TWI409410B - Optoelectronic device assembly - Google Patents

Optoelectronic device assembly Download PDF

Info

Publication number
TWI409410B
TWI409410B TW97143265A TW97143265A TWI409410B TW I409410 B TWI409410 B TW I409410B TW 97143265 A TW97143265 A TW 97143265A TW 97143265 A TW97143265 A TW 97143265A TW I409410 B TWI409410 B TW I409410B
Authority
TW
Taiwan
Prior art keywords
optical member
optoelectronic device
energy
light
energy receiver
Prior art date
Application number
TW97143265A
Other languages
Chinese (zh)
Other versions
TW201018851A (en
Inventor
Min Hsun Hsieh
Tsung Xian Lee
Original Assignee
Epistar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epistar Corp filed Critical Epistar Corp
Priority to TW97143265A priority Critical patent/TWI409410B/en
Publication of TW201018851A publication Critical patent/TW201018851A/en
Application granted granted Critical
Publication of TWI409410B publication Critical patent/TWI409410B/en

Links

Abstract

An embodiment of present invention discloses an optoelectronic device package including a first auxiliary energy receiver having a first energy inlet and a side wall for substantially directing energy far away from the first energy inlet; an optical element optically coupled to the first auxiliary energy receiver and having a recess facing the first energy inlet; and an optoelectronic device optically coupled to the optical element and receiving the energy from the first energy inlet.

Description

光電裝置組件Optoelectronic device assembly

本發明係關於一種能量收集系統,尤其關於一種太陽能收集系統以及與其相接合之光學透鏡The present invention relates to an energy harvesting system, and more particularly to a solar energy collection system and an optical lens coupled thereto

第1圖係顯示一傳統發光二極體(Light Emitting Diode;LED)封裝10,其包含一光學透鏡11、一封裝基座12、以及一LED晶粒13。LED封裝10具有一縱軸15,其係通過光學透鏡11之中心。LED晶粒13係設置於封裝基座12上。封裝基座12可以具有一杯狀物(未顯示),此杯狀物更可以具有一反射器(未顯示)以反射自LED晶粒13之底面與側面發射之光線,使其朝向觀測者。1 shows a conventional Light Emitting Diode (LED) package 10 including an optical lens 11, a package base 12, and an LED die 13. The LED package 10 has a longitudinal axis 15 that passes through the center of the optical lens 11. The LED die 13 is disposed on the package base 12. The package base 12 can have a cup (not shown) that can have a reflector (not shown) to reflect light emitted from the bottom and sides of the LED die 13 toward the viewer.

光學透鏡11係連接至LED晶粒13以接收並導引來自LED晶粒13之光線。光學透鏡11具有凹穴14以容置LED晶粒13。通過光學透鏡11之凹穴14之光線可於二個主要光徑上行進:第一光徑LP1係為光線自LED晶粒13行進至表面1102,經過全反射以相對於縱軸15呈接近90度之角度穿越側壁1101。第二光徑LP2係為光線以會在側壁1101上產生全反射或反射之角度自LED晶粒13射向側壁1101,並以大體上非垂直於縱軸15之角度離開光學透鏡11。第一光徑LP1係有利於製造一有效率之側面發光,然而第二光徑卻可能引起觀測者所不希望看到之光點。Optical lens 11 is coupled to LED die 13 to receive and direct light from LED die 13. The optical lens 11 has a recess 14 for receiving the LED die 13. The light passing through the pockets 14 of the optical lens 11 can travel over two major optical paths: the first optical path LP1 is the light traveling from the LED die 13 to the surface 1102, and is totally reflected to be approximately 90 with respect to the longitudinal axis 15. The angle of the angle passes through the side wall 1101. The second optical path LP2 is such that light rays are directed from the LED die 13 toward the sidewall 1101 at an angle that would cause total reflection or reflection on the sidewall 1101, and exit the optical lens 11 at an angle substantially non-perpendicular to the longitudinal axis 15. The first optical path LP1 is advantageous for producing an efficient side illumination, while the second optical path may cause a spot of light that the observer does not wish to see.

因此,對於LED封裝或發光裝置而言,為避免令觀測者不悅之光點產生,通常以連接一較薄之光學透鏡之方式以降低整體之尺寸。此外,亦希望LED封裝或發光裝置可以提供均勻色光。Therefore, for the LED package or the light-emitting device, in order to avoid the occurrence of the unpleasant light spot of the observer, the thinner optical lens is usually connected to reduce the overall size. In addition, it is also desirable for the LED package or illumination device to provide uniform color light.

依據本發明之一實施例,光電裝置組件包含一光學構件、一基部、以及一光電裝置。此光電裝置係設置於基座之一表面上。此光學構件係裝設至基座及/或光電裝置。此光學構件具有一喇叭狀展開部與一基部。此喇叭狀展開部係包含一上表面、一側表面、以及一下表面。此上表面形成此喇叭狀展開部之凹口,此側表面係與上表面連接並相對於一縱軸傾斜,此縱軸係大體上垂直於基部之一水平表面。此外,側表面係呈彎曲,且較佳地係為一凹面。下表面係與側表面及基部連接。光學構件可以輻射對稱於縱軸。In accordance with an embodiment of the invention, an optoelectronic device assembly includes an optical member, a base, and an optoelectronic device. The photovoltaic device is disposed on a surface of one of the bases. The optical component is mounted to the pedestal and/or optoelectronic device. The optical member has a flared portion and a base. The flared deployment includes an upper surface, a side surface, and a lower surface. The upper surface forms a recess of the flared portion that is coupled to the upper surface and is inclined relative to a longitudinal axis that is substantially perpendicular to a horizontal surface of the base. Further, the side surface is curved and is preferably a concave surface. The lower surface is joined to the side surface and the base. The optical member can be radially symmetric to the longitudinal axis.

依據本發明之另一實施例,光學構件係沿縱向延伸,較佳地,係左右對稱於一通過光學構件之縱面。再者,一透鏡係形成於上表面上。特別地,上表面係為一波紋狀表面。形成於上表面上之波紋之傳遞方向可以平行於此縱向。透鏡之半徑係約介於50μm~60μm。光電裝置較佳地係沿著波紋之傳遞方向設置。In accordance with another embodiment of the present invention, the optical member extends longitudinally, preferably bilaterally symmetrically to a longitudinal surface through the optical member. Furthermore, a lens system is formed on the upper surface. In particular, the upper surface is a corrugated surface. The direction of transmission of the corrugations formed on the upper surface may be parallel to this longitudinal direction. The radius of the lens is between about 50 μm and 60 μm. The optoelectronic device is preferably arranged along the direction of propagation of the corrugations.

依據本發明之另一實施例,光電裝置組件包含一第一輔助能量接收器,具有一第一能量進口及一側壁用以大體上導引能量遠離此第一能量進口;一光學構件,係光學耦合至此第一輔助能量接收器並具有一朝向此第一能量進口之凹口;以及一光電裝置,係光學耦合至此光學構件並接收來自於此第一能量進口之能量。According to another embodiment of the present invention, a photovoltaic device assembly includes a first auxiliary energy receiver having a first energy inlet and a sidewall for substantially guiding energy away from the first energy inlet; an optical component, optical Coupled to the first auxiliary energy receiver and having a recess toward the first energy inlet; and an optoelectronic device optically coupled to the optical member and receiving energy from the first energy inlet.

於本發明又一實施例中,光電裝置組件包含一第一輔助能量接收器,具有一第一級進口以及一具有一外邊界與一內邊界之第二級進口;及一光電裝置,係光學耦合至此第一輔助能量接收器;其中此外邊界對於可被此光電裝置接收之輻射能係大體上不可穿透,而此內邊界對於此輻射能係大體上可穿透。再者,此內邊界可藉由本發明各個實施例中所描述之光學構件被限定。In still another embodiment of the present invention, the optoelectronic device assembly includes a first auxiliary energy receiver having a first stage inlet and a second stage inlet having an outer boundary and an inner boundary; and an optoelectronic device Coupled to the first auxiliary energy receiver; wherein the boundary is substantially impermeable to radiant energy that can be received by the optoelectronic device, and the inner boundary is substantially transparent to the radiant energy system. Again, this inner boundary can be defined by the optical members described in the various embodiments of the invention.

於本發明另一實施中,光電裝置組件包含一光電裝置,係用於轉換輻射能為電能;一第一輔助能量接收器,包含一第一能量進口、一側壁、及一內表面;及一光學構件,用以將來自於此第一輔助能量接收器之輻射能大體上導引朝向此光電裝置。In another implementation of the present invention, a photovoltaic device assembly includes an optoelectronic device for converting radiant energy into electrical energy; a first auxiliary energy receiver including a first energy inlet, a sidewall, and an inner surface; An optical member for directing radiant energy from the first auxiliary energy receiver toward the optoelectronic device.

甚者,一第二輔助能量接收器可選擇性地結合或光學耦合至此第一輔助能量接收器。較佳地,此第二輔助能量接收器係可擴展,更佳地,係可以自此第一輔助能量接收器分離。Furthermore, a second auxiliary energy receiver can be selectively coupled or optically coupled to the first auxiliary energy receiver. Preferably, the second auxiliary energy receiver is expandable, and more preferably, it can be separated from the first auxiliary energy receiver.

於本發明之再一實施例中,一電子裝置包含一主要單元;一顯示單元,係與此主要單元相結合;一匣體單元,係可裝入且移出自此主要單元;及一如前述實施例之光電裝置組件,係與此匣體單元相結合。In still another embodiment of the present invention, an electronic device includes a main unit; a display unit is coupled to the main unit; a unit is loaded and removed from the main unit; and The optoelectronic device assembly of the embodiment is combined with the body unit.

第2A圖係例示依據本發明一實施例之光電裝置組件20。光電裝置組件20包含光學構件21、基座22、及縱軸24。光學構件21,例如一透鏡,係連接至基座22以導引進入其中之光線。縱軸24可以通過或不通過光學構件21之中心。較佳地,縱軸24係大體上垂直於基座22之一水平表面。Figure 2A illustrates a photovoltaic device assembly 20 in accordance with an embodiment of the present invention. Optoelectronic device assembly 20 includes an optical member 21, a base 22, and a longitudinal axis 24. An optical member 21, such as a lens, is coupled to the base 22 to direct light entering it. The longitudinal axis 24 may or may not pass through the center of the optical member 21. Preferably, the longitudinal axis 24 is substantially perpendicular to a horizontal surface of the base 22.

第2B圖係顯示第2A圖之光電裝置組件20之剖面圖。光電裝置23係設置於基座22之一表面上。光電裝置23包含但不限於LED晶粒、白熾燈、螢光燈、冷陰極燈管(Cold Cathode Fluorescent Lamp;CCFL)、太陽能電池、以及其他可以發射或接收光線且可以連接至光學構件21之裝置。Figure 2B is a cross-sectional view showing the optoelectronic device assembly 20 of Figure 2A. The photovoltaic device 23 is disposed on one surface of the susceptor 22. The optoelectronic device 23 includes, but is not limited to, an LED die, an incandescent lamp, a fluorescent lamp, a Cold Cathode Fluorescent Lamp (CCFL), a solar cell, and other devices that can emit or receive light and can be coupled to the optical member 21. .

光學構件21可以為一個獨立的零件並藉由各種方式連接至基座22,該些方式包含但不限於螺絲固定、扣接、摩擦配合、接著劑接合、熱接合、以及超音波接合。另一方面,光學構件21可以藉由許多方式形成於基座22及/或光電裝置23之上,該些方式包含但不限於射出成形以及鑄造。The optical member 21 can be a separate component and coupled to the base 22 by a variety of means including, but not limited to, screwing, snapping, friction fit, adhesive bonding, thermal bonding, and ultrasonic bonding. Alternatively, optical member 21 can be formed on susceptor 22 and/or optoelectronic device 23 in a number of ways including, but not limited to, injection molding and casting.

光學構件21係由透光材料所構成。透光材料可以為一透明材料或一非透明材料,且光電裝置23所發出或可吸收之光可以完全或部份通過此透明材料或此非透明材料。透光材料包含但不限於丙烯酸樹脂(Acrylic Resin)、環烯烴聚合物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、聚碳酸酯/聚甲基丙烯酸甲酯(PC/PMMA)、聚醚醯亞胺(Polyetherimide)、氟碳聚合物(Fluorocarbon Polymer)、及矽膠(Silicone)。透光材料可以被賦予顏色,使光學構件21之功能如同一濾光器而產生所需之色光。The optical member 21 is composed of a light transmissive material. The light transmissive material may be a transparent material or a non-transparent material, and the light emitted or absorbed by the optoelectronic device 23 may pass through the transparent material or the non-transparent material completely or partially. Light transmissive materials include, but are not limited to, acrylic resin (Acrylic Resin), cycloolefin polymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), polycarbonate / polymethyl methacrylate ( PC/PMMA), Polyetherimide, Fluorocarbon Polymer, and Silicone. The light transmissive material can be imparted with a color such that the optical member 21 functions as the same filter to produce the desired color light.

若光電裝置組件20係設置於環境中充滿折射係數為1之空氣中,為了產生所需之光場,光學構件21之折射係數需介於1.4~1.8。依光電裝置組件20所處或使用之環境之不同,光學構件21之折射係數亦可為上述範圍以外之值。較佳地,光學構件21與其所處之環境之折射係數之差值係介於0.45~0.5。If the optoelectronic device assembly 20 is placed in an environment filled with air having a refractive index of 1, the refractive index of the optical member 21 needs to be between 1.4 and 1.8 in order to produce the desired light field. Depending on the environment in which the optoelectronic device assembly 20 is located or used, the refractive index of the optical member 21 may also be outside the above range. Preferably, the difference between the refractive index of the optical member 21 and the environment in which it is located is between 0.45 and 0.5.

如第2B圖所示,光學構件21包含一喇叭狀展開部與一基部2106。喇叭狀展開部包含上表面2101,其係於透光材料上形成一凹口2105、連接至上表面2101之側表面2102、以及連接至側表面2102之下表面2103。基部2106係用以接收來自光電裝置23之光線,並可以具有一凹穴2107以容置光電裝置23。光學構件21係用以導引來自於光電裝置23之大部分光線使其以大體上垂直於縱軸24之方向或非直接指向觀測者之方向離開光學構件21。再者,為避免於光學構件21上方形成暗點,來自於光電裝置23之小部分光線可以被導引至大體上平行於縱軸24之方向或指向觀測者之方向。As shown in FIG. 2B, the optical member 21 includes a flared portion and a base portion 2106. The flared flared portion includes an upper surface 2101 that is formed on the light transmissive material to form a recess 2105, a side surface 2102 that is coupled to the upper surface 2101, and a lower surface 2103 that is coupled to the side surface 2102. The base 2106 is for receiving light from the optoelectronic device 23 and may have a recess 2107 for receiving the optoelectronic device 23. The optical member 21 is used to direct most of the light from the optoelectronic device 23 away from the optical member 21 in a direction generally perpendicular to the longitudinal axis 24 or in a direction that is not directly directed toward the observer. Moreover, to avoid the formation of dark spots above the optical member 21, a small portion of the light from the optoelectronic device 23 can be directed to a direction generally parallel to the longitudinal axis 24 or toward the observer.

凹口2105係用以形成上表面2101。較佳地,凹口2105具有一尖點,其係位於上表面2101下沉處,並指向光電裝置23。縱軸24可以通過或不通過尖點。凹口2105上可以形成反射材料或反射結構以反射行進至上表面2101之光線。反射材料或反射結構包含但不限於Ag、Al、Cu、Au、Cr、反射塗料、以及分散式布拉格反射層(Distributed Bragg Reflector;DBR)。凹口2105上可以形成一抗紫外光材料以保護裝置中之零件,特別係對紫外光敏感之零件,防止其因紫外光照射而劣化。The recess 2105 is used to form the upper surface 2101. Preferably, the recess 2105 has a sharp point that lies at the sinking of the upper surface 2101 and is directed toward the optoelectronic device 23. The longitudinal axis 24 may or may not pass through a sharp point. A reflective material or reflective structure may be formed on the recess 2105 to reflect light traveling to the upper surface 2101. The reflective material or reflective structure includes, but is not limited to, Ag, Al, Cu, Au, Cr, a reflective coating, and a Distributed Bragg Reflector (DBR). An anti-ultraviolet material can be formed on the recess 2105 to protect the parts of the device, particularly those sensitive to ultraviolet light, from being deteriorated by ultraviolet light.

上表面2101係設計為一全反射(Total Internal Reflection;TIR)表面,用以反射自基部2106進入之光線,並防止其由凹口2105離開,即使如此,仍可能有部分以特定入射角入射之光線穿過上表面2101,此特定入射角係隨著光電裝置組件20之整體設計而變。上表面2101可以為一平面或一具有固定半徑或二個以上半徑之曲面。特別地,此曲面可以具有一可變半徑,其係隨著上表面2101之彎曲路徑而變。較佳地,遠離凹口2105之尖點之半徑係大於靠近尖點之半徑。The upper surface 2101 is designed as a Total Internal Reflection (TIR) surface for reflecting light entering from the base 2106 and preventing it from exiting by the recess 2105. Even so, there may be portions incident at a particular angle of incidence. Light passes through the upper surface 2101, which varies with the overall design of the optoelectronic device assembly 20. The upper surface 2101 can be a plane or a curved surface having a fixed radius or more than two radii. In particular, the curved surface can have a variable radius that varies with the curved path of the upper surface 2101. Preferably, the radius of the sharp point away from the recess 2105 is greater than the radius near the sharp point.

側表面2102係連接至上表面2101,並相對於縱軸24傾斜,用以導引光線至光學構件21之側向,較佳地,用以導引光線至大約垂直於縱軸24之方向。若側表面2102之法線向量與縱軸24之夾角約為90度,則有相當高比例穿過側表面2102之光線將朝下方行進。然而,若側表面2102係相對於縱軸24傾斜一定角度,較佳地,側表面2102係面朝上,如第2B圖所示,則朝下方行進之光線將減少。側表面2102可以為一平面、一粗糙表面、或一曲面。曲面可以為凹面、凸面、或兩者之組合。凹側表面可以分散穿過此表面之光線,而凸側表面將聚集穿過此表面之光線。粗糙表面則可以散射光線。The side surface 2102 is coupled to the upper surface 2101 and is inclined relative to the longitudinal axis 24 for directing light to the lateral direction of the optical member 21, preferably for directing light to a direction approximately perpendicular to the longitudinal axis 24. If the normal vector of the side surface 2102 is at an angle of about 90 degrees to the longitudinal axis 24, then a relatively high proportion of light passing through the side surface 2102 will travel downward. However, if the side surface 2102 is inclined at an angle relative to the longitudinal axis 24, preferably, the side surface 2102 is facing upward, as shown in Figure 2B, the light traveling downward will be reduced. The side surface 2102 can be a flat surface, a rough surface, or a curved surface. The surface can be concave, convex, or a combination of both. The concave side surface can disperse light rays passing through the surface, and the convex side surface will collect light rays passing through the surface. Rough surfaces can scatter light.

下表面2103係連接至側表面2102以及基部2106。上表面2101、側表面2102、以及下表面2103於基部2106上方形成喇叭狀展開部。The lower surface 2103 is coupled to the side surface 2102 and the base 2106. The upper surface 2101, the side surface 2102, and the lower surface 2103 form a flared flared portion above the base 2106.

下表面2103與基部2106間可以形成一凹面2104。來自光電裝置23之光若射向凹面2104可能被反射而朝向凹口2105之區域,因此可以增加經由凹口2105射出之出光量。若此,觀測者將不容易觀察到發生於光電裝置組件20之光學構件21之凹口2105上方之暗點。A concave surface 2104 can be formed between the lower surface 2103 and the base 2106. The light from the photovoltaic device 23 may be reflected toward the concave surface 2104 toward the region of the recess 2105, so that the amount of light emitted through the recess 2105 can be increased. If so, the observer will not easily observe dark spots that occur above the recess 2105 of the optical member 21 of the optoelectronic device assembly 20.

基部2106內可以形成一凹穴2107以容置光電裝置23。凹穴2107之形狀較佳地係形成為圓錐形或角錐形。圓錐或角錐之尖點可以指向凹口2105之尖點。基部2106之台面2108可以為水平面、曲面、或斜面。光線通過傾斜一定角度之斜面可能被折射而朝大體上垂直於縱軸24之方向前進。A recess 2107 can be formed in the base 2106 to accommodate the optoelectronic device 23. The shape of the pocket 2107 is preferably formed into a conical or pyramidal shape. The sharp point of the cone or pyramid can point to the sharp point of the recess 2105. The deck 2108 of the base 2106 can be a horizontal, curved, or beveled surface. The light rays may be refracted by tilting at an angle to advance substantially perpendicular to the longitudinal axis 24.

第2C圖係顯示依據本發明一較佳實施例之光學構件21之剖面圖。為使畫面清晰,第2C圖中部分輪廓線與標號將省略。如第2C圖所示,光學構件21係假設輻射對稱於縱軸24,且較佳地,其直徑D約為105mm,高度H約為14mm。凹口2105尖點之角度可以於A1與A2間變化,其中A1是30度而A2是180度,較佳地,A1是50度而A2是145度。側表面2102與縱軸24間之夾角A3可以於5度~20度間變化。凹穴2107尖點之角度A4可以於180度內變化,較佳地,係介於90度~140度。台面2108之斜度A5可以於60度內變化,較佳地,係於10度內變化。側表面2102之半徑R1可以於20mm內變化,較佳地,於10mm內變化。凹面2104之半徑R2可以於10mm內變化。上述之尺寸可以隨著光學構件21之比例與具體的設計而調整。Figure 2C is a cross-sectional view showing the optical member 21 in accordance with a preferred embodiment of the present invention. In order to make the picture clear, some outlines and labels in Fig. 2C will be omitted. As shown in Fig. 2C, the optical member 21 is assumed to be symmetrical to the longitudinal axis 24, and preferably has a diameter D of about 105 mm and a height H of about 14 mm. The angle of the cusp of the notch 2105 can vary between A1 and A2, where A1 is 30 degrees and A2 is 180 degrees, preferably A1 is 50 degrees and A2 is 145 degrees. The angle A3 between the side surface 2102 and the longitudinal axis 24 can vary between 5 and 20 degrees. The angle A4 of the cusp of the pocket 2107 can vary within 180 degrees, preferably between 90 and 140 degrees. The slope A5 of the table top 2108 can vary within 60 degrees, preferably within 10 degrees. The radius R1 of the side surface 2102 can vary within 20 mm, preferably within 10 mm. The radius R2 of the concave surface 2104 can vary within 10 mm. The above dimensions may be adjusted in accordance with the ratio of the optical member 21 and the specific design.

第2D圖顯示來自基部內之發射點P並穿過光學構件21之光線之光跡圖。光跡L1係自發射點P射向上表面2101,並因一或多次全反射而改變方向達到下表面2103或離開光學構件21,最後於彎曲之側表面2102處被折射而水平地離開光學構件21。光跡L2係自發射點P射出,於凹面2104與上表面2101經過兩次全反射後,再於彎曲之側表面2102處被折射而水平地離開光學構件21。光跡L3係自發射點P射向台面2108之斜面並經折射後水平地離開光學構件21。Fig. 2D shows a light trace of light from the emission point P in the base and passing through the optical member 21. The light trace L1 is emitted from the emission point P to the upper surface 2101, and changes direction to the lower surface 2103 or leaves the optical member 21 due to one or more total reflections, and is finally refracted at the curved side surface 2102 to horizontally exit the optical member. twenty one. The light trace L2 is emitted from the emission point P, and after being totally totally reflected by the concave surface 2104 and the upper surface 2101, it is refracted at the curved side surface 2102 to horizontally leave the optical member 21. The light trace L3 is emitted from the emission point P toward the slope of the mesa 2108 and is refracted to horizontally exit the optical member 21.

光學構件21之形狀由上視圖觀之可以為橢圓形、圓形、或矩形。若光學構件21相對於通過光學構件21之中心之縱軸24呈輻射對稱(radial symmetry),則光學構件21於上視圖之形狀係為圓形。此時,縱軸24將通過凹口2105之尖點。若光學構件21相對於將光學構件21分割為二個完全相同部分之縱面呈左右對稱(bilateral symmetry),則光學構件21於上視圖之形狀可以為橢圓形、圓形、或矩形。此時,縱軸24係位於縱面上並通過凹口2105之尖點。The shape of the optical member 21 may be elliptical, circular, or rectangular from the top view. If the optical member 21 is radially symmetrical with respect to the longitudinal axis 24 passing through the center of the optical member 21, the shape of the optical member 21 in the upper view is circular. At this point, the longitudinal axis 24 will pass through the sharp point of the notch 2105. If the optical member 21 is bilaterally symmetrical with respect to the longitudinal plane dividing the optical member 21 into two identical portions, the shape of the optical member 21 in the upper view may be elliptical, circular, or rectangular. At this time, the longitudinal axis 24 is located on the longitudinal plane and passes through the sharp point of the recess 2105.

第3A~3D圖係顯示依據本發明另一實施例之光學構件21。於本實施例中,光學構件21之上表面2101係形成為一波紋表面。上表面2101之波紋2109可以環繞著縱軸24,如第3A圖所示,或自凹口2105之最深處朝外移動,如第3C圖所示。第3B圖與第3D圖係分別為兩種波紋表面之上視圖。波紋2109可以由複數個凸透鏡形成。此凸透鏡之半徑可以介於50μm~60μm。3A to 3D are views showing an optical member 21 according to another embodiment of the present invention. In the present embodiment, the upper surface 2101 of the optical member 21 is formed as a corrugated surface. The corrugations 2109 of the upper surface 2101 can surround the longitudinal axis 24, as shown in Figure 3A, or outwardly from the deepest point of the notch 2105, as shown in Figure 3C. Figures 3B and 3D are top views of the two corrugated surfaces, respectively. The corrugations 2109 can be formed by a plurality of convex lenses. The convex lens may have a radius of 50 μm to 60 μm.

第4圖係顯示本發明再一實施例之立體圖。本實施例之發光裝置30包含光學構件31、基座32、發光體33、以及縱面34。光學構件31具有與上述光學構件21相似之剖面。光學構件31與光學構件21間之差異在於光學構件31係形成於一縱向35上並為縱面34所通過。縱向35係垂直於光學構件31之剖面。縱面34可通過或不通過光學構件31之中心線,較佳地,係大體上垂直於基座32之一水平面。Figure 4 is a perspective view showing still another embodiment of the present invention. The light-emitting device 30 of the present embodiment includes an optical member 31, a susceptor 32, an illuminator 33, and a vertical surface 34. The optical member 31 has a cross section similar to that of the optical member 21 described above. The difference between the optical member 31 and the optical member 21 is that the optical member 31 is formed on a longitudinal direction 35 and passes through the longitudinal surface 34. The longitudinal direction 35 is perpendicular to the cross section of the optical member 31. The longitudinal faces 34 may or may not pass through the centerline of the optical member 31, and are preferably substantially perpendicular to one of the horizontal planes of the base 32.

第5A圖係顯示依據發明一實施例之具有波紋狀上表面之發光裝置之立體圖。第5B圖係顯示第5A圖所示之發光裝置之上視圖。如第5A圖所示,發光裝置30A具有與第4圖所示之發光裝置30相似之組成,除了形成於光學構件31A之上表面之波紋3109。如第5B圖所示,波紋3109係沿著一傳遞方向3110前進。傳遞方向3110係波紋傳遞之方向,較佳地,係平行或大約平行於縱向35,然而其他方向亦可以被接受。發光體33可以被設置於光學構件31A之下,較佳地,係平行於傳遞方向3110配置。Fig. 5A is a perspective view showing a light-emitting device having a corrugated upper surface according to an embodiment of the invention. Fig. 5B is a top view showing the light-emitting device shown in Fig. 5A. As shown in Fig. 5A, the light-emitting device 30A has a composition similar to that of the light-emitting device 30 shown in Fig. 4 except for the corrugations 3109 formed on the upper surface of the optical member 31A. As shown in FIG. 5B, the corrugations 3109 are advanced along a transfer direction 3110. The direction of transmission 3110 is the direction of corrugation transfer, preferably parallel or approximately parallel to longitudinal direction 35, although other directions are acceptable. The illuminator 33 may be disposed below the optical member 31A, preferably in a direction parallel to the transfer direction 3110.

如第6圖所示,依據本發明一實施例之光電裝置封裝或組件20包含光學構件21、基座22、光電裝置23、及第一輔助能量接收器40。光學構件21及基座22之詳細說明可參考前述之實施例。除了如LED與雷射二極體(laser diode)等之發光元件之外,本實施例之光電裝置23尤可選自如太陽能電池(solar cell)與光二極體(photo diode)等之收光元件。As shown in FIG. 6, a photovoltaic device package or assembly 20 in accordance with an embodiment of the present invention includes an optical member 21, a susceptor 22, an optoelectronic device 23, and a first auxiliary energy receiver 40. For a detailed description of the optical member 21 and the susceptor 22, reference may be made to the foregoing embodiments. In addition to the light-emitting elements such as LEDs and laser diodes, the photovoltaic device 23 of the present embodiment can be selected, in particular, from light-receiving elements such as solar cells and photo diodes. .

光學構件21係安置於或光學耦合至第一輔助能量器40。第一輔助能量接收器40具有第一能量進口4001、側壁4002、及內表面4003。相較於無封裝之光電裝置23,例如未裝配任何附加聚光器之太陽能電池,第一輔助能量接收器40可提供光電裝置23較高之能量通量或密度。若光電裝置23可以將輻射能轉變為電能,第一輔助能量接收器40則可用於收集進入第一能量進口4001之輻射能,例如:太陽光、紫外光、紅外線、可見光、X射線、及γ射線等。The optical member 21 is disposed or optically coupled to the first auxiliary energy device 40. The first auxiliary energy receiver 40 has a first energy inlet 4001, a side wall 4002, and an inner surface 4003. The first auxiliary energy receiver 40 can provide a higher energy flux or density of the optoelectronic device 23 than a non-packaged optoelectronic device 23, such as a solar cell that is not equipped with any additional concentrators. If the optoelectronic device 23 can convert radiant energy into electrical energy, the first auxiliary energy receiver 40 can be used to collect radiant energy entering the first energy inlet 4001, such as: sunlight, ultraviolet light, infrared light, visible light, X-ray, and gamma. Rays, etc.

第一輔助能量接收器40之側壁4002以建構為反向截頭圓錐體(reversed truncated conical shape)尤佳。換言之,第一能量進口4001之截面積大於接收器40另一端之截面積。然而,第一輔助能量接收器40之外型亦可以形成如截頭角錐體或半圓形。甚者,側壁4002係與內表面4003結合為複合拋物面反射器(compound parabolic reflector;CPC)或冪級數聚光器(power series concentrator)。側壁4002之內表面4003可任意性地選擇反射性材料、反射性結構、散射材料或結構、及其組合中至少其一而形成或與其相結合。反射性材料係例如鋁、銀、銅、金、鉻、錫、鐵、鎳、錳、鎢、青銅、或其合金或組合。反射性結構係例如導電性或介電性分佈式布拉格反射器(distributed Bragg reflector;DBR)。散射材料或結構係例如光子晶體。再者,內表面4003可形成為拋物面、橢圓面、雙曲面、及冪級數面中至少其一。The sidewall 4002 of the first auxiliary energy receiver 40 is preferably constructed as a reverse truncated conical shape. In other words, the cross-sectional area of the first energy inlet 4001 is greater than the cross-sectional area of the other end of the receiver 40. However, the first auxiliary energy receiver 40 may also be formed as a truncated pyramid or a semicircle. Moreover, the side wall 4002 is combined with the inner surface 4003 as a compound parabolic reflector (CPC) or a power series concentrator. The inner surface 4003 of the sidewall 4002 can be arbitrarily selected to form or be combined with at least one of a reflective material, a reflective structure, a scattering material or structure, and combinations thereof. Reflective materials are, for example, aluminum, silver, copper, gold, chromium, tin, iron, nickel, manganese, tungsten, bronze, or alloys or combinations thereof. The reflective structure is, for example, a conductive or dielectric distributed Bragg reflector (DBR). A scattering material or structure is, for example, a photonic crystal. Furthermore, the inner surface 4003 can be formed as at least one of a paraboloid, an elliptical surface, a hyperboloid, and a power series surface.

具體而言,光學構件21具有側表面2102、凹口2105、及凹穴2107。於一實施例中,凹口2105與凹穴2107係分別形成於光學構件21之相對側。如第2B與第2F圖所示,凹穴2107之內容積可形成為角錐體或半圓形。再者,凹穴2107可包含一個形成為凸狀輪廓之上表面2110。此凸狀上表面2110有助使來自於第一能量進口4001之輻射能聚焦於恰為、靠近、或約當光電裝置23之區域。除此之外,上表面2110之輪廓可形成為凹狀、平面、斜面、波紋狀、或上述選擇之任意組合。雖然光學構件21係配合第一輔助能量接收器40,如第6圖所示,然而本實施例並不限於此。一個預設的間隔物或間隙可以形成於第一輔助能量接收器40與光學構件21之間。並且,一填充材料4010可以形成於第一輔助能量接收器40與光學構件21間之部份或全部之自由空間中。形成填充材料4010之方法包含但不限於沉積、塗佈、噴塗、填塞、射出、吸收、附裝、黏合、配接、及鎖固。填充材料4010可選自於氣體、液體、及固體。氣體係例如空氣與惰性氣體。液體係例如水、油與溶劑。固體係例如氧化物、半導體、金屬、陶瓷、與塑膠。Specifically, the optical member 21 has a side surface 2102, a notch 2105, and a pocket 2107. In one embodiment, the recess 2105 and the recess 2107 are formed on opposite sides of the optical member 21, respectively. As shown in Figures 2B and 2F, the inner volume of the pocket 2107 can be formed as a pyramid or a semi-circle. Further, the pocket 2107 can include a surface 2110 formed as a convex profile. This convex upper surface 2110 helps to focus the radiant energy from the first energy inlet 4001 to the area just in, close to, or about the optoelectronic device 23. Additionally, the contour of the upper surface 2110 can be formed as a concave, planar, beveled, corrugated, or any combination of the above. Although the optical member 21 is fitted to the first auxiliary energy receiver 40 as shown in Fig. 6, the embodiment is not limited thereto. A predetermined spacer or gap may be formed between the first auxiliary energy receiver 40 and the optical member 21. Also, a filling material 4010 may be formed in a part or all of the free space between the first auxiliary energy receiver 40 and the optical member 21. Methods of forming fill material 4010 include, but are not limited to, deposition, coating, spraying, tamping, ejecting, absorbing, attaching, bonding, mating, and locking. Filler material 4010 can be selected from the group consisting of gases, liquids, and solids. Gas systems such as air and inert gases. Liquid systems such as water, oils and solvents. Solids such as oxides, semiconductors, metals, ceramics, and plastics.

第7A至第7D圖係例示依據本發明其他數個實施例之數個光電裝置封裝或組件20。第7A至第7D圖與第6圖之主要差異係所採用之光學構件種類。第7A圖之光學構件21A具有上部211A及下部212A。上部211A之側表面2102A係與第6圖之側表面2102相似或相同。下部212A係可以與第一輔助能量接收器40相配合。第7B圖之光學構件21B具有之側表面2102B係可以與第一輔助能量接收器40之至少一部分完全地或部分地幾何配接。具體而言,側表面2102B形成為平滑輪廓。第7C圖之光學構件21C具有之側表面2102C係呈現內凹狀態。第7D圖之光學構件21D具有上部211D及下部212D。上部211D係形成為漏斗狀並具有端部2102D。端部2102D可視為側表面2102之變形或小型化。下部212D與上部211D係物理性相接。此外,如第8圖所示,光學構件21可選自菲涅耳透鏡(Fresnel lens)、平凸透鏡(plano-convex lens;如虛線所示)、雙凸透鏡(biconvex lens;以下未顯示)、正彎月形透鏡(positive meniscus lens)、負彎月形透鏡(negative meniscus lens)、平凹透鏡(plano-concave)、雙凹透鏡(biconcave lens)、及全內反射鏡(TIR lens)中之一或其任意組合。並且,光電裝置23可選擇性地容置於具有上表面2110之凹穴2107。上表面2110之輪廓可選擇性地形成為凹狀、平面、斜面、波紋狀、或上述選擇之任意組合。7A through 7D illustrate a plurality of optoelectronic device packages or assemblies 20 in accordance with other embodiments of the present invention. The main difference between the 7Ath to 7th and 6th figures is the type of optical member used. The optical member 21A of Fig. 7A has an upper portion 211A and a lower portion 212A. The side surface 2102A of the upper portion 211A is similar or identical to the side surface 2102 of Fig. 6. The lower portion 212A can be mated with the first auxiliary energy receiver 40. The optical member 21B of FIG. 7B has a side surface 2102B that can be geometrically mated completely or partially with at least a portion of the first auxiliary energy receiver 40. Specifically, the side surface 2102B is formed into a smooth contour. The side surface 2102C of the optical member 21C of Fig. 7C has a concave state. The optical member 21D of Fig. 7D has an upper portion 211D and a lower portion 212D. The upper portion 211D is formed in a funnel shape and has an end portion 2102D. The end 2102D can be considered to be a deformation or miniaturization of the side surface 2102. The lower portion 212D is physically in contact with the upper portion 211D. Further, as shown in FIG. 8, the optical member 21 may be selected from a Fresnel lens, a plano-convex lens (as indicated by a broken line), a biconvex lens (not shown below), and a positive One of a positive meniscus lens, a negative meniscus lens, a plano-concave, a biconcave lens, and a total internal mirror (TIR lens) random combination. Also, optoelectronic device 23 is selectively received in recess 2107 having upper surface 2110. The contour of the upper surface 2110 can be selectively formed into a concave shape, a flat surface, a beveled surface, a corrugated shape, or any combination of the above.

如第9A與第9B圖所示,依據本發明再一實施例之光電裝置封裝或組件20包含光電裝置23、第一輔助能量接收器40、及光學構件50。光學構件50係安置於或光學耦合至第一輔助能量器40。光電裝置23係與光學構件50之一端光學耦合,並以耦合至與第一能量進口4001相對之一側尤佳。第9A圖之光學構件50係形成為圓錐形或角錐形。圓錐之輪廓可選自於拋物面、橢圓面、雙曲面、及冪級數面中之一或其任意組合。As shown in FIGS. 9A and 9B, a photovoltaic device package or assembly 20 in accordance with yet another embodiment of the present invention includes a photovoltaic device 23, a first auxiliary energy receiver 40, and an optical member 50. The optical member 50 is disposed or optically coupled to the first auxiliary energy device 40. The optoelectronic device 23 is optically coupled to one end of the optical member 50 and is preferably coupled to one side opposite the first energy inlet 4001. The optical member 50 of Fig. 9A is formed into a conical shape or a pyramid shape. The contour of the cone may be selected from one of a paraboloid, an elliptical surface, a hyperboloid, and a power series surface, or any combination thereof.

第9B圖係例示第一輔助能量接收器40與光學構件50之組立圖。第一輔助能量接收器40之內部空間可虛擬上劃分為第一級進口4020與第二級進口4030。光學構件50之大多數部件以安排於第二級進口4030之內尤佳。換言之,光學構件50之部件中全無或僅少數係被安排於第一級進口之中。進入第一能量進口4001之輻射能可由第一級進口4020下移至第二級進口4030。此外,若輻射能於第一輔助能量接收器40中經歷反射、折射、散射、與導引中至少其一,輻射能可能會由第二級進口4030上移至第一級進口4020。於某些實施例中,輻射能甚至能在第一級進口4020與第二級進口4030中之一或二者之間來回移動。FIG. 9B illustrates an assembled view of the first auxiliary energy receiver 40 and the optical member 50. The internal space of the first auxiliary energy receiver 40 can be virtually divided into a first stage inlet 4020 and a second stage inlet 4030. Most of the components of optical component 50 are preferably disposed within second stage inlet 4030. In other words, none or only a few of the components of the optical member 50 are arranged in the first stage inlet. The radiant energy entering the first energy inlet 4001 can be moved down from the first stage inlet 4020 to the second stage inlet 4030. In addition, if the radiant energy is subjected to at least one of reflection, refraction, scattering, and steering in the first auxiliary energy receiver 40, the radiant energy may be moved up from the second stage inlet 4030 to the first stage inlet 4020. In some embodiments, radiant energy can even move back and forth between one or both of the first stage inlet 4020 and the second stage inlet 4030.

第一輔助能量接收器40之內部空間可藉由一內邊界4040、一外邊界4050、及一上邊界4060來劃定。內邊界4040係被光學構件所限定。外邊界4050係被側壁40所限定,更具體而言,係被內表面4003或介於光學構件50與側壁4002間不為輻射能穿透之材質所限定。上邊界4060係被第一能量進口4001之最外層表面所限定。較佳地,對於可被光電裝置23吸收之輻射能,內邊界4040係可穿透,而外邊界4050係不可穿透。內邊界4040之穿透性取決於光學構件50之材料或表面結構。穿透性之數值表示係約為90%、80%、70%、60%、50%、40%、30%、20%、10%、5%、或介於99.99%與5%之間。外邊界4050之建構通常係在內邊界4040之外形成反射與散射功能中至少其一。例如前述實施例中所述,外邊界4050係藉由形成於內表面4003上方之反射性或散射性之材料或結構所構成。The interior space of the first auxiliary energy receiver 40 can be defined by an inner boundary 4040, an outer boundary 4050, and an upper boundary 4060. Inner boundary 4040 is defined by optical members. The outer boundary 4050 is defined by the side walls 40, and more specifically by the inner surface 4003 or between the optical member 50 and the side wall 4002 that is not permeable to radiant energy. The upper boundary 4060 is defined by the outermost surface of the first energy inlet 4001. Preferably, for radiant energy that can be absorbed by optoelectronic device 23, inner boundary 4040 is permeable and outer boundary 4050 is impermeable. The penetration of the inner boundary 4040 depends on the material or surface structure of the optical member 50. The value of the permeability is about 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20%, 10%, 5%, or between 99.99% and 5%. The construction of the outer boundary 4050 typically forms at least one of the reflection and scattering functions outside of the inner boundary 4040. For example, as described in the foregoing embodiments, the outer boundary 4050 is formed by a reflective or scattering material or structure formed over the inner surface 4003.

甚者,用以說明第9A與第9B圖之實施例之方法論亦可適用於第6圖、第7A至第7D圖、與第8圖之實施例。形成光學構件21、21A~21D、與50之透光材料係包含但不限於玻璃、壓克力樹脂(acrylic resin)、環烯烴共聚合物(cyclic olefin copolymer;COC)、聚甲基丙烯酸甲脂(PMMA)、聚碳酸酯(PC)、聚碳酸酯/聚甲基丙烯酸甲脂(PC/PMMA)、聚醚醯亞胺(Polyetherimide;PEI)、氟碳聚合物(Polyetherimide;PEI)、及矽樹脂(silicone)。Moreover, the methodology for explaining the embodiments of Figures 9A and 9B can also be applied to the embodiments of Figures 6, 7A through 7D, and Figure 8. The light transmissive materials forming the optical members 21, 21A-21D, and 50 include, but are not limited to, glass, acrylic resin, cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), polycarbonate/polymethylmethacrylate (PC/PMMA), polyetherimide (PEI), fluorocarbon polymer (Polyetherimide; PEI), and hydrazine Silicone.

如第10圖所示,本發明之光電裝置封裝或組件20呈現出接收大角度變化入射光之能力。如數值模擬之結果,以0°至50°射入第一能量進口4001之光線可以有效地被第一輔助能量接收器40與光學構件50導引至目標之光電裝置23。觀察射線軌跡,大多數之光線被第一輔助能量接收器40所反射,但卻為光學構件50所反射與折射。As shown in Fig. 10, the optoelectronic device package or assembly 20 of the present invention exhibits the ability to receive incident light at varying angles. As a result of the numerical simulation, light incident on the first energy inlet 4001 at 0° to 50° can be effectively guided by the first auxiliary energy receiver 40 and the optical member 50 to the optoelectronic device 23 of the target. Observing the ray trajectory, most of the light is reflected by the first auxiliary energy receiver 40, but is reflected and refracted by the optical member 50.

除第一輔助能量接收器40之外,組件20中可再選擇性地整合一第二輔助能量接收器60A。詳述之,第二輔助能量接收器60A係與第一輔助能量接收器40光學耦合,如第11A圖所示。較佳地,第二輔助能量接收器60A具有複合拋物面反射器(compound parabolic reflector;CPC)、冪級數聚光器(power series concentrator)、或其二者之功能。並且,第二輔助能量接收器60A可以具有反射性內表面。此反射性內表面之輪廓係形成為拋物面、橢圓面、雙曲面、及冪級數面中至少其一。第二輔助能量接收器60A之外型以形成為截頭圓錐體尤佳,然而,亦可以為截頭角錐體或半圓形。In addition to the first auxiliary energy receiver 40, a second auxiliary energy receiver 60A can be selectively integrated in the assembly 20. In detail, the second auxiliary energy receiver 60A is optically coupled to the first auxiliary energy receiver 40, as shown in FIG. 11A. Preferably, the second auxiliary energy receiver 60A has the function of a compound parabolic reflector (CPC), a power series concentrator, or both. Also, the second auxiliary energy receiver 60A can have a reflective inner surface. The contour of the reflective inner surface is formed as at least one of a paraboloid, an elliptical surface, a hyperboloid, and a power series surface. The second auxiliary energy receiver 60A is preferably shaped to be a truncated cone, however, it may also be a truncated pyramid or a semi-circular shape.

於本發明之另一實施例中,伸縮式第二輔助能量接收器60B係與組件20光學整合,如第11B圖所示。此伸縮式第二輔助能量接收器60B係可擴展,因此,對於使用者而言較易攜帶與收藏。In another embodiment of the invention, the telescoping second auxiliary energy receiver 60B is optically integrated with the assembly 20 as shown in FIG. 11B. The telescopic second auxiliary energy receiver 60B is expandable and therefore easier to carry and collect for the user.

一種可攜式電子裝置100係如第12圖所示。可攜式電子裝置100係如膝上型電腦、行動電話、輕省筆記型電腦(netbook)、音樂播放器、個人數位助理(PDA)、及電子字典。較佳地,可攜式裝置100包含主要單元101、顯示單元102、及匣體單元103。主要單元101係裝配有輸入介面、輸出介面、或其二者。顯示單元102包含視覺訊息輸出介面,例如:液晶顯示器(LCD)、發光二極體、有機發光二極體(OLED)、或上述選擇之任意組合。匣體單元103可移入且移出主要單元101。一光電裝置23與一第一輔助能量接收器40係安排於匣體單元103之內或之上。光電裝置23係電性連接至主要單元101、顯示單元102、或其二者。再者,一伸縮式第二輔助能量接收器60B可選擇性地與第一輔助能量接收器40相耦合以提供光電裝置23更高之能量通量或密度。於一事例中,伸縮式第二輔助能量接收器60B可自匣體單元103分離。此外,伸縮式第二輔助能量接收器60B亦內建於匣體單元103之中。雖然本發明已說明如上,然其並非用以限制本發明之範圍、實施順序、或使用之材料與製程方法。對於本發明所作之各種修飾與變更,皆不脫本發明之精神與範圍。A portable electronic device 100 is shown in FIG. The portable electronic device 100 is such as a laptop computer, a mobile phone, a netbook, a music player, a personal digital assistant (PDA), and an electronic dictionary. Preferably, the portable device 100 includes a main unit 101, a display unit 102, and a body unit 103. The main unit 101 is equipped with an input interface, an output interface, or both. Display unit 102 includes a visual message output interface, such as a liquid crystal display (LCD), a light emitting diode, an organic light emitting diode (OLED), or any combination of the above. The body unit 103 can move in and out of the main unit 101. An optoelectronic device 23 and a first auxiliary energy receiver 40 are arranged in or on the body unit 103. The optoelectronic device 23 is electrically connected to the main unit 101, the display unit 102, or both. Moreover, a telescoping second auxiliary energy receiver 60B can be selectively coupled to the first auxiliary energy receiver 40 to provide a higher energy flux or density of the optoelectronic device 23. In one instance, the telescoping second auxiliary energy receiver 60B can be separated from the body unit 103. In addition, the telescopic second auxiliary energy receiver 60B is also built in the body unit 103. Although the invention has been described above, it is not intended to limit the scope of the invention, the order of implementation, or the materials and process methods used. Various modifications and variations of the present invention are possible without departing from the spirit and scope of the invention.

10...發光二極體封10. . . Light-emitting diode package

11...光學透鏡11. . . optical lens

1101...表面1101. . . surface

1102...側壁1102. . . Side wall

12...封裝基座12. . . Package base

13...LED晶粒13. . . LED die

14...凹穴14. . . Pocket

15...縱軸15. . . Vertical axis

20...光電裝置組件20. . . Optoelectronic device assembly

21...光學構件twenty one. . . Optical member

21A...光學構件21A. . . Optical member

21B...光學構件21B. . . Optical member

21C...光學構件21C. . . Optical member

21D...光學構件21D. . . Optical member

2101...上表面2101. . . Upper surface

2102...側表面2102. . . Side surface

2102A...側表面2102A. . . Side surface

2102B...側表面2102B. . . Side surface

2102C...側表面2102C. . . Side surface

2102D...端部2102D. . . Ends

2103...下表面2103. . . lower surface

2104...凹面2104. . . Concave surface

2105...凹口2105. . . Notch

2105A...凹口2105A. . . Notch

2105B...凹口2105B. . . Notch

2105C...凹口2105C. . . Notch

2105D...凹口2105D. . . Notch

2106...基部2106. . . Base

2107...凹穴2107. . . Pocket

2107A...凹穴2107A. . . Pocket

2107B...凹穴2107B. . . Pocket

2107C...凹穴2107C. . . Pocket

2107D...凹穴2107D. . . Pocket

2108...台面2108. . . mesa

2109...波紋2109. . . ripple

2110...上表面2110. . . Upper surface

2110A...上表面2110A. . . Upper surface

2110B...上表面2110B. . . Upper surface

2110C...上表面2110C. . . Upper surface

2110D...上表面2110D. . . Upper surface

211A...上部211A. . . Upper

211D...上部211D. . . Upper

212A...下部212A. . . Lower part

212D...下部212D. . . Lower part

22...基座twenty two. . . Pedestal

23...光電裝置twenty three. . . Photoelectric device

24...縱軸twenty four. . . Vertical axis

30...發光裝置30. . . Illuminating device

30A...發光裝置30A. . . Illuminating device

31...光學構件31. . . Optical member

31A...光學構件31A. . . Optical member

3109...波紋3109. . . ripple

3110...傳遞方向3110. . . Direction of transmission

32...基座32. . . Pedestal

33...發光體33. . . illuminator

34...縱面34. . . Longitudinal

35...縱向35. . . Portrait

40...第一輔助能量接收器40. . . First auxiliary energy receiver

4001...第一能量進口4001. . . First energy inlet

4002...側壁4002. . . Side wall

4003...內表面4003. . . The inner surface

4010...填充材料4010. . . Filler

4020...第一級進口4020. . . First level import

4030...第二級進口4030. . . Second level import

4040...內邊界4040. . . Inner boundary

4050...外邊界4050. . . Outer boundary

4060...上邊界4060. . . Upper boundary

50...光學構件50. . . Optical member

60A...第二輔助能量接收器60A. . . Second auxiliary energy receiver

60B...第二輔助能量接收器60B. . . Second auxiliary energy receiver

100...可攜式電子裝置100. . . Portable electronic device

101...主要單元101. . . Main unit

102...顯示單元102. . . Display unit

103...匣體單元103. . . Carcass unit

第1圖係顯示一傳統之LED封裝。Figure 1 shows a conventional LED package.

第2A圖係顯示本發明之一實施例。Figure 2A shows an embodiment of the invention.

第2B圖係顯示第2A圖所示之光電裝置組件之剖面圖。Figure 2B is a cross-sectional view showing the photovoltaic device assembly shown in Figure 2A.

第2C圖係顯示連接至第2A圖之光電裝置組件之光學構件之剖面圖。Figure 2C is a cross-sectional view showing the optical member connected to the photovoltaic device assembly of Figure 2A.

第2D圖係顯示光學構件之一實施例之光跡圖。Figure 2D is a light trace showing an embodiment of an optical member.

第2E圖係顯示依據本發明另一實施例之光電裝置組件之下視圖。Figure 2E is a bottom view showing a photovoltaic device assembly in accordance with another embodiment of the present invention.

第2F圖係顯示本發明一實施例之光電裝置組件之剖面圖。Figure 2F is a cross-sectional view showing a photovoltaic device assembly in accordance with an embodiment of the present invention.

第3A圖係顯示依據本發明另一實施例之光電裝置組件之剖面圖。Figure 3A is a cross-sectional view showing a photovoltaic device assembly in accordance with another embodiment of the present invention.

第3B圖係顯示第3A圖所示光電裝置組件之上視圖。Fig. 3B is a top view showing the photovoltaic device assembly shown in Fig. 3A.

第3C圖係顯示依據本發明另一實施例之發光裝置之剖面圖。Figure 3C is a cross-sectional view showing a light-emitting device according to another embodiment of the present invention.

第3D圖係顯示第3C圖所示光電裝置組件之上視圖。Fig. 3D is a top view showing the photovoltaic device assembly shown in Fig. 3C.

第4圖係顯示本發明又一實施例之立體圖。Figure 4 is a perspective view showing still another embodiment of the present invention.

第5A圖係顯示本發明又一實施例之立體圖。Fig. 5A is a perspective view showing still another embodiment of the present invention.

第5B圖係顯示第5A圖所示之光電裝置組件之上視圖。Fig. 5B is a top view showing the photovoltaic device assembly shown in Fig. 5A.

第6圖係顯示依據本發明一實施例之可以接收輻射能之光電裝置組件或總成之剖面圖。Figure 6 is a cross-sectional view showing an optoelectronic device assembly or assembly that can receive radiant energy in accordance with an embodiment of the present invention.

第7A~第7D圖係顯示依據本發明實施例之與不同光學構件接合之光電裝置組件或總成之剖面圖。7A-7D are cross-sectional views showing optoelectronic device assemblies or assemblies joined to different optical components in accordance with an embodiment of the present invention.

第8圖係顯示依據本發明實施例之與菲涅耳透鏡(Fresnel lens)或平凸透鏡(plano-convex lens)接合之光電裝置組件或總成之剖面圖。Figure 8 is a cross-sectional view showing a photovoltaic device assembly or assembly joined to a Fresnel lens or a plano-convex lens in accordance with an embodiment of the present invention.

第9A與第9B圖係顯示依據本發明一實施例之與特定光學構件結合之光電裝置組件或總成之剖面圖。9A and 9B are cross-sectional views showing a photovoltaic device assembly or assembly in combination with a particular optical member in accordance with an embodiment of the present invention.

第10圖係顯示第9A及第9B圖之光電裝置組件或總成之光跡圖。Figure 10 is a light trace showing the photovoltaic device assembly or assembly of Figures 9A and 9B.

第11A與第11B圖係顯示依據本發明又一實施例之與一附加或可擴展之能量接收器相接合之光電裝置組件或總成。11A and 11B are diagrams showing optoelectronic device assemblies or assemblies that are coupled to an additional or expandable energy receiver in accordance with yet another embodiment of the present invention.

第12圖係顯示依據本發明實施例之與光電裝置組件或總成接合之可攜式電子裝置。Figure 12 is a diagram showing a portable electronic device that is coupled to an optoelectronic device assembly or assembly in accordance with an embodiment of the present invention.

20...光電裝置組件20. . . Optoelectronic device assembly

21...光學構件twenty one. . . Optical member

2102...側表面2102. . . Side surface

2105...凹口2105. . . Notch

2107...凹穴2107. . . Pocket

2110...上表面2110. . . Upper surface

22...基座twenty two. . . Pedestal

23...光電裝置twenty three. . . Photoelectric device

40...第一輔助能量接收器40. . . First auxiliary energy receiver

4001...第一能量進口4001. . . First energy inlet

4002...側壁4002. . . Side wall

4003...內表面4003. . . The inner surface

4010...填充材料4010. . . Filler

Claims (4)

一種光電裝置組件,包含:一第一輔助能量接收器,具有一第一能量進口及一側壁用以大體上導引進入該第一能量進口之能量遠離該第一能量進口,其中,該側壁具有一反射性內表面;一光學構件,係位於該第一輔助能量接收器之內,且用以接收進入該第一能量進口並經該側壁偏向後之能量,其中該光學透鏡係由一透光材料構成,並包含一凹口及一鄰近該凹口之側表面;及一光電裝置,係光學耦合至該光學構件並接收來自於該第一能量進口之能量。 An optoelectronic device assembly comprising: a first auxiliary energy receiver having a first energy inlet and a sidewall for substantially guiding energy entering the first energy inlet away from the first energy inlet, wherein the sidewall has a reflective inner surface; an optical member disposed within the first auxiliary energy receiver and configured to receive energy entering the first energy inlet and deflected through the sidewall, wherein the optical lens is transparent The material is constructed and includes a recess and a side surface adjacent the recess; and an optoelectronic device optically coupled to the optical member and receiving energy from the first energy inlet. 如請求項1所述之光電裝置組件,其中該第一輔助能量接收器包含一複合拋物面反射器(compound parabolic reflector)、一冪級數聚光器(power series concentrator)、或其二者。 The optoelectronic device assembly of claim 1, wherein the first auxiliary energy receiver comprises a compound parabolic reflector, a power series concentrator, or both. 如請求項1所述之光電裝置組件,更包含:一第二輔助能量接收器,係光學耦合至該第一輔助能量接收器。 The optoelectronic device assembly of claim 1, further comprising: a second auxiliary energy receiver optically coupled to the first auxiliary energy receiver. 如請求項3所述之光電裝置組件,其中該第二輔助能量接收器係可擴展。 The optoelectronic device assembly of claim 3, wherein the second auxiliary energy receiver is expandable.
TW97143265A 2008-11-05 2008-11-05 Optoelectronic device assembly TWI409410B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97143265A TWI409410B (en) 2008-11-05 2008-11-05 Optoelectronic device assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97143265A TWI409410B (en) 2008-11-05 2008-11-05 Optoelectronic device assembly

Publications (2)

Publication Number Publication Date
TW201018851A TW201018851A (en) 2010-05-16
TWI409410B true TWI409410B (en) 2013-09-21

Family

ID=44831449

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97143265A TWI409410B (en) 2008-11-05 2008-11-05 Optoelectronic device assembly

Country Status (1)

Country Link
TW (1) TWI409410B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103187506B (en) * 2011-12-29 2015-11-18 展晶科技(深圳)有限公司 Light-emitting diode assembly
TWI454631B (en) * 2011-12-29 2014-10-01 Univ Nat Kaohsiung Applied Sci Adjustable variable light emitting diode lens and lamp with its own

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6359965B1 (en) * 1999-07-26 2002-03-19 Siemens Aktiengesellschaft Diagnostic radiography system with a flat x-ray image converter with back-illumination
US20030127583A1 (en) * 2002-01-10 2003-07-10 Bechtel Jon H. Sensor configuration for substantial spacing from a small aperture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6359965B1 (en) * 1999-07-26 2002-03-19 Siemens Aktiengesellschaft Diagnostic radiography system with a flat x-ray image converter with back-illumination
US20030127583A1 (en) * 2002-01-10 2003-07-10 Bechtel Jon H. Sensor configuration for substantial spacing from a small aperture

Also Published As

Publication number Publication date
TW201018851A (en) 2010-05-16

Similar Documents

Publication Publication Date Title
US8704149B2 (en) Optoelectronic device assembly having auxiliary energy receiver
US8541795B2 (en) Side-emitting optical coupling device
US7142769B2 (en) Illumination package
TWI364120B (en) Convex-fresnel led lens for angular distribution patterns and led assembly thereof
TW565951B (en) LED lens
KR101236401B1 (en) Illumination device
EP1376708A2 (en) Side emitting LED and lens
JP2010054864A (en) Liquid lens element and lighting system
TW201231874A (en) Tube luminescent retrofit using light emitting diodes
TW201011349A (en) Plano-Fresnel LED lens for angular distribution patterns and LED assembly thereof
WO2014141204A1 (en) Optics for illumination devices and solar concentrators
TW201326890A (en) Lens
CN102563526B (en) Light-equalizing lens
KR101044682B1 (en) illumination package
TWI409410B (en) Optoelectronic device assembly
TW201226783A (en) Tir optics with optimized incoupling structure
US20100124055A1 (en) Side-emitting optical elements and methods thereof
CN101834219B (en) Electrooptical device assembly
KR100639873B1 (en) Side emitting led and lens suitable for the same
CN102779886B (en) Electrooptical device assembly
CN107919431B (en) Light-emitting diode chip for backlight unit class encapsulation structure and direct type backlight module
JP2011054443A (en) Diffusion material, light guide body unit, and surface light source device
US20110031518A1 (en) Led device
KR100764235B1 (en) Side emitting lens
US8303133B2 (en) Light emitting diode, backlight module, and light tube