Claims (10)
一種化學機械拋光液，包含水、摻雜金屬的二氧化矽及速率促進劑，該速率促進劑為下列群組中之一種或多種：有機酸、氟化物、氨水、季銨鹽及其衍生物。
A chemical mechanical polishing liquid comprising water, metal doped cerium oxide and a rate promoter, the rate promoter being one or more of the group consisting of organic acids, fluorides, ammonia, quaternary ammonium salts and derivatives thereof .
如申請專利範圍第1項所述之化學機械拋光液，其中該金屬為鋁、鋯、鈰、金、銀、鐵、鉻或鉬。
The chemical mechanical polishing liquid according to claim 1, wherein the metal is aluminum, zirconium, hafnium, gold, silver, iron, chromium or molybdenum.
如申請專利範圍第1項所述之化學機械拋光液，其中該摻雜金屬的二氧化矽之粒徑為20~80奈米。
The chemical mechanical polishing liquid according to claim 1, wherein the doped metal cerium oxide has a particle diameter of 20 to 80 nm.
如申請專利範圍第1項所述之化學機械拋光液，其中該摻雜金屬的二氧化矽之用量為質量百分比1~20%。
The chemical mechanical polishing liquid according to claim 1, wherein the doped metal cerium oxide is used in an amount of 1 to 20% by mass.
如申請專利範圍第4項所述之化學機械拋光液，其中該摻雜金屬的二氧化矽之用量為質量百分比3~10%。
The chemical mechanical polishing liquid according to claim 4, wherein the metal-doped cerium oxide is used in an amount of 3 to 10% by mass.
如申請專利範圍第1項所述之化學機械拋光液，其中該有機酸係選自草酸、2-膦酸丁烷-1,2,4-三羧酸、2-羥基膦醯基乙酸、氨基三亞甲基膦酸及酒石酸中的一種或多種，該氟化物係選自氟化氫、氟化銨、氟矽酸銨及氟硼酸銨中的一種或多種，該季銨鹽係選自四丁基氫氧化銨、四甲基氫氧化銨及四丁基氟硼酸銨中的一種或多種。
The chemical mechanical polishing liquid according to claim 1, wherein the organic acid is selected from the group consisting of oxalic acid, butane-1,2,4-tricarboxylic acid, 2-hydroxyphosphoninoacetic acid, and amino group. One or more of trimethylenephosphonic acid and tartaric acid, the fluoride being selected from one or more of hydrogen fluoride, ammonium fluoride, ammonium fluoroantimonate and ammonium fluoroborate, the quaternary ammonium salt being selected from the group consisting of tetrabutyl hydrogen One or more of ammonium oxide, tetramethylammonium hydroxide, and tetrabutylammonium fluoroborate.
如申請專利範圍第1項所述之化學機械拋光液，其中該速率促進劑的用量為質量百分比0.05~1%。
The chemical mechanical polishing liquid according to claim 1, wherein the rate promoter is used in an amount of 0.05 to 1% by mass.
如申請專利範圍第7項所述之化學機械拋光液，其中該速率促進劑的用量為質量百分比0.1~0.6%。
The chemical mechanical polishing liquid according to claim 7, wherein the rate promoter is used in an amount of 0.1 to 0.6% by mass.
如申請專利範圍第1項所述之化學機械拋光液，其中該化學機械拋光液的pH值為2~5。
The chemical mechanical polishing liquid according to claim 1, wherein the chemical mechanical polishing liquid has a pH of 2 to 5.
如申請專利範圍第1項所述之化學機械拋光液，進一步包含緩蝕劑、氧化劑、絡合劑及表面活性劑中的一種或多種。
The chemical mechanical polishing liquid according to claim 1, further comprising one or more of a corrosion inhibitor, an oxidizing agent, a complexing agent and a surfactant.