TWI422292B - Printed circuit board - Google Patents

Description

A printed circuit board

The present invention relates to a printed circuit board, and more particularly to a printed circuit board having an inductive structure.

Consumer electronics has become the mainstream of products in the electronics market with increasing importance and explosive demand. In any consumer electronics product, inductive components play a very important role, especially in terms of filtering and storing energy. The inductance is the strength of the current that can be sensed when the body coil is in motion in the magnetic field. Therefore, when a general circuit needs to use an inductive component, the wire is often wound into a loop, thereby completing the fabrication of the inductor. When these inductor components are disposed on a printed circuit board, they are limited by the wiring area and the like, thereby affecting the function and cost control of the entire electronic product.

In view of the above, it is necessary to provide a printed circuit board having an inductive structure.

A printed circuit board comprising a first layer, a second layer, a plurality of vias, and a plurality of transmission lines disposed on the first layer and the second layer, the vias extending through the first layer and the second layer, The transmission line is used to sequentially connect the pads of the vias such that the transmission paths formed by the vias and the transmission lines are spirally wound.

The printed circuit board connects the via holes through the transmission line, so that the signal transmission path formed by the via hole and the transmission line is equivalent to the coil winding mode of the spiral inductor, so that the printed circuit board can be effectively generated Inductive effect, no additional auxiliary circuitry is required.

10‧‧‧ first floor

30a-30e, 300a-300d‧‧‧through pairs

60a, 62a, 60b, 62b, 60c, 62c, 60d, 62d, 60e, 62e, 60f, 62f, 600a, 620a, 600b, 620b, 600c, 620c, 600d, 620d, 600e, 620e‧ ‧ transmission line

20‧‧‧ second floor

32a, 36a, 32b, 36b, 32c, 36c, 32d, 36d, 32e, 36e, 320a, 360a, 320b, 360b, 320c, 360c, 320d, 360d‧‧‧ via

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a first preferred embodiment of a printed circuit board of the present invention.

2 is a graph showing simulation results of the differential input loss performance of the printed circuit board of FIG.

FIG. 3 is a simulation result of the common mode differential mode input loss performance of the printed circuit board of FIG. 1. FIG.

4 is a graph showing simulation results of inductance values of the printed circuit board of FIG. 1.

Figure 5 is a perspective view of a second preferred embodiment of the printed circuit board of the present invention.

Referring to FIG. 1, a first preferred embodiment of the printed circuit board of the present invention includes a first layer 10, a second layer 20, a plurality of via pairs, and a plurality of transmission lines, wherein each via pair includes two vias, each A via is used to connect the plurality of transmission lines on the first layer 10 and the second layer 20. Each transmission line is used to connect to the via pads. An insulating medium is filled between the first layer 10 and the second layer 20.

This embodiment is described by taking five via pairs 30a-30e as an example. In other embodiments, the number of via pairs may be any value greater than or equal to three. The via pair 30a includes two vias 32a, 36a, the via pair 30b includes two vias 32b, 36b, the via pair 30c includes two vias 32c, 36c, and the via pair 30d includes two vias 32d, 36d, vias Pair 30e includes two vias 32e, 36e. The via holes in the five via pairs 30a-30e are arranged in two parallel rows, the via pairs 30a, 30c, 30e are arranged in a first column, and the via pairs 30b, 30d are arranged in a second column. The via holes 32b, 36b, 32d, 36d of the via pairs 30b, 30d correspond to the vias 32c, 36c, 32e, 36e of the via pairs 30c, 30e. The via pair 30a is an input terminal, and the via pair 30e is an output terminal.

Transmission lines 60a and 62a are disposed on the first layer 10 and are respectively connected to the pads of the vias 32a and 36a for inputting signals. Transmission lines 60b and 62b are disposed on the second layer 20, and are respectively connected between the pads of the via holes 32a and 32b and between the pads of the via holes 36a and 36b. Transmission lines 60c and 62c are disposed on the first layer 10, and are connected between the pads of the via holes 32b and 32c and the pads of the via holes 36b and 36c, respectively. Transmission lines 60d and 62d are disposed on the second layer 20, and are connected between the pads of the via holes 32c and 32d and the pads of the via holes 36c and 36d, respectively. Transmission lines 60e and 62e are disposed on the first layer 10, and are connected between pads of the via holes 32d and 32e and between the pads of the via holes 36d and 36e, respectively. Transmission lines 60f and 62f are disposed on the second layer 20 and are connected to the pads of the via holes 32e and 36e, respectively, for outputting signals.

When the signal is input to the printed circuit board through the transmission line 60a, the signal is first transmitted to the second layer 20 through the via 32a in the first layer 10, and then transmitted to the via 32b through the transmission line 60b on the second layer 20, and then The transmission to the first layer 10 by the via 32b is transmitted from the transmission line 60c of the first layer 10 to the via 32c, whereby the interleaved signals between the first layer 10 and the second layer 20 are transmitted to the via 32e. The signal transmission path can be equivalent to the coil winding mode of the spiral inductor, so that the inductance effect can be effectively generated. In addition, an inductive effect can also be produced by the signal transmission path of the vias 36a-36e. The inductive effect of parallel conductors can also occur between the two transmission paths. Moreover, the signal transmission path generated by the via holes 32a-32e can be made equal to the signal transmission path generated by the via holes 36a-36e to achieve a better effect.

Please refer to FIG. 2 and FIG. 3 together, which are simulation results of the differential input loss performance and the common mode differential mode input loss performance of the printed circuit board, wherein the parameters are set as follows: between the via holes 32a and 32b The distance is 80 mils, the radius of the via 32a is 15 mils, the radius of the via 36a is 10 mils, and the distance between the two vias 36a and 32c For 40 mils, the distance between the two via pairs 32b and 32c is 34.6 mils.

As can be seen from FIG. 2 and FIG. 3, the printed circuit board enjoys excellent differential input loss frequency response in the low frequency to high frequency stage, and can effectively suppress common mode noise.

Please refer to FIG. 4, which is a simulation analysis of the inductance value on the printed circuit board. In FIG. 4, curve 40 represents the inductance value equivalent to the inductance effect generated by each transmission path, and curve 42 represents two transmissions. The inductance value equivalent to the inductance effect generated between the paths. As can be seen from Figure 4, each transmission path on the printed circuit board can produce an inductive effect at different frequency stages, and the inductive effect of parallel conductors can also occur between the two transmission paths.

Referring to FIG. 5, a second preferred embodiment of the printed circuit board of the present invention includes a first layer 100, a second layer 200, a plurality of via pairs, and a plurality of transmission lines, wherein the present embodiment includes four Hole pairs 300a, 300b, 300c, and 300d.

The via pair 300a includes two vias 320a and 360a, the via pair 300b includes two vias 320b and 360b, the via pair 300c includes two vias 320c and 360c, and the via pair 300d includes two vias 320d and 360d. The vias in the five via pairs 300a-300d are arranged in two parallel rows, the via pairs 300a and 300c are arranged in a first column, and the via pairs 300b and 300d are arranged in a second column. The via holes 320a, 360a, 320c, 360c of the via pairs 300a, 300c correspond to the vias 320b, 360b, 360d, 360d of the via pairs 300b, 300d. The via pair 300a is an input terminal, and the via pair 300d is an output terminal.

The transmission lines 600a and 620a are disposed on the first layer 100 and are respectively connected to the pads of the via holes 320a and 360a for inputting signals. The transmission lines 600b and 620b are disposed on the second layer 200, and are respectively connected between the pads of the via holes 320a and 320b and between the pads of the via holes 360a and 360b. Transmission lines 600c and 620c are disposed on the first layer 100, respectively It is connected between the pads of the via holes 320b and 320c and between the pads of the via holes 360b and 360c. The transmission lines 600d and 620d are disposed on the second layer 200, and are respectively connected between the pads of the via holes 320c and 320d and between the pads of the via holes 360c and 360d. The transmission lines 600e and 620e are disposed on the first layer 100 and are respectively connected to the pads of the via holes 320d and 360d for outputting signals.

According to the same principle as the first preferred embodiment, the signal transmission path composed of the via holes 320a-320d and the signal transmission path formed by the via holes 360a-360d can be equivalent to the coil winding mode of the spiral inductor, so Effectively produces an inductive effect. In addition, the inductive effect of parallel conductors can also occur between the two transmission paths.

The difference between the foregoing first embodiment and the second embodiment is that the signal input and output are located on different layers in the first embodiment, and the signal input and output are located on the same layer in the second embodiment. In other embodiments, only the via holes 32a-32e or 320a-320d may be included. In this case, only the inductance effect generated by the signal transmission path formed by the via holes 32a-32e or 320a-320d is generated. Moreover, the via holes 32a-32e, 36a-36e, 320a-320d or 360a-360d may be arranged in other manners as long as the signal transmission path formed by them is spirally wound.

The printed circuit board connects the via holes through the transmission line, so that the signal transmission path formed by the via hole and the transmission line is equivalent to the coil winding mode of the spiral inductor, so that the inductance effect can be effectively generated without an additional auxiliary circuit.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

20‧‧‧ first floor

30a-30e‧‧‧through hole pair

60a, 62a, 60b, 62b, 60c, 62c, 60d, 62d, 60e, 62e, 60f, 62f‧‧‧ transmission line

10‧‧‧ first floor

32a, 36a, 32b, 36b, 32c, 36c, 32d, 36d, 32e, 36e‧‧‧ vias

Claims (5)

A printed circuit board comprising a first layer, a second layer, a plurality of vias, and a plurality of transmission lines disposed on the first layer and the second layer, the vias extending through the first layer and the second layer, The transmission line is used for sequentially connecting the pads of the via holes such that the transmission paths formed by the via holes and the transmission lines are spirally wound, wherein the via holes are arranged in two columns parallel to each other, and the two columns have the same number and corresponding arrangement a plurality of vias, the pads of the first column of via holes on the first layer are connected to the pads of the next via after the row of vias in the second column through the transmission line, and the corresponding holes in the two columns on the second layer The pads of the vias of the location are connected by a transmission line. The printed circuit board of claim 1, wherein the vias comprise first to eighth vias, and the first, third, fifth and seventh vias are located in the first column, the first 2. The fourth, sixth, and eighth vias are located in the second column, and the first, third, fifth, and seventh vias respectively correspond to the second, fourth, sixth, and eighth vias Arranging, the pad of the first via hole on the first layer is connected to the pad of the sixth via hole through the transmission line, and the pad of the third via hole is connected to the eighth pad through the transmission line, and the first layer is on the second layer The pad of the hole is connected to the pad of the second via hole through the transmission line, the pad of the third via hole is connected to the pad of the fourth via hole through the transmission line, and the pad of the fifth via hole is transmitted through the transmission line and the sixth via hole. The pads are connected, and the pads of the seventh via are connected to the pads of the eighth via through the transmission line. A printed circuit board comprising a first layer, a second layer, a plurality of vias, and a plurality of transmission lines disposed on the first layer and the second layer, the vias extending through the first layer and the second layer, The transmission line is used for sequentially connecting the pads of the via holes such that the transmission paths formed by the via holes and the transmission lines are spirally wound, wherein the via holes comprise two columns arranged in parallel with each other, wherein the second column includes The number of holes is two more than the first column, and the via holes in the first column are arranged corresponding to the via holes except the two via holes arranged at one end in the second column; the corresponding positions in the two columns of the via holes on the first layer The via pads are connected through the transmission line, and the pads of the first column vias on the second layer are connected to the pads of the next via after the row of vias in the second column through the transmission line. The printed circuit board of claim 3, wherein the vias comprise a first through tenth via, the first, third, fifth and seventh vias being located in the first column, the second The fourth, sixth, eighth, ninth and tenth vias are located in the second column, and the first, third, fifth and seventh vias are respectively associated with the second, fourth, sixth and eighth The via holes are correspondingly arranged, and the ninth and tenth via holes are located on a side of the second via hole not adjacent to the fourth via hole; the pad of the first via hole on the first layer transmits the pad of the transmission line and the second via hole The pad of the connected, third via is connected to the pad of the fourth via through the transmission line, the pad of the fifth via is connected to the pad of the sixth via, and the pad of the seventh via is transmitted through the transmission line Connected to the pad of the eighth via, the first pad is connected to the pad of the tenth via through the transmission line, and the pad of the third via is connected to the ninth pad through the transmission line, the fifth pass The pad of the hole is connected to the pad of the second via through the transmission line, and the pad of the seventh via is connected to the pad of the fourth via through the transmission line. The printed circuit board of claim 3, wherein the vias comprise first to sixth vias, the first and third vias being located in the first column, the second, fourth, and fifth And the sixth via hole is located in the second column, and the first and third via holes are respectively arranged corresponding to the second and fourth via holes, and the fifth via hole is located on a side of the second via hole not adjacent to the fourth via hole The sixth via hole is located on a side of the fifth via hole not adjacent to the second via hole; the pad of the first via hole on the first layer is connected to the pad of the second via hole through the transmission line, and the third via hole is The pad is connected to the pad of the fourth via through the transmission line, and the pad of the first via on the second layer is connected to the pad of the sixth via through the transmission line, and the pad of the third via is transmitted through the transmission line and the fifth The via pads of the vias are connected.