TWI418965B - Temperature balance device and operation system utilizing the samepower supply device - Google Patents
Temperature balance device and operation system utilizing the samepower supply device Download PDFInfo
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本發明係有關於一種操作系統,特別是有關於一種具有溫度平衡裝置的操作系統。The present invention relates to an operating system, and more particularly to an operating system having a temperature balancing device.
隨著科技的快速發展,電子產品朝向高功率及輕、薄、短、小且多功能化的方向發展。一般而言,電子產品內部包括許多被動元件以及主動元件。主動元件(active component)一般是指電晶體和積體電路(Integrated Circuit,IC)。積體電路是眾多電晶體的組合體,具有訊號放大的功能。相對的,被動元件(Passive Components)一般指的是電阻、電容和電感。With the rapid development of technology, electronic products are developing in the direction of high power and light, thin, short, small and multi-functional. In general, electronic products include many passive components as well as active components. An active component generally refers to a transistor and an integrated circuit (IC). The integrated circuit is a combination of a plurality of transistors and has a function of signal amplification. In contrast, Passive Components generally refer to resistors, capacitors, and inductors.
為了縮小電子產品的體積,電子產品內部的電子元件(被動元件以及主動元件)也愈來愈小。然而,在電子元件的體積變小的情況下,電子元件很容易受到溫度的影響。In order to reduce the size of electronic products, electronic components (passive components and active components) inside electronic products are becoming smaller and smaller. However, in the case where the volume of the electronic component becomes small, the electronic component is easily affected by temperature.
本發明提供一種溫度平衡裝置,耦接一電源供應裝置,並包括一第一感測模組、一第二感測模組以及一處理模組。第一感測模組根據電源供應裝置的周圍溫度,產生一第一偵測信號。第二感測模組根據電源供應裝置的周圍溫度,產生一第二偵測信號。處理模組處理第一及第二偵測信號,並根據處理後的結果,產生一第一平衡信號以及一第二平衡信號予電源供應裝置。The present invention provides a temperature balancing device coupled to a power supply device and includes a first sensing module, a second sensing module, and a processing module. The first sensing module generates a first detection signal according to the ambient temperature of the power supply device. The second sensing module generates a second detection signal according to the ambient temperature of the power supply device. The processing module processes the first and second detection signals, and generates a first balance signal and a second balance signal to the power supply device according to the processed result.
本發明另提供一種操作系統,包括一電源供應裝置、一負載以及一溫度平衡裝置。電源供應裝置產生一輸出電壓。負載根據輸出電壓而動作。溫度平衡裝置包括,一第一感測模組、一第二感測模組以及一處理模組。第一感測模組根據電源供應裝置的周圍溫度,產生一第一偵測信號。第二感測模組根據電源供應裝置的周圍溫度,產生一第二偵測信號。處理模組處理第一及第二偵測信號,並根據處理後的結果,產生一第一平衡信號以及一第二平衡信號予電源供應裝置。The invention further provides an operating system comprising a power supply device, a load and a temperature balance device. The power supply device generates an output voltage. The load operates according to the output voltage. The temperature balancing device includes a first sensing module, a second sensing module, and a processing module. The first sensing module generates a first detection signal according to the ambient temperature of the power supply device. The second sensing module generates a second detection signal according to the ambient temperature of the power supply device. The processing module processes the first and second detection signals, and generates a first balance signal and a second balance signal to the power supply device according to the processed result.
為讓本發明之特徵和優點能更明顯易懂,下文特舉出較佳實施例,並配合所附圖式,作詳細說明如下:In order to make the features and advantages of the present invention more comprehensible, the preferred embodiments are described below, and are described in detail with reference to the accompanying drawings.
第1圖為本發明之操作系統之示意圖。如圖所示,操作系統100包括,電源供應裝置110、負載130以及溫度平衡裝置150。電源供應裝置110產生輸出電壓VOUT 。負載130根據輸出電壓VOUT 而動作。溫度平衡裝置130根據電源供應裝置110周圍溫度,產生平衡信號SP1 與SP2 予該電源供應裝置。Figure 1 is a schematic diagram of the operating system of the present invention. As shown, the operating system 100 includes a power supply device 110, a load 130, and a temperature balancing device 150. The power supply device 110 generates an output voltage V OUT . The load 130 operates in accordance with the output voltage V OUT . The temperature balance device 130 generates balance signals S P1 and S P2 to the power supply device in accordance with the temperature around the power supply device 110.
在本實施例中,溫度平衡裝置150包括感測模組151、153以及處理模組155。感測模組151、153根據電源供應裝置110的周圍溫度,各自產生偵測信號SD1 與SD2 。處理模組155處理偵測信號SD1 與SD2 ,並根據處理後的結果,產生平衡信號SP1 與SP2 。In the embodiment, the temperature balancing device 150 includes sensing modules 151 and 153 and a processing module 155. The sensing modules 151 and 153 respectively generate detection signals S D1 and S D2 according to the ambient temperature of the power supply device 110 . The processing module 155 processes the detection signals S D1 and S D2 and generates balanced signals S P1 and S P2 according to the processed results.
在一可能實施例中,感測模組的數量與電源供應裝置110的內部結構有關,稍後將詳細說明。另外,在本實施例中,溫度平衡裝置150具有感測模組151及153,但並非用以限制本發明。在其它實施例中,溫度平衡裝置150可具有三個以上的感測模組。In a possible embodiment, the number of sensing modules is related to the internal structure of the power supply device 110, as will be described in detail later. In addition, in the present embodiment, the temperature balance device 150 has the sensing modules 151 and 153, but is not intended to limit the present invention. In other embodiments, the temperature balancing device 150 can have more than three sensing modules.
第2圖為本發明之處理模組之一可能實施例。如圖所示,處理模組155包括,電流產生單元210、電流鏡230以及計算單元250。電流產生單元210根據參考信號SPREF ,產生參考電流IREF 。在本實施例中,電流產生單元210係為一比較器211。當比較器211之非反相(+)輸入端接收一預設位準SPR ,並且其反相(-)輸入端接收參考信號SPREF 時,則比較器211的輸出端便可產生參考電流IREF 。Figure 2 is a possible embodiment of a processing module of the present invention. As shown, the processing module 155 includes a current generating unit 210, a current mirror 230, and a computing unit 250. The current generating unit 210 generates a reference current I REF according to the reference signal S PREF . In the present embodiment, the current generating unit 210 is a comparator 211. When the non-inverting (+) input of the comparator 211 receives a predetermined level S PR and the inverting (-) input thereof receives the reference signal S PREF , the output of the comparator 211 can generate a reference current I REF .
電流鏡230根據參考電流IREF ,產生電流信號I1 及I2 。感測模組151根據電流信號I1 以及電源供應裝置110的周圍溫度,產生偵測信號SD1 。同樣地,感測模組153根據電流信號I2 以及電源供應裝置110的周圍溫度,產生偵測信號SD2 。在一可能實施例中,電流信號I1 係等於電流信號I2 。The current mirror 230 generates current signals I 1 and I 2 based on the reference current I REF . The sensing module 151 generates the detection signal S D1 according to the current signal I 1 and the ambient temperature of the power supply device 110. Similarly, the sensing module 153 generates the detection signal S D2 according to the current signal I 2 and the ambient temperature of the power supply device 110. In a possible embodiment, the current signal I 1 is equal to the current signal I 2 .
在另一可能實施例中,感測模組151及153分別具有熱敏電阻RPTS1 及RPTS2 。熱敏電阻RPTS1 及RPTS2 的阻抗係隨溫度而變化。當電流信號I1 流經熱敏電阻RPTS1 時,將使得節點N271 具有一電壓位準。在本實施例中,節點N271 的電壓位準係為偵測信號SD1 。同樣地,當電流信號I2 流經熱敏電阻RPTS2 時,將使得節點N272 具有一電壓位準。在本實施例中,節點N272 的電壓位準係為偵測信號SD2 。In another possible embodiment, the sensing modules 151 and 153 have thermistors R PTS1 and R PTS2 , respectively . The impedance of the thermistors R PTS1 and R PTS2 varies with temperature. When the current signal I 1 flows through the thermistor R PTS1 , the node N 271 will have a voltage level. In this embodiment, the voltage level of the node N 271 is the detection signal S D1 . Similarly, when the current signal I 2 flows through the thermistor R PTS2 , the node N 272 will have a voltage level. In this embodiment, the voltage level of the node N 272 is the detection signal S D2 .
計算單元250根據偵測信號SD1 與SD2 ,得到一平均值,並根據該平均值,分別處理偵測信號SD1 與SD2 ,用以產生平衡信號SP1 與SP2 。在一實施例中,計算單元250平均偵測信號SD1 與SD2 ,以得到該平均值。Calculating unit 250 according to the detection signal S D1 and S D2, to obtain an average value, and based on the average value, respectively, processed detection signal S D1 and S D2, for generating balanced signals S P1 and S P2. In one embodiment, computing unit 250 averages signals S D1 and S D2 to obtain the average.
在本實施例中,計算單元250根據該平均值,調整偵測信號SD1 與SD2 ,並根據調整後的結果,產生具有電流格式的平衡信號SP1 與SP2 ,但並非用以限制本發明。在其它實施例中,計算單元250可利用其它方式,產生電流格式或電壓格式的平衡信號。In this embodiment, the calculating unit 250 adjusts the detection signals S D1 and S D2 according to the average value, and generates balanced signals S P1 and S P2 having a current format according to the adjusted result, but is not used to limit the present. invention. In other embodiments, computing unit 250 may utilize other means to generate a balanced signal in either current or voltage format.
第3圖為電源供應裝置之一可能實施例。如圖所示,電源供應裝置110包括,脈寬調變(Pulse Width Modulation;PWM)模組310、信號產生模組330、350以及儲壓模組370。在本實施例中,電源供應裝置110具有兩信號產生模組,但並非用以限制本發明。在其它實施例中,電源供應裝置110具有3個以上的信號產生模組。Figure 3 is a possible embodiment of a power supply unit. As shown, the power supply device 110 includes a Pulse Width Modulation (PWM) module 310, signal generation modules 330, 350, and a load storage module 370. In the present embodiment, the power supply device 110 has two signal generating modules, but is not intended to limit the present invention. In other embodiments, the power supply device 110 has more than three signal generation modules.
在另一可能實施例中,第1圖所示的感測模組的數量與電源供應裝置110的信號產生模組的數量有關。在一可能實施例中,感測模組用以偵測信號產生模組的周圍溫度。因此,在此例中,感測模組的數量等於信號產生模組的數量。In another possible embodiment, the number of sensing modules shown in FIG. 1 is related to the number of signal generating modules of the power supply device 110. In a possible embodiment, the sensing module is configured to detect the ambient temperature of the signal generating module. Therefore, in this example, the number of sensing modules is equal to the number of signal generating modules.
信號產生模組330根據脈寬調變模組310所產生的控制信號組SC1 ,產生相位信號PH1。信號產生模組350根據脈寬調變模組310所產生的控制信號組SC2 ,產生相位信號PH2。由於信號產生模組330與350具有相同的電路結構,故以下僅以信號產生模組330為例,說明其內容電路結構。The signal generation module 330 generates a phase signal PH1 according to the control signal group S C1 generated by the pulse width modulation module 310. The signal generation module 350 generates a phase signal PH2 according to the control signal group S C2 generated by the pulse width modulation module 310. Since the signal generating modules 330 and 350 have the same circuit structure, the following is only the signal generating module 330 as an example, and the content circuit structure thereof will be described.
在本實施例中,信號產生模組330包括,切換單元331以及儲能單元333。如圖所示,儲能單元333可為一電感,耦接於切換單元331與儲壓單元370之間。在一可能實施例中,第1及2圖所示的感測模組151係根據儲能單元333或切換單元331的周圍溫度,產生偵測信號SD1 。同樣地,第1及2圖所示的感測模組153可根據儲能單元353或切換單元351的周圍溫度,產生偵測信號SD2 。In this embodiment, the signal generating module 330 includes a switching unit 331 and an energy storage unit 333. As shown in the figure, the energy storage unit 333 can be an inductor coupled between the switching unit 331 and the pressure accumulating unit 370. In a possible embodiment, the sensing module 151 shown in FIGS. 1 and 2 generates the detection signal S D1 according to the ambient temperature of the energy storage unit 333 or the switching unit 331. Similarly, the sensing module 153 shown in FIGS. 1 and 2 can generate the detection signal S D2 according to the ambient temperature of the energy storage unit 353 or the switching unit 351.
在本實施例中,切換單元331包括電晶體N1及N2。電晶體N1之閘極接收控制信號組SC1 中之切換信號SS1 ,其汲極接收操作電壓VDD,其源極耦接儲能單元333以及脈寬調變模組310。電晶體N2之閘極接收控制信號組SC1 中之切換信號SS2 ,其汲極耦接儲能單元333,其源極接收操作電壓GND。在一可能實施例中,操作電壓GND小於操作電壓VDD。In the present embodiment, the switching unit 331 includes transistors N1 and N2. The gate of the transistor N1 receives the switching signal S S1 in the control signal group S C1 , the drain of which receives the operating voltage VDD , and the source of which is coupled to the energy storage unit 333 and the pulse width modulation module 310 . The gate of the transistor N2 receives the switching signal S S2 in the control signal group S C1 , the drain of which is coupled to the energy storage unit 333 , and the source thereof receives the operating voltage GND . In a possible embodiment, the operating voltage GND is less than the operating voltage VDD.
儲壓模組370根據相位信號PH1及PH2,提供輸出電壓VOUT 。在本實施例中,儲壓模組370係為一電容371。相位信號PH1及PH2可對電容371進行充電,使得電容371提供輸出電壓VOUT 。The voltage storage module 370 provides an output voltage V OUT according to the phase signals PH1 and PH2. In this embodiment, the pressure storage module 370 is a capacitor 371. Phase signals PH1 and PH2 charge capacitor 371 such that capacitor 371 provides an output voltage V OUT .
另外,電源供應裝置110更包括回授電阻391及393。回授電阻391耦接於信號產生模組330與脈寬調變模組310的回授端ISEN1之間。回授電阻391可根據相位信號PH1,產生回授電流IF1 予脈寬調變模組310。在本實施例中,脈寬調變模組310更可透過回授端ISEN1,接收處理模組155所產生的平衡信號SP1 。在本實施例中,脈寬調變模組310透過回授端ISEN1所接收到的信號係為,回授電流IF1 與平衡信號SP1 的總合。脈寬調變模組310透過回授端ISEN1所接收到的信號,同樣地,回授電阻393耦接於信號產生模組350與脈寬調變模組310的回授端ISEN2之間。回授電阻393可根據相位信號PH2,產生回授電流IF2 予脈寬調變模組310。在本實施例中,脈寬調變模組310更可透過回授端ISEN2,接收處理模組155所產生的平衡信號SP2 。在本實施例中,脈寬調變模組310透過回授端ISEN2所接收到的信號係為,回授電流IF2 與平衡信號SP2 的總合。In addition, the power supply device 110 further includes feedback resistors 391 and 393. The feedback resistor 391 is coupled between the signal generating module 330 and the feedback terminal ISEN1 of the pulse width modulation module 310. The feedback resistor 391 can generate a feedback current I F1 to the pulse width modulation module 310 according to the phase signal PH1. In this embodiment, the pulse width modulation module 310 can receive the balanced signal S P1 generated by the processing module 155 through the feedback terminal ISEN1. In this embodiment, the signal received by the pulse width modulation module 310 through the feedback terminal ISEN1 is the sum of the feedback current I F1 and the balance signal S P1 . The pulse width modulation module 310 transmits the signal received by the feedback terminal ISEN1. Similarly, the feedback resistor 393 is coupled between the signal generation module 350 and the feedback terminal ISEN2 of the pulse width modulation module 310. The feedback resistor 393 can generate a feedback current I F2 to the pulse width modulation module 310 according to the phase signal PH2. In this embodiment, the pulse width modulation module 310 can receive the balance signal S P2 generated by the processing module 155 through the feedback terminal ISEN2. In this embodiment, the signal received by the pulse width modulation module 310 through the feedback terminal ISEN2 is the sum of the feedback current I F2 and the balance signal S P2 .
由於相位信號PH1及PH2易受溫度所發生變化,因此,在本實施例中,藉由感測模組151及153偵測相位信號產生模組330與350周圍的溫度,並根據偵測結果,產生平衡信號SP1 與SP2 。由於平衡信號SP1 與SP2 與相位信號產生模組330與350周圍的溫度有關,故脈寬調變模組310可根據回授電流IF1 與平衡信號SP1 的總合,適當地調整控制信號組SC1 。同樣地,脈寬調變模組310可根據回授電流IF2 與平衡信號SP2 的總合,適當地調整控制信號組SC2 。Since the phase signals PH1 and PH2 are susceptible to temperature changes, in the present embodiment, the sensing modules 151 and 153 detect the temperature around the phase signal generating modules 330 and 350, and according to the detection result, Balance signals S P1 and S P2 are generated. Since the balance signals S P1 and S P2 are related to the temperature around the phase signal generating modules 330 and 350, the pulse width modulation module 310 can appropriately adjust and control according to the sum of the feedback current I F1 and the balance signal S P1 . Signal group S C1 . Similarly, the pulse width modulation module 310 can appropriately adjust the control signal group S C2 according to the sum of the feedback current I F2 and the balance signal S P2 .
第4A圖為相位信號PH1及PH2之示意圖。在本實施例中,相位信號PH1及PH2相差180度。在第3圖中,若電源供應裝置110具有4個信號產生模組時,則可產生4個相位信號。在一可能實施例中,4個相位信號可如第4B圖所示。在第4B圖中,相鄰相位相差90度。Figure 4A is a schematic diagram of phase signals PH1 and PH2. In this embodiment, the phase signals PH1 and PH2 differ by 180 degrees. In Fig. 3, if the power supply device 110 has four signal generating modules, four phase signals can be generated. In a possible embodiment, the four phase signals can be as shown in FIG. 4B. In Figure 4B, the adjacent phases are 90 degrees out of phase.
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
100...操作系統100. . . operating system
110...電源供應裝置110. . . Power supply unit
130...負載130. . . load
150...溫度平衡裝置150. . . Temperature balance device
151、153...感測模組151, 153. . . Sensing module
155...處理模組155. . . Processing module
210...電流產生單元210. . . Current generating unit
230...電流鏡230. . . Current mirror
250...計算單元250. . . Computing unit
211...比較器211. . . Comparators
RPTS1 、RPTS2 ...熱敏電阻R PTS1 , R PTS2 . . . Thermistor
310...脈寬調變模組310. . . Pulse width modulation module
370...儲壓模組370. . . Pressure storage module
371...電容371. . . capacitance
331、351...切換單元331, 351. . . Switching unit
333、353...儲能單元333, 353. . . Energy storage unit
N1~N4...電晶體N1~N4. . . Transistor
391、393...回授電阻391, 393. . . Feedback resistor
330、350...信號產生模組330, 350. . . Signal generation module
第1圖為本發明之操作系統之示意圖。Figure 1 is a schematic diagram of the operating system of the present invention.
第2圖為本發明之處理模組之一可能實施例。Figure 2 is a possible embodiment of a processing module of the present invention.
第3圖為電源供應裝置之一可能實施例。Figure 3 is a possible embodiment of a power supply unit.
第4A、4B圖為相位信號之示意圖。Figures 4A and 4B are schematic diagrams of phase signals.
100...操作系統100. . . operating system
110...電源供應裝置110. . . Power supply unit
130...負載130. . . load
150...溫度平衡裝置150. . . Temperature balance device
151、153...感測模組151, 153. . . Sensing module
155...處理模組155. . . Processing module
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TW99121424A TWI418965B (en) | 2010-06-30 | 2010-06-30 | Temperature balance device and operation system utilizing the samepower supply device |
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TW (1) | TWI418965B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI662393B (en) * | 2017-06-26 | 2019-06-11 | 日商歐姆龍股份有限公司 | Power supply unit |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW509832B (en) * | 1998-03-31 | 2002-11-11 | Fujitsu Ltd | Power supply apparatus and method of controlling power supply circuit |
TW200823620A (en) * | 2006-05-11 | 2008-06-01 | Intel Corp | Load circuit supply voltage control |
EP1580636B1 (en) * | 2001-10-09 | 2009-10-21 | Fujitsu Microelectronics Limited | Semiconductor device with temperature compensation circuit |
US20100033237A1 (en) * | 2008-08-05 | 2010-02-11 | Nai-Yuan Liang | Multi-functional drMOS |
-
2010
- 2010-06-30 TW TW99121424A patent/TWI418965B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW509832B (en) * | 1998-03-31 | 2002-11-11 | Fujitsu Ltd | Power supply apparatus and method of controlling power supply circuit |
EP1580636B1 (en) * | 2001-10-09 | 2009-10-21 | Fujitsu Microelectronics Limited | Semiconductor device with temperature compensation circuit |
TW200823620A (en) * | 2006-05-11 | 2008-06-01 | Intel Corp | Load circuit supply voltage control |
US20100033237A1 (en) * | 2008-08-05 | 2010-02-11 | Nai-Yuan Liang | Multi-functional drMOS |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI662393B (en) * | 2017-06-26 | 2019-06-11 | 日商歐姆龍股份有限公司 | Power supply unit |
Also Published As
Publication number | Publication date |
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TW201200984A (en) | 2012-01-01 |
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