TWI420155B - Method for manufacturing optical module and display device - Google Patents

Description

Optical module and manufacturing method of display device

The invention relates to an optical module and a manufacturing method of the display device, in particular to a cutting method which can be used in a birefringent lens process.

In general, the principle of artificial stereoscopic image imaging is to simulate the real situation, to generate the existence of a true solid object, or to project different images (paired stereo images) to the left and right eyes, respectively, to provide additional depth information to form a stereoscopic image. The conventional stereo image imaging technology can be divided into three types: holographic, planar, and paired stereo images. In view of the fact that the hologram and the flat type have a large number of data processing difficulties and the display effect is not good, in recent years, the research on the stereoscopic image display is mainly based on the stereoscopic image type. In the paired stereoscopic image type, the spatially multiplexed stereoscopic display technology is the main application technology.

The optical techniques used in common conventional spatial multiplexed stereoscopic displays are mainly slanted lenticular lenses and parallax barriers. Because the twill grating technology does not have brightness loss, the twill grating technology has a better brightness advantage than the parallax barrier technology. In order to achieve the display advantages of the twill grating technology, and also have the 2D/3D switching function, a switching element can be arranged on the liquid crystal display, and a birefringence lens is matched to form a set of 2D/3D switchable. Stereo display.

In the process of manufacturing a birefringent lens, a lens structure is generally formed on a large glass substrate, and then a dicing is performed by a conventional cutting method (for example, cutter wheel cutting) to form a plurality of birefringent lenses. However, in the process of splitting, the lens structure is often separated from the glass substrate, so that the production yield of the birefringent lens is greatly reduced.

Therefore, an object of the present invention is to provide an optical module and a method of manufacturing the display device, which use the laser and the cutter to respectively cut the lens structure and the substrate to solve the above problem.

According to an embodiment, a method of fabricating an optical module of the present invention comprises: providing a plate comprising a lens structure and a substrate, the lens structure being formed on a first surface of the substrate; and cutting by a laser on the lens structure Forming a groove to expose the first surface of the substrate to the trench; cutting a cutting line on a second surface of the substrate by a cutter, the second surface being opposite to the first surface, the cutting line being opposite to the groove; The plate is split from the cutting line.

According to another embodiment, a method of fabricating a display device of the present invention includes: providing a plate material comprising a lens structure and a substrate, the lens structure being formed on a first surface of the substrate; and cutting by a laser on the lens structure Forming a groove to expose the first surface of the substrate to the trench; cutting a cutting line on the second surface of the substrate by a cutter, the second surface is opposite to the first surface, and the cutting line is opposite to the groove; The plate is split from the cutting line to form two optical modules; the optical module is disposed on a liquid crystal module; and the liquid crystal module is disposed on a display module.

According to another embodiment, a method of manufacturing an optical module of the present invention includes: providing a plate material comprising a lens structure, a first substrate, a second substrate, and a first liquid crystal material, the first substrate being located in the lens structure and Between the second substrates, the first liquid crystal material is disposed between the first substrate and the second substrate; a trench is cut on the lens structure by a laser to expose the first substrate to the trench; The groove cuts a first cutting line on the first substrate; the second cutting line is cut on the second substrate by the cutter, the second cutting line is opposite to the first cutting line; and the sheet is cut from the first cutting line The second cutting line is split.

According to another embodiment, a method of manufacturing a display device of the present invention includes: providing a plate material comprising a lens structure, a first substrate, a second substrate, and a first liquid crystal material, wherein the first substrate is located in the lens structure and Between the two substrates, the first liquid crystal material is disposed between the first substrate and the second substrate; a trench is cut on the lens structure by a laser to expose the first substrate to the trench; Cutting a first cutting line on the first substrate; cutting a second cutting line on the second substrate by the cutter, the second cutting line is opposite to the first cutting line; cutting the sheet from the first cutting line and the second cutting line The line is split to form two optical modules; the optical module is disposed on a display module.

In summary, the present invention firstly uses a laser to cut a groove on the lens structure to expose the substrate to the groove, and then uses a cutter to cut the cutting line at a position corresponding to the groove on the substrate, so When the cutting line is split, it ensures that the lens structure is not separated from the substrate, thereby improving the production yield of the optical module.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

Referring to FIG. 1 and FIG. 2, FIG. 1 is a flow chart showing a method of manufacturing an optical module according to an embodiment of the present invention, and FIG. 2 is a schematic view showing a process of the first embodiment. First, in step S10, a sheet 1 is provided, wherein the sheet 1 comprises a lens structure 10 and a substrate 12, and the lens structure 10 is formed on one of the first surfaces 120 of the substrate 12, as shown in Fig. 2(A). In this embodiment, the substrate 12 can be a glass substrate, but is not limited thereto. Next, step S12 is performed to cut a trench 100 on the lens structure 10 by a laser 2, and expose the first surface 120 of the substrate 12 to the trench 100, as shown in FIG. 2(B) and FIG. 2 ( C) is shown. Next, step S14 is performed to turn the sheet 1 and a cutting line 124 is cut on the second surface 122 of the substrate 12 by a cutter 3, wherein the second surface 122 is opposite to the first surface 120, and the cutting line 124 Opposite the trenches 100, more specifically, the dicing lines 124 are substantially aligned with the trenches 100, as shown in Figure 2(C). Finally, step S16 is performed to rupture the sheet 1 from the cutting line 124. According to the above-described cutting method, the sheet material 1 can be cut into a plurality of optical modules composed of the lens structure 10 and the substrate 12.

As shown in Fig. 2, the trench 100 formed by the laser-cutting lens structure 10 is substantially trapezoidal. In this embodiment, the bottom width W1 of the trench 100 is between 15 and 40 microns, and the top width W2 of the trench is between 200 and 400 microns. Further, since the groove 100 is formed by laser 2 cutting, if the circumference of the groove 100 is observed by an electron microscope, a burnt mark is found.

In practical applications, a pair of alignment marks 102 may be formed in the lens structure 10. Before performing the cutting process of steps S12 and S14, an image sensor such as a charge coupled device (CCD) is used. An image sensor or a complementary metal oxide semiconductor (CMOS) image sensor reads the alignment mark 102 for alignment. Thereby, the laser 2 and the cutter 3 can accurately cut the groove 100 and the cutting line 124 in a relative position. In addition, in practical applications, the substrate 12 may be a glass substrate, the laser 2 may be a focus laser, and the cutter 3 may be a diamond cutter wheel, but not limited thereto.

Please refer to FIG. 3 and FIG. 4, FIG. 3 is a detailed flowchart of step S10 of FIG. 1, and FIG. 4 is a schematic diagram of a process with FIG. First, step S100 is performed to provide the substrate 12 as shown in Fig. 4(A). Next, in step S102, a glue layer 14 is formed on the substrate 12 as shown in FIG. 4(B). Next, in step S104, a plurality of grooves 140 and alignment marks 102 are formed on the sealant layer 14, as shown in FIG. 4(C). Next, in step S106, a liquid crystal material 16 is filled in each of the grooves 140, as shown in FIG. 4(D). Next, in step S108, a film 18 is formed on the sealant layer 14, as shown in FIG. 4(E). Finally, step S110 is performed to cure the liquid crystal material 16. Thereby, the production of the above-mentioned sheet material 1 is completed. In this embodiment, the lens structure 10 described above includes a sealant layer 14, a liquid crystal material 16, and a film 18. In this embodiment, the film 18 can be a polyester film (PET), but is not limited thereto.

Please refer to FIG. 5. FIG. 5 is a schematic diagram of a display device 4 according to an embodiment of the invention. As shown in Fig. 5, the optical module 1' can be formed by the above process. In the present invention, the optical module 1' can be disposed on a liquid crystal module 40, and the liquid crystal module 40 can be disposed on a display module 42. Thereby, the production of the display device 4 is completed. It should be noted that the film 18 is removed first before the optical module 1' is disposed on the liquid crystal module 40. In this embodiment, the liquid crystal module 40 can be a twisted nematic liquid crystal module, but is not limited thereto. In practical applications, the liquid crystal module 40 can include two upper and lower glass substrates, and a transparent electrode (such as indium tin oxide), an alignment layer, and a liquid crystal layer are disposed between the two glass substrates; the display module 42 can include upper and lower Two glass substrates are provided with a plurality of pixels (for example, a plurality of red pixels, green pixels, and blue pixels) between the two glass substrates, and elements such as a polarizing plate are disposed on the upper and lower glass substrates.

Please refer to FIG. 6. FIG. 6 is a schematic diagram of a display device 4' according to another embodiment of the present invention. As shown in FIG. 6, the main difference between the display device 4' and the display device 4 described above is that the liquid crystal module 40 of the display device 4' is disposed between the optical module 1' and the display module 42.

Please refer to FIG. 7 and FIG. 8 . FIG. 7 is a flow chart of a method for manufacturing an optical module according to another embodiment of the present invention, and FIG. 8 is a schematic diagram of a process with FIG. 7 . First, in step S30, a plate 5 is provided. The plate 5 includes a lens structure 50, a first substrate 51, a second substrate 52, and a first liquid crystal material 53. The first substrate 51 is located at the lens structure 50 and the second. Between the substrates 52, and the first liquid crystal material 53 is disposed between the first substrate 51 and the second substrate 52, as shown in Fig. 8(A). In this embodiment, the first substrate 51 and the second substrate 52 may be glass substrates, but not limited thereto. Next, step S32 is performed to cut a trench 500 on the lens structure 50 by a laser 6 and expose the first substrate 51 to the trench 500, as shown in FIGS. 8(B) and 8(C). Show. Next, in step S34, a first cutting line 510 is cut on the first substrate 51 by a cutter 7 through the groove 500, as shown in Fig. 8(C). Next, step S36 is performed to turn the sheet 5 over, and a second cutting line 520 is cut on the second substrate 52 by the cutter 7, wherein the second cutting line 520 is opposite to the first cutting line 510, more specifically, The second cutting line 520 is substantially aligned with the first cutting line 510 as shown in Fig. 8(D). Finally, step S38 is performed to split the sheet 5 from the first cutting line 510 and the second cutting line 520. According to the above-described cutting method, the sheet material 5 can be cut into a plurality of optical modules composed of the lens structure 50, the first substrate 51, the second substrate 52, and the first liquid crystal material 53. In this embodiment, the first liquid crystal material 53 can be a twisted nematic liquid crystal material, but is not limited thereto.

As shown in Fig. 8, the groove 500 formed by the laser 6-cut lens structure 50 is substantially trapezoidal. In this embodiment, the bottom width W3 of the trench 500 is between 150 and 400 microns, and the top width W4 of the trench 500 is between 1200 and 1800 microns. Further, since the groove 500 is formed by cutting by the laser 6, if the periphery of the groove 500 is observed by an electron microscope, a burnt mark is found.

In a practical application, a pair of bit marks 502 may be formed in the lens structure 50, and an image sensor such as a CCD image sensor or a complementary MOS film CMOS image may be used before the cutting process of steps S32 and S36 is performed. The sensor reads the alignment mark 502 for alignment. Thereby, the laser 6 and the cutter 7 can accurately cut the groove 500, the first cutting line 510 and the second cutting line 520 in opposite positions. In addition, in practical applications, the first substrate 51 and the second substrate 52 may be glass substrates, the laser 60 may be a defocus laser, and the tool 7 may be a diamond cutter wheel, but not limited thereto.

Please refer to FIG. 9 and FIG. 10, FIG. 9 is a detailed flowchart of step S30 of FIG. 7, and FIG. 10 is a schematic diagram of a process with FIG. First, step S300 is performed to combine the first substrate 51 and the second substrate 52, wherein the first liquid crystal material 53 is disposed between the first substrate 51 and the second substrate 52, as shown in FIG. 10(A). As shown in FIG. 10(A), a transparent electrode 55 (for example, indium tin oxide) and an alignment layer 57 may be further included between the first substrate 51 and the second substrate 52. Next, in step S302, a glue layer 54 is formed on the first substrate 51 as shown in FIG. 10(B). Next, in step S304, a plurality of grooves 540 and alignment marks 502 are formed on the sealant layer 54, as shown in FIG. 10(C). Next, in step S306, a second liquid crystal material 56 is filled in each of the grooves 540, as shown in FIG. 10(D). Next, in step S308, a film 58 is formed on the sealant layer 54, as shown in FIG. 10(E). Finally, step S310 is performed to cure the second liquid crystal material 56. Thereby, the production of the above-mentioned sheet 5 is completed. In this embodiment, the lens structure 50 described above includes a sealant layer 54, a second liquid crystal material 56, and a film 58. In this embodiment, the film 58 may be a polyester film (PET), but is not limited thereto.

Referring to FIG. 11, FIG. 11 is a schematic diagram of a display device 8 according to another embodiment of the present invention. As shown in Fig. 11, the optical module 5' can be formed by the above process. The optical module 5' can be disposed on a display module 82. Thereby, the production of the display device 8 is completed. It should be noted that the film 58 is removed first before the optical module 5' is disposed on the display module 82. In practical applications, the display module 82 can include two upper and lower glass substrates, and a plurality of pixels (for example, a plurality of red pixels, green pixels, and blue pixels) are disposed between the two glass substrates. Components such as a polarizing plate are disposed on the two glass substrates.

Please refer to FIG. 12, which is a schematic diagram of a display device 8' according to another embodiment of the present invention. As shown in FIG. 12, the main difference between the display device 8' and the display device 8 described above is that the optical module 5' of the display device 8' is attached to the display module 82 by the second substrate 52.

Compared with the prior art, since the present invention firstly uses a laser to cut a groove on the lens structure, the substrate is exposed to the groove, and then the cutting line is cut at a position corresponding to the groove on the substrate by the cutter. When the lobes are cut along the cutting line, it is ensured that the lens structure is not separated from the substrate, thereby improving the production yield of the optical module.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1, 5. . . Plate

1', 5'. . . Optical module

2, 6. . . Laser

3, 7. . . Tool

4, 4', 8, 8'. . . Display device

10, 50. . . Lens structure

12. . . Substrate

14, 54. . . Sealing layer

16. . . Liquid crystal material

18, 58. . . film

40. . . LCD module

42, 82. . . Display module

51. . . First substrate

52. . . Second substrate

53. . . First liquid crystal material

55. . . Transparent electrode

56. . . Second liquid crystal material

57. . . Alignment layer

100, 500. . . Trench

102, 502. . . Alignment mark

120. . . First surface

122. . . Second surface

124. . . Cutting line

140, 540. . . Groove

510. . . First cutting line

520. . . Second cutting line

W1, W3. . . Bottom width

W2, W4. . . Top width

S10-S16, S100-S110, S30-S38, S300-S310. . . step

1 is a flow chart of a method of fabricating an optical module in accordance with an embodiment of the present invention.

Figure 2 is a schematic diagram of the process with the first figure.

Fig. 3 is a detailed flowchart of step S10 of Fig. 1.

Figure 4 is a schematic diagram of the process with the third drawing.

Figure 5 is a schematic diagram of a display device in accordance with an embodiment of the present invention.

Figure 6 is a schematic diagram of a display device in accordance with another embodiment of the present invention.

Figure 7 is a flow chart of a method of fabricating an optical module in accordance with another embodiment of the present invention.

Figure 8 is a schematic diagram of the process with Figure 7.

Fig. 9 is a detailed flowchart of step S30 of Fig. 7.

Figure 10 is a schematic diagram of the process with the Figure 9.

Figure 11 is a schematic view of a display device in accordance with another embodiment of the present invention.

Figure 12 is a schematic view of a display device in accordance with another embodiment of the present invention.

S10-S16. . . step

Claims (20)

A method for manufacturing an optical module, comprising: providing a plate material comprising a lens structure and a substrate, the lens structure being formed on a first surface of the substrate; and cutting a laser on the lens structure a trench, the first surface of the substrate being exposed to the trench, wherein a bottom of the trench has a width between 15 and 40 microns, and a top width of the trench is between 200 and 400 microns; a cutter cutting a cutting line on a second surface of the substrate, the second surface being opposite the first surface, the cutting line being opposite the groove; and splitting the sheet from the cutting line to The optical module is formed. The manufacturing method of claim 1, wherein the step of providing the sheet material comprises: providing the substrate; forming a glue layer on the substrate; forming a plurality of grooves on the sealant layer; The groove is filled with a liquid crystal material; a film is formed on the sealant layer; and the liquid crystal material is cured; wherein the lens structure comprises the sealant layer, the liquid crystal material and the film. The manufacturing method of claim 1, further comprising: forming a pair of bit marks on the sealant layer. The manufacturing method of claim 1, wherein the laser is a focused laser. A manufacturing method of a display device, comprising: providing a plate material comprising a lens structure and a substrate formed on a first surface of the substrate; cutting a groove on the lens structure by a laser a groove, the first surface of the substrate being exposed to the trench, wherein a width of a bottom of the trench is between 15 and 40 micrometers, and a top width of the trench is between 200 and 400 micrometers; The cutter cuts a cutting line on a second surface of the substrate, the second surface is opposite to the first surface, the cutting line is opposite to the groove; the plate is split from the cutting line to form two An optical module; one of the optical modules is disposed on a liquid crystal module; and the liquid crystal module is disposed on a display module. The manufacturing method of claim 5, wherein the step of providing the sheet material comprises: providing the substrate; forming a glue layer on the substrate; forming a plurality of grooves on the sealant layer; The groove is filled with a liquid crystal material; a film is formed on the sealant layer; and the liquid crystal material is cured; wherein the lens structure comprises the sealant layer, the liquid crystal material and the film. The manufacturing method of claim 6, further comprising: forming a pair of bit marks on the sealant layer. The manufacturing method of claim 6, further comprising: removing the film before one of the optical modules is disposed on the liquid crystal module. The manufacturing method of claim 5, wherein the laser is a focused laser. The manufacturing method of claim 5, wherein the liquid crystal module is a twisted nematic liquid crystal module. A method for manufacturing an optical module, comprising: providing a plate material comprising a lens structure, a first substrate, a second substrate, and a first liquid crystal material, wherein the first substrate is located on the lens structure and the second substrate The first liquid crystal material is disposed between the first substrate and the second substrate; a trench is cut on the lens structure by a laser to expose the first substrate to the trench, wherein the The bottom of the trench has a width between 150 and 400 micrometers, and the top width of the trench is between 1200 and 1800 micrometers; a first cutting line is cut on the first substrate by the cutter through the trench Cutting a second cutting line on the second substrate by the cutter, the second cutting a wire is opposite the first cutting line; and the plate is split from the first cutting line and the second cutting line to form the optical module. The manufacturing method of claim 11, wherein the step of providing the plate material comprises: combining the first substrate and the second substrate, wherein the first liquid crystal material is disposed between the first substrate and the second substrate; Forming a glue layer on the first substrate; forming a plurality of grooves on the sealant layer; filling a second liquid crystal material in each of the grooves; forming a film on the sealant layer; and curing The second liquid crystal material; wherein the lens structure comprises the sealant layer, the second liquid crystal material, and the film. The manufacturing method of claim 12, further comprising: forming a pair of bit marks on the sealant layer. The manufacturing method of claim 11, wherein the laser is an out-of-focus laser. The manufacturing method of claim 11, wherein the first liquid crystal material is a twisted nematic liquid crystal material. A manufacturing method of a display device, comprising: providing a plate material, comprising: a lens structure, a first substrate, a second substrate, and a first liquid crystal material, wherein the first substrate is located on the lens structure and the second substrate The first liquid crystal material is disposed between the first substrate and the second substrate; a trench is cut on the lens structure by a laser to expose the first substrate to the trench, wherein the trench The bottom of the groove has a width of between 150 and 400 microns, and the top width of the groove is between 1200 and 1800 microns; a first cutting line is cut on the first substrate by the cutter through the groove; Cutting a second cutting line on the second substrate by the cutter, the second cutting line is opposite to the first cutting line; and splitting the sheet from the first cutting line and the second cutting line to Forming two optical modules; one of the optical modules is disposed on a display module. The manufacturing method of claim 16, wherein the step of providing the plate material comprises: combining the first substrate and the second substrate, wherein the first liquid crystal material is disposed between the first substrate and the second substrate; Forming a glue layer on the first substrate; forming a plurality of grooves on the sealant layer; filling a second liquid crystal material in each of the grooves; forming a film on the sealant layer; and curing The second liquid crystal material; Wherein, the lens structure comprises the sealant layer, the second liquid crystal material and the film. The manufacturing method of claim 17, further comprising: forming a pair of bit marks on the sealant layer. The method of manufacturing of claim 16, wherein the laser is an out-of-focus laser. The manufacturing method of claim 16, wherein the first liquid crystal material is a twisted nematic liquid crystal material.