TWI411144B - Package substrate - Google Patents

Abstract

The present invention relates to a package substrate. The package substrate is configured for packaging LED. The package substrate includes a substrate body, a rectifier circuit, and an electrically insulative layer. The substrate body includes a first surface having a metal circuit thereon. The first surface of the substrate body has a plurality of grooves thereon. The rectifier circuit includes a plurality of LEDs. The LEDs are arranged at the grooves, respectively. The LEDs electrically connect to each other via the metal circuit of the first surface to form a bridge circuit. The electrically insulative layer forms on the first surface of the substrate body. Two outputs of the bridge circuit extend through the electrically insulative layer, and electrically connect to the LED which needs to be packaged.

Description

Package substrate

The present invention relates to a package substrate, and more particularly to a package substrate having the function of a bridge rectifier circuit.

At present, Light Emitting Diode (LED) has been widely used in many fields due to its low power consumption, long life, small size and high brightness.

When the light emitting diode is packaged on the package substrate, the light emitting diode is generally directly packaged on the package substrate. If the AC power supply is used to directly supply the LED, a rectifier circuit is required on the package substrate, which results in a complicated LED package structure.

A package substrate having a bridge rectifier circuit function will be described below by way of example.

A package substrate for encapsulating a light emitting diode. The package substrate includes a substrate body, a rectifying device and an insulating layer. The substrate body has a first surface on which a metal wiring layer is formed, and a plurality of grooves are formed on the first surface. The rectifying device includes a plurality of diodes respectively disposed in the recesses of the substrate, and the plurality of diodes are electrically connected to form a bridge circuit through the metal circuit layer. The insulating layer is formed on the first surface of the substrate body, the bridge type The two outputs of the path pass through the insulating layer for electrical connection with the light emitting diode.

Compared with the prior art, a rectifying device is formed in the package substrate. Therefore, the LED is disposed on the package substrate, and the LED is directly electrically connected to the output end of the bridge circuit, so that the LED can be directly externally connected. The AC power supply does not need to re-set the rectifier circuit on the package substrate, so the package substrate has a simple structure.

100‧‧‧Package substrate

10‧‧‧Substrate body

11‧‧‧ first surface

12‧‧‧ second surface

13‧‧‧First conductive material

14‧‧‧Second conductive material

15‧‧‧First electrical connection point

16‧‧‧Second electrical connection point

17‧‧‧ Groove

18‧‧‧Metal circuit layer

115‧‧‧First through hole

116‧‧‧Second through hole

20‧‧‧Rectifier

21‧‧‧First Diode

22‧‧‧second diode

23‧‧‧ Third Dipole

24‧‧‧ fourth diode

FIG. 1 is a cross-sectional view of a package substrate according to an embodiment of the invention.

2 is a top plan view of the package substrate of FIG. 1.

3 is an equivalent circuit diagram of a circuit connection manner of a diode provided in the package substrate of FIG. 2.

The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 and FIG. 2, a first embodiment of the present invention provides a package substrate 100 for packaging a light emitting diode. The package substrate 100 includes a substrate body 10, a rectifying device 20, and an insulating layer 30.

In this embodiment, the substrate body 10 has a first surface 11 and a second surface 12 opposite thereto. The substrate body 10 has a first through hole 115 and a second through hole 116 extending through the first surface 11 and the second surface 12. The first through hole 115 and the second through hole 116 are used to fill the first conductive material 13 and the second conductive material 14, respectively. In the present embodiment, the second surface 12 of the substrate body 10 has a first electrical connection point 15 electrically connected to the first conductive material 13 and a second electrical connection point 16 electrically connected to the second conductive material 14. . The first electrical connection point 15 and the second electrical connection point 16 serve as external power A source access point that is used to electrically connect an external power source. The first surface 11 of the substrate body 10 has a plurality of grooves 17 extending toward the second surface 12. In this embodiment, the first surface has four recesses 17 extending toward the second surface 12, the four recesses 17 are arranged in a rectangular shape, and the first through holes 115 and the second through holes 116 are located in the Both ends of the rectangle. The substrate body 10 is generally sapphire, SiC, bismuth (Si), gallium arsenide (GaAs), lithium metaaluminate (LiAlO2), magnesium oxide (MgO), zinc oxide (ZnO), nitrogen. A single crystal substrate such as gallium (GaN), aluminum nitride (AlN), or indium nitride (InN).

In the present embodiment, the rectifying device 20 includes four diodes disposed in four recesses 17 on the first surface 11 of the substrate body 10, respectively. In the embodiment, the rectifying device 20 includes a first diode 21, a second diode 22, a third diode 23 and a fourth diode 24. In this embodiment, the plurality of diodes included in the rectifying device 20 are directly grown in the recess 17 of the substrate body 10 by doping.

In the embodiment, a metal wiring layer 18 is formed on the first surface 11 of the substrate body 10. The metal circuit layer 18 is used to electrically connect the plurality of diodes to each other to form a bridge circuit. Please refer to FIG. 3 together, which is an equivalent circuit diagram of the circuit connection mode in FIG. The first diode 21, the second diode 22, the third diode 23 and the fourth diode 24 are electrically connected to form a bridge circuit, and the four diodes are respectively used as a bridge circuit. A bridge arm.

The first diode 21 and the third diode 23 are opposite bridge arms, and the second diode 22 and the fourth diode 24 are opposite bridge arms. The junction of the anode of the first diode 21 and the cathode of the fourth diode 24 is defined as an electrical connection point A, the second diode The junction of the anode of 22 and the cathode of the third diode 23 is defined as electrical connection point B. The electrical connection point A and the electrical connection point B serve as external power supply access points of the bridge circuit for electrical connection with an external power source. In this embodiment, the external power source is an AC power source.

The junction of the cathode of the first diode 21 and the cathode of the second diode 22 is defined as an electrical connection point C, and the anode of the third diode 23 is connected to the anode of the fourth diode 24 For electrical connection point D. The electrical connection point C and the electrical connection point D serve as power supply output points of the package substrate 100. Specifically, the two electrodes of the light-emitting diode packaged on the package substrate 100 directly connect the electrical connection point C and the electrical connection point D, and supply power to the light-emitting diode through an external power source, thereby passing through the package substrate 100. It realizes direct AC power supply to the LED. The package substrate 100 has a simple structure, and can directly connect an external AC power source to AC-power the LEDs packaged thereon.

In an embodiment, the insulating layer 30 is formed on the first surface 11 of the substrate body 10. The insulating layer 30 may be made of an insulating material such as glass or tantalum. The electrical connection point C and the electrical connection point D are vapor-transmissively transmitted through the insulating layer 30, and an electrical connection point is formed on the surface of the insulating layer 30 away from the substrate body 10 for being packaged to the package substrate. The light-emitting diodes on 100 are electrically connected.

Obviously, many modifications and differences may be made to the invention in light of the above description. It is therefore to be understood that within the scope of the appended claims, the invention may be The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the claims of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the present invention should be included in the following claims. Within the scope.

100‧‧‧Package substrate

10‧‧‧Substrate body

11‧‧‧ first surface

12‧‧‧ second surface

13‧‧‧First conductive material

14‧‧‧Second conductive material

15‧‧‧First electrical connection point

16‧‧‧Second electrical connection point

17‧‧‧ Groove

18‧‧‧Metal circuit layer

115‧‧‧First through hole

116‧‧‧Second through hole

20‧‧‧Rectifier

Claims (5)

a package substrate for packaging a light emitting diode, the package substrate comprising: a substrate body, the substrate body having a first surface, a metal circuit layer formed on the first surface, and Forming a plurality of grooves on the first surface; a rectifying device, wherein the plurality of diodes are directly grown in the grooves of the substrate body by doping, a plurality of diodes are electrically connected to form a bridge circuit through the metal circuit layer; and an insulating layer is formed on the first surface of the substrate body, and the two output ends of the bridge circuit are worn The insulating layer is used for electrical connection with the light emitting diode to be packaged. The package substrate of claim 1, wherein the substrate body further comprises a second surface opposite to the first surface, the substrate body having a first surface and the first surface a first through hole and a second through hole of the two surfaces, wherein the two electrodes of the metal circuit layer are respectively guided to the second surface of the substrate body through the first through hole and the second through hole. The package substrate of claim 2, wherein the first through hole and the second through hole are respectively filled with a first conductive material and a second conductive material. The package substrate according to claim 1, wherein the insulating layer is glass or germanium. The package substrate of claim 1, wherein the two output ends of the bridge circuit pass through the insulating layer by evaporation.