TWI413296B - Balun - Google Patents
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- TWI413296B TWI413296B TW098122516A TW98122516A TWI413296B TW I413296 B TWI413296 B TW I413296B TW 098122516 A TW098122516 A TW 098122516A TW 98122516 A TW98122516 A TW 98122516A TW I413296 B TWI413296 B TW I413296B
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- 239000000463 material Substances 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 3
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- 239000010410 layer Substances 0.000 description 58
- 238000004519 manufacturing process Methods 0.000 description 5
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
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Abstract
Description
本發明係有關於一種平衡-非平衡轉換器,特別係有關於一種製作簡單的平衡-非平衡轉換器。The present invention relates to a balanced-unbalanced converter, and more particularly to a simple balanced-unbalanced converter.
參照第1a圖,其係顯示習知之平衡-非平衡轉換器1,其係為一圓柱狀結構。參照第1b圖,其係顯示習知之平衡-非平衡轉換器1的截面圖,該平衡-非平衡轉換器1包括一饋入導體10、一第一接地元件21、一第二接地元件22以及一共用接地元件30。第一接地元件21以及第二接地元件22環繞該饋入導體10。共用接地元件30環繞第一接地元件21以及第二接地元件22。第一接地元件21連接一第一輸出埠23,該第二接地元件22連接一第二輸出埠24。共用接地元件30電性連接第一接地元件21以及第二接地元件22。Referring to Fig. 1a, there is shown a conventional balanced-unbalanced converter 1 which is a cylindrical structure. Referring to FIG. 1b, a cross-sectional view of a conventional balun 1 is shown. The balun 1 includes a feed conductor 10, a first ground element 21, a second ground element 22, and A common grounding element 30. The first ground element 21 and the second ground element 22 surround the feed conductor 10. The common ground element 30 surrounds the first ground element 21 and the second ground element 22. The first grounding element 21 is connected to a first output port 23, and the second grounding element 22 is connected to a second output port 24. The common ground element 30 is electrically connected to the first ground element 21 and the second ground element 22.
在習知技術中,由於饋入導體10、第一接地元件21、第二接地元件22以及共用接地元件30等各元件均需要以機械加工的方式製作,其加工過程耗時且難度高,並且製造成本高昂。In the prior art, since each of the feeding conductor 10, the first grounding member 21, the second grounding member 22, and the common grounding member 30 needs to be machined, the processing is time consuming and difficult, and Manufacturing costs are high.
本發明即為了欲解決習知技術之問題而提供之一種平衡-非平衡轉換器,包括一第一基板、一饋入導體、一第二基板、一第一接地層、一第二接地層以及一共用接地元件。饋入導體包括一饋入部以及一饋入延伸部,該饋入導體設於該第一基板之上。第一接地層設於該第二基板之上,並對應該饋入部,第二接地層設於該第二基板之上,並對應該饋入延伸部,該第一接地層與該第二接地層之間具有一間隙。共用接地元件設於該第二基板之上,其中,該共用接地元件與該第一接地層以及該第二接地層相導通,該共用接地元件包括一第一共用接地部,該第一共用接地部平行對應該饋入導體,該第一接地層以及該第二接地層於短軸方向的寬度大於該第一共用接地部的線寬。The present invention provides a balanced-unbalanced converter for solving the problems of the prior art, comprising a first substrate, a feed conductor, a second substrate, a first ground layer, a second ground layer, and A common grounding element. The feed conductor includes a feed portion and a feed extension, and the feed conductor is disposed on the first substrate. The first ground layer is disposed on the second substrate, and is disposed on the second substrate, and the second ground layer is disposed on the second substrate, and is fed to the extension portion, the first ground layer and the second connection There is a gap between the formations. The common grounding component is disposed on the second substrate, wherein the common grounding component is electrically connected to the first grounding layer and the second grounding layer, and the common grounding component comprises a first common grounding portion, the first common grounding The portions are parallel to the feed conductor, and the width of the first ground layer and the second ground layer in the short axis direction is greater than the line width of the first common ground portion.
在本發明之實施例中,透過將饋入導體、第一接地層、一第二接地層以及一共用接地元件設於該第一基板以及該第二基板之上,可獲得平面化的平衡-非平衡轉換器結構。由於上述結構可輕易透過半導體製程等相關技術大量製造,因此可降低製造成本並縮短製造時間。此外,本發明透過將第一共用接地部的線寬降低,可簡單提高平衡-非平衡轉換器的操作頻寬。In an embodiment of the present invention, a planarization balance can be obtained by providing a feed conductor, a first ground layer, a second ground layer, and a common ground element on the first substrate and the second substrate. Unbalanced converter structure. Since the above structure can be easily manufactured in a large amount by a related art such as a semiconductor process, the manufacturing cost can be reduced and the manufacturing time can be shortened. Further, the present invention can easily increase the operation bandwidth of the balun by reducing the line width of the first common ground portion.
參照第2圖,其係顯示本發明第一實施例之平衡-非平衡轉換器100,用於轉換一非平衡訊號至平衡訊號,包括一第一基板110、一饋入導體120、一第二基板130、一第一接地層140、一第二接地層150以及一共用接地元件160。第一基板110包括一第一表面111以及一第二表面112,該第一表面111相反於該第二表面112。饋入導體120包括一饋入部121以及一饋入延伸部122,該饋入導體120設於該第一表面111之上,並沿一第一軸線X延伸。第二基板130包括一第三表面131以及一第四表面132,該第三表面131相反於該第四表面132,該第三表面131相對該第二表面112。第一接地層140設於該第三表面131之上,並對應該饋入部121。第二接地層150設於該第三表面131之上,並對應該饋入延伸部122,該第一接地層140與該第二接地層150之間具有一間隙101。共用接地元件160設於該第四表面132之上,其中,該共用接地元件160與該第一接地層140以及該第二接地層150相導通,該共用接地元件160包括一第一共用接地部161,該第一共用接地部161平行該第一軸線X並對應該饋入導體120。Referring to FIG. 2, a balanced-unbalanced converter 100 for converting an unbalanced signal to a balanced signal includes a first substrate 110, a feed conductor 120, and a second The substrate 130, a first ground layer 140, a second ground layer 150, and a common ground element 160. The first substrate 110 includes a first surface 111 and a second surface 112 opposite to the second surface 112. The feed conductor 120 includes a feed portion 121 and a feed extension portion 122. The feed conductor 120 is disposed above the first surface 111 and extends along a first axis X. The second substrate 130 includes a third surface 131 opposite to the fourth surface 132 and a third surface 131 opposite to the second surface 112. The first ground layer 140 is disposed on the third surface 131 and is fed to the portion 121. The second ground layer 150 is disposed on the third surface 131 and is fed into the extension portion 122. The first ground layer 140 and the second ground layer 150 have a gap 101 therebetween. The common grounding element 160 is disposed on the fourth surface 132. The common grounding component 160 is electrically connected to the first grounding layer 140 and the second grounding layer 150. The common grounding component 160 includes a first common grounding portion. 161. The first common ground portion 161 is parallel to the first axis X and is fed into the conductor 120.
在本發明的第一實施例中,透過將第一共用接地部的線寬降低,可提高第一接地層140與該第一共用接地部161之間的特徵阻抗值,同時也提高第二接地層150與該第一共用接地部161之間的特徵阻抗值,藉此可提高平衡-非平衡轉換器100的操作頻寬。In the first embodiment of the present invention, by reducing the line width of the first common ground portion, the characteristic impedance value between the first ground layer 140 and the first common ground portion 161 can be increased, and the second connection is also improved. The characteristic impedance value between the formation 150 and the first common ground portion 161, whereby the operating bandwidth of the balun 100 can be increased.
該饋入部121的寬度小於該饋入延伸部122的寬度。The width of the feed portion 121 is smaller than the width of the feed extension portion 122.
在此實施例中,第一接地層和第二接地層是設計在50歐姆的阻抗。第一及第二輸出埠的線寬為0.35mm,第一及第二接地層的線寬為3mm,第一及第二共用接地部的線寬為0.2mm。第一接地層與第二接地層之間的間隙寬度為0.25mm,第一及第二接地層與共用接地部之間的高(厚)度為1mm。該第一及第二接地層的線寬與該第一共用接地部的線寬之間的比例,約介於18:1~12:1之間。In this embodiment, the first ground plane and the second ground plane are designed to have an impedance of 50 ohms. The line widths of the first and second output turns are 0.35 mm, the line widths of the first and second ground layers are 3 mm, and the line widths of the first and second common ground portions are 0.2 mm. The gap width between the first ground layer and the second ground layer is 0.25 mm, and the height (thickness) between the first and second ground layers and the common ground portion is 1 mm. The ratio between the line width of the first and second ground layers and the line width of the first common ground portion is between about 18:1 and 12:1.
該第一接地層140包括一第一輸出埠141,該第二接地層150包括一第二輸出埠151,該第一輸出埠141以及該第二輸出埠151位於一第二軸線Y之上,並分別朝相反方向延伸,該第二軸線Y垂直於該第一軸線X。該共用接地元件160更包括一第二共用接地部162,該第二共用接地部162垂直於該第一共用接地部161,並平行對應於該第一輸出埠141以及該第二輸出埠151。The first ground layer 140 includes a first output port 151, and the second ground layer 150 includes a second output port 151. The first output port 141 and the second output port 151 are located above a second axis Y. And extending respectively in opposite directions, the second axis Y being perpendicular to the first axis X. The common grounding component 160 further includes a second common grounding portion 162 that is perpendicular to the first common grounding portion 161 and that corresponds in parallel to the first output port 141 and the second output port 151.
該間隙101沿一第三軸線Z延伸,該第三軸線Z與該第二軸線Y之間具有一夾角θ,該夾角θ可以落在+/-80度之間。The gap 101 extends along a third axis Z, and the third axis Z has an angle θ with the second axis Y, and the angle θ can fall between +/- 80 degrees.
在本發明之實施例中,該第一接地層140與該第二接地層150大致上呈梯形,該第一輸出埠141位於該第一接地層140的一角,該第二輸出埠151位於該第二接地層150的一角。該第一接地層140以及該第二接地層150的長軸方向長度L各約為該訊號的四分一波長。In the embodiment of the present invention, the first ground layer 140 and the second ground layer 150 are substantially trapezoidal, the first output port 141 is located at a corner of the first ground layer 140, and the second output port 151 is located at the A corner of the second ground layer 150. The length L of the first ground layer 140 and the second ground layer 150 in the major axis direction is each about a quarter wavelength of the signal.
該第二基板130更包括一第一連通柱133以及一第二連通柱134,該第一連通柱133貫穿該第二基板130並電性連接該第一接地層140以及該第一共用接地部161,該第二連通柱134貫穿該第二基板130並電性連接該第二接地層150以及該第一共用接地部161。The second substrate 130 further includes a first connecting pillar 133 and a second connecting pillar 134. The first connecting pillar 133 extends through the second substrate 130 and is electrically connected to the first ground layer 140 and the first common The grounding portion 161 extends through the second substrate 130 and is electrically connected to the second ground layer 150 and the first common ground portion 161 .
在本發明之實施例中,透過將饋入導體、第一接地層、一第二接地層以及一共用接地元件設於該第一基板以及該第二基板之上,可獲得平面化的平衡-非平衡轉換器結構。由於上述結構可輕易透過半導體製程等相關技術大量製造,因此可降低製造成本並縮短製造時間。此外,本發明透過將第一共用接地部的線寬降低,可簡單提高平衡-非平衡轉換器的輸出操作頻寬。In an embodiment of the present invention, a planarization balance can be obtained by providing a feed conductor, a first ground layer, a second ground layer, and a common ground element on the first substrate and the second substrate. Unbalanced converter structure. Since the above structure can be easily manufactured in a large amount by a related art such as a semiconductor process, the manufacturing cost can be reduced and the manufacturing time can be shortened. Furthermore, the present invention can simply increase the output operation bandwidth of the balun by reducing the line width of the first common ground portion.
參照第3圖,其係顯示本發明第二實施例之平衡-非平衡轉換器100’,用於轉換一非平衡訊號至平衡訊號,包括一第一基板110、一饋入導體120、一第二基板130、一第一接地層140、一第二接地層150以及一共用接地元件160’。第一基板110包括一第一表面111以及一第二表面112,該第一表面111相反於該第二表面112。饋入導體120包括一饋入部121以及一饋入延伸部122,該饋入導體120設於該第一表面111之上,並沿一第一軸線X延伸。第二基板130包括一第三表面131以及一第四表面132,該第三表面131相反於該第四表面132,該第三表面131相對該第二表面112。第一接地層140設於該第三表面131之上,並對應該饋入部121。第二接地層150設於該第三表面131之上,並對應該饋入延伸部122,該第一接地層140與該第二接地層150之間具有一間隙101。共用接地元件160’設於該第四表面132之上,該共用接地元件160’具有一第一鏤空部161’、一第二鏤空部162’以及一分隔部163’。該分隔部163’介於該第一鏤空部161’以及該第二鏤空部162’之間。該第一鏤空部161’對應該第一接地層140,該第二鏤空部162’對應該第二接地層150,其中,該共用接地元件160’與該第一接地層140以及該第二接地層150相導通。Referring to FIG. 3, a balanced-unbalanced converter 100' according to a second embodiment of the present invention is shown for converting an unbalanced signal to a balanced signal, including a first substrate 110, a feed conductor 120, and a first The second substrate 130, a first ground layer 140, a second ground layer 150, and a common grounding element 160'. The first substrate 110 includes a first surface 111 and a second surface 112 opposite to the second surface 112. The feed conductor 120 includes a feed portion 121 and a feed extension portion 122. The feed conductor 120 is disposed above the first surface 111 and extends along a first axis X. The second substrate 130 includes a third surface 131 opposite to the fourth surface 132 and a third surface 131 opposite to the second surface 112. The first ground layer 140 is disposed on the third surface 131 and is fed to the portion 121. The second ground layer 150 is disposed on the third surface 131 and is fed into the extension portion 122. The first ground layer 140 and the second ground layer 150 have a gap 101 therebetween. A common grounding member 160' is disposed on the fourth surface 132. The common grounding member 160' has a first hollow portion 161', a second hollow portion 162', and a partition portion 163'. The partition portion 163' is interposed between the first hollow portion 161' and the second hollow portion 162'. The first hollow portion 161 ′ corresponds to the first ground layer 140 , and the second hollow portion 162 ′ corresponds to the second ground layer 150 , wherein the common ground element 160 ′ and the first ground layer 140 and the second connection The formation 150 is electrically conductive.
第二實施例的特點在於,透過第一鏤空部161’以及第二鏤空部162’的設計,可提高第一接地層140與該共用接地元件160’之間的特徵阻抗,同時也提高第二接地層150與該共用接地元件160’之間的特徵阻抗,藉此可提高平衡-非平衡轉換器100’的操作頻寬。The second embodiment is characterized in that, through the design of the first hollow portion 161' and the second hollow portion 162', the characteristic impedance between the first ground layer 140 and the common grounding element 160' can be improved, and the second is also improved. The characteristic impedance between the ground plane 150 and the common ground element 160', thereby increasing the operating bandwidth of the balun 100'.
在第二實施例中,該第一鏤空部161’以及該第二鏤空部162’為矩形,然其並未限制本發明,該第一鏤空部161’以及該第二鏤空部162’亦可以為梯形、圓形或其他形狀。In the second embodiment, the first hollow portion 161' and the second hollow portion 162' are rectangular, but the invention is not limited thereto, and the first hollow portion 161' and the second hollow portion 162' may also be It is trapezoidal, circular or other shape.
參照第4圖,其係顯示本發明第三實施例之平衡-非平衡轉換器100’’,用於轉換一非平衡訊號至平衡訊號,包括一第一基板110、一饋入導體120、一第二基板130、一第一接地層140、一第二接地層150以及一共用接地元件160’。第一基板110包括一第一表面111、一第二表面112以及連通柱113,該第一表面111相反於該第二表面112。Referring to FIG. 4, a balanced-unbalanced converter 100'' of a third embodiment of the present invention is shown for converting an unbalanced signal to a balanced signal, including a first substrate 110, a feed conductor 120, and a The second substrate 130, a first ground layer 140, a second ground layer 150, and a common ground element 160'. The first substrate 110 includes a first surface 111 , a second surface 112 , and a communication post 113 . The first surface 111 is opposite to the second surface 112 .
饋入導體120’包括一饋入部121’以及一饋入延伸部122’,該饋入部121’設於該第一表面111之上,該饋入延伸部122’設於該第二表面112之上,該饋入部121’以及該饋入延伸部122’平行一第一軸線X,該饋入部121’透過該連通柱113電性連接該饋入延伸部122’。第一接地層140設於該第三表面131之上,並對應該饋入部121。第二接地層150設於該第三表面131之上,並對應該饋入延伸部122,該第一接地層140與該第二接地層150之間具有一間隙101。共用接地元件160’設於該第四表面132之上,該共用接地元件160’具有一第一鏤空部161’、一第二鏤空部162’以及一分隔部163’。該分隔部163’介於該第一鏤空部161’以及該第二鏤空部162’之間。該第一鏤空部161’對應該第一接地層140’該第二鏤空部162’對應該第二接地層150,其中,該共用接地元件160’與該第一接地層140以及該第二接地層150相導通。The feeding conductor 120 ′ includes a feeding portion 121 ′ and a feeding extension portion 122 ′. The feeding portion 121 ′ is disposed on the first surface 111 , and the feeding extension portion 122 ′ is disposed on the second surface 112 . The feed portion 121 ′ and the feed extension portion 122 ′ are parallel to a first axis X. The feed portion 121 ′ is electrically connected to the feed extension portion 122 ′ through the communication post 113 . The first ground layer 140 is disposed on the third surface 131 and is fed to the portion 121. The second ground layer 150 is disposed on the third surface 131 and is fed into the extension portion 122. The first ground layer 140 and the second ground layer 150 have a gap 101 therebetween. A common grounding member 160' is disposed on the fourth surface 132. The common grounding member 160' has a first hollow portion 161', a second hollow portion 162', and a partition portion 163'. The partition portion 163' is interposed between the first hollow portion 161' and the second hollow portion 162'. The first hollow portion 161 ′ corresponds to the first ground layer 140 ′ the second hollow portion 162 ′ corresponds to the second ground layer 150 , wherein the common ground element 160 ′ and the first ground layer 140 and the second connection The formation 150 is electrically conductive.
在第三實施例中,一間隔材料102設於該第二表面112與該第三表面132之間,以電性分隔該饋入延伸部以及該第二接地層。該間隔材料102可以為一黏著層。In the third embodiment, a spacer material 102 is disposed between the second surface 112 and the third surface 132 to electrically separate the feed extension and the second ground layer. The spacer material 102 can be an adhesive layer.
第三實施例的特點在於,透過將饋入延伸部122’移至該第二表面112,可縮短饋入延伸部122’與第二接地層150之間的間隔距離,因而可縮減饋入延伸部122’的寬度。在此實施例中,該饋入部的寬度大致等於該饋入延伸部的寬度。The third embodiment is characterized in that by moving the feed extension portion 122' to the second surface 112, the distance between the feed extension portion 122' and the second ground layer 150 can be shortened, thereby reducing the feed extension. The width of the portion 122'. In this embodiment, the width of the feed portion is substantially equal to the width of the feed extension.
雖然本發明已以具體之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此項技藝者,在不脫離本發明之精神和範圍內,仍可作些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
1...平衡-非平衡轉換器1. . . Balanced-unbalanced converter
10...饋入導體10. . . Feed conductor
21...第一接地元件twenty one. . . First grounding element
22...第二接地元件twenty two. . . Second grounding element
23...第一輸出埠twenty three. . . First output埠
24...第二輸出埠twenty four. . . Second output埠
30...共用接地元件30. . . Common grounding element
100、100’、100’’...平衡-非平衡轉換器100, 100', 100''. . . Balanced-unbalanced converter
101...間隙101. . . gap
110...第一基板110. . . First substrate
111...第一表面111. . . First surface
112...第二表面112. . . Second surface
113...連通柱113. . . Connecting column
120、120’...饋入導體120, 120’. . . Feed conductor
121、121’...饋入部121, 121’. . . Feeding department
122、122’...饋入延伸部122, 122’. . . Feeding extension
130...第二基板130. . . Second substrate
131...第三表面131. . . Third surface
132...第四表面132. . . Fourth surface
133...第一連通柱133. . . First connecting column
134...第二連通柱134. . . Second connecting column
140...第一接地層140. . . First ground plane
141...第一輸出埠141. . . First output埠
150...第二接地層150. . . Second ground plane
151...第二輸出埠151. . . Second output埠
160、160’...共用接地元件160, 160’. . . Common grounding element
161...第一共用接地部161. . . First common grounding
162...第二共用接地部162. . . Second common grounding
161’...第一鏤空部161’. . . First hollow
162’...第二鏤空部162’. . . Second hollow
163’...分隔部163’. . . Separator
第1a圖係顯示習知之平衡-非平衡轉換器;Figure 1a shows a conventional balanced-unbalanced converter;
第1b圖係顯示習知之平衡-非平衡轉換器的截面圖;Figure 1b shows a cross-sectional view of a conventional balanced-unbalanced converter;
第2圖係顯示本發明第一實施例之平衡-非平衡轉換器;Figure 2 is a diagram showing a balun of a first embodiment of the present invention;
第3圖係顯示本發明第二實施例之平衡-非平衡轉換器;以及Figure 3 is a diagram showing a balun of a second embodiment of the present invention;
第4圖係顯示本發明第三實施例之平衡-非平衡轉換器。Fig. 4 is a view showing a balun of a third embodiment of the present invention.
100...平衡-非平衡轉換器100. . . Balanced-unbalanced converter
101...間隙101. . . gap
110...第一基板110. . . First substrate
111...第一表面111. . . First surface
112...第二表面112. . . Second surface
120...饋入導體120. . . Feed conductor
121...饋入部121. . . Feeding department
122...饋入延伸部122. . . Feeding extension
130...第二基板130. . . Second substrate
131...第三表面131. . . Third surface
132...第四表面132. . . Fourth surface
133...第一連通柱133. . . First connecting column
134...第二連通柱134. . . Second connecting column
140...第一接地層140. . . First ground plane
141...第一輸出埠141. . . First output埠
150...第二接地層150. . . Second ground plane
151...第二輸出埠151. . . Second output埠
160...共用接地層160. . . Common ground plane
161...第一共用接地部161. . . First common grounding
162...第二共用接地部162. . . Second common grounding
Claims (16)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098122516A TWI413296B (en) | 2009-07-03 | 2009-07-03 | Balun |
US12/696,969 US8207797B2 (en) | 2009-07-03 | 2010-01-29 | Balun |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW098122516A TWI413296B (en) | 2009-07-03 | 2009-07-03 | Balun |
Publications (2)
Publication Number | Publication Date |
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TW201103186A TW201103186A (en) | 2011-01-16 |
TWI413296B true TWI413296B (en) | 2013-10-21 |
Family
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Application Number | Title | Priority Date | Filing Date |
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TW098122516A TWI413296B (en) | 2009-07-03 | 2009-07-03 | Balun |
Country Status (2)
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US (1) | US8207797B2 (en) |
TW (1) | TWI413296B (en) |
Cited By (1)
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TWI562450B (en) * | 2015-01-26 | 2016-12-11 | Trans Electric Co Ltd |
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EP2629106B8 (en) * | 2012-02-20 | 2018-10-17 | Rohde & Schwarz GmbH & Co. KG | Measurement bridge in a printed circuit board |
US9949361B1 (en) * | 2015-05-08 | 2018-04-17 | Scientific Components Corporation | Geometrically inverted ultra wide band microstrip balun |
CN106487353B (en) | 2015-08-28 | 2021-09-28 | 香港城市大学深圳研究院 | Device, method and system for converting single-end signal into differential signal |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM280042U (en) * | 2005-07-11 | 2005-11-01 | Walsin Technology Corp | Micro multi-layer balun having matching circuitry |
US7471167B2 (en) * | 2006-02-17 | 2008-12-30 | Samsung Electronics Co., Ltd. | Balun |
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US5025232A (en) * | 1989-10-31 | 1991-06-18 | Texas Instruments Incorporated | Monolithic multilayer planar transmission line |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM280042U (en) * | 2005-07-11 | 2005-11-01 | Walsin Technology Corp | Micro multi-layer balun having matching circuitry |
US7471167B2 (en) * | 2006-02-17 | 2008-12-30 | Samsung Electronics Co., Ltd. | Balun |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI562450B (en) * | 2015-01-26 | 2016-12-11 | Trans Electric Co Ltd |
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US20110001574A1 (en) | 2011-01-06 |
US8207797B2 (en) | 2012-06-26 |
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