TWI411505B - Cutting tool for cutting conductive film - Google Patents

Abstract

A cutting tool is used for cutting a conductive film having a release film and an adhesive layer. The Cutting tool includes a stop block disposed on one side of the release film of the conductive film and a cutter disposed on one side of the adhesive layer of the conductive film. The stop block has a receiving portion and at least one prevention portion. The receiving portion has a first width that is more than or even with a width of the conductive film. The prevention portion has a height that is less than a thickness of the conductive film. The cutter has at least one edge having a second width that is more than the first width of the receiving portion. When the cutter cutting the adhesive layer of the conductive film, the release film of the conductive film is received into the receiving portion, and the prevention portion can prevent the cutter from continuing to go into the receiving portion thereby controlling the cutting dimension and preventing the release film from being cut off.

Description

Conductive film cutting tool

The present invention relates to a cutting tool, and more particularly to a cutting tool for a conductive film.

In the configuration of the conventional liquid crystal display, the liquid crystal panel and the flexible circuit board are usually thermocompression bonded by an anisotropic conductive film (ACF) to form an electrically connected conductive path. For example, in a chip on glass (COG) process, a collective circuit (IC) is directly encapsulated on a glass by an anisotropic conductive paste to realize a conductive bump of the collective circuit and a conductive pad on the glass. Even packaged together. Similarly, in the process of chip on film (COF) on a flexible substrate, the collective circuit wafer is also directly packaged on the flexible printed board to achieve high bulk density, light weight, volume reduction, and free bending. The purpose of the installation.

The existing anisotropic conductive film comprises a conductive adhesive layer and a release film. The conductive adhesive layer contains a plurality of conductive particles. The release film comprises a substrate layer, an oil layer and a coating layer, wherein the material of the substrate layer is paper; the oil layer is bonded to one side of the substrate layer; the coating layer is bonded to the other side of the substrate layer, and The tear-off is bonded to the conductive adhesive layer. In actual production, the anisotropic conductive film is usually cut according to the length of the conductive layer required, and due to the need of continuous production, when the anisotropic conductive film is cut, the actual cut should be anisotropic. The conductive adhesive layer of the conductive film can not be cut off. However, due to the unreasonable design of the conventional cutting tools, the release film is often cut together during the cutting process, so that continuous production operations are interrupted; conductive adhesive layers may also occur in the existing cutting process. It can not be completely cut off, so that the conductive adhesive layer adheres continuously during the automatic peeling, which affects the normal attachment.

Referring to the schematic view of the conventional cutting tool 9 shown in the first figure, the positional relationship between the cutting tool 9 and the conductive film 100 to be cut is shown; the conventional cutting tool 9 shown in FIG. Schematic diagram of the positional relationship of the conductive film 100, wherein the cutting tool 9 has not been cut into the conductive film 100; the positional relationship between the conventional cutting tool 9 and the side of the conductive film 100 to be cut shown in FIG. 9 is not cut into the conductive adhesive film 100; the schematic view of the positional relationship of the conventional cutting tool 9 shown in FIG. C in the normal cutting of the conductive adhesive film 100, wherein the adhesive layer 104 of the conductive adhesive film 100 is completely cut by the cutting tool 9 FIG. 2 is a schematic view showing the positional relationship of the conventional cutting tool 9 shown in the second D diagram when the conductive film 100 is unreasonably cut, wherein the release film 102 and the adhesive layer 104 of the conductive film 100 are completely cut by the cutting tool 9. Broken.

Please refer to the first, second, second, second, second, and second D diagrams. The conventional cutting tool 9 includes: a stopper 90 and all the blades 92. The stopper 90 is disposed on one side of the release film 102 of the conductive adhesive film 100, and the cutter 92 is disposed on one side of the adhesive layer 104 of the conductive adhesive film 100. After the conductive adhesive film 100 is transported in the lateral direction X for a desired length, the cutter 92 is moved upward in the longitudinal direction Y to cut the adhesive layer 104 of the conductive adhesive film 100, and the release film 102 of the conductive adhesive film 100 is pressed against the stopper. The bottom surface 902 of 90. Since the cutter 92 adjusts its cutting force and the depth of cut by the cylinder flow rate, the cylinder flow rate is difficult to be accurately controlled and cannot be quantified, so that the cutting force and the depth of the cutter 92 are difficult to be accurately controlled. If the cutter 92 is cut too far, the release film 102 is cut together (as in the second D diagram); and if the cutter 92 is cut too shallow, the conductive paste layer 104 cannot be completely cut. In the module process of the liquid crystal display, the poor adhesion of the conductive adhesive layer 104 is the main defect of the module segment, and the main cause of poor adhesion is poor cutting. It can be seen that the cutting quality of the conductive film 100 is one of the important factors affecting the quality of the product.

Therefore, it is necessary to provide a new cutting tool to solve the drawbacks of the above prior art.

The main object of the present invention is to provide a cutting tool for a conductive adhesive film, which can control the cutting depth of the cutting blade when cutting the adhesive layer of the conductive adhesive film, thereby protecting the release film and preventing the release film from being completely cut by the cutter.

According to the above object of the present invention, the present invention provides a cutting tool for a conductive film, the conductive film having a release film and a glue layer, the glue layer being adhered to the release film. The cutting tool of the conductive film includes: a stopper and all the knives. The stopper is disposed on one side of the release film of the conductive adhesive film, and the receiving block is provided with a receiving portion and at least one blocking portion. The accommodating portion extends along the length direction of the conductive adhesive film and has a first width, the first width is greater than or equal to the width of the conductive adhesive film, and the accommodating portion is used for partially accommodating or completely accommodating the conductive adhesive film. The film is used to pass through the conductive film. The blocking portion forms a height with respect to the accommodating portion, and the height is smaller than the thickness of the conductive adhesive film. The cutter is disposed on one side of the adhesive layer of the conductive adhesive film, and the cutter has at least one cutting edge, and the cutting edge extends along the width direction of the conductive adhesive film to form a second width, and the second width is greater than the first portion of the receiving portion a width.

According to one embodiment of the invention, the cutter is perpendicular to the stop.

According to an embodiment of the invention, the accommodating portion is formed on the stopper by milling.

According to an embodiment of the invention, the height of the blocking portion relative to the receiving portion is less than or equal to the thickness of the release film of the conductive adhesive film, and the height of the blocking portion relative to the receiving portion is greater than the thickness of the release film. One of the points.

According to an embodiment of the present invention, the blocking portion is located on both sides in the width direction of the accommodating portion, and in the embodiment, the blocking portion is located on one side in the width direction of the accommodating portion.

Compared with the prior art of the present invention, the cutting tool of the conductive film of the present invention has a stopper and all the blades, and the receiving block is provided with a receiving portion and at least one blocking portion, and when the cutting blade cuts the conductive film In the adhesive layer, the release film can be accommodated in the accommodating portion, and the cutting depth of the cutter is controlled by the blocking portion, thereby protecting the release film and preventing the release film from being completely cut by the cutter, thereby enabling the adhesive layer to be It is peeled off normally, and the production process can be carried out continuously.

In order to make the above-mentioned contents of the present invention more comprehensible, the preferred embodiments are described below, and the detailed description is as follows:

The following description of the various embodiments is provided to illustrate the specific embodiments of the invention. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "side", etc., are merely directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and understanding of the invention. In the following embodiments, the same portions are denoted by the same reference numerals in the different drawings.

Please refer to the perspective view of the cutting tool 1 of one embodiment of the present invention shown in the third figure, wherein the positional relationship between the cutting tool 1 and the conductive film 100 to be cut is shown; Schematic diagram of the positional relationship between the cutting tool 1 and the conductive film 100 to be cut in an embodiment, wherein the cutting tool 1 has not been cut into the conductive film 100; and the conductive film of one embodiment of the present invention shown in FIG. A schematic diagram showing the positional relationship between the cutting tool 1 of 100 and the side of the conductive adhesive film 100 to be cut, wherein the adhesive layer 104 of the conductive adhesive film 100 is completely cut by the cutting tool 1. In one embodiment, the cutting tool 1 of the conductive adhesive film 100 of the present invention is used to cut the conductive adhesive film 100 (for example, an anisotropic conductive adhesive). The conductive adhesive film 100 has a release film 102 and a glue layer 104. The layer 104 is adhered to the release film 102.

Referring to FIG. 3, FIG. 4A and FIG. 4B, in one embodiment, the cutting tool 1 of the conductive adhesive film 100 of the present invention comprises: a stopper 10 and all the knives 20. The stopper 10 is disposed on one side of the release film 102 of the conductive adhesive film 100. On the stopper 10, a receiving portion 12 and two blocking portions 14, 16 are disposed. The accommodating portion 12 extends along the length direction of the conductive adhesive film 100 and has a first width W1. The first width W1 is greater than or equal to the width W0 of the conductive adhesive film 100. The accommodating portion is used to partially accommodate or completely The release film 102 of the conductive paste film 100 is accommodated and passed through the conductive paste film 100. The two blocking portions 14 and 16 are respectively located at two sides in the width direction of the accommodating portion 12, and the two blocking portions 14 and 16 form a height H1 with respect to the accommodating portion 12, and the two blocking portions 14 and 16 are equal in height. The height H1 of the barrier portions 14, 16 is smaller than the thickness H0 of the conductive paste film 100. The cutter 20 is disposed on one side of the adhesive layer 104 of the conductive adhesive film 100. The cutter 20 has a cutting edge 22 extending along the width direction of the conductive adhesive film 100 to form a second width W2, the second width. The W2 is larger than the first width W1 of the accommodating portion 12. In the actual cutting, the conductive adhesive film 100 is transported in the lateral direction X to the required length to meet the needs of the attaching process; and the cutter 20 is moved upward in the longitudinal direction Y to cut the adhesive layer 104 of the conductive adhesive film 100, and is electrically conductive. The release film 102 of the film 100 is pressed against the bottom surface 120 of the accommodating portion 12. In one embodiment, the stopper 10 is a movable member, and the cutter 20 is a movable member; and in other embodiments, both the stopper 10 and the cutter 20 may be provided as a movable member.

In one embodiment, the cutting tool 1 of the present invention is used to cut an anisotropic conductive tape.

In one embodiment, the cutter 20 is perpendicular to the stop 10 as shown in FIG.

In one embodiment, the receiving portion 12 is formed on the stopper 10 by milling. Structurally, the receiving portion 12 is a groove structure formed on the stopper 10.

In one embodiment, the height H1 of the two blocking portions 14 and 16 relative to the receiving portion 12 is less than or equal to the thickness H2 of the release film 102 of the conductive adhesive film 100. When the height H1 of the blocking portions 14 and 16 with respect to the accommodating portion 12 is smaller than the thickness H2 of the release film 102, the release film 102 is cut in a small portion in the thickness direction of the release film 102 (for example, the fourth B). The figure shows, but is not completely cut off, at which point the release film 102 can still function as a conveyor belt without affecting the continuity of the production operation. When the height H1 of the blocking portions 14, 16 with respect to the accommodating portion 12 is equal to the thickness H2 of the release film 102, the adhesive layer 104 is completely cut, and the release film 102 is not cut to the minute.

In one embodiment, the height H1 of the blocking portions 14 and 16 relative to the receiving portion 12 is greater than one-half of the thickness H2 of the release film 102, thereby ensuring that the structural strength of the release film 102 is not damaged. And able to perform the functions of its conveyor belt.

Referring to the third embodiment of the cutting tool 1 ′ according to another embodiment of the present invention, the blocking portion 14 ′ on the stopper 10 ′ is located on one side of the width direction of the accommodating portion 12 ′. The blocking of a barrier portion 14' can also provide an effect of preventing the cutter 20' from being excessively deep, thereby controlling the depth at which the conductive adhesive film 100 is cut.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the present invention has been disclosed in the above preferred embodiments. However, it is not intended to limit the invention, and any one of ordinary skill in the art can make a few changes without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

1, 1', 9‧‧‧ cutting tools

10, 10', 90‧‧ ‧ blocks

12, 12’‧‧‧ 容 部

120, 902‧‧‧ bottom

14, 16, 14' ‧ ‧ blocking

20, 20’, 92‧ ‧ cutting

22‧‧‧ Blade

100‧‧‧conductive film

102‧‧‧ release film

104‧‧‧ glue layer

W1‧‧‧ first width

W2‧‧‧ second width

W0‧‧‧Width of conductive film

H0‧‧‧Thickness of conductive film

H1‧‧‧ height of the barrier

H2‧‧‧The thickness of the release film

The first figure is a schematic view of a three-dimensional structure of a conventional cutting tool, in which the positional relationship between the cutting tool and the conductive film to be cut is shown.

The second A is a schematic diagram showing the relationship between the conventional cutting tool and the front surface of the conductive film to be cut, wherein the cutting tool has not been cut into the conductive film.

The second B is a schematic diagram showing the positional relationship between the conventional cutting tool and the conductive film to be cut, wherein the cutting tool has not been cut into the conductive film.

The second C is a schematic diagram showing the positional relationship of the conventional cutting tool in the normal cutting of the conductive film, wherein the adhesive layer of the conductive film is completely cut by the cutting tool.

The second D is a schematic diagram of the positional relationship of the conventional cutting tool when the conductive film is unreasonably cut, wherein the release film and the adhesive layer of the conductive film are completely cut by the cutting tool.

The third figure is a schematic perspective view of a cutting tool of a conductive film according to an embodiment of the present invention, wherein the positional relationship between the cutting tool and the conductive film to be cut is shown.

The fourth A is a schematic diagram showing the relationship between the cutting tool of the conductive film of the embodiment and the front surface of the conductive film to be cut, wherein the cutting tool has not been cut into the conductive film.

FIG. 4B is a schematic view showing the positional relationship between the cutting tool of the conductive film and the side of the conductive film to be cut according to an embodiment of the present invention, wherein the glue layer of the conductive film is completely cut by the cutting tool.

The fifth figure is a schematic perspective view of a cutting tool of a conductive film according to another embodiment of the present invention, wherein the positional relationship between the cutting tool and the conductive film to be cut is shown.

1. . . Cutting tool

10. . . Stoppers

12. . . Housing

14,16. . . Blocking

20. . . Cutter

twenty two. . . Blade

100. . . Conductive film

102. . . Release film

104. . . Glue layer

W1. . . First width

W2. . . Second width

W0. . . Width of conductive film

H0. . . Thickness of conductive film

H1. . . Height of the barrier

Claims (5)

A cutting tool for a conductive film, the conductive film has a release film and a glue layer, the glue layer is adhered to the release film, and the cutting tool of the conductive film comprises: a stopper, a receiving portion is disposed on a side of the release film of the conductive adhesive film, and a receiving portion and at least one blocking portion are disposed on the stopper, the receiving portion extending along a length direction of the conductive adhesive film and having a a first width, the first width being greater than or equal to a width of the conductive film for partially accommodating or completely accommodating the release film of the conductive film and passing through the conductive film; the blocking portion is opposite to the The accommodating portion forms a height which is smaller than the thickness of the conductive adhesive film; and all the knives are disposed on one side of the adhesive layer of the conductive adhesive film, the cutting cutter is perpendicular to the stopper, the cutter And having at least one cutting edge extending along a width direction of the conductive adhesive film to form a second width, wherein the second width is greater than a first width of the receiving portion. The cutting tool for a conductive film according to claim 1, wherein the receiving portion is formed on the stopper by milling. The cutting tool of the conductive film of claim 1, wherein the height of the blocking portion relative to the receiving portion is less than or equal to the thickness of the release film of the conductive film. The cutting tool for a conductive film according to claim 3, wherein the height of the blocking portion relative to the receiving portion is greater than one-half of the thickness of the release film. The cutting tool for a conductive film according to claim 1, wherein the blocking portion is located on either side or one side of the width direction of the receiving portion.