TWI421481B - Preloaded pressure sensor module - Google Patents

Preloaded pressure sensor module Download PDF

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TWI421481B
TWI421481B TW100122119A TW100122119A TWI421481B TW I421481 B TWI421481 B TW I421481B TW 100122119 A TW100122119 A TW 100122119A TW 100122119 A TW100122119 A TW 100122119A TW I421481 B TWI421481 B TW I421481B
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pressure sensor
pressure
disposed
upper cover
electronic device
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TW100122119A
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Chinese (zh)
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TW201300750A (en
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Chih Sheng Hou
Yann Cherng Chern
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Universal Cement Corp
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Description

預壓式壓力感測器模組Pre-press pressure sensor module

本技藝係有關於一個壓力感測器,特別是一種預壓式壓力感測器模組(Preloaded Pressure Sensor Module,PPSM)。This technology is related to a pressure sensor, in particular a preloaded pressure sensor module (PPSM).

圖1是先前技藝Figure 1 is a prior art

圖中顯示一個平板式壓力感測器10,由上層堆疊141以及下層堆疊142所構成。上層堆疊141具有上層基材111;上層電極112安置於上層基材111下方;上層壓阻層113安置於上層電極112下方。下層堆疊142具有:下層基材121;下層電極122安置在下層基材121上;下層壓阻層123安置在下層電極122上。一對隔離單元114安置在上層堆疊141與下層堆疊142之間,致使一個空間13形成於上層壓阻層113與下層壓阻層123之間。上層電極112電性耦合至控制電路15的第一電極例如正極;下層電極122電性耦合至控制電路15的第二電極例如負極。The figure shows a flat pressure sensor 10 consisting of an upper stack 141 and a lower stack 142. The upper layer stack 141 has an upper layer substrate 111; the upper layer electrode 112 is disposed under the upper layer substrate 111; and the upper laminate resist layer 113 is disposed under the upper layer electrode 112. The lower layer stack 142 has a lower layer substrate 121; a lower layer electrode 122 is disposed on the lower layer substrate 121; and a lower laminate resist layer 123 is disposed on the lower layer electrode 122. A pair of isolation units 114 are disposed between the upper layer stack 141 and the lower layer stack 142 such that a space 13 is formed between the upper laminate resist layer 113 and the lower laminate resist layer 123. The upper electrode 112 is electrically coupled to a first electrode of the control circuit 15, such as a positive electrode; the lower electrode 122 is electrically coupled to a second electrode of the control circuit 15, such as a negative electrode.

圖2顯示圖1壓力感測器的受壓狀態Figure 2 shows the pressure state of the pressure sensor of Figure 1.

圖中顯示圖1壓力感測器的中央區域被使用者壓下,當上層壓阻層113接觸到下層壓阻層123以後,通過上層電極112與下層電極122的電路被導通。在上層壓阻層113與下層壓阻層123的材料表面剛開始接觸時的不穩定狀態,會產生如圖3的P10~P11區間所示不穩定的波浪信號輸出。The figure shows that the central region of the pressure sensor of Fig. 1 is depressed by the user. After the upper laminate resist layer 113 contacts the lower laminate resist layer 123, the circuit through the upper layer electrode 112 and the lower layer electrode 122 is turned on. When the surface of the material of the upper laminate resist layer 113 and the lower laminate resist layer 123 is initially in contact with the unstable state, an unstable wave signal output as shown in the interval P10 to P11 of Fig. 3 occurs.

圖3顯示圖2先前技藝的電路特性Figure 3 shows the circuit characteristics of the prior art of Figure 2.

圖中顯示Y軸為輸出電導,X軸為使用者對圖2單元所施加的壓力。L1顯示輸出電導對壓力的線形,在壓力為P00~P10區間,輸出電導為零,這是因為上層壓阻層113與下層壓阻層123尚未接觸的緣故。The figure shows the Y-axis as the output conductance and the X-axis as the pressure applied by the user to the unit of Figure 2. L1 shows the line shape of the output conductance versus pressure. The output conductance is zero in the pressure range of P00~P10 because the upper laminated resistive layer 113 and the lower laminated resistive layer 123 are not yet in contact.

在壓力為P10~P11區間,輸出電導為不穩定的波浪形狀,這是因為上層壓阻層113與下層壓阻層123表面剛開始接觸時的不穩定所造成。在壓力為P11之後呈現可以用於測量壓力的理想的直線線形,此時,P11的壓力值又被稱之為啟動壓力(activation force)。In the interval of pressure P10 to P11, the output conductance is an unstable wave shape due to the instability of the upper laminate resist layer 113 and the surface of the lower laminate resist layer 123 at the beginning of contact. After the pressure P11, an ideal linear shape that can be used to measure the pressure is presented. At this time, the pressure value of P11 is also referred to as an activation force.

圖1的先前技藝的缺點,便是量產以後,產品與產品之間,可以設定的啟動壓力差異頗大,這是由於本質上產品受壓初期的不穩定所造成的如圖3的P10~P11區域,各個產品之間的P10~P11區間大小不均勻所致。因此生產者必須折衷,若是設定相對較低的啟動壓力,以便產出可以測試較小壓力的產品時,便會有較多的不良產品被淘汰。The shortcoming of the prior art of Fig. 1 is that after the mass production, the starting pressure difference between the product and the product can be quite large, which is caused by the instability of the initial pressure of the product, as shown in Fig. 3, P10~ In the P11 area, the size of the P10~P11 interval between products is uneven. Therefore, producers must compromise, and if a relatively low starting pressure is set to produce a product that can test less pressure, more defective products will be eliminated.

本技藝揭露一個預壓式壓力感測器模組,相對於習知技藝而言,本技藝PPSM產品可以偵測相對較小的壓力。The present technology discloses a pre-stressed pressure sensor module that can detect relatively small pressures relative to prior art techniques.

圖4A顯示一片壓阻材料Figure 4A shows a piece of piezoresistive material

圖中顯示平板式壓阻材料PR具有一個厚度R1,在垂直方向第一電阻。The figure shows that the piezo-type piezoresistive material PR has a thickness R1 and a first resistance in the vertical direction.

圖4B顯示圖4A的壓阻材料被彎折的狀態4B shows the state in which the piezoresistive material of FIG. 4A is bent.

圖中顯示彎折的壓阻材料,在圖4B的剖面圖中央處,厚度R2變薄,即是R2<R1,這種中央較薄的狀態,呈現出壓阻材料PR的「預壓」(preloaded)效果。在中央變薄處,垂直方向具有較低的第二電阻。相對於圖4A未彎折狀態而言,圖4B中央較低的電阻會有較高的電導率。The figure shows a bent piezoresistive material. In the center of the cross-sectional view of Fig. 4B, the thickness R2 becomes thin, that is, R2 < R1, and the central thinner state exhibits a "preload" of the piezoresistive material PR ( Preloaded) effect. At the central thinning, the vertical direction has a lower second resistance. The lower central resistance of Figure 4B has a higher electrical conductivity relative to the unbent state of Figure 4A.

圖4B顯示圖4A的壓阻材料被彎折的狀態4B shows the state in which the piezoresistive material of FIG. 4A is bent.

圖中顯示彎折的壓阻材料,在圖4B的剖面圖中央處厚度R2變薄,即是R2<R1,這種中央較薄的狀態,呈現出壓阻材料PR的「預壓」(preloaded)效果。在中央變薄處,相對於圖4A未彎折狀態而言,圖4B中央垂直方向具有較低的電阻,即是具有較高的電導率。The figure shows a bent piezoresistive material. The thickness R2 is thinner at the center of the cross-sectional view of Fig. 4B, that is, R2 < R1. This thin central state exhibits "preloading" of the piezoresistive material PR (preloaded). )effect. At the central thinning, the central vertical direction of Fig. 4B has a lower electrical resistance with respect to the unbent state of Fig. 4A, i.e., has a higher electrical conductivity.

圖5A顯示製作第一PPSM的製程Figure 5A shows the process of making the first PPSM

圖5A顯示首先,準備一片平板式壓力感測器10;再準備具有凸面301的基材30。然後,將平板式壓力感測器10彎折安置在基材30的凸面301上。形成一個呈凸面狀的預壓式壓力感測模組(PPSM)10B(如圖6所示)。Fig. 5A shows that, first, a flat plate type pressure sensor 10 is prepared; and a substrate 30 having a convex surface 301 is prepared. Then, the flat pressure sensor 10 is bent and placed on the convex surface 301 of the substrate 30. A pre-stressed pressure sensing module (PPSM) 10B (shown in FIG. 6) is formed in a convex shape.

圖5B顯示圖5A基材的立體圖Figure 5B shows a perspective view of the substrate of Figure 5A

圖5B顯示基材30呈塊狀或是長條狀,上面呈現一個凸面301。Fig. 5B shows that the substrate 30 is in the form of a block or an elongated strip with a convex surface 301 on it.

圖6A顯示本技藝第一PPSMFigure 6A shows the first PPSM of the art

圖6A顯示依據圖5A的方式製作完成的第一PPSM,係將一片平板式壓力感測器10,安置在凸面基材30的上表面,且沿著基材凸面301的弧度彎折安置,製成本技藝第一PPSM 10B。PPSM 10B內部的上層壓阻層113以及下層壓阻層123中央區域相擠壓接觸,參考圖中截面圖所示。PPSM 10B的產品在中間區域的擠壓形成預壓(preloaded)效果,這種預壓效果等同將習知技藝加上預負載的(preloaded)效果,可以將習知產品早期測試區的不穩定區域預先消除,使得產品呈現出可以測試壓力的穩定區域,致使本產品PPSM 10B可以測試相對較小的壓力。6A shows a first PPSM fabricated in accordance with the manner of FIG. 5A, in which a flat plate pressure sensor 10 is placed on the upper surface of the convex substrate 30 and bent along the curvature of the substrate convex surface 301. Cost Skills First PPSM 10B. The upper laminate resist layer 113 inside the PPSM 10B and the central region of the lower laminate resist layer 123 are in press contact, as shown in the cross-sectional view of the drawing. The extrusion of the PPSM 10B product forms a preloaded effect in the middle zone. This preloading effect is equivalent to the prior art and preloaded effect, which can bring unstable regions in the early test area of the conventional product. Pre-cancellation allows the product to exhibit a stable area where the pressure can be tested, so that the product PPSM 10B can test relatively small pressures.

圖6B顯示圖6A的立體視圖。Fig. 6B shows a perspective view of Fig. 6A.

圖6B顯示PPSM 10B呈塊狀或是長條狀。Fig. 6B shows that the PPSM 10B is in the form of a block or a strip.

圖7顯示圖6A本技藝第一PPSM電性圖Figure 7 shows the first PPSM electrical diagram of the prior art of Figure 6A

直線L2顯示圖6A的PPSM 10B的電性關係,Y軸為輸出電導,X軸為壓力。圖中L2的直線區域,顯示其適合作為壓力測試區,圖中直線的起點P21被設定為本產品的啟動壓力。The straight line L2 shows the electrical relationship of the PPSM 10B of Fig. 6A, with the Y axis being the output conductance and the X axis being the pressure. The straight line area of L2 in the figure shows that it is suitable as a pressure test area, and the starting point P21 of the straight line in the figure is set as the starting pressure of the product.

圖8顯示本技藝產品與習知技藝的電性圖相比較Figure 8 shows an electrical diagram of the prior art product and the prior art.

圖中的線型L2為本產品PPSM 10B的電性圖呈現完全直線狀,而線型L1為圖1先前技藝的電性圖,呈現初期施壓時的不穩定輸出,例如壓力在10g~15g區間。兩者以相同的偵測閾值(DT)為1*10-6 /ohm作比較,可以看出本技藝產品在壓力為0g時便可被測得,而習知技藝的壓力在15g時才可以被測得。因此,比起習知技藝而言,本技藝產品可以測試的最小壓力相對比較低,而優於習知技藝。本產品具有較低的啟動壓力,使得本產品可以作為如行動電話等的電子產品的功能按鍵,且在產品設計時,可以依據施加壓力的大小觸發不同的功能,例如施加第一壓力時,觸發第一功能,施加第二壓力時,觸發第二功能...等。The line type L2 in the figure shows that the electrical pattern of the product PPSM 10B is completely linear, and the line type L1 is an electrical diagram of the prior art of Fig. 1, exhibiting an unstable output at the initial pressure application, for example, a pressure in the range of 10g to 15g. Comparing the same detection threshold (DT) to 1*10 -6 /ohm, it can be seen that the technical product can be measured at a pressure of 0g, while the pressure of the conventional technique can be 15g. It was measured. Thus, the minimum pressure that can be tested with the prior art products is relatively low compared to conventional techniques and is superior to conventional techniques. This product has a low starting pressure, which makes the product a function button for electronic products such as mobile phones, and when the product is designed, different functions can be triggered according to the magnitude of the applied pressure, for example, when the first pressure is applied, the trigger is triggered. The first function, when the second pressure is applied, triggers the second function...etc.

圖9顯示製作第二PPSM的製程Figure 9 shows the process of making a second PPSM

圖9顯示首先準備一個平板式壓力感測器40,平板式壓力感測器40具有五層材料,依序由上至下為:上層基材411、上層電極412、單層壓阻材料413、下層電極422、以及下層基材421。其次,準備一個具有凸面301以及平坦的底部的基材30。再來,將壓力感測器40安置於基材30表面且沿著凸面301的弧度彎折安置;完成本技藝的第二PPSM 40B產品(如圖10所示)。FIG. 9 shows that a flat pressure sensor 40 is first prepared. The flat pressure sensor 40 has five layers of materials, from top to bottom: upper substrate 411, upper electrode 412, single laminate resist material 413, The lower electrode 422 and the lower substrate 421. Next, a substrate 30 having a convex surface 301 and a flat bottom is prepared. Next, the pressure sensor 40 is placed on the surface of the substrate 30 and bent along the curvature of the convex surface 301; the second PPSM 40B product of the present technology is completed (as shown in FIG. 10).

圖10顯示圖9所製作完成的另一PPSMFigure 10 shows another PPSM made in Figure 9.

圖10顯示PPSM 40B,由上到下依序具有:彎折的上層基材411、彎折的上層電極412、彎折的單層壓阻材料413、彎折的下層電極422、彎折的下層電極421、以及一個凸面基材30。其中,彎折的壓阻材料413中央區域呈上下擠壓狀,如圖示所示。Fig. 10 shows a PPSM 40B having, in order from top to bottom, a bent upper substrate 411, a bent upper electrode 412, a bent single laminate resistor 413, a bent lower electrode 422, and a bent lower layer. An electrode 421 and a convex substrate 30. Wherein, the central region of the bent piezoresistive material 413 is extruded upward and downward as shown in the drawing.

圖11A顯示圖10的PPSM修飾後的另一PPSMFIG. 11A shows another PPSM after the PPSM modification of FIG.

圖11A顯示一個空間431被設置在壓阻材料413與下層電極422之間。此一產品的電性圖如同圖7所示。FIG. 11A shows that a space 431 is disposed between the piezoresistive material 413 and the lower layer electrode 422. The electrical diagram of this product is shown in Figure 7.

圖11B顯示圖10的PPSM修飾後的又另一PPSMFIG. 11B shows still another PPSM after the PPSM modification of FIG.

圖11B顯示一個空間432被設置在上層電極412與壓阻材料413之間。此一產品的電性圖如同圖7所示。FIG. 11B shows that a space 432 is disposed between the upper electrode 412 and the piezoresistive material 413. The electrical diagram of this product is shown in Figure 7.

圖12顯示一個行動電子裝置的頂面視圖Figure 12 shows a top view of a mobile electronic device

圖12顯示一個行動電子裝置60例如:行動電話、可攜式媒體撥放器、平板電腦、個人數位助理(Personal Digital Assistant,PDA)...等具有一個玻璃上蓋601用以保護下方元件如顯示器模組等。將本技藝的PPSM 10B或是40B安置在玻璃上蓋601的下方,使得施加於玻璃上蓋601的壓力可被偵測PPSM偵測。。12 shows a mobile electronic device 60 such as a mobile phone, a portable media player, a tablet, a Personal Digital Assistant (PDA), etc. having a glass cover 601 for protecting the underlying components such as a display. Modules, etc. The PPSM 10B or 40B of the present technology is placed under the glass cover 601 so that the pressure applied to the glass cover 601 can be detected by the detected PPSM. .

圖13顯示本技藝的PPSM的第一應用Figure 13 shows the first application of the PPSM of the present technology

圖13顯示四個PPSM 10B或是40B,安置在電子裝置60的玻璃上蓋601下方四個角落,每一個角落各安置一個PPSM 10B或是40B。每一個PPSM 10B或是40B皆電性耦合至控制單元用以觸發行動電子裝置60的功能。PPSM 10B或是40B感測來自於玻璃上蓋601的壓力,依據壓力大小分別觸發電子裝置的不同功能。Figure 13 shows four PPSMs 10B or 40B placed in four corners below the glass cover 601 of the electronic device 60, one PPSM 10B or 40B in each corner. Each PPSM 10B or 40B is electrically coupled to the control unit for triggering the function of the mobile electronic device 60. The PPSM 10B or 40B senses the pressure from the glass cover 601 and triggers different functions of the electronic device depending on the magnitude of the pressure.

圖14顯示本技藝的PPSM的第二應用Figure 14 shows a second application of the PPSM of the present technology

圖14顯示四個互補式凹枕622分別安置在玻璃上蓋601與PPSM之間,凹枕622的平底與玻璃上蓋601的下方平面接觸,凹枕622凹槽則與下方的PPSM的凸面相囓合。Figure 14 shows that four complementary recessed pillows 622 are respectively disposed between the glass upper cover 601 and the PPSM. The flat bottom of the concave pillow 622 is in planar contact with the lower surface of the glass upper cover 601, and the recess of the concave pillow 622 is engaged with the convex surface of the lower PPSM.

圖15顯示本技藝的PPSM的第三應用Figure 15 shows a third application of the PPSM of the present technology

圖15顯示四個凹槽602被設置在玻璃上蓋601下方四個角落。每一個凹槽602的下方安置有PPSM,凹槽602的凹面囓合於PPSM的凸面。PPSM係安置在移動式電子裝置60內部的框架63上方。Figure 15 shows four recesses 602 disposed at four corners below the glass upper cover 601. A PPSM is disposed below each of the grooves 602, and the concave surface of the groove 602 is engaged with the convex surface of the PPSM. The PPSM is placed over the frame 63 inside the mobile electronic device 60.

圖16顯示本技藝的PPSM的第四應用Figure 16 shows a fourth application of the PPSM of the present technology

圖16顯示條狀PPSM 40C被使用了,第一條條狀PPSM 40C安置在玻璃上蓋601下方左邊,第二條條狀PPSM 40C安置在玻璃上蓋601下方右邊。條狀PPSM 40C係安置在移動式電子裝置60內部的框架63上方。例外一種安置方式,則是將兩條PPSM分別安置在玻璃上蓋601下方的另外兩邊--前邊與後邊。Figure 16 shows that the strip PPSM 40C is used, the first strip PPSM 40C is placed on the left side of the glass upper cover 601, and the second strip PPSM 40C is placed on the lower side of the glass upper cover 601. The strip PPSM 40C is placed over the frame 63 inside the mobile electronic device 60. An alternative method is to place two PPSMs on the other two sides below the glass cover 601 - the front and the back.

圖17顯示本技藝的PPSM的第五應用Figure 17 shows the fifth application of the PPSM of the present technology.

圖17顯示兩條凹槽602被設置在玻璃上蓋601下方左右,凹槽602下方安置有PPSM 10B或是40B,凹槽的凹面囓合於PPSM 10B,40B的凸面。PPSM 10B或是40B,係安置在移動式電子裝置60內部的框架63上方。Fig. 17 shows that two recesses 602 are disposed below and below the glass upper cover 601, and PPSM 10B or 40B is disposed below the recess 602, and the concave surface of the recess engages the convex surface of the PPSM 10B, 40B. The PPSM 10B or 40B is disposed above the frame 63 inside the mobile electronic device 60.

圖18顯示本技藝的PPSM的第六應用Figure 18 shows the sixth application of the PPSM of the present technology

圖18顯示玻璃上蓋601下方設置有液晶顯示模組61,圖18的截面圖中,液晶顯示模組61的下方左右安置有一個PPSM 10B,40B,或是40C,當玻璃上蓋601被壓下時,液晶顯示模組61也被壓下,PPSM 10B,40B,或是40C感測到壓力,信號耦合至控制單元,然後控制單元觸發對應的功能。18 shows a liquid crystal display module 61 disposed under the glass upper cover 601. In the cross-sectional view of FIG. 18, a PPSM 10B, 40B, or 40C is disposed on the left and right sides of the liquid crystal display module 61 when the glass upper cover 601 is depressed. The liquid crystal display module 61 is also depressed, the PPSM 10B, 40B, or 40C senses the pressure, the signal is coupled to the control unit, and then the control unit triggers the corresponding function.

圖19顯示本技藝的PPSM的第七應用Figure 19 shows the seventh application of the PPSM of the present technology

圖19顯示電子裝置60具有一個框架62,框架62具有一個凸緣621。玻璃上蓋601安置在框架凸緣621下方,玻璃上蓋601下方與液晶顯示模組61之間設置有一個空間633,圖18的截面圖中,液晶顯示模組61的左右端比玻璃上蓋601短,在玻璃上蓋601下方左右各安置有一個PPSM 10B,40B,或是40C,當玻璃上蓋601被壓下時,PPSM 10B,40B,或是40C感測到壓力,信號耦合至控制單元,然後控制單元觸發對應的功能。空間633是用以提供玻璃上蓋601下壓所需要的緩衝區域。Figure 19 shows electronic device 60 having a frame 62 with a flange 621. The glass upper cover 601 is disposed under the frame flange 621. A space 633 is disposed between the lower surface of the glass upper cover 601 and the liquid crystal display module 61. In the cross-sectional view of FIG. 18, the left and right ends of the liquid crystal display module 61 are shorter than the glass upper cover 601. A PPSM 10B, 40B, or 40C is placed on the left and right of the glass cover 601. When the glass cover 601 is pressed, the PPSM 10B, 40B, or 40C senses the pressure, the signal is coupled to the control unit, and then the control unit Trigger the corresponding function. The space 633 is used to provide a buffer area required for the glass upper cover 601 to be pressed down.

圖20顯示本技藝的PPSM的第八應用Figure 20 shows the eighth application of the PPSM of the present technology.

圖20與圖19類似,只有在PPSM的安置為上下顛倒。本技藝的PPSM 10B,40B,或是40C平底朝上,安置在玻璃上蓋601下方,PPSM的凸面向下接觸於框架62。Figure 20 is similar to Figure 19 except that the placement of the PPSM is upside down. The PPSM 10B, 40B, or 40C of the present technology is placed upside down on the glass cover 601 with the convex face of the PPSM facing down to the frame 62.

圖21顯示本技藝的PPSM的第九應用Figure 21 shows the ninth application of the PPSM of the present technology.

圖21顯示移動式電子裝置60具有U形框架62,一個整合式顯示模組70安置在框架62上方開口處。整合式顯示模組70整合「觸控面板」(touch panel)於上方。圖21截面圖顯示第一PPSM 10B,40B,或是40C安置在整合式顯示模組70下方左邊,第二PPSM安置在整合式顯示模組70下方右邊。當整合式顯示模組70被壓下時,PPSM感測到壓力,信號耦合至控制單元,然後控制單元觸發對應的功能。21 shows that the mobile electronic device 60 has a U-shaped frame 62 with an integrated display module 70 disposed at an opening above the frame 62. The integrated display module 70 integrates a "touch panel" on the top. 21 is a cross-sectional view showing that the first PPSM 10B, 40B, or 40C is disposed on the left side of the integrated display module 70, and the second PPSM is disposed on the lower side of the integrated display module 70. When the integrated display module 70 is depressed, the PPSM senses the pressure, the signal is coupled to the control unit, and the control unit then triggers the corresponding function.

圖22顯示製作第三PPSM的製程Figure 22 shows the process of making a third PPSM

圖22顯示首先準備一個平板式壓力感測器10,其次準備凹面801的一個基材80。然後,將平板式壓力感測器10彎折安置在基座80的凹面801上。平板式壓力感測器10沿著凹面801的弧度安置,構成本技藝第三PPSM。Figure 22 shows that a flat pressure sensor 10 is first prepared, and secondly a substrate 80 of the concave surface 801 is prepared. Then, the flat pressure sensor 10 is bent and placed on the concave surface 801 of the base 80. The flat pressure sensor 10 is placed along the curvature of the concave surface 801 to form the third PPSM of the present technology.

圖23A~23B顯示本技藝的第三PPSM23A-23B show a third PPSM of the present technology

圖23A顯示一個凹面PPSM由一個平板式壓力感測器沿著凹面801安置構成本技藝的凹面壓力感測器80B。圖23B顯示本技藝的PPSM的立體視圖。Figure 23A shows a concave PPSM placed by a flat pressure sensor along concave surface 801 to form a concave pressure sensor 80B of the present technology. Figure 23B shows a perspective view of the PPSM of the present technology.

圖24顯示製作第四PPSM的製程Figure 24 shows the process of making the fourth PPSM

圖24顯示首先準備一個平板式壓力感測器40,平板式壓力感測器40係由五層材料堆疊而成,該五層材料由上到下依序為:上層基材411、上層電極412、單層壓阻材料413、下層電極、422、以及下層基材421。其次,準備一個凹面基材80,該凹面基材80具有一個凹面801於上方,具有一個平面底部於下方。再其次,將平板式壓力感測器40彎折安置在基座80的凹面801上。平板式壓力感測器10沿著凹面801的弧度安置,構成本技藝的PPSM 80C(如圖25A所示)。FIG. 24 shows that a flat pressure sensor 40 is first prepared. The flat pressure sensor 40 is formed by stacking five layers of materials, which are sequentially from top to bottom: upper substrate 411 and upper electrode 412. A single laminate resistor 413, a lower electrode, a 422, and a lower substrate 421. Next, a concave substrate 80 having a concave surface 801 above it has a flat bottom and a lower surface. Secondly, the flat pressure sensor 40 is bent and placed on the concave surface 801 of the base 80. The flat pressure sensor 10 is placed along the curvature of the concave surface 801 to form the PPSM 80C of the present technology (as shown in Figure 25A).

圖25A~25B顯示本技藝第五PPSM25A-25B show the fifth PPSM of the present technology

圖25A顯示依據圖24製作完成的凹面式PPSM 80C,截面圖中顯示,其中的壓阻材料413的中央區域上下呈擠壓狀,而呈現出預壓(preloaded)效果。圖25B顯示本技藝的PPSM的立體視圖。Fig. 25A shows a concave PPSM 80C which is completed in accordance with Fig. 24, and shows a cross-sectional view in which the central portion of the piezoresistive material 413 is extruded upward and downward to exhibit a preloaded effect. Figure 25B shows a perspective view of the PPSM of the present technology.

圖26顯示本技藝PPSM的第十應用Figure 26 shows the tenth application of the present technology PPSM

圖26顯示移動式電子產品60的玻璃上蓋601,左邊下方安置有第一凸枕603,右邊安置有第二凸枕603。第一PPSM 80C安置於第一凸枕603下方,第二PPSM 80C安置於第二凸枕603下方。凸枕603的凸面囓合於PPSM 80C的凹面,當玻璃上蓋601被壓下時,凹面PPSM 80C感測到壓力,信號耦合至控制單元,然後控制單元觸發對應的功能。26 shows the glass upper cover 601 of the mobile electronic product 60, with a first pillow 603 disposed on the lower left side and a second pillow 603 disposed on the right side. The first PPSM 80C is disposed under the first pillow 603, and the second PPSM 80C is disposed below the second pillow 603. The convex surface of the rib 603 is engaged with the concave surface of the PPSM 80C. When the glass upper cover 601 is depressed, the concave PPSM 80C senses the pressure, the signal is coupled to the control unit, and then the control unit triggers the corresponding function.

圖27顯示本技藝PPSM的第二電性線型Figure 27 shows the second electrical line type of the present technology PPSM

圖27顯示本技藝的PPSM的「輸出電容」對「壓力」的關係線型,參考圖6A本技藝的PPSM等同於一個電容結構:上層電極112、上層壓阻材料113、下層壓阻材料123、下層電極122的結構,整個結構等同於電容器結構。當元件被壓下時,上下電極的電容產生變化。其中的上層壓阻材料113與下層壓阻材料123作為介電材料,可以被其他介電材料所取代,上層電極112安置於介電材料的上面,下層電極122安置於介電材料的下面,構成電容器結構。不同的電容輸出,電性耦合至控制單元,可以分別觸發不同的功能。27 shows the relationship between the "output capacitance" and the "pressure" of the PPSM of the present technology. Referring to FIG. 6A, the PPSM of the present technology is equivalent to a capacitor structure: an upper electrode 112, an upper laminate resistive material 113, a lower laminated resistive material 123, and a lower layer. The structure of the electrode 122 is equivalent to the capacitor structure. When the component is depressed, the capacitance of the upper and lower electrodes changes. The upper laminate barrier material 113 and the lower laminate barrier material 123 are used as dielectric materials, and may be replaced by other dielectric materials. The upper layer electrode 112 is disposed on the upper surface of the dielectric material, and the lower layer electrode 122 is disposed under the dielectric material. Capacitor structure. Different capacitor outputs are electrically coupled to the control unit to trigger different functions.

前述描述揭示了本技藝之較佳實施例以及設計圖式,惟,較佳實施例以及設計圖式僅是舉例說明,並非用於限制本技藝之權利範圍於此,凡是以均等之技藝手段實施本技藝者、或是以下述之「申請專利範圍」所涵蓋之權利範圍而實施者,均不脫離本技藝之精神而為申請人之權利範圍。The above description of the preferred embodiments and the drawings are intended to be illustrative of the preferred embodiments of the invention The present invention is intended to be within the scope of the applicant's scope of the invention.

10...壓力感測器10. . . Pressure sensor

10B...預壓式壓力感測器10B. . . Preload pressure sensor

111...上層基材111. . . Upper substrate

112...上層電極112. . . Upper electrode

113...上層壓阻材料113. . . Upper laminate resistance material

114...隔離單元114. . . Isolation unit

121...下層基材121. . . Underlying substrate

122...下層電極122. . . Lower electrode

123...下層壓阻材料123. . . Lower laminate resistance material

13...空間13. . . space

141...上層堆疊141. . . Upper stack

142...下層堆疊142. . . Lower stack

15...控制電路15. . . Control circuit

211...上層基材211. . . Upper substrate

212...上層電極212. . . Upper electrode

213...上層壓阻材料213. . . Upper laminate resistance material

221...下層基材221. . . Underlying substrate

222...下層電極222. . . Lower electrode

223...下層壓阻材料223. . . Lower laminate resistance material

225...壓阻材料225. . . Piezoresistive material

PR...壓阻材料PR. . . Piezoresistive material

30...凸面基材30. . . Convex substrate

301...凸面301. . . Convex

10B...預壓式壓力感測器10B. . . Preload pressure sensor

40...壓力感測器40. . . Pressure sensor

40B...預壓式壓力感測器40B. . . Preload pressure sensor

40C...預壓式壓力感測器40C. . . Preload pressure sensor

411...上層基材411. . . Upper substrate

412...上層電極412. . . Upper electrode

413...壓阻材料413. . . Piezoresistive material

421...下層基材421. . . Underlying substrate

422...下層電極422. . . Lower electrode

431...空間431. . . space

432...空間432. . . space

60...手機60. . . Mobile phone

601...手機玻璃蓋601. . . Mobile phone glass cover

602...凹槽602. . . Groove

603...凸枕603. . . Pillow

61...液晶顯示模組61. . . Liquid crystal display module

62...手機框架62. . . Mobile phone frame

621...框架凸緣621. . . Frame flange

622...凹枕622. . . Concave pillow

63...手機框架63. . . Mobile phone frame

633...空間633. . . space

70...整合式顯示單元(in-cell touch)70. . . Integrated display unit (in-cell touch)

80...凹面基材80. . . Concave substrate

80B...預壓式壓力感測器80B. . . Preload pressure sensor

801...凹面801. . . Concave surface

圖1是先前技藝Figure 1 is a prior art

圖2顯示圖1壓力感測器的受壓狀態Figure 2 shows the pressure state of the pressure sensor of Figure 1.

圖3顯示圖2先前技藝的電路特性Figure 3 shows the circuit characteristics of the prior art of Figure 2.

圖4A顯示一片壓阻材料Figure 4A shows a piece of piezoresistive material

圖4B顯示圖4A的壓阻材料被彎折的狀態4B shows the state in which the piezoresistive material of FIG. 4A is bent.

圖5A顯示製作第一PPSM的製程Figure 5A shows the process of making the first PPSM

圖5B顯示圖5A基材的立體圖Figure 5B shows a perspective view of the substrate of Figure 5A

圖6A顯示本技藝第一PPSMFigure 6A shows the first PPSM of the art

圖6B顯示圖6A的立體視圖。Fig. 6B shows a perspective view of Fig. 6A.

圖7顯示圖6A本技藝第一PPSM電性圖Figure 7 shows the first PPSM electrical diagram of the prior art of Figure 6A

圖8顯示本技藝產品與習知技藝的電性圖相比較Figure 8 shows an electrical diagram of the prior art product and the prior art.

圖9顯示製作第二PPSM的製程Figure 9 shows the process of making a second PPSM

圖10顯示圖9所製作完成的另一PPSMFigure 10 shows another PPSM made in Figure 9.

圖11A顯示圖10的PPSM修飾後的另一PPSMFIG. 11A shows another PPSM after the PPSM modification of FIG.

圖11B顯示圖10的PPSM修飾後的又另一PPSMFIG. 11B shows still another PPSM after the PPSM modification of FIG.

圖12顯示一個行動電子裝置的頂面視圖Figure 12 shows a top view of a mobile electronic device

圖13顯示本技藝的PPSM的第一應用Figure 13 shows the first application of the PPSM of the present technology

圖14顯示本技藝的PPSM的第二應用Figure 14 shows a second application of the PPSM of the present technology

圖15顯示本技藝的PPSM的第三應用Figure 15 shows a third application of the PPSM of the present technology

圖16顯示本技藝的PPSM的第四應用Figure 16 shows a fourth application of the PPSM of the present technology

圖17顯示本技藝的PPSM的第五應用Figure 17 shows the fifth application of the PPSM of the present technology.

圖18顯示本技藝的PPSM的第六應用Figure 18 shows the sixth application of the PPSM of the present technology

圖19顯示本技藝的PPSM的第七應用Figure 19 shows the seventh application of the PPSM of the present technology

圖20顯示本技藝的PPSM的第八應用Figure 20 shows the eighth application of the PPSM of the present technology.

圖21顯示本技藝的PPSM的第九應用Figure 21 shows the ninth application of the PPSM of the present technology.

圖22顯示製作第三PPSM的製程Figure 22 shows the process of making a third PPSM

圖23A~23B顯示本技藝的第三PPSM23A-23B show a third PPSM of the present technology

圖24顯示製作第四PPSM的製程Figure 24 shows the process of making the fourth PPSM

圖25A~25B顯示本技藝第五PPSM25A-25B show the fifth PPSM of the present technology

圖26顯示本技藝PPSM的第十應用Figure 26 shows the tenth application of the present technology PPSM

圖27顯示本技藝PPSM的第二電性線型Figure 27 shows the second electrical line type of the present technology PPSM

111...上層基材111. . . Upper substrate

112...上層電極112. . . Upper electrode

113...上層壓阻材料113. . . Upper laminate resistance material

114...隔離單元114. . . Isolation unit

121...下層基材121. . . Underlying substrate

122...下層電極122. . . Lower electrode

123...下層壓阻材料123. . . Lower laminate resistance material

30...凸面基材30. . . Convex substrate

Claims (31)

一種預壓式壓力感測器,包含:一個硬質基材,具有一個曲面;以及一個壓力感測器,直接接觸安置於所述之曲面上,且沿著所述之曲面形狀安置。 A pre-pressure type pressure sensor comprising: a hard substrate having a curved surface; and a pressure sensor disposed directly on the curved surface and disposed along the curved surface shape. 如申請專利範圍第1項所述之一種預壓式壓力感測器,其中所述之壓力感測器,更包含:上層壓感材料;以及下層壓感材料,安置於所述之上層壓感材料下方;以及其中所述之上層壓感材料的中央底部與所述之下層壓感材料的中央上方相接觸。 A pre-pressure type pressure sensor according to claim 1, wherein the pressure sensor further comprises: an upper laminate sensing material; and a lower laminate sensing material disposed on the laminated feeling Below the material; and wherein the central bottom of the laminate sensation material is in contact with the center of the lower laminate sensation material. 如申請專利範圍第2項所述之一種預壓式壓力感測器,其中所述之兩個壓感材料層係沿著所述之曲面彎折安置者。 A pre-pressure type pressure sensor according to claim 2, wherein the two layers of pressure sensitive material are bent along the curved surface. 如申請專利範圍第3項所述之一種預壓式壓力感測器,其中所述之曲面,係選自於下述族群中的一種:凸面以及凹面。 A pre-pressure type pressure sensor according to claim 3, wherein the curved surface is selected from one of the following groups: a convex surface and a concave surface. 如申請專利範圍第2項所述之一種預壓式壓力感測器,其中所述之壓感材料,至少一層係選自於下述族群中的一種:壓阻材料以及介電材料。 A pre-pressure type pressure sensor according to claim 2, wherein the at least one layer of the pressure sensitive material is selected from one of the group consisting of a piezoresistive material and a dielectric material. 如申請專利範圍第5項所述之一種預壓式壓力感測器,更包含:上層電極,安置於所述之上層壓感材料上方;以及下層電極,安置於所述之下層壓感材料下方。A pre-pressure pressure sensor according to claim 5, further comprising: an upper electrode disposed above the upper laminate sensing material; and a lower electrode disposed under the lower laminate sensing material . 如申請專利範圍第6項所述之一種預壓式壓力感測器,更包含:上層基材,安置於所述之上層電極上方;以及下層基材,安置於所述之下層電極下方。A pre-pressure type pressure sensor according to claim 6, further comprising: an upper substrate disposed above the upper layer electrode; and a lower substrate disposed under the lower layer electrode. 如申請專利範圍第1項所述之一種預壓式壓力感測器,其中所述之曲面係選自於下數族群中的一種:凸面以及凹面。A pre-pressure type pressure sensor according to claim 1, wherein the curved surface is selected from the group consisting of a convex group and a concave surface. 如申請專利範圍第1項所述之一種預壓式壓力感測器,其中所述之壓力感測器,更包含:上層電極;下層電極;以及單層壓感材料,安置於所述之上層電極與所述之下層電極之間。The pre-pressure type pressure sensor of claim 1, wherein the pressure sensor further comprises: an upper layer electrode; a lower layer electrode; and a single laminate sensing material disposed on the upper layer Between the electrode and the underlying electrode. 如申請專利範圍第9項所述之一種預壓式壓力感測器,其中所述之壓感材料,係選自於下述族群中的一種:壓阻材料以及介電材料。A pre-pressure type pressure sensor according to claim 9, wherein the pressure sensitive material is selected from one of the group consisting of a piezoresistive material and a dielectric material. 如申請專利範圍第9項所述之一種預壓式壓力感測器,更包含:空間,安置於所述之上層電極與所述之壓感材料之間。A pre-pressure type pressure sensor according to claim 9, further comprising: a space disposed between the upper layer electrode and the pressure sensitive material. 如申請專利範圍第9項所述之一種預壓式壓力感測器,更包含:空間,安置於所述之壓感材料與所述之下層電極之間。A pre-pressure type pressure sensor according to claim 9, further comprising: a space disposed between the pressure sensitive material and the lower layer electrode. 如申請專利範圍第9項所述之一種預壓式壓力感測器,更包含:上層基材,安置於所述之上層電極上方;以及下層基材,安置於所述之下層電極下方。 A pre-pressure type pressure sensor according to claim 9, further comprising: an upper substrate disposed above the upper electrode; and a lower substrate disposed under the lower electrode. 如申請專利範圍第9項所述之一種預壓式壓力感測器,其中所述之曲面,係選自於下述族群中的一種:凸面與凹面。 A pre-pressure type pressure sensor according to claim 9, wherein the curved surface is selected from one of the following groups: a convex surface and a concave surface. 如申請專利範圍第1項所述之一種預壓式壓力感測器,其中所述之壓力感測器,係選自於下述族群中的一種:壓阻式壓力感測器以及電容式壓力感測器。 A pre-pressure type pressure sensor according to claim 1, wherein the pressure sensor is selected from the group consisting of a piezoresistive pressure sensor and a capacitive pressure. Sensor. 一種可攜式電子裝置,包含:上蓋玻璃;以及如申請專利範圍第1項所述之預壓式壓力感測器模組,安置於所述之上蓋玻璃下方。 A portable electronic device comprising: an upper cover glass; and the pre-pressure type pressure sensor module according to claim 1 , disposed under the upper cover glass. 如申請專利範圍第16項所述之一種可攜式電子裝置,其中所述之預壓式壓力感測器模組,具有頂部凸面;以及四個所述之預壓式壓力感測器模組被使用,每一個分別安置在四個角落之一,且以所述之頂部凸面與所述之玻璃上蓋相接觸。 The portable electronic device of claim 16, wherein the pre-pressure type pressure sensor module has a top convex surface; and four of the pre-press pressure sensor modules They are used, each of which is placed in one of four corners, and is in contact with the glass upper cover with the top convex surface. 如申請專利範圍第17項所述之一種可攜式電子裝置,更包含:凹枕,安置於所述之玻璃上蓋以及所述之預壓式壓力感測器模組之間。 The portable electronic device of claim 17, further comprising: a concave pillow disposed between the glass upper cover and the pre-pressure pressure sensor module. 如申請專利範圍第17項所述之一種可攜式電子裝置,更包含:凹面,安置於所述之玻璃上蓋的下表面,耦合於所述之預壓式壓力感測器模組之頂部凸面。 The portable electronic device of claim 17, further comprising: a concave surface disposed on a lower surface of the glass upper cover and coupled to the top convex surface of the pre-pressure pressure sensor module . 如申請專利範圍第16項所述之一種可攜式電子裝置,其中所述之預壓式壓力感測器,具有頂部凸面;第一條所述之預壓式壓力感測器,安置於所述之玻璃上蓋下方第一邊,且以所述之頂部凸面接觸所述之玻璃上蓋下方;以及第二條所述之預壓式壓力感測器,安置於所述之玻璃上蓋下方第二邊,且以所述之頂部凸面接觸所述之玻璃上蓋下方。The portable electronic device of claim 16, wherein the pre-pressure type pressure sensor has a top convex surface; and the first pre-pressure type pressure sensor is disposed in the The first side below the glass upper cover, and the top convex surface contacting the glass upper cover; and the second preload pressure sensor disposed on the second side of the glass upper cover And the top convex surface contacts the underside of the glass upper cover. 如申請專利範圍第20項所述之一種可攜式電子裝置,其中所述之第一邊以及所述之第二邊,係指:前邊與後邊。The portable electronic device of claim 20, wherein the first side and the second side are: front and back sides. 如申請專利範圍第20項所述之一種可攜式電子裝置,其中所述之第一邊以及所述之第二邊,係指:左邊與右邊。The portable electronic device of claim 20, wherein the first side and the second side are: left and right. 如申請專利範圍第20項所述之一種可攜式電子裝置,更包含:第一凹面,設置於所述之玻璃上蓋的下表面,耦合於前述之第一條凸面預壓式感測模組的凸面;以及第二凹面,設置於所述之玻璃上蓋的下表面,耦合於前述之第二條凸面預壓式感測模組的凸面。The portable electronic device of claim 20, further comprising: a first concave surface disposed on a lower surface of the glass upper cover, coupled to the first convex preloading sensing module And a second concave surface disposed on the lower surface of the glass upper cover and coupled to the convex surface of the second convex pre-pressing sensing module. 如申請專利範圍第16項所述之一種可攜式電子裝置,其中所述之預壓式壓力感測器模組,具有頂部凸面以及平面底部;以及所述之預壓式壓力感測器模組,安置於所述之玻璃上蓋下方,且以所述之平面底部接觸所述之玻璃上蓋下方。The portable electronic device of claim 16, wherein the pre-pressure type pressure sensor module has a top convex surface and a flat bottom portion; and the pre-pressure type pressure sensor module The group is disposed under the glass upper cover and contacts the underside of the glass upper cover with the flat bottom. 一種可攜式電子裝置,包含:顯示模組;以及如申請專利範圍第1項所述之預壓式壓力感測模組,安置於所述之顯示模組下方。A portable electronic device comprising: a display module; and the pre-pressure type pressure sensing module according to claim 1 of the patent application, disposed under the display module. 一種可攜式電子裝置,包含:玻璃上蓋;空間,設置於所述之玻璃上蓋下方;顯示模組,設置於所述之空間下方;第一條預壓式壓力感測模組,安置於所述之玻璃上蓋下方第一邊;以及第二條預壓式壓力感測模組,安置於所述之玻璃上蓋下方第二邊;其中所述之顯示模組,設置於所述之兩條預壓式壓力感測模組之間。A portable electronic device comprises: a glass upper cover; a space disposed under the glass upper cover; a display module disposed below the space; and a first pre-press pressure sensing module disposed at the The first side of the glass upper cover is disposed; and the second pre-pressure type pressure sensing module is disposed on the second side of the glass upper cover; wherein the display module is disposed on the two pre-s Pressure between pressure sensing modules. 一種可攜式電子裝置,包含:整合式顯示模組,具有觸摸式感測器;以及如申請專利範圍第1項所述之預壓式壓力感測模組,安置於所述之整合式顯示模組下方。A portable electronic device comprising: an integrated display module having a touch sensor; and a preload pressure sensing module according to claim 1 of the patent application, disposed in the integrated display Below the module. 一種可攜式電子裝置,包含:玻璃上蓋,底部具有枕塊;以及如申請專利範圍第5項所述之預壓式壓力感測模組,安置於所述之枕塊下方;其中所述之枕塊,底部具有一個外形互補於所述之預壓式壓力感測器的上表面之外形者。A portable electronic device comprising: a glass upper cover having a pillow block at the bottom; and a pre-pressure type pressure sensing module according to claim 5, disposed under the pillow block; wherein The pillow block has a shape at the bottom that is complementary to the outer surface of the pre-stressed pressure sensor. 一種可攜式電子裝置,包含:玻璃上蓋,具有枕塊;以及如申請專利範圍第11項所述之預壓式壓力感測模組,安置於所述之枕塊下方;其中所述之枕塊,底部具有一個外形互補於所述之預壓式壓力感測器的上表面之外形者。 A portable electronic device comprising: a glass upper cover having a pillow block; and a pre-pressure type pressure sensing module according to claim 11 disposed under the pillow block; wherein the pillow is The block has a shape at the bottom that is complementary to the outer surface of the pre-stressed pressure sensor. 一種製作預壓式壓力感測模組的製程,包含:準備硬質基材,所述之基材具有曲面;準備壓力感測器;以及將所述之壓力感測器,直接接觸安置於所述之曲面,且沿著所述之曲面形狀而彎折安置者。 A process for fabricating a pre-compression pressure sensing module, comprising: preparing a hard substrate, the substrate having a curved surface; preparing a pressure sensor; and placing the pressure sensor in direct contact with the pressure sensor The curved surface and the setter is bent along the curved shape. 如申請專利範圍第30項所述之.一種製作預壓式壓力感測模組的製程,其中所述之曲面,係選自於下述族群中的一種:凸面以及凹面。 A process for fabricating a pre-compression pressure sensing module, wherein the curved surface is selected from one of the following groups: a convex surface and a concave surface, as described in claim 30.
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