TWI415731B - Tool and method for taking out module core - Google Patents

Tool and method for taking out module core Download PDF

Info

Publication number
TWI415731B
TWI415731B TW97121139A TW97121139A TWI415731B TW I415731 B TWI415731 B TW I415731B TW 97121139 A TW97121139 A TW 97121139A TW 97121139 A TW97121139 A TW 97121139A TW I415731 B TWI415731 B TW I415731B
Authority
TW
Taiwan
Prior art keywords
mold
connecting device
hole
mold core
carrier
Prior art date
Application number
TW97121139A
Other languages
Chinese (zh)
Other versions
TW200950953A (en
Inventor
Hsin Chuan Liu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW97121139A priority Critical patent/TWI415731B/en
Publication of TW200950953A publication Critical patent/TW200950953A/en
Application granted granted Critical
Publication of TWI415731B publication Critical patent/TWI415731B/en

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

A tool for taking out a module core includes a connecting member and a supporting base. The connecting member includes a body and a resisting portion. A portion of the body defines some screws used for meshing with the module core. The supporting base includes a board defining a hole thereon. The connecting member passes through the hole and against to a surface of the supporting base by one end thereof. The middle portion of the connecting member defines multi-storey wedge-shaped gapes spaced from each other.

Description

模仁頂起器及其頂起方法 Mould top jacker and jacking method thereof

本發明涉及一種頂起器,尤其涉及一種模仁頂起器及其頂起方法。 The invention relates to a jacking device, in particular to a mould jacking device and a lifting method thereof.

模仁廣泛應用於模壓成型製程,特別是用於製造光學鏡片製程中,如非球面光學鏡片、導光板、棱鏡等,採用直接模壓成型(Direct Press-molding)技術可直接生產高品質之光學鏡片產品(請參見“Quartz Glass Molding by Precision Glass Molding Method”,Trans.IEE Jpn.,pp.494-497,2002),而且無需打磨、拋光等後續加工步驟,可大大提高生產效率和產量。 Molding is widely used in the molding process, especially in the manufacturing of optical lens processes, such as aspherical optical lenses, light guides, prisms, etc. Direct die-molding technology can directly produce high-quality optical lenses. Products (see "Quartz Glass Molding by Precision Glass Molding Method", Trans.IEE Jpn., pp. 494-497, 2002), and without subsequent processing steps such as sanding, polishing, etc., can greatly improve production efficiency and yield.

模壓成型模具之模仁精度高且價格昂貴,光學元件於模仁內模制好後,需將成形之光學元件從模仁中取出。傳統之方法是將模仁從模座之模穴中頂起,將模制好之光學元件伸出於模座之模穴,然後取出光學元件。然而此操作步驟如果施力不當,容易造成模仁與模穴之間不同心,造成模仁卡死於模穴中,損壞模仁。 The mold of the molded mold has high precision and high cost. After the optical component is molded in the mold, the formed optical component needs to be taken out from the mold. The conventional method is to lift the mold core from the cavity of the mold base, project the molded optical component out of the mold cavity of the mold base, and then take out the optical component. However, if the operation step is improperly applied, it is easy to cause a difference between the mold core and the cavity, causing the mold to be stuck in the cavity and damaging the mold.

因此,有必要提供一種可避免頂起模仁時,模仁與模穴不同心,模仁卡死於模穴問題之模仁頂起器及其頂起方法。 Therefore, it is necessary to provide a mold top jack which can avoid the problem that the mold core and the cavity are not concentric when the mold core is jacked up, and the mold core is stuck in the cavity problem and the jacking method thereof.

一種模仁頂起器,其用於頂起模具之模仁。該模仁頂起器包括:一連接裝置及一承載架。該連接裝置包括一本體及一抵壓部。該本體遠離抵壓部之一端設有螺紋,用於與該模仁相螺接。該承載架包括一平臺,其開設有一通孔,該連接裝置穿設於該通孔。該連接裝置之本體之中心處設有多層環繞本體之楔狀之缺口,該多層楔狀之缺口相互間隔設置。 A mold ejector for lifting a mold of a mold. The mold riser includes: a connecting device and a carrier. The connecting device comprises a body and a pressing portion. The body is threaded away from one end of the pressing portion for screwing with the mold core. The carrier includes a platform, and a through hole is defined, and the connecting device is disposed through the through hole. The center of the body of the connecting device is provided with a plurality of wedge-shaped notches surrounding the body, and the plurality of wedge-shaped notches are spaced apart from each other.

一種頂起模具之模仁之方法,其包括以下步驟:提供一模仁頂起器,其包括一連接裝置及一承載架,該連接裝置包括一本體及一抵壓部,該本體遠離抵壓部之一端設有螺紋,用於與該模仁之螺孔相螺接,該連接裝置之本體之中心處設有多層環繞本體之楔狀之缺口,該多層楔狀之缺口相互間隔設置,該承載架包括一平臺,該平臺上開設有一通孔;將承載架放置於模具之間隔板上,承載架之平臺橫跨間隔板之導向孔,且承載架之通孔對準模仁之螺紋孔;擰入連接裝置,連接裝置外螺紋旋入至模仁底部之螺紋孔中,該多層楔狀之缺口收容於間隔板之導向孔內;頂起模仁,即通過按壓連接裝置,模仁向上運動而使模仁之成形部凸出於該模穴。 A method for jacking up a mold of a mold, comprising the steps of: providing a mold jacker comprising a connecting device and a carrier, the connecting device comprising a body and a pressing portion, the body being away from the pressing portion One end is provided with a thread for screwing with the screw hole of the mold core, and a center of the body of the connecting device is provided with a plurality of wedge-shaped notches surrounding the body, and the plurality of wedge-shaped notches are spaced apart from each other, and the carrier is spaced apart from each other. The utility model comprises a platform, wherein a through hole is formed in the platform; the carrier is placed on the partition between the molds, the platform of the carrier spans the guiding hole of the partition plate, and the through hole of the carrier is aligned with the threaded hole of the mold; a connecting device, the external thread of the connecting device is screwed into the threaded hole at the bottom of the mold core, the multi-layered wedge-shaped notch is received in the guiding hole of the partitioning plate; the mold core is jacked up, that is, by pressing the connecting device, the mold core moves upwards The forming portion of the mold core protrudes from the cavity.

相較於先前技術,該連接裝置之本體上設有楔狀之缺口,因此,連接裝置與間隔板之導向孔之間有一定可微調空間。當模仁與模穴之間不同心,導致模仁卡死於模穴時,可通過於導向孔內微調該連接裝置,從而使模仁與模穴之間同心。同時,由於設置該楔 狀之缺口,因此可減小連接裝置之本體與導向孔側壁之間之面接觸面積,如此於該模仁頂起器頂起該模仁時,可進一步提高連接裝置與該間隔板之導向孔之間之同心度,從而提高了該模仁與模穴之間之同心度,避免了於模仁頂起器頂起模仁時,模仁卡死於模穴,造成模仁卡死於模穴損壞模仁之問題。 Compared with the prior art, the connecting device has a wedge-shaped notch on the body, so that there is a certain fine-tuning space between the connecting device and the guiding hole of the spacer. When the mold core and the cavity are not concentric, causing the mold to be stuck in the cavity, the connection device can be finely adjusted in the guide hole, so that the mold core and the cavity are concentric. At the same time, due to the setting of the wedge The gap of the shape can reduce the surface contact area between the body of the connecting device and the side wall of the guiding hole, so that the guiding device and the guiding hole of the spacing plate can be further improved when the mold top jack lifts the mold core The concentricity between them improves the concentricity between the mold core and the mold cavity, and avoids the mold core being stuck in the mold cavity when the mold top jacker lifts the mold core, causing the mold core to be stuck in the mold. The problem of damage to the mold core.

100‧‧‧模仁頂起器 100‧‧‧Molden jacks

10‧‧‧承載架 10‧‧‧ Carrier

20‧‧‧連接裝置 20‧‧‧Connecting device

11‧‧‧平臺 11‧‧‧ platform

13‧‧‧支腳 13‧‧‧ feet

12‧‧‧通孔 12‧‧‧through hole

21‧‧‧本體 21‧‧‧ body

22‧‧‧抵壓部 22‧‧‧Resistance Department

212‧‧‧外螺紋 212‧‧‧ external thread

214‧‧‧缺口 214‧‧‧ gap

200‧‧‧模具 200‧‧‧Mold

50‧‧‧該模座 50‧‧‧The mold base

30‧‧‧模仁 30‧‧‧Men

40‧‧‧間隔板 40‧‧‧ Spacer

52‧‧‧模穴 52‧‧‧ cavity

522‧‧‧第一收容槽 522‧‧‧First storage trough

524‧‧‧第二收容槽 524‧‧‧Second holding trough

32‧‧‧底部 32‧‧‧ bottom

31‧‧‧頂部 31‧‧‧ top

322‧‧‧螺紋孔 322‧‧‧Threaded holes

312‧‧‧成形部 312‧‧‧Forming Department

42‧‧‧導向孔 42‧‧‧ Guide hole

圖1係本發明模仁頂起器之剖示圖;圖2係本發明之模仁頂起器之使用狀態圖;圖3係使用本發明模仁頂起器頂起模仁之方法流程圖;圖4係圖2中模仁被頂起時之剖面示意圖。 1 is a cross-sectional view of a mold top riser of the present invention; FIG. 2 is a view showing a state of use of the mold top riser of the present invention; and FIG. 3 is a flow chart of a method for jacking up a mold core using the mold top riser of the present invention; Figure 4 is a schematic cross-sectional view showing the mold core of Figure 2 when it is jacked up.

下面將結合附圖與實施方式對本技術方案作進一步詳細說明。 The technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

請參閱圖1,該模仁頂出器100包括一承載架10、一連接裝置20。 Referring to FIG. 1 , the mold ejector 100 includes a carrier 10 and a connecting device 20 .

該承載架10包括一平臺11及二個支腳13。該平臺11為一矩形平板。二個支腳13分別對稱設置於平臺11之外緣,其分別由平臺11之兩側向上延伸形成,以支撐該平臺11。平臺11之中心處開設有一通孔12。 The carrier 10 includes a platform 11 and two legs 13. The platform 11 is a rectangular flat plate. The two legs 13 are respectively symmetrically disposed on the outer edge of the platform 11, and are respectively formed by extending upward from both sides of the platform 11 to support the platform 11. A through hole 12 is defined in the center of the platform 11.

本實施方式中,該連接裝置20為一螺桿,其包括一本體21及一抵壓部22。該本體21遠離抵壓部22之一端設有外螺紋212。於該本體21之中心處設有多層環繞本體21之楔狀之缺口214,該多層楔狀之缺口214相互均勻間隔設置。該連接裝置20之本體21可穿設該平臺11中心之通孔12,而連接裝置20之抵壓部22之寬度大於通 孔12之直徑,則可抵靠於平臺11上。 In the embodiment, the connecting device 20 is a screw, and includes a body 21 and a pressing portion 22 . The body 21 is provided with an external thread 212 away from one end of the pressing portion 22 . A plurality of wedge-shaped notches 214 surrounding the body 21 are provided at the center of the body 21, and the plurality of wedge-shaped notches 214 are evenly spaced from each other. The body 21 of the connecting device 20 can pass through the through hole 12 in the center of the platform 11, and the width of the pressing portion 22 of the connecting device 20 is greater than The diameter of the hole 12 can be abutted against the platform 11.

請參閱圖2,模具200包括一模座50、一模仁30及一間隔板40。該模座50形成有一貫穿該模座50之模穴52。該模穴52為一階梯狀結構,其包括相互貫通之第一收容槽522及第二收容槽524,該第一收容槽522之直徑大於該第二收容槽524之直徑。該模穴52之結構與該模仁30之結構相對應。該模仁30包括一圓柱狀之底部32及一與底部32相對之頂部31,該底部32收容於第一收容槽522內,該頂部31收容於第二收容槽524內。該底部32之中央開設有一與連接裝置20之外螺紋212配合之螺紋孔322。模仁30之頂部31形成有一成形部312,其形狀與欲模制之光學鏡片製品之形狀相對應。該間隔板40之長度大於該第一收容槽522之直徑,該間隔板40固設於該模座50之底端,並密封該第一收容槽522。該間隔板40對應該模仁30底部32之螺紋孔322位置開設有一導向孔42同時該導向孔42與該平臺11之通孔12正對。該楔狀之缺口214收容於該導向孔42內。該二個支腳13之間之間距小於該間隔板40之長度,則平臺11可橫跨該導向孔42。該螺紋孔322、導向孔42及承載架10之高度之和小於該連接裝置20之本體21長度。 Referring to FIG. 2, the mold 200 includes a mold base 50, a mold core 30 and a partition plate 40. The mold base 50 is formed with a cavity 52 extending through the mold base 50. The cavity 52 is a stepped structure, and includes a first receiving groove 522 and a second receiving groove 524. The diameter of the first receiving groove 522 is larger than the diameter of the second receiving groove 524. The structure of the cavity 52 corresponds to the structure of the mold core 30. The mold core 30 includes a cylindrical bottom portion 32 and a top portion 31 opposite to the bottom portion 32. The bottom portion 32 is received in the first receiving groove 522. The top portion 31 is received in the second receiving groove 524. A threaded hole 322 is formed in the center of the bottom portion 32 to engage the external thread 212 of the connecting device 20. The top portion 31 of the mold core 30 is formed with a forming portion 312 having a shape corresponding to the shape of the optical lens article to be molded. The length of the spacer 40 is greater than the diameter of the first receiving slot 522. The spacer 40 is fixed to the bottom end of the die holder 50 and seals the first receiving slot 522. The spacer plate 40 defines a guiding hole 42 corresponding to the screw hole 322 of the bottom portion 32 of the mold core 30, and the guiding hole 42 faces the through hole 12 of the platform 11. The wedge-shaped notch 214 is received in the guiding hole 42. The distance between the two legs 13 is less than the length of the spacer 40, and the platform 11 can span the guiding hole 42. The sum of the heights of the threaded holes 322, the guide holes 42 and the carrier 10 is smaller than the length of the body 21 of the connecting device 20.

該連接裝置20之本體21上設有楔狀之缺口214,因此,連接裝置20與間隔板40之導向孔42之間有一定可微調空間。當模仁30與模穴52之間不同心,導致模仁30卡死於模穴52時,可通過於導向孔42內微調該連接裝置20,從而使模仁30與模穴52之間同心。同時,由於設置該楔狀之缺口214,因此可減小連接裝置20之本體21與該導向孔42之側壁之間之面接觸面積,如此於該模仁頂起器 100頂起該模仁30時,可進一步提高連接裝置20與該間隔板40之導向孔42之間之同心度,從而提高了該模仁30與模穴52之間之同心度,避免了於模仁頂起器100頂起模仁30時,模仁30卡死於模穴52,造成模仁30卡死於模穴52損壞模仁30之問題。 The body 21 of the connecting device 20 is provided with a wedge-shaped notch 214. Therefore, there is a certain fine-tunable space between the connecting device 20 and the guiding hole 42 of the partitioning plate 40. When the mold core 30 and the cavity 52 are not concentric, causing the mold core 30 to be stuck in the cavity 52, the connection device 20 can be finely adjusted in the guide hole 42 so that the mold core 30 and the cavity 52 are concentric. . At the same time, since the wedge-shaped notch 214 is provided, the surface contact area between the body 21 of the connecting device 20 and the side wall of the guiding hole 42 can be reduced, so that the mold top jacker is When the mold core 30 is lifted up by 100, the concentricity between the connecting device 20 and the guiding hole 42 of the partitioning plate 40 can be further improved, thereby improving the concentricity between the mold core 30 and the cavity 52, thereby avoiding When the mold top jack 100 lifts the mold core 30, the mold core 30 is stuck in the mold cavity 52, causing the mold core 30 to be stuck in the mold cavity 52 to damage the mold core 30.

模壓成型過程中,模仁30之成形部312收容在於模穴52之第二收容槽524內。模壓成型結束後,需將該模仁30從模穴52頂起,以使成形部312內之製品凸出於第二收容槽524。請參閱圖3,為使用本發明模仁頂起器100頂起模仁之方法流程圖,該方法包括以下步驟:S101:提供一模仁頂起器100,其包括一連接裝置20及一承載架10,該連接裝置20包括一本體21及一抵壓部22,該本體21遠離抵壓部22之一端設有螺紋,用於與該模仁30之螺孔322相螺接,該連接裝置20之本體21之中心處設有多層環繞本體21之楔狀之缺口214,該多層楔狀之缺口214相互間隔設置,該該承載架10包括一平臺11,該平臺11上開設有一通孔12;S102:將承載架10放置於模具200之間隔板40上,承載架10之平臺11橫跨間隔板40之導向孔42,且承載架10之通孔12對準模仁30之螺紋孔322;S103:擰入連接裝置20,連接裝置20外螺紋212旋入至模仁30底部32之螺紋孔322中,該多層楔狀之缺口214收容於間隔板40之導向孔42內;S104:頂起模仁30,如圖4,即通過按壓連接裝置20,模仁30向 上運動而使模仁30之成形部312凸出於該模穴52。 During the molding process, the forming portion 312 of the mold core 30 is received in the second receiving groove 524 of the cavity 52. After the molding is completed, the mold core 30 is lifted from the cavity 52 so that the product in the forming portion 312 protrudes from the second receiving groove 524. Please refer to FIG. 3, which is a flow chart of a method for jacking up a mold core using the mold jacker 100 of the present invention. The method includes the following steps: S101: providing a mold core riser 100 including a connecting device 20 and a carrier The connecting device 20 includes a body 21 and a pressing portion 22. The body 21 is threaded away from one end of the pressing portion 22 for screwing with the screw hole 322 of the mold core 30. The connecting device 20 The center of the body 21 is provided with a plurality of wedge-shaped notches 214 surrounding the body 21, the plurality of wedge-shaped notches 214 are spaced apart from each other, the carrier 10 includes a platform 11, and a through hole 12 is defined in the platform 11; S102: the carrier 10 is placed on the partition plate 40 between the mold 200, the platform 11 of the carrier 10 spans the guide hole 42 of the partition plate 40, and the through hole 12 of the carrier 10 is aligned with the threaded hole 322 of the mold core 30; S103: screwing into the connecting device 20, the external thread 212 of the connecting device 20 is screwed into the threaded hole 322 of the bottom portion 32 of the mold core 30, and the multi-layered wedge-shaped notch 214 is received in the guiding hole 42 of the partitioning plate 40; S104: jacking up The mold core 30, as shown in Fig. 4, is by pressing the connecting device 20, the mold core 30 direction The upper movement causes the forming portion 312 of the mold core 30 to protrude from the cavity 52.

綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧模仁頂起器 100‧‧‧Molden jacks

10‧‧‧承載架 10‧‧‧ Carrier

20‧‧‧連接裝置 20‧‧‧Connecting device

11‧‧‧平臺 11‧‧‧ platform

13‧‧‧支腳 13‧‧‧ feet

12‧‧‧通孔 12‧‧‧through hole

21‧‧‧本體 21‧‧‧ body

22‧‧‧抵壓部 22‧‧‧Resistance Department

212‧‧‧外螺紋 212‧‧‧ external thread

214‧‧‧缺口 214‧‧‧ gap

Claims (4)

一種模仁頂起器,其用於頂起模具之模仁,該模仁頂起器包括:一連接裝置及一承載架,該連接裝置包括一本體及一抵壓部,該本體遠離抵壓部之一端設有螺紋,用於與該模仁相螺接,該承載架包括一平臺,其開設有一通孔,該連接裝置穿設於該通孔,其改進在於:該連接裝置之本體之中心處設有多層環繞本體之楔狀之缺口,該多層楔狀之缺口相互間隔設置。 A mold ejector for lifting a mold of a mold, the mold ejector comprising: a connecting device and a carrier, the connecting device comprising a body and a pressing portion, the body is away from the pressing One end of the portion is provided with a thread for screwing with the mold core. The carrier includes a platform, and a through hole is formed. The connecting device is disposed through the through hole, and the improvement is: the body of the connecting device The center is provided with a plurality of wedge-shaped notches surrounding the body, and the plurality of wedge-shaped notches are spaced apart from each other. 如申請專利範圍第1項所述之模仁頂起器,其中,該抵壓部之寬度大於該通孔之直徑。 The mold riser according to claim 1, wherein the pressing portion has a width larger than a diameter of the through hole. 如申請專利範圍第1項所述之模仁頂起器,其中,該承載架還包括二個支腳,該二個支腳分別對稱設置於平臺之外緣,其分別由平臺之兩側向上延伸形成。 The mold core jacking device according to claim 1, wherein the carrier further comprises two legs, the two legs are symmetrically disposed on the outer edge of the platform, respectively, from the sides of the platform upward Extended formation. 一種頂起模具之模仁之方法,其包括以下步驟:提供一模仁頂起器,其包括一連接裝置及一承載架,所述連接裝置包括一本體及一抵壓部,該本體遠離抵壓部之一端設有螺紋,用於與該模仁之螺孔相螺接,該連接裝置之本體之中心處設有多層環繞本體之楔狀之缺口,該多層楔狀之缺口相互間隔設置,該承載架包括一平臺,該平臺上開設有一通孔;將承載架放置於模具之間隔板上,承載架之平臺橫跨間隔板之導向孔,且承載架之通孔對準模仁之螺紋孔;擰入連接裝置,連接裝置外螺紋旋入至模仁底部之螺紋孔中,所述多層楔狀之缺口收容於間隔板之導向孔內; 頂起模仁,即通過按壓連接裝置,模仁向上運動而使模仁之成形部凸出於所述模穴。 A method for jacking up a mold of a mold, comprising the steps of: providing a mold jacker comprising a connecting device and a carrier, the connecting device comprising a body and a pressing portion, the body being away from the pressing One end of the connecting portion is provided with a thread for screwing with the screw hole of the mold core, and a center of the body of the connecting device is provided with a plurality of wedge-shaped notches surrounding the body, and the plurality of wedge-shaped notches are spaced apart from each other, and the bearing is disposed at intervals The rack comprises a platform, the platform is provided with a through hole; the carrier is placed on the partition between the molds, the platform of the carrier spans the guiding hole of the partition plate, and the through hole of the carrier is aligned with the threaded hole of the mold; Into the connecting device, the external thread of the connecting device is screwed into the threaded hole at the bottom of the mold core, and the plurality of wedge-shaped notches are received in the guiding holes of the partitioning plate; The mold core is jacked up, that is, by pressing the connecting device, the mold core moves upward to cause the forming portion of the mold core to protrude from the mold cavity.
TW97121139A 2008-06-06 2008-06-06 Tool and method for taking out module core TWI415731B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97121139A TWI415731B (en) 2008-06-06 2008-06-06 Tool and method for taking out module core

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97121139A TWI415731B (en) 2008-06-06 2008-06-06 Tool and method for taking out module core

Publications (2)

Publication Number Publication Date
TW200950953A TW200950953A (en) 2009-12-16
TWI415731B true TWI415731B (en) 2013-11-21

Family

ID=44871551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97121139A TWI415731B (en) 2008-06-06 2008-06-06 Tool and method for taking out module core

Country Status (1)

Country Link
TW (1) TWI415731B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5551516A (en) * 1978-10-12 1980-04-15 Sintokogio Ltd Method of and mold for molding core mold
JPH0284231A (en) * 1988-09-20 1990-03-26 Mitsubishi Motors Corp Structure for taking out core for mold
TW200621464A (en) * 2004-12-23 2006-07-01 Asia Optical Co Inc Mold assembly allowing core and insert alignment
TW200734151A (en) * 2006-03-10 2007-09-16 Hon Hai Prec Ind Co Ltd Mold structure
TWM331434U (en) * 2007-10-22 2008-05-01 Senyun Optical Corp Improved mold insert ejecting structure for manufacturing optical lens
TWM333296U (en) * 2007-12-25 2008-06-01 Hui-Fang Wang Quick mold cavity replacing device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5551516A (en) * 1978-10-12 1980-04-15 Sintokogio Ltd Method of and mold for molding core mold
JPH0284231A (en) * 1988-09-20 1990-03-26 Mitsubishi Motors Corp Structure for taking out core for mold
TW200621464A (en) * 2004-12-23 2006-07-01 Asia Optical Co Inc Mold assembly allowing core and insert alignment
TW200734151A (en) * 2006-03-10 2007-09-16 Hon Hai Prec Ind Co Ltd Mold structure
TWM331434U (en) * 2007-10-22 2008-05-01 Senyun Optical Corp Improved mold insert ejecting structure for manufacturing optical lens
TWM333296U (en) * 2007-12-25 2008-06-01 Hui-Fang Wang Quick mold cavity replacing device

Also Published As

Publication number Publication date
TW200950953A (en) 2009-12-16

Similar Documents

Publication Publication Date Title
KR102117337B1 (en) Apparatus for forming a glass
TW201111144A (en) High sag optical lens and method for fast molding the same
US6615711B2 (en) Press-forming machine for glass
TW201532775A (en) Apparatus and method for molding optical lenses during a puddle dispensing process
KR101838087B1 (en) Cam Slider Type Forming Press Mold
TWI415731B (en) Tool and method for taking out module core
KR20110108915A (en) Injection compression mold that have moved core that form cavity
WO2016095446A1 (en) Diffusion sheet and manufacturing method therefor, and backlight module
CN105502899A (en) Novel irregular glass processing mold
CN203844111U (en) Mould with universal mould base
CN112848038A (en) Plastic injection molding production process
US20100072638A1 (en) Light guide plate mold and method for manufacturing light guide plate using same
CN215283198U (en) BOSS column forming die
JPH11165323A (en) Mold molding tool and its molding method
CN106182649A (en) For producing the mould of moulded parts
KR102233297B1 (en) Non-dicing type grating structure mold for manufacturing microlens and method of manufacturing microlens using the same
CN207657111U (en) The Double-ejection demoulding mechanism of mold
CN209320167U (en) A kind of novel photoelectric mold mechanism
CN102285030A (en) Balancing cushion block mechanism for joint faces of plastic mold
JP2003095671A (en) Plunger and method for molding glassware
CN220515361U (en) Gravity casting mould with ejecting force transmission mechanism
US7988889B2 (en) Mold for molding lenses and method for making the mold
CN114953375A (en) Plastic injection molding production process
CN215151464U (en) Optical lens mould that steadily resets
CN206703456U (en) Drug taking device manufactures mould

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees