semiconductor Eng | Method for auto checking wire bonding parameters |
Also Published As
Publication number | Publication date |
---|---|
TW201125091A (en) | 2011-07-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |