TWI415730B - The system of masking - Google Patents

The system of masking Download PDF

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TWI415730B
TWI415730B TW100105210A TW100105210A TWI415730B TW I415730 B TWI415730 B TW I415730B TW 100105210 A TW100105210 A TW 100105210A TW 100105210 A TW100105210 A TW 100105210A TW I415730 B TWI415730 B TW I415730B
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Taiwan
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mask
pattern
fabricating
mask according
mold
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TW100105210A
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Chinese (zh)
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TW201235177A (en
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Jun Ming Lin
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Abstract

A manufacturing method of mask is disclosed, which is to form a sculpture layer on a substrate first, then carve the required pattern outline on the sculpture layer. Then the method includes forming the main mask body on the sculpture layer, and taking out the main mask body, reinforce the main mask body properly, and excavating the pattern portion of main mask body, thereby completing the manufacturing of mask. Because it is totally not necessary to use hi-tech equipment and system, so the manufacturing cost of mask is greatly decreased.

Description

遮罩之製法Masking method

本發明係有關一種遮罩之製法,尤指一種可降低製作成本之遮罩之製法。The invention relates to a method for manufacturing a mask, in particular to a method for reducing a mask of manufacturing cost.

目前幣章局部電鍍係藉由電鍍方式於幣章之局部表面上形成金屬材,而局部電鍍的方法繁多,如上漆遮蔽法、凹版印刷轉印(PAD)法、防鍍膠帶貼紙遮蔽法或遮罩法等,可依欲電鍍之產品性質作選擇;利用防鍍漆、防鍍膠帶或防鍍貼紙的方式具有精密度不佳之問題,例如:有些無法應用於具有3D立體圖樣之表面上;利用PAD法,係將油墨覆於有圖案之鋼板上,再用刀片將平面之油墨刮除,接著用轉印膠頭沾起剩餘之油墨以印於幣章上,經電鍍後去墨,此法容易污染幣章,且容易刮傷幣章。At present, the local plating of the currency stamp is formed by metal plating on the partial surface of the currency stamp, and the method of partial plating is various, such as the paint masking method, the gravure printing transfer (PAD) method, the anti-plating tape sticker masking method or the masking. The cover method, etc., can be selected according to the nature of the product to be electroplated; the use of anti-painting, anti-plating tape or anti-plating stickers has the problem of poor precision, for example, some cannot be applied to the surface with 3D stereoscopic pattern; The PAD method is to coat the ink on the patterned steel plate, and then scrape the flat ink with a blade, then use the transfer adhesive to pick up the remaining ink to be printed on the currency stamp, and then remove the ink after electroplating. It is easy to contaminate the currency stamp and it is easy to scratch the coin.

對於質軟精緻之幣章局部電鍍而言,以遮罩電鍍之方式係最為合適,其不但精密度高,且對幣章損害之情形也最少。For the soft and delicate coin stamping partial plating, it is most suitable for the mask plating method, which is not only highly precise, but also has the least damage to the currency stamp.

請參閱第1A至1C圖,係為習知於幣章上電鍍金屬之製法。如第1A圖所示,提供一頂面上具有圖案K之幣章1;如第1B圖所示,形成遮罩9於該幣章1上,且該遮罩9具有對應該圖案K之鏤空區90;如第1C圖所示,於該鏤空區90中之圖案K上電鍍金(Au)層8,再移除該遮罩9。Please refer to Figures 1A to 1C for the method of electroplating metal on the chapter of the currency. As shown in FIG. 1A, a coin 1 having a pattern K on the top surface is provided; as shown in FIG. 1B, a mask 9 is formed on the medal 1, and the mask 9 has a hollow corresponding to the pattern K. A region 90; as shown in FIG. 1C, a gold (Au) layer 8 is electroplated on the pattern K in the hollow region 90, and the mask 9 is removed.

習知幣章1係由高品質之銀材配合精製模具,經印花所產製之產品,故其表面係為平整鏡面,容易因觸摸而產生沾污或刮傷。因此,於習知遮罩電鍍法中,因需於該幣章1之表面覆蓋該遮罩9以作局部電鍍,故為了避免於該幣章1之表面上造成損壞,用以形成該遮罩9之材質需有諸多考量,例如:該遮罩9需耐酸鹼以接觸電鍍溶液、不可損傷幣章1表面(如:刮痕或沾污)、具伸縮性以緊密貼合於幣章1之表面、需透光以目視定位等。而基於針對該遮罩9之材質考量,目前業界係使用矽橡膠作為該遮罩9之材質,且以逆向工程法(Reverse Engineering,RE)將矽橡膠製成該遮罩9。The Chapter 1 is a high-quality silver material that is combined with a refined mold and produced by printing. Therefore, the surface of the product is a flat mirror surface, which is easily stained or scratched by touch. Therefore, in the conventional mask plating method, since the mask 9 needs to be covered on the surface of the coin 1 for partial plating, in order to avoid damage on the surface of the coin 1, the mask is formed. The material of 9 needs to have many considerations. For example, the mask 9 needs to be resistant to acid and alkali to contact the plating solution, not to damage the surface of the coin 1 (such as scratches or stains), and has elasticity to closely fit the coin 1 The surface needs to be transparent to visually locate. Based on the material consideration for the mask 9, the industry currently uses ruthenium rubber as the material of the mask 9, and the ruthenium rubber is made into the mask 9 by Reverse Engineering (RE).

所述之逆向工程法的定義為:藉由逆向掃描設備把實際物體表面的點資料量測出來,再匯入逆向工程專用軟體建構成圖檔資料的製程。The reverse engineering method is defined as: measuring the point data of the surface of the actual object by the reverse scanning device, and then re-introducing into the special software for the reverse engineering to construct the process of forming the image data.

使用逆向工程法製作遮罩9之製法係先用科學儀器掃瞄幣章以建立3D圖檔,再經由電腦精算依需求範圍轉為電子檔並製作出電極,接著以精密放電加工方式製出生產遮罩之模具。The method of making the mask 9 by using the reverse engineering method is to first scan the coin chapter with a scientific instrument to create a 3D image file, and then convert it into an electronic file according to the demand range by computer actuation, and then produce an electrode, and then produce a production mask by precision electric discharge machining. The mold of the cover.

詳細而言,該製法係先進行點資料的掃描:利用CCD Camera及光柵投影設備,以光柵投影於幣章之表面上,並加以粗細變化及位移,且配合CCD Camera將所擷取的數位影像透過電腦運算處理,即可得知幣章的3D外型及點資料。In detail, the system first scans the point data: using a CCD Camera and a grating projection device, the grating is projected onto the surface of the coin, and the thickness is changed and displaced, and the captured digital image is matched with the CCD Camera. Through computer computing, you can know the 3D appearance and point data of the currency stamp.

接著,進行點資料的處理:完成3D掃描後,用三角網格運算,以將掃描的重複資料消除,並根據工件外觀曲率進行最佳化運算。之後,進行曲面模具的建構:依欲電鍍的區域、輪廓、曲面產生之3D座標,並建構外框部位,將資料匯入CAD/CAM系統,再轉化成NC加工路徑,以製作放電加工純銅電極。最後,以精密放電加工機製作出遮罩模具,再利用該模具經熱壓成型機,以一體成形製出該遮罩。Then, the processing of the point data is performed: after the 3D scanning is completed, the triangular mesh operation is used to eliminate the repeated data of the scanning, and the optimization operation is performed according to the curvature of the appearance of the workpiece. After that, the construction of the curved mold is carried out: according to the 3D coordinates generated by the area, contour and curved surface to be electroplated, and the outer frame part is constructed, the data is transferred into the CAD/CAM system, and then converted into an NC processing path to produce an electric discharge processed pure copper electrode. . Finally, a mask mold is formed by a precision electric discharge machining mechanism, and the mold is integrally formed by a hot press molding machine.

惟,習知使用逆向工程法製作遮罩9之製法,需使用多種高科技設備與系統,例如:CCD Camera、光柵投影設備、精密放電加工機、CAD/CAM系統等,因該些設備之價格昂貴,且不易取得,故該遮罩9之製作成本大幅提高。However, it is customary to use the reverse engineering method to make the mask 9. It is necessary to use a variety of high-tech equipment and systems, such as CCD Camera, grating projection equipment, precision electric discharge machine, CAD/CAM system, etc., because of the price of these equipments. It is expensive and difficult to obtain, so the manufacturing cost of the mask 9 is greatly increased.

因此,如何避免習知技術製作遮罩之成本過高之缺失,實已成為目前亟欲解決的課題。Therefore, how to avoid the lack of high cost of masking by conventional techniques has become a problem that is currently being solved.

鑑於上述習知技術之缺失,本發明係提供一種精確性高且不需昂貴設備即可製作之遮罩。In view of the above-described deficiencies of the prior art, the present invention provides a mask that is highly accurate and can be fabricated without expensive equipment.

大致而言,係先直接於一如幣章之基體上形成雕塑層;再於該雕塑層上刻出所需之圖樣輪廓;接著,於該雕塑層上形成遮罩本體;最後,取出該遮罩本體,經適當的補強再將該遮罩本體上之圖樣部分挖空,以形成具有對應該圖樣之鏤空區之遮罩,使該遮罩可用於任一欲加工件上形成附著材。Generally speaking, the sculptural layer is formed directly on the base of the coin, and the desired outline of the pattern is engraved on the sculptural layer; then, the mask body is formed on the sculptural layer; finally, the cover is taken out. The cover body is appropriately reinforced to hollow out the pattern on the mask body to form a mask having a cutout corresponding to the pattern, so that the mask can be used to form an attachment material on any workpiece.

由上可知,本發明遮罩之製法,係於欲電鍍之同款幣章上直接製作遮罩本體,完全不需使用高科技設備與系統,亦即人工即可製作,因而可大幅降低遮罩之製作成本。It can be seen from the above that the mask method of the present invention directly forms the mask body on the same coin chapter to be electroplated, and does not need to use high-tech equipment and systems, that is, can be manually manufactured, thereby greatly reducing the mask. Production costs.

再者,可繼續利用表面具有圖案化雕塑層之幣章,先於該雕塑層上形成公模;接著,取出該公模,再形成母模於該公模上;最後,取出該母模,以便於後續製程使用該母模製作遮罩;如此,用以取代原具有圖案雕塑層之幣章。Furthermore, the coin having a patterned sculptural layer on the surface may be used to form a male mold on the sculpted layer; then, the male mold is taken out, and then the female mold is formed on the male mold; finally, the female mold is taken out, In order to facilitate the subsequent process to use the master mold to make a mask; thus, to replace the original medallion with a patterned sculpture layer.

以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

請參閱第2A至2H圖,係為本發明之遮罩2之製法。其中,所述之遮罩2係可用以遮蓋欲加工件,以於該欲加工件之外露表面上形成附著材。Please refer to Figures 2A to 2H for the method of manufacturing the mask 2 of the present invention. Wherein, the mask 2 can be used to cover the workpiece to form an adhesive on the exposed surface of the workpiece.

如第2A及2A'圖所示,提供一承載件20,且設置一幣章21於該承載件20上,該幣章21之頂面上具有圖案K;於本實施例中,係以幣章21作為基體,但不以此為限。As shown in FIGS. 2A and 2A', a carrier 20 is provided, and a coin 21 is disposed on the carrier 20, and the top surface of the medal 21 has a pattern K; in this embodiment, the coin is Chapter 21 is used as the substrate, but not limited to this.

如第2B及2B'圖所示,形成雕塑層22於該幣章21上。形成該雕塑層22之材質係為具附著性(如黏性強)之雕塑材質,例如:蠟、黏土等,以固定於該幣章21上,在此係以蠟為主,可將蠟滴熔於該幣章21上而凝固。接著,因該幣章21之頂面上已具有圖案K,故沿該圖案K之輪廓刻出溝槽220於該雕塑層22上,以露出該幣章21之圖案K輪廓之表面。As shown in Figures 2B and 2B', a sculptural layer 22 is formed on the coin cap 21. The material forming the sculptural layer 22 is a sculptural material having adhesion (such as strong adhesion), for example, wax, clay, etc., to be fixed on the coin 21, which is mainly based on wax, and can be used as a wax drop. Melted on the coin 21 and solidified. Then, since the top surface of the medal 21 has a pattern K, a groove 220 is engraved on the sculptural layer 22 along the outline of the pattern K to expose the surface of the pattern K contour of the medal 21.

所刻之圖樣不僅可為圖案,亦可為圖形。如第2B"圖所示,於該幣章21邊緣上之雕塑層22上刻出圓環槽221,以於後續所製之遮罩上形成凸圈,供設置遮罩時可便於定位。再者,可將該幣章21上之字體(如圖中之”年”字)或起伏處上之蠟層雕刻鏤空,以外露該字體或起伏處,故於使用後續所製之遮罩時,不僅可利於對位,且可於另一相同幣章上之”年”字或起伏處上形成金屬材。The engraved pattern can be not only a pattern but also a graphic. As shown in Fig. 2B", a circular groove 221 is engraved on the sculptural layer 22 on the edge of the coin 21 to form a bead on the subsequent mask to facilitate positioning when the mask is provided. Alternatively, the font on the coin 21 (in the figure "year") or the wax layer on the undulation may be hollowed out to expose the font or the undulation, so when using the mask prepared subsequently, Not only can the alignment be facilitated, but the metal can be formed on the word "year" or on the undulation of another coin.

於其他實施例中,使用者可於該雕塑層22上自行刻出任何圖形(如:圓形、多邊形、不規則形等)或圖案。In other embodiments, the user can engrave any graphic (eg, circular, polygonal, irregular, etc.) or pattern on the sculptural layer 22.

如第2C及2C'圖所示,將該承載件20置於一基座23上,該基座23底部具有貫穿之開口230,該基座23之周邊設置定位柱231,該定位柱231之表面可具有螺紋。As shown in FIG. 2C and FIG. 2C, the carrier 20 is placed on a pedestal 23 having a through opening 230 at the bottom of the pedestal 23, and a positioning post 231 is disposed around the pedestal 23, and the positioning post 231 is disposed. The surface can have threads.

如第2D圖所示,形成遮罩材24a於該承載件20及該雕塑層22上,以包覆該雕塑層22,且該遮罩材24a流入該溝槽220中。於本實施例中,該遮罩材24a係為膠材,例如矽橡膠,且於調配矽橡膠時,需配合真空製程,以抽出該調配矽橡膠中之空氣,可避免後續矽橡膠成形時內部產生氣泡,而成為不良品。As shown in FIG. 2D, a masking material 24a is formed on the carrier member 20 and the sculpture layer 22 to cover the sculpture layer 22, and the masking material 24a flows into the groove 220. In this embodiment, the masking material 24a is a rubber material, such as a rubber, and when the rubber is blended, a vacuum process is required to extract the air in the rubber, thereby avoiding the internal molding of the rubber. Air bubbles are generated and become defective.

再者,矽橡膠是一種化學合成的彈性體,類似橡膠的柔韌,優點為耐高低溫、耐酸鹼、防水等,於此選用業界常用之翻模矽橡膠,其流動性高,用於製作精密度高之遮罩,若將其用於電鍍製程時可隔絕電鍍液。In addition, bismuth rubber is a chemically synthesized elastomer, which is similar to the flexibility of rubber. It has the advantages of high and low temperature resistance, acid and alkali resistance, water resistance, etc., which is commonly used in the industry, which has high fluidity and is used for production. A high-density mask that isolates the plating solution if it is used in an electroplating process.

如第2E及2E'圖所示,藉由壓模製程,將透明頂蓋25放置於該基座23上,以壓整該遮罩材24a,令該遮罩材24a配合該承載件20及該雕塑層22而形成具有該圖案K'(係與該幣章21之圖案K相同)之遮罩本體24。As shown in FIGS. 2E and 2E', a transparent top cover 25 is placed on the base 23 by a molding process to press the mask member 24a so that the mask member 24a fits the carrier member 20 and The sculpture layer 22 forms a mask body 24 having the pattern K' (which is the same as the pattern K of the medal 21).

於本實施例中,該頂蓋25具有導流孔250及定位孔251,以於壓模時多餘之遮罩材24a可由該導流孔250導出,而該頂蓋25藉由該定位孔251穿設該基座23之定位柱231,以便於將該頂蓋25放置於該基座23上,且斜向壓下該頂蓋25可避免氣泡產生於該遮罩本體24中。In this embodiment, the top cover 25 has a flow guiding hole 250 and a positioning hole 251, so that the unnecessary covering material 24a can be led out from the guiding hole 250 when the stamper is pressed, and the top cover 25 is provided by the positioning hole 251. The positioning post 231 of the base 23 is inserted to facilitate the placement of the top cover 25 on the base 23, and the top cover 25 is pressed obliquely to prevent air bubbles from being generated in the mask body 24.

再者,當該頂蓋25壓整該遮罩材24a之後,可藉由螺絲(圖未示)鎖固於該定位柱231上,以防止該頂蓋25上下移動,可避免該遮罩本體24之圖案K'變形。Moreover, after the top cover 25 is pressed against the masking material 24a, it can be locked on the positioning post 231 by screws (not shown) to prevent the top cover 25 from moving up and down, and the mask body can be avoided. The pattern of 24 is K' deformation.

又,若該雕塑層22為蠟材,則無法使用加熱方式加速該遮罩材24a熱固成為該遮罩本體24,故可採用使用常溫性之乾固方式,以藉由該導流孔250供氣體流通,令該遮罩材24a自然成形為該遮罩本體24。Moreover, if the sculptural layer 22 is a wax material, the masking material 24a cannot be heated and fixed to the mask body 24 by heating, so that a normal-temperature drying method can be used to pass the guiding hole 250. The gas is circulated, so that the masking material 24a is naturally formed into the mask body 24.

如第2F、2G及2G'圖所示,移除該頂蓋25之後,雖可利用該基座23之開口230推出該遮罩本體24,但因該遮罩本體24為矽橡膠材,故其結構之撓性大而易損壞;因此,可先設置強化結構26於該遮罩本體24上,再由該承載件20及該雕塑層22上一併取出該遮罩本體24與該強化結構26。As shown in FIGS. 2F, 2G, and 2G', after the top cover 25 is removed, the mask body 24 can be pushed out by the opening 230 of the base 23, but since the mask body 24 is made of a rubber material, The structure is flexible and easily damaged; therefore, the reinforcing structure 26 can be first disposed on the mask body 24, and the mask body 24 and the reinforcing structure are taken out from the bearing member 20 and the sculpture layer 22 together. 26.

其中,該強化結構26可包括:對應該遮罩本體24底部之板體260、及設於該板體260上之架體261,以藉由該架體261而便於拿取該遮罩本體24。於本實施例中,該板體260係為透明壓克力板,以降低該遮罩本體24撓性,且其透明性可作為校對遮罩所遮蓋之位置及定位點之準確度,以避免電鍍位置不良。而該架體261係為輻射狀壓克力條,不僅用以增強該遮罩本體24強度,且具有夾部261a,若用於遮罩電鍍法中可藉由該夾部261a以夾緊遮罩,而利於電鍍。The reinforcing structure 26 may include: a plate body 260 corresponding to the bottom of the shielding body 24, and a frame body 261 disposed on the plate body 260 for facilitating access to the mask body 24 by the frame body 261. . In the embodiment, the plate body 260 is a transparent acrylic plate to reduce the flexibility of the mask body 24, and the transparency thereof can be used as the position and positioning point of the proof mask to avoid the accuracy. Poor plating position. The frame 261 is a radial acryl strip, which not only enhances the strength of the mask body 24, but also has a clamping portion 261a. If used in the mask plating method, the clamping portion 261a can be used for clamping. Cover, which is good for plating.

再者,於形成該遮罩材24a之前(即第2C圖之製程中),可形成離型材(圖未示)於該雕塑層22上,例如:噴上離型劑,以利於分離該雕塑層22與該遮罩本體24,使取出該遮罩本體24時,不會破壞該遮罩本體24之表面,亦即不會殘留該遮罩材24a於該雕塑層22上。Furthermore, before forming the masking material 24a (ie, in the process of FIG. 2C), a release profile (not shown) may be formed on the sculpture layer 22, for example, by spraying a release agent to facilitate separation of the sculpture. The layer 22 and the mask body 24 are such that when the mask body 24 is taken out, the surface of the mask body 24 is not damaged, that is, the mask material 24a is not left on the sculpture layer 22.

又,因該雕塑層22之溝槽220之緣故,該遮罩本體24上之圖案輪廓L將與該遮罩本體24表面形成高度差,如第2G'圖所示。Moreover, due to the groove 220 of the sculptural layer 22, the pattern outline L on the mask body 24 will form a height difference from the surface of the mask body 24, as shown in Fig. 2G'.

另外,因該遮罩本體24為矽橡膠材而易於與其他材質產生離型作用,故藉由膠合方式,以將該板體260(壓克力板)黏著於該遮罩本體24上。Further, since the mask body 24 is made of a rubber material and is easily released from other materials, the plate body 260 (acrylic plate) is adhered to the mask body 24 by gluing.

如第2H及2H'圖所示,移除部分遮罩本體24b,即該遮罩本體24對應該圖案輪廓L內之部分,以形成具有鏤空區240(對應該幣章21圖案K)之遮罩2。再者,因該板體260對應該遮罩本體24底部,故需一併移除對應該部分遮罩本體24b之圖案K'之部分板體26a。As shown in Figures 2H and 2H', part of the mask body 24b is removed, i.e., the mask body 24 corresponds to a portion of the pattern outline L to form a mask having a hollowed out area 240 (corresponding to the pattern K of the medal 21). Cover 2. Moreover, since the plate body 260 corresponds to the bottom of the body 24, a part of the plate body 26a corresponding to the pattern K' of the partial mask body 24b needs to be removed.

於本實施例中,因該板體260係為壓克力板,且該遮罩本體24為矽橡膠材,故不宜使用燒灼、蝕刻、雷射等化學方式進行移除製程,可利用刀具切割、鑽孔、雕刻等物理方式進行移除製程,以避免對該遮罩本體24產生破壞。In this embodiment, since the plate body 260 is an acrylic plate, and the mask body 24 is made of a rubber material, it is not suitable to use a chemical method such as cauterization, etching, or laser to remove the process, and the tool can be cut by a cutter. The removal process is performed in a physical manner such as drilling, engraving, or the like to avoid damage to the mask body 24.

本發明藉由直接於基體(幣章21)上製作遮罩本體24,完全不需使用高科技設備與系統,故有效降低遮罩2之製作成本。The invention makes the mask body 24 directly on the base body (coin chapter 21), and does not need to use high-tech equipment and systems at all, so the manufacturing cost of the mask 2 is effectively reduced.

於本發明之上述製法中,雖該具有雕塑層22之基體可重複使用,但因蠟之材質脆軟而易損壞,因而不易保存,致使該雕塑層22難以長期使用;再者,因蠟材受熱會熔化,故無法選擇熱固成型之方式以縮短遮罩2之成型時間。因此,本發明遂延伸出可製作不會受熱熔化之模具之製法,而得以用熱固成型之方式縮短成型時間。當然地,亦可選擇受熱不會熔化及較易保存之材質作為雕塑層22,並非一定需額外製作耐熱及耐用之模具。In the above method of the present invention, although the substrate having the sculptural layer 22 can be reused, the material of the wax is fragile and easily damaged, so that it is difficult to store, and the sculpted layer 22 is difficult to use for a long time; The heat will melt, so the thermosetting method cannot be selected to shorten the molding time of the mask 2. Therefore, the present invention has been developed to produce a mold which is not melted by heat, and the molding time can be shortened by means of thermosetting. Of course, it is also possible to select a material that is not melted by heat and is easier to store as the sculptural layer 22, and it is not necessary to additionally produce a heat-resistant and durable mold.

請參閱第3A至3D圖,係為利用已具有雕塑層22之基體,如第2B及2B'圖所示之幣章21製作永久性模具之製法。Referring to Figures 3A through 3D, a method of making a permanent mold using a base having a sculptural layer 22, such as the coin 21 shown in Figures 2B and 2B'.

如第3A圖所示,將如第2B圖所示之結構設於一容器34中,於該容器34中置入液態物,如石膏漿,待石膏漿固化後,以形成模型30於該承載件20、幣章21及雕塑層22上,且該模型30係具有對應該溝槽220之凸部300。As shown in FIG. 3A, the structure as shown in FIG. 2B is disposed in a container 34, and a liquid substance such as gypsum slurry is placed in the container 34, and after the gypsum slurry is solidified, a model 30 is formed on the carrier. The member 20, the coin cap 21 and the sculptural layer 22, and the model 30 has a convex portion 300 corresponding to the groove 220.

於本實施例中,調製石膏漿時,若石膏密度愈小,固化後石膏之強度則愈弱而吸水率愈大,反之則強度愈強吸水率愈小,因此,該模型30需要有一定之強度,以避免該凸部300斷裂。再者,調製石膏漿時,需配合真空製程,以抽出石膏漿中之空氣,可避免石膏成形時具有氣泡,而成為不良品。In the present embodiment, when the gypsum slurry is prepared, if the gypsum density is smaller, the strength of the gypsum after curing is weaker and the water absorption rate is larger, and conversely, the stronger the strength, the smaller the water absorption rate. Therefore, the model 30 needs to have a certain value. The strength is to prevent the convex portion 300 from being broken. Furthermore, when the gypsum slurry is prepared, it is necessary to cooperate with a vacuum process to extract the air in the gypsum slurry, thereby avoiding bubbles in the formation of the gypsum and becoming a defective product.

如第3B圖所示,移除該容器34,再取出該模型30;接著,將該模型30放入烤箱烘烤,再加工進行表面微整修。As shown in Fig. 3B, the container 34 is removed and the mold 30 is removed; the mold 30 is then baked in an oven and processed for surface microfinishing.

於本實施例中,於該容器34中置入石膏漿之前,可先噴塗離型劑於該雕塑層22上,以利於分離該雕塑層22與該模型30,使取出該模型30時,不會破壞該模型30之表面,亦即不會殘留石膏材於該雕塑層22上。In this embodiment, before the gypsum slurry is placed in the container 34, a release agent may be sprayed onto the sculpture layer 22 to facilitate separation of the sculpture layer 22 and the mold 30 so that when the model 30 is taken out, The surface of the mold 30 is destroyed, i.e., no gypsum material remains on the sculpture layer 22.

如第3C圖所示,形成模具31於該石膏模型30上。於本實施例中,該模具31之製程係先以離型劑刷塗於該模型30上,並以熱風乾燥,再將該模型30設於另一容器35中,接著,於該容器35中置入塑膠液(如樹脂)或金屬液,待塑膠或金屬固化後,以形成塑膠或金屬模具31於該石膏模型30上。As shown in FIG. 3C, a mold 31 is formed on the plaster mold 30. In the present embodiment, the process of the mold 31 is first applied to the mold 30 with a release agent, dried by hot air, and the mold 30 is placed in another container 35, and then in the container 35. A plastic liquid (such as a resin) or a molten metal is placed, and after the plastic or metal is cured, a plastic or metal mold 31 is formed on the plaster mold 30.

再者,調製塑膠時,需配合真空製程,以避免該塑膠模具31具有具有氣泡,而成為不良品。Furthermore, when modulating the plastic, it is necessary to cooperate with a vacuum process to prevent the plastic mold 31 from having bubbles and becoming a defective product.

如第3D及3D'圖所示,從該石膏模型30上取出該模具31,再加工進行表面微整修,以完成永久性模具31,且該模具31係具有對應該溝槽220之凹部310,該凹部310即形成對應該幣章21圖案K之圖樣S。於後續製程中,即可利用該模具31製作遮罩2,請參考第2C至2H圖之製程,且於固化該遮罩本體24時,可選擇加熱方式,以增快遮罩成形時間。As shown in FIGS. 3D and 3D', the mold 31 is taken out from the plaster mold 30, and then subjected to surface micro-finishing to complete the permanent mold 31, and the mold 31 has a concave portion 310 corresponding to the groove 220. The recess 310 forms a pattern S corresponding to the pattern K of the medal 21 . In the subsequent process, the mask 2 can be made by using the mold 31. Please refer to the process of FIGS. 2C-2H, and when curing the mask body 24, the heating method can be selected to increase the mask forming time.

本發明亦藉由複製蠟模製作出永久性之模具31,如樹脂模具或金屬模具等,且因該模具31耐熱,故可選擇熱固方式以增快遮罩成形時間。再者,樹脂模具31或金屬模具因不易破損而容易保存,故可長期重複使用製作遮罩。In the present invention, a permanent mold 31, such as a resin mold or a metal mold, is also produced by replicating a wax mold, and since the mold 31 is heat-resistant, a thermosetting method can be selected to increase the mask forming time. Further, since the resin mold 31 or the metal mold is easily stored because it is not easily broken, the mask can be repeatedly used for a long period of time.

藉由上述製法所製作之遮罩,可於任一欲加工件上形成不同顏色或材質之附著圖樣。以下係藉由第4A至4C圖、第5A至5B圖說明將該遮罩應用於電鍍法之使用方式,但並不以此為限。By the mask made by the above method, an attachment pattern of different colors or materials can be formed on any workpiece to be processed. The following is a description of the use of the mask in the plating method by means of FIGS. 4A to 4C and FIGS. 5A to 5B, but is not limited thereto.

請參閱第4A至4C圖,係為單面局部電鍍之實施態樣。於該電鍍製程中,係於欲加工件(如:與上述幣章21相同之另一幣章41)之頂面與底面分別蓋設頂部遮罩2與底部遮罩4,且頂部遮罩係為第2H圖所示之遮罩2,而該底部遮罩4係可參考第2A至2H圖及第4A圖之製法進行製作。因此,有關該底部遮罩4之製法若與頂部遮罩之製法具有相同處,則不再贅述。Please refer to Figures 4A to 4C for the implementation of single-sided partial plating. In the electroplating process, the top surface and the bottom surface of the workpiece (for example, the same coin 41 as the coin chapter 21) are respectively covered with a top mask 2 and a bottom mask 4, and the top mask system is respectively It is the mask 2 shown in FIG. 2H, and the bottom mask 4 can be produced by referring to the methods of FIGS. 2A to 2H and FIG. 4A. Therefore, the method for manufacturing the bottom mask 4 is the same as the method for manufacturing the top mask, and will not be described again.

如第4A及4A'圖所示,提供另一承載件40,且將該承載件40置於該基座23上,再形成遮罩材於該承載件40及該基座23上;接著,藉由該頂蓋25壓合於該基座23上,以壓整形成該底部遮罩4。As shown in FIGS. 4A and 4A', another carrier 40 is provided, and the carrier 40 is placed on the base 23, and a masking material is formed on the carrier 40 and the base 23; The bottom cover 4 is press-formed by the top cover 25 to be pressed to form the bottom cover 4.

如第4B圖所示,於該遮罩4上膠合一具有板體260'及架體261之強化結構26';並於該遮罩4上設置電線47,該電線47穿過該遮罩4與該板體260',以外露於該遮罩4上表面。再者,因該幣章41之底面無需電鍍金屬,故該底部遮罩4與該強化結構26'之板體260'均無需鏤空。As shown in FIG. 4B, a reinforcing structure 26' having a plate body 260' and a frame body 261 is glued to the mask 4; and a wire 47 is disposed on the mask 4, and the wire 47 passes through the mask 4. The plate body 260' is exposed to the upper surface of the mask 4. Moreover, since the bottom surface of the coin cap 41 does not need to be plated with metal, the bottom mask 4 and the plate body 260' of the reinforcing structure 26' need not be hollowed out.

接著,將該幣章41之頂面與底面分別蓋設該具有鏤空區240(如第2H圖所示之圖案K')之遮罩2與該底部遮罩4,且該電線47碰觸該幣章41之底面。再者,藉由該夾部261a可使電鍍設備上下夾緊該遮罩2與該底部遮罩4,以避免電鍍液滲入非電鍍區,俾可提升電鍍之精確度。Then, the top surface and the bottom surface of the medal 41 are respectively covered with the mask 2 having the hollow area 240 (such as the pattern K' shown in FIG. 2H) and the bottom mask 4, and the electric wire 47 touches the The bottom of the coin chapter 41. Furthermore, the clamping portion 261a allows the plating device to clamp the mask 2 and the bottom mask 4 up and down to prevent the plating solution from penetrating into the non-plating area, thereby improving the precision of plating.

如第4C圖所示,進行電鍍製程,藉由該底部遮罩4上之電線47連接電極,使該幣章41帶電進行電鍍,以於該遮罩2之鏤空區240中之幣章41表面上形成金屬材,即完成單面電鍍幣章之製作。As shown in FIG. 4C, an electroplating process is performed, and the wire is connected to the electrode by the wire 47 on the bottom mask 4, so that the coin cap 41 is electrified for electroplating, so as to face the surface of the coin 41 in the hollow region 240 of the mask 2. The metal material is formed on the surface, that is, the production of the single-sided electroplated coin is completed.

請參閱第5A至5B圖,係為雙面局部電鍍之實施態樣,即於另一幣章51之頂面與底面分別蓋設頂部遮罩與底部遮罩5,且頂部遮罩係為第2H圖所示之遮罩2,而該底部遮罩5與頂部遮罩之差異僅在於鏤空區之圖案不同。Please refer to FIG. 5A to FIG. 5B, which are embodiments of double-sided partial plating, that is, a top mask and a bottom mask 5 are respectively disposed on the top surface and the bottom surface of another coin 51, and the top mask is the first The mask 2 shown in Fig. 2H differs from the top mask only in the pattern of the cutout area.

如第5A圖所示,將該幣章51之頂面與底面分別蓋設該具有鏤空區240之遮罩2與具有鏤空區540(呈另一圖案X之形狀)之底部遮罩5,且該電線57碰觸該幣章51之底面。As shown in FIG. 5A, the top surface and the bottom surface of the medal 51 are respectively covered with the mask 2 having the hollowed out area 240 and the bottom mask 5 having the hollowed out area 540 (in the shape of another pattern X), and The wire 57 touches the bottom surface of the medal 51.

如第5B圖所示,於該鏤空區240、540中之幣章51之頂面與底面上藉由該電線57連接電極,使該幣章51帶電進行電鍍,而於該幣章51之頂面與底面上同時形成金屬材,即完成雙面電鍍幣章之製作。As shown in FIG. 5B, the electrode is connected to the top surface and the bottom surface of the currency stamps 240, 540 in the hollow region 240, 540, and the coin 51 is electrified for electroplating, at the top of the coin 51. The metal material is formed simultaneously on the surface and the bottom surface, that is, the double-sided electroplated coin is completed.

綜上所述,本發明所提供之遮罩之製法,係完全不需使用高科技設備與系統,故可大幅降低遮罩之製作成本。In summary, the method for manufacturing the mask provided by the present invention does not require the use of high-tech equipment and systems at all, so that the manufacturing cost of the mask can be greatly reduced.

上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

1、21、41、51...幣章1, 21, 41, 51. . . Coin chapter

2、4、5、9...遮罩2, 4, 5, 9. . . Mask

20、40...承載件20, 40. . . Carrier

22...雕塑層twenty two. . . Sculpture layer

220...溝槽220. . . Trench

221...圓環槽221. . . Ring groove

23...基座twenty three. . . Pedestal

230...開口230. . . Opening

231...定位柱231. . . Positioning column

24...遮罩本體twenty four. . . Mask body

240、540、90...鏤空區240, 540, 90. . . Hollow area

24a...遮罩材24a. . . Cover material

24b...部分遮罩本體24b. . . Partial mask body

25...頂蓋25. . . Top cover

250...導流孔250. . . Diversion hole

251...定位孔251. . . Positioning hole

26、26'...強化結構26, 26'. . . Reinforced structure

26a...部分板體26a. . . Partial plate

260、260'...板體260, 260'. . . Plate body

261...架體261. . . Frame

261a...夾部261a. . . Clip

30...模型30. . . model

300...凸部300. . . Convex

31...模具31. . . Mold

310...凹部310. . . Concave

34、35...容器34, 35. . . container

47、57...電線47, 57. . . wire

8...金層8. . . Gold layer

L...輪廓L. . . profile

K、K'、X...圖案K, K', X. . . pattern

S...圖樣S. . . pattern

第1A至1C圖係為習知於銀幣章上電鍍金屬之製法的剖視示意圖;1A to 1C are schematic cross-sectional views showing a conventional method of plating metal on a silver coin;

第2A至2H圖係為本發明遮罩之製法的剖視與立體示意圖;其中,第2A'圖係為第2A圖之立體分解圖,第2B'圖係為第2B圖之立體圖,第2B"圖係為第2B'圖之另一實施態樣,第2C'圖係為第2C圖之立體分解圖,第2E'圖係為第2E圖之剖視分解圖,第2G'圖係為第2G圖之立體分解圖,第2H'圖係為第2H圖之立體分解圖;2A to 2H are a cross-sectional view and a perspective view showing a method of manufacturing the mask of the present invention; wherein, the 2A' is a perspective exploded view of FIG. 2A, and the 2B' is a perspective view of FIG. 2B, 2B. "The figure is another embodiment of the 2B' diagram, the 2C' diagram is the perspective exploded view of the 2Cth diagram, and the 2E' diagram is the cross-sectional exploded view of the 2E diagram, and the 2G' diagram is The exploded view of Fig. 2G, the 2H' is a perspective exploded view of Fig. 2H;

第3A至3D圖係為利用本發明遮罩之製法所製作之永久性模具之製法的剖視示意圖;其中,第3D'圖係為第3D圖之立體圖;3A to 3D are schematic cross-sectional views showing a method of manufacturing a permanent mold produced by the method of the mask of the present invention; wherein the 3D' diagram is a perspective view of the 3D diagram;

第4A至4C圖係為利用本發明遮罩進行單面局部電鍍之剖視示意圖;其中,第4A'圖係為第4A圖之剖視分解圖;以及4A to 4C are schematic cross-sectional views showing single-sided partial plating using the mask of the present invention; wherein, FIG. 4A' is a cross-sectional exploded view of FIG. 4A;

第5A至5B圖利用本發明遮罩進行雙面局部電鍍之剖視示意圖。5A to 5B are schematic cross-sectional views showing the double-sided partial plating using the mask of the present invention.

20...承載件20. . . Carrier

22...雕塑層twenty two. . . Sculpture layer

220...溝槽220. . . Trench

23...基座twenty three. . . Pedestal

230...開口230. . . Opening

24...遮罩本體twenty four. . . Mask body

26...強化結構26. . . Reinforced structure

260...板體260. . . Plate body

261...架體261. . . Frame

261a...夾部261a. . . Clip

Claims (19)

一種遮罩之製法,該遮罩係用以敷設於欲加工件上,以於該欲加工件未覆有該遮罩之表面上形成附著材,該製法包括:提供一基體;形成雕塑層於該基體上;刻出圖樣於該雕塑層上;形成遮罩材於該雕塑層上,以形成具有該圖樣之遮罩本體;取出該遮罩本體;以及移除該遮罩本體對應該圖樣之部分,以形成該遮罩,且該遮罩具有對應該圖樣之鏤空區。A masking method for laying on a workpiece to form an attachment material on a surface of the workpiece that is not covered with the mask, the method comprising: providing a substrate; forming a sculpture layer Forming a pattern on the sculpture layer; forming a masking material on the sculpture layer to form a mask body having the pattern; removing the mask body; and removing the mask body corresponding to the pattern Part to form the mask, and the mask has a hollowed out area corresponding to the pattern. 如申請專利範圍第1項所述之遮罩之製法,其中,該基體係與該欲加工件同樣式。The method of fabricating a mask according to claim 1, wherein the base system is the same as the workpiece. 如申請專利範圍第1項所述之遮罩之製法,其中,該基體係為幣章。The method for manufacturing a mask according to claim 1, wherein the base system is a currency stamp. 如申請專利範圍第1項所述之遮罩之製法,其中,該基體具有對應該圖樣之另一相同圖樣,以令該雕塑層上所刻出之圖樣輪廓外露該基體之另一相同圖樣輪廓。The method of fabricating a mask according to claim 1, wherein the substrate has another identical pattern corresponding to the pattern, such that the contour of the pattern engraved on the sculpture layer exposes another identical pattern contour of the substrate. . 如申請專利範圍第1項所述之遮罩之製法,其中,形成該雕塑層之材質具有附著性,以固定於該基體上。The method of fabricating a mask according to claim 1, wherein the material forming the sculptural layer has adhesion to be fixed to the substrate. 如申請專利範圍第1項所述之遮罩之製法,其中,形成該雕塑層之材質係為蠟、或黏土。The method of fabricating a mask according to claim 1, wherein the material forming the sculptural layer is wax or clay. 如申請專利範圍第1項所述之遮罩之製法,其中,該遮罩材係為膠材。The method of fabricating a mask according to claim 1, wherein the masking material is a rubber material. 如申請專利範圍第1項所述之遮罩之製法,其中,該遮罩材係為矽橡膠。The method of fabricating a mask according to claim 1, wherein the masking material is a ruthenium rubber. 如申請專利範圍第1項所述之遮罩之製法,其中,該遮罩本體上之圖樣輪廓與該遮罩本體表面具有高度差,以利於形成該鏤空區。The method of fabricating a mask according to claim 1, wherein a contour of the pattern on the mask body and a surface of the mask body have a height difference to facilitate formation of the hollow region. 如申請專利範圍第1項所述之遮罩之製法,復包括形成該雕塑層之前,提供承載件,以令該基體設於該承載件上。The method of fabricating a mask according to claim 1, wherein before the forming of the sculpture layer, a carrier is provided to provide the substrate on the carrier. 如申請專利範圍第1項所述之遮罩之製法,復包括形成該遮罩材之前,先將該基體置於基座上。The method of fabricating a mask according to claim 1, wherein the substrate is placed on the pedestal before forming the mask. 如申請專利範圍第1項所述之遮罩之製法,復包括形成該遮罩材之前,形成離型材於該雕塑層上,以利於取出該遮罩本體。The method for manufacturing a mask according to claim 1, wherein before the forming of the masking material, a release profile is formed on the sculpture layer to facilitate removal of the mask body. 如申請專利範圍第1項所述之遮罩之製法,復包括藉由壓模製程,將頂蓋壓整該遮罩材,以形成具有該圖樣之遮罩本體。The method of fabricating a mask according to claim 1, further comprising pressing the cover material by a stamping process to form a mask body having the pattern. 如申請專利範圍第1項所述之遮罩之製法,復包括於形成該遮罩本體之後,先設置強化結構於該遮罩本體上,再取出該遮罩本體。The method for manufacturing a mask according to claim 1, wherein after the mask body is formed, a reinforcing structure is first disposed on the mask body, and then the mask body is taken out. 如申請專利範圍第1項所述之遮罩之製法,復包括於該遮罩上設置電線。The method of fabricating a mask according to claim 1, further comprising providing an electric wire on the mask. 如申請專利範圍第1項所述之遮罩之製法,復包括形成模型於該幣章及雕塑層上;取出該模型;形成模具於該模型上;及取出該模具,使該模具之表面上具有該圖樣。The method for manufacturing a mask according to claim 1, further comprising forming a model on the coin and the sculpture layer; taking out the mold; forming a mold on the mold; and taking out the mold to make the mold surface With this pattern. 如申請專利範圍第16項所述之遮罩之製法,復包括:形成另一遮罩材於該模具之表面上,以形成具有該圖樣之另一遮罩本體;取出該另一遮罩本體;以及移除該另一遮罩本體上之圖樣輪廓內之部分,以形成另一具有該圖樣之鏤空區之遮罩。The method of fabricating a mask according to claim 16, further comprising: forming another masking material on the surface of the mold to form another mask body having the pattern; and removing the other mask body And removing a portion of the outline of the pattern on the other mask body to form another mask having the hollowed out area of the pattern. 如申請專利範圍第16項所述之遮罩之製法,其中,形成該模型之材質係為石膏。The method of fabricating a mask according to claim 16, wherein the material forming the model is gypsum. 如申請專利範圍第16項所述之遮罩之製法,其中,形成該模具之材質係為樹脂、塑膠或金屬。The method of fabricating a mask according to claim 16, wherein the material forming the mold is resin, plastic or metal.
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US6663820B2 (en) * 2001-03-14 2003-12-16 The Procter & Gamble Company Method of manufacturing microneedle structures using soft lithography and photolithography
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