TWI404809B - Special complex alloy - Google Patents
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- TWI404809B TWI404809B TW098132152A TW98132152A TWI404809B TW I404809 B TWI404809 B TW I404809B TW 098132152 A TW098132152 A TW 098132152A TW 98132152 A TW98132152 A TW 98132152A TW I404809 B TWI404809 B TW I404809B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/18—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/047—Making non-ferrous alloys by powder metallurgy comprising intermetallic compounds
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- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F2003/248—Thermal after-treatment
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- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
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Abstract
Description
本發明係關於一種特殊複合合金組成物，特別是一種具有低熔點、低硬度及高延性之特殊複合合金組成物。The present invention relates to a special composite alloy composition, in particular to a special composite alloy composition having a low melting point, a low hardness and a high ductility.
微機電系統(Micro Electro-Mechanical system,MEMS)的發展是起源於半導體製程與精密機械技術的結合，將讓各種產業產品的發展朝向輕、薄、短、小與多功能、智慧化、省能源的微型化產品，諸如微小化的內科手術、生物科技或信息科技。面對這些嚴苛的挑戰，微機電系統製造及研究者長久以來一直期盼著開發新的「精微加工技術」解決此問題。例如：德國為歐洲發展精微加工技術最具代表性國家，是發展「微影電鑄成型(LIGA)」製程最早的國家之一，並積極投入矽基微加工及微機械加工相關技術之開發；美國從半導體製程演化出微細加工技術，以矽為主要應用材料；日本的發展則較為不同，是由傳統之機械加工技術演化而生的精微加工技術，並利用在機電領域的領先優勢，發展出各式微機械產品。The development of Micro Electro-Mechanical System (MEMS) originates from the combination of semiconductor manufacturing and precision mechanical technology, which will make the development of various industrial products light, thin, short, small and multifunctional, intelligent and energy-saving. Miniaturized products, such as miniaturized medical surgery, biotechnology or information technology. Faced with these rigorous challenges, MEMS manufacturing and researchers have long been looking forward to developing new "fine processing technologies" to solve this problem. For example, Germany is one of the countries with the most representative process for the development of micro-machining technology in Europe. It is one of the earliest countries to develop the “Micro-Film Electroforming (LIGA)” process, and is actively involved in the development of 矽-based micro-machining and micro-machining related technologies; The United States has evolved microfabrication technology from the semiconductor process, with 矽 as the main application material; Japan's development is quite different, it is the micro-machining technology evolved from the traditional mechanical processing technology, and it develops with the leading edge in the electromechanical field. A variety of micro-mechanical products.
其他精微加工技術，例如「微熱壓成型(Hot Embossing)」，其係由微機電製程中LIGA技術的發展而衍生出來的一項技術，微熱壓成型技術於高分子薄膜以產生具有微特徵圖案之產品是極具潛力且非常重要之製程技術。因此，目前是產學界極欲開發研究的一項技術，可使用熱塑性高分子或熱固性高分子來進行熱壓成型，而其主要的製程是將高分子基材，例如聚碳酸脂(Polycarbonate，PC)或聚甲基丙烯酸甲酯(Polymethyl methacrylate acrylic，PMMA)置入成型機中，並將該高分子基材加熱高於該高分子基材之玻璃轉移溫度(Tg )以上之溫度(加熱段)。並藉由電腦數值控制微細切削加工機(micro-CNC)或微影電鑄成型法(LIGA)所製造一具有圖案或微結構之模具，並將該模具於真空室內壓蓋於該高分子基材上，使該模具上之圖案或微結構能完全轉印至該高分子基材上而成型(Embossing)。最後，模具與該高分子基材接觸一段時間以後(持溫段)，將溫度降至玻璃轉移溫度以下(冷卻段)，緊接著將該高分子基材從該模具中分離出來，便可獲得具有圖案或微結構之產品。Other micromachining technologies, such as "Hot Embossing", a technology derived from the development of LIGA technology in MEMS, micro-compression molding technology for polymer films to produce micro-feature patterns. Products are highly promising and very important process technologies. Therefore, it is currently a technology that the industry and academia are keen to develop and research. Thermoplastic polymers or thermosetting polymers can be used for hot press forming, and the main process is to use a polymer substrate such as polycarbonate (Polycarbonate, PC). Or polymethyl methacrylate acrylic (PMMA) is placed in a molding machine, and the polymer substrate is heated to a temperature higher than a glass transition temperature (T g ) of the polymer substrate (heating section) ). And a mold having a pattern or a microstructure is fabricated by a computer numerical control micro-CNC or a lithography electroforming method (LIGA), and the mold is pressed into the polymer base in a vacuum chamber. On the material, the pattern or microstructure on the mold can be completely transferred onto the polymer substrate to be formed (Embossing). Finally, after the mold is in contact with the polymer substrate for a period of time (holding temperature), the temperature is lowered below the glass transition temperature (cooling section), and then the polymer substrate is separated from the mold to obtain A product with a pattern or microstructure.
上述「微熱壓成型」是極少數具高速量產效益的微機電加工技術，卻僅適用於塑膠微形元件的製作。塑膠微形元件雖有其應用市場，但在工程上，一些特定產品基於耐熱性、尺寸安定性、熱傳導性及導電性等需求，必須採用金屬材料。The above "micro-hot press forming" is one of the few MEMS processing technologies with high-speed mass production benefits, but it is only suitable for the production of plastic micro-components. Although plastic micro-components have their application market, in engineering, some specific products must be made of metal materials based on heat resistance, dimensional stability, thermal conductivity and electrical conductivity.
然而，目前一般金屬材料因為無法如同塑膠具有優良熱塑性，而無法適用於該微熱壓成型製程，金屬微形元件的成型主要是利用微影電鑄成型方法。例如，目前習知具有軟質合金組成物，主要銲錫合金，其主成分為錫(Sn)，其他成分為鉛(Pb)、銀(Ag)、銅(Cu)、鎳(Ni)及其他微量金屬元素，所形成共晶合金之銲錫，例如：Sn37(wt%)Pb合金、Sn0.9(wt%)Cu合金、Sn3.5(wt%)Ag合金及Sn3.5(wt%)Ag0.5(wt%)Cu合金等銲錫合金。然而，上述銲錫之錫元素比例過高，並且這些銲錫合金形成，是利用一定比例配置，利用高溫熔煉，所形成之銲錫合金，並且該習用合金之錫元素比例過高，即使利用微熱壓成型製程後，仍無法利用熱反應方式提高機械性質，即使於加熱後亦無法反應形成具有高硬度、高熔點及高強度等特性之合金組成物。因此，確實有必要開發一可應用於微熱壓成型製程之特殊金屬組成物。However, at present, general metal materials cannot be applied to the micro-hot press forming process because they have excellent thermoplasticity as plastics, and the metal micro-shaped components are mainly formed by using a micro-photoelectroforming method. For example, it is currently known to have a soft alloy composition, a main solder alloy whose main component is tin (Sn), and other components are lead (Pb), silver (Ag), copper (Cu), nickel (Ni) and other trace metals. Element, solder of eutectic alloy formed, for example: Sn37 (wt%) Pb alloy, Sn0.9 (wt%) Cu alloy, Sn3.5 (wt%) Ag alloy and Sn3.5 (wt%) Ag0.5 (wt%) solder alloy such as Cu alloy. However, the proportion of the tin element in the solder is too high, and the solder alloy is formed by using a certain proportion of the solder alloy formed by high-temperature melting, and the ratio of the tin element of the conventional alloy is too high, even if the micro-hot press forming process is utilized. After that, it is still impossible to improve the mechanical properties by the thermal reaction method, and it is impossible to react to form an alloy composition having characteristics of high hardness, high melting point, and high strength even after heating. Therefore, it is indeed necessary to develop a special metal composition that can be applied to a micro thermoforming process.
本發明目的乃改良上述缺點，以提供一種特殊複合合金組成物。It is an object of the present invention to improve the above disadvantages to provide a special composite alloy composition.
本發明次一目的係提供一低熔點、低硬度及高延性之特殊複合合金組成物，且該特殊複合合金組成物經熱反應處理(例如微熱壓成型製程或時效處理)後具有高硬度、高熔點、高強度、尺寸穩定及導電特性佳等特性。The second object of the present invention is to provide a special composite alloy composition having low melting point, low hardness and high ductility, and the special composite alloy composition has high hardness and high after thermal reaction treatment (for example, micro hot press forming process or aging treatment). Melting point, high strength, dimensional stability and good electrical conductivity.
本發明係一種特殊複合合金組成物，係包含以重量百分比計72～74.5%之銀及24.5～27%錫，且該銀之粒徑大小係介於10nm至200μm之間。The present invention is a special composite alloy composition comprising 72 to 74.5% by weight of silver and 24.5 to 27% tin, and the silver has a particle size ranging from 10 nm to 200 μm.
本發明係一種特殊複合合金組成物，係包含以重量百分比計29～67.5%之銀及31.5～70%之銦，且該銀之粒徑大小係介於10nm至200μm之間。The present invention is a special composite alloy composition comprising 29 to 67.5% by weight of silver and 31.5 to 70% of indium, and the silver has a particle size ranging from 10 nm to 200 μm.
本發明係一種特殊複合合金組成物，係包含以重量百分比計29～60%之銀、19～35%錫及20～35.2%之銦，且該銀之粒徑大小係介於10nm至200μm之間。The invention is a special composite alloy composition comprising 29-60% by weight of silver, 19-35% tin and 20-35.2% of indium, and the size of the silver is between 10 nm and 200 μm. between.
藉此，本發明之特殊複合合金組成物在熱反應前具有低熔點、低硬度及高延性之特性，可適用於微熱壓成型製程，且經微熱壓成型製程後可形成具有高硬度、高熔點、高強度、尺寸穩定及導電特性佳等特性之金屬微型元件。Thereby, the special composite alloy composition of the invention has the characteristics of low melting point, low hardness and high ductility before the thermal reaction, and can be applied to the micro hot press forming process, and can form a high hardness and a high melting point after the micro hot press forming process. Metal micro-components with high strength, dimensional stability and good electrical conductivity.
為讓本發明之上述及其他目的、特徵及優點能更明顯易懂，下文特舉本發明之較佳實施例，並配合所附圖式，作詳細說明如下：本發明之特殊複合合金組成物主要係由軟質金屬混摻銀(Ag)金屬粉末所共同組成，其中該軟質金屬係為低熔點、質軟且延展性佳之金屬，可選擇為錫、銦、錫銦合金、錫基合金、銦基合金或錫銦基合金之至少一種，其中，該錫基合金係可選擇為Sn-0.9(wt%)Cu合金、Sn-3.5(wt%)Ag合金、Sn-0.7(wt%)Ni合金、Sn-3.5(wt%)Ag-0.5(wt%)Cu合金、Sn-3.0(wt%)Ag-0.9(wt%)Cu合金、Sn9(wt%)Zn或Sn-x(wt%)Al合金，該銦基合金係可選擇為In-0.9(wt%)Cu合金、In-1.2(wt%)Ag合金、In-1.2Ni合金或In-x(wt%)Zn合金。使該複合合金組成物在混練過程及使用前保有軟質金屬的特性，包含低熔點、質軟且延展性佳之複合合金組成物。The above and other objects, features and advantages of the present invention will become more <RTIgt; Mainly composed of soft metal mixed with silver (Ag) metal powder, wherein the soft metal is a low melting point, soft and ductile metal, which can be selected from tin, indium, tin indium alloy, tin based alloy, indium. At least one of a base alloy or a tin indium-based alloy, wherein the tin-based alloy may be selected from a Sn-0.9 (wt%) Cu alloy, a Sn-3.5 (wt%) Ag alloy, and a Sn-0.7 (wt%) Ni alloy. , Sn-3.5 (wt%) Ag-0.5 (wt%) Cu alloy, Sn-3.0 (wt%) Ag-0.9 (wt%) Cu alloy, Sn9 (wt%) Zn or Sn-x (wt%) Al As the alloy, the indium-based alloy may be selected from an In-0.9 (wt%) Cu alloy, an In-1.2 (wt%) Ag alloy, an In-1.2Ni alloy, or an In-x (wt%) Zn alloy. The composite alloy composition retains the characteristics of a soft metal before the kneading process and before use, and comprises a composite alloy composition having a low melting point, a soft texture, and good ductility.
本發明可另包含錫基銲錫合金或銦基銲錫合金，亦可降低複合合金主成分之銀金屬粉末使用用量，增加機械性質。在本發明之複合合金組成物中，該銀金屬粉末係指預先研磨成粒徑大小介於10nm至200μm之間。該銀金屬粉末均勻分佈於該複合合金組成物內部組織，並經過熱反應使該銀金屬粉末與該軟質金屬反應形成一新的組織型態的複合合金組成物，此新的複合合金組成物具有高硬度、高熔點、高強度、尺寸穩定及導電性佳等特性。該特殊複合合金組成物中係可另包含以重量百分比計0.01～2%之銅(Cu)，以提升該特殊複合合金組成物之導熱效果；或者另包含以重量百分比計0.01～2%之鎳(Ni)，以提升整體特殊複合合金組成物之耐腐蝕性及機械性質；或者另包含0.01～3%鍺(Ge)，以降低本發明之特殊複合合金組成物反應前之低熔點及潤濕性。The invention may further comprise a tin-based solder alloy or an indium-based solder alloy, and may also reduce the amount of the silver metal powder used as the main component of the composite alloy and increase the mechanical properties. In the composite alloy composition of the present invention, the silver metal powder means pre-milling to a particle size of between 10 nm and 200 μm. The silver metal powder is evenly distributed in the internal structure of the composite alloy composition, and the silver metal powder is reacted with the soft metal to form a new composite alloy composition by thermal reaction, and the new composite alloy composition has High hardness, high melting point, high strength, dimensional stability and good electrical conductivity. The special composite alloy composition may further comprise 0.01 to 2% by weight of copper (Cu) to enhance the heat conduction effect of the special composite alloy composition; or further comprise 0.01 to 2% by weight of nickel. (Ni) to improve the corrosion resistance and mechanical properties of the overall special composite alloy composition; or further comprise 0.01 to 3% yttrium (Ge) to reduce the low melting point and wetting of the special composite alloy composition of the present invention before the reaction Sex.
本發明之特殊複合合金組成物中可能因銀金屬或軟質金屬來源純度影響，因此可能包含有上述之銅(Cu)、鎳(Ni)、金(Au)或鋅(Zn)等微量金屬，當然，該銅金屬粉末或鎳金屬粉末亦可依需求加入一定比例混入該特殊複合合金組成物中。The special composite alloy composition of the present invention may be affected by the purity of the source of silver metal or soft metal, and thus may contain trace metals such as copper (Cu), nickel (Ni), gold (Au) or zinc (Zn) described above, of course. The copper metal powder or the nickel metal powder may also be mixed into the special composite alloy composition by a certain ratio as needed.
請參照第1圖所示，本發明之特殊複合合金組成物較佳係以下列製程製作完成，當然亦可選擇以其他方式進行混合製作：請參照第1圖所示，以滾軋混練法為例，首先，將該軟質金屬，例如錫、銦或錫銦合金，以一滾壓裝置1滾壓成數層金屬薄片2後，接著將粒徑大小介於10nm至200μm之間的銀金屬粉末3均勻散佈於該數層金屬薄片2之間，並經過該滾壓裝置1進行滾壓後，便可形成一滾壓薄片2’；再進一步將該滾壓薄片2’進行折疊，再透過該滾壓裝置1進行滾壓，如此，透過重複折疊滾壓動作，便可將該銀金屬粉末3均勻混練入該軟質金屬製成之金屬薄片2中，進而獲得如上述之組成比例之特殊複合合金組成物4。若欲額外加入該銅金屬粉末或鎳金屬粉末之成分，僅需同時將銅或鎳金屬粉末與該銀金屬粉末3混練後，形成銀銅金屬粉末、銀鎳金屬粉末或銀銅鎳金屬粉末，將所選擇金屬粉末均勻散佈於該軟質金屬製成之金屬薄片2中即可，依據上述步驟進行該滾壓裝置1進行滾壓，如此，透過重複折疊滾壓動作，便可獲得如上述之組成比例之複合合金組成物4。Referring to Fig. 1, the special composite alloy composition of the present invention is preferably produced by the following processes, and of course, may be selected and mixed by other means: as shown in Fig. 1, the rolling and kneading method is For example, first, the soft metal, such as tin, indium or tin indium alloy, is rolled into a plurality of metal foils 2 by a rolling device 1, and then silver metal powder 3 having a particle size of between 10 nm and 200 μm is obtained. Evenly distributed between the plurality of metal foils 2, and after being rolled by the rolling device 1, a rolled sheet 2' can be formed; and the rolled sheet 2' is further folded and then passed through the roll. The pressing device 1 is rolled, so that the silver metal powder 3 can be uniformly kneaded into the metal foil 2 made of the soft metal by repeated folding and rolling operations, thereby obtaining a special composite alloy composition having the composition ratio as described above. Matter 4. If it is desired to additionally add the copper metal powder or the nickel metal powder component, it is only necessary to simultaneously knead the copper or nickel metal powder with the silver metal powder 3 to form silver copper metal powder, silver nickel metal powder or silver copper nickel metal powder. The selected metal powder is evenly dispersed in the metal foil 2 made of the soft metal, and the rolling device 1 is rolled according to the above steps. Thus, by repeating the folding rolling action, the composition as described above can be obtained. Proportion of composite alloy composition 4.
請參照第2至4圖所示，本發明之特殊複合合金組成物由於在熱反應前具有低熔點、質軟及延展性佳等特性，因此可應用於「微熱壓成型(Hot Embossing)」製程，以製作金屬微型元件。舉例而言，僅需透過一加熱裝置5對上述本發明之特殊複合合金組成物4進行加熱，且加熱溫度T係較佳係接近該特殊複合合金組成物4之熔點溫度(Tm )，例如Tm -100℃<T<Tm +100℃之溫度區間；接著，再於一大氣壓或一真空環境下以一模具6壓蓋於該特殊複合合金組成物4上，便可使該模具6上之圖案61轉印製該特殊複合合金組成物4上，以於該特殊複合合金組成物4之表面形成對應該圖案之微結構41；接著，使該特殊複合合金組成物4與該模具6接觸並保持溫度一段時間，以使該特殊複合合金組成物4內之金屬進行「等溫凝固」反應，進而形成具有高熔點及高硬度之介金屬化合物；接著進行冷卻，再將該模具移除，便可使該特殊複合合金組成物4形成金屬微型元件，且該特殊複合合金組成物4之表面係可形成微齒痕、微流道等微結構41，例如本實施例之特殊複合合金組成物4之表面之微結構41便選擇為微流道之形式，如第5圖所示。該微型金屬元件完成熱反應後之特殊複合合金組成物4具有高硬度、高熔點、高強度、尺寸穩定及導電特性佳等特性，可作為微機電系統(Micro Electro-Mechanical System,MEMS)之應用。如此，本發明具低熔點、質軟及延展性佳之特殊複合合金組成物4可應用於「微熱壓成型」製程，可有效克服習知一般金屬因具有熔點過高及塑性不佳等缺點，而無法適用於「微熱壓成型」製程之技術問題；且本發明之特殊複合合金組成物4經「微熱壓成型」製程處理後，便可形成具有高硬度、高熔點、高強度、尺寸穩定及導電特性佳等特性之金屬微型元件，可有效提高該金屬微型元件之應用層面。當然本發明複合合金組成物的應用並不侷限於為熱壓成型。舉例而言，本發明之初始複合合金組成物由於具有低熔點、質軟及延展性佳等特性，因此可應用於微電子構裝製程，以製作晶片與晶片的微型電路接點接合，或是晶片與電路載板接點接合。經過迴銲的熱反應後，將晶片與晶片軟銲而成，並隨著電子產品會發熱情形，使用接點過形成具有高硬度、高熔點、高強度、尺寸穩定及導電性佳等特性。Referring to Figures 2 to 4, the special composite alloy composition of the present invention can be applied to the "Hot Embossing" process because of its low melting point, softness, and ductility before thermal reaction. To make metal micro-components. For example, the special composite alloy composition 4 of the present invention described above is heated only by a heating device 5, and the heating temperature T is preferably close to the melting point temperature (T m ) of the special composite alloy composition 4, for example. a temperature range of T m -100 ° C < T < T m + 100 ° C; then, the mold 6 can be pressed onto the special composite alloy composition 4 by a mold 6 under an atmospheric pressure or a vacuum atmosphere. The upper pattern 61 is transferred onto the special composite alloy composition 4 to form a corresponding patterned microstructure 41 on the surface of the special composite alloy composition 4; then, the special composite alloy composition 4 and the mold 6 are formed. Contacting and maintaining the temperature for a period of time to cause an "isothermal solidification" reaction of the metal in the special composite alloy composition 4 to form a metal intermetallic compound having a high melting point and high hardness; then cooling and then removing the mold The special composite alloy composition 4 can be formed into a metal micro-component, and the surface of the special composite alloy composition 4 can form micro-structures such as micro-tooth marks and micro-flow channels, such as the special composite alloy group of the embodiment. Microstructured surface 41 of the object 4 will be selected to form the micro-channel, as shown in Figure 5. The special composite alloy composition 4 after the thermal reaction of the micro metal component has high hardness, high melting point, high strength, dimensional stability and good electrical conductivity, and can be used as a micro electro-mechanical system (MEMS). . Thus, the special composite alloy composition 4 having low melting point, soft texture and good ductility can be applied to the "micro-hot press forming" process, and can effectively overcome the disadvantages of the conventional metal due to excessive melting point and poor plasticity. It is not applicable to the technical problems of the "micro-hot press forming"process; and the special composite alloy composition 4 of the present invention can be formed into a high hardness, a high melting point, a high strength, a dimensionally stable and electrically conductive after being subjected to a "micro-hot press forming" process. Metal micro-components with excellent characteristics can effectively improve the application level of the metal micro-components. Of course, the application of the composite alloy composition of the present invention is not limited to hot press forming. For example, the initial composite alloy composition of the present invention has low melting point, good softness and good ductility, and thus can be applied to a microelectronic fabrication process to make a micro-circuit joint of a wafer and a wafer, or The wafer is bonded to the circuit carrier contacts. After the thermal reaction of reflowing, the wafer is soldered to the wafer, and as the electronic product is heated, the contact is formed to have characteristics of high hardness, high melting point, high strength, dimensional stability, and good electrical conductivity.
以下揭示本發明第一至第四實施例之特殊複合合金組成物之比例：本發明之較佳第一實施例之特殊複合合金組成物中，該軟質金屬係選擇為錫，該特殊複合合金組成物係包含以重量百分比計72～74.5%之銀及24.5～27%之錫，較佳係包含74%之銀及26%之錫，本實施例之特殊複合合金組成物係可選擇於230℃至400℃之間加熱進行該「微熱壓成型」製程，較佳係為260℃，且於加熱反應後，其金屬微型元件內部組織可形成大量Ag3 Sn之介金屬組成物或單一組織結構的Ag3 Sn之介金屬組成物，可大幅提昇熔點及硬度。Hereinafter, the ratio of the special composite alloy composition of the first to fourth embodiments of the present invention is disclosed: in the special composite alloy composition of the preferred first embodiment of the present invention, the soft metal is selected to be tin, and the special composite alloy is composed. The system comprises 72 to 74.5% by weight of silver and 24.5 to 27% of tin, preferably 74% of silver and 26% of tin. The special composite alloy composition of the embodiment can be selected at 230 ° C. The "micro-hot press forming" process is preferably carried out by heating to 400 ° C, preferably 260 ° C, and after the heating reaction, the internal structure of the metal micro-component can form a large amount of Ag 3 Sn meso-metal composition or a single structure. The metal composition of Ag 3 Sn can greatly increase the melting point and hardness.
本發明之較佳第二實施例之特殊複合合金組成物中，該軟質金屬係選擇為銦，該特殊複合合金組成物係包含以重量百分比計為29～67.5%之銀及31.5～70%之銦，於本第二實施例中，較佳係包含29～32%之銀及66.5～70%之銦，最佳係為31.7%之銀及68.1%之銦，另包含0.2%之銅，本實施例之特殊複合合金組成物係可選擇於100℃至160℃之間加熱進行該「微熱壓成型」製程，較佳係為156℃，且於加熱反應後，其金屬微型元件內部組織可形成大量AgIn2 之介金屬化合物或單一組織結構的AgIn2 之介金屬組成物，可大幅提昇熔點及硬度。In a special composite alloy composition according to a preferred second embodiment of the present invention, the soft metal is selected from indium, and the special composite alloy composition comprises 29 to 67.5% by weight of silver and 31.5 to 70% by weight. Indium, in the second embodiment, preferably comprises 29 to 32% of silver and 66.5 to 70% of indium, preferably 31.7% of silver and 68.1% of indium, and further comprises 0.2% of copper, The special composite alloy composition of the embodiment may be selected to be heated between 100 ° C and 160 ° C to perform the "micro hot press forming" process, preferably 156 ° C, and after the heating reaction, the internal structure of the metal micro-component may be formed. AgIn intermetallic composition intermetallic compound or a single large tissue structures of AgIn 2 of 2, can significantly improve the hardness and melting point.
本發明之較佳第三實施例之特殊複合合金組成物中，該軟質金屬係選擇為銦，該特殊複合合金組成物係包含以重量百分比計為29～67.5%之銀及31.5～70%之銦，於本第三實施例中，較佳係包含64～67.5%之銀及31.5～35%之銦，最佳係為66.7%之銀及32%之銦，另包含0.3%之鎳，本實施例之特殊複合合金組成物係可選擇於150℃至250℃之間加熱進行該「微熱壓成型」製程，較佳係為220℃，且於加熱反應後，其金屬微型元件內部組織可形成大量Ag2 In之介金屬化合物或單一組織結構的Ag2 In之介金屬組成物。In a special composite alloy composition according to a preferred third embodiment of the present invention, the soft metal is selected from indium, and the special composite alloy composition comprises 29 to 67.5% by weight of silver and 31.5 to 70% by weight. Indium, in the third embodiment, preferably comprises 64 to 67.5% of silver and 31.5 to 35% of indium, preferably 66.7% of silver and 32% of indium, and further comprises 0.3% of nickel, The special composite alloy composition of the embodiment may be selected by heating at 150 ° C to 250 ° C for the "micro hot press forming" process, preferably 220 ° C, and after the heating reaction, the internal structure of the metal micro-component may be formed. Ag large intermetallic compound or a single organizational structure of the intermetallic compound Ag 2 in 2 in the compositions.
本發明之較佳第四實施例之特殊複合合金組成物中，該軟質金屬係包含為錫銦合金之組成；該特殊複合合金組成物係包含以重量百分比計為29～60%之銀、19～35%之錫及20～35.2%之銦，於本第四實施例中，較佳係為35%之銀、30%之錫及35%之銦，本實施例之特殊複合合金組成物係可選擇於150℃至250℃之間加熱進行該「微熱壓成型」製程，較佳係為200℃，且於加熱反應後，其金屬微型元件內部組織可形成大量(Ag3 Sn、Ag2 In、AgIn2 及AgInSn2 )之介金屬化合物。如此，便可依照使用之「微熱壓成型」製程溫度，進一步調整該特殊複合合金組成物中銀及軟質金屬之間之配比，以符合使用上之需求。In a special composite alloy composition according to a preferred fourth embodiment of the present invention, the soft metal is comprised of a composition of a tin-indium alloy; the special composite alloy composition comprises 29 to 60% by weight of silver, 19 ～35% tin and 20-35.2% indium, in the fourth embodiment, preferably 35% silver, 30% tin and 35% indium, the special composite alloy composition of the embodiment The "micro-hot press forming" process may be optionally performed by heating between 150 ° C and 250 ° C, preferably 200 ° C, and after heating, the internal structure of the metal micro-components may be formed in a large amount (Ag 3 Sn, Ag 2 In a metal intermetallic compound of AgIn 2 and AgInSn 2 ). In this way, the ratio between silver and soft metal in the special composite alloy composition can be further adjusted according to the "micro-hot press forming" process temperature used to meet the requirements of use.
如上所述，本發明透過將銀金屬粉末混練入該軟質金屬中，以形成該具低熔點、質軟及延展性佳之特殊複合合金組成物，使得該特殊複合合金組成物可適用於「微熱壓成型」製程。該特殊複合合金組成物經熱反應處理(例如微熱壓成型製程)後可形成具有高硬度、高熔點、高強度、尺寸穩定及導電特性佳之介金屬化合物，可有效提升該特殊複合合金組成物之特性。As described above, the present invention is obtained by kneading a silver metal powder into the soft metal to form a special composite alloy composition having a low melting point, a soft texture, and a good ductility, so that the special composite alloy composition can be applied to "small hot pressing". Molding process. The special composite alloy composition can form a mesometallic compound having high hardness, high melting point, high strength, dimensional stability and good electrical conductivity by thermal reaction treatment (for example, micro-hot press forming process), which can effectively enhance the composition of the special composite alloy. characteristic.
另外，本發明之複合合金組成物亦可應用於做為電子元件之表面黏著技術(surface mount technology,SMT)的焊料，以便將電子元件銲接接合於電路板(例如主機板或手機板)上，尤其立體式之晶片構裝應用(3D packaging)。本發明複合合金組成物能承受立體式晶片構裝在使用所產生高溫問題。惟，上述僅是列舉說明發明之複合合金組成物的可能應用領域，但並非用以限制本發明。In addition, the composite alloy composition of the present invention can also be applied as a surface mount technology (SMT) solder for electronic components to solder electronic components to a circuit board (such as a motherboard or a mobile phone board). Especially three-dimensional wafer assembly application (3D packaging). The composite alloy composition of the present invention can withstand the high temperature problems caused by the use of a three-dimensional wafer package. However, the above is merely illustrative of possible fields of application of the composite alloy composition of the invention, but is not intended to limit the invention.
本發明之特殊複合合金組成物具有低熔點、低硬度及高延性，可應用於微熱壓成型製程。且該特殊複合合金組成物經熱反應處理(例如微熱壓成型製程)後可形成具有高硬度、高熔點、高強度、尺寸穩定及導電特性佳之介金屬化合物，可有效提升該特殊複合合金組成物之特性。The special composite alloy composition of the invention has low melting point, low hardness and high ductility, and can be applied to a micro hot press forming process. And the special composite alloy composition can form a mesometallic compound having high hardness, high melting point, high strength, dimensional stability and good electrical conductivity by thermal reaction treatment (for example, micro-compression molding process), and can effectively enhance the special composite alloy composition. Characteristics.
雖然本發明已利用上述較佳實施例揭示，然其並非用以限定本發明，任何熟習此技藝者在不脫離本發明之精神和範圍之內，相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of the invention is defined by the scope of the appended claims.
1．．．滾壓裝置1. . . Rolling device
2．．．金屬薄片2. . . foil
2’．．．滾壓薄片2'. . . Rolling sheet
3．．．銀金屬粉末3. . . Silver metal powder
4．．．金屬組成物4. . . Metal composition
41．．．微結構41. . . microstructure
5．．．加熱裝置5. . . heating equipment
6．．．模具6. . . Mold
61．．．圖案61. . . pattern
第1圖：本發明之特殊複合合金組成物之製作示意圖。Fig. 1 is a schematic view showing the production of a special composite alloy composition of the present invention.
第2圖：本發明之特殊複合合金組成物進行微熱壓成型製程之示意圖。Fig. 2 is a schematic view showing a microcompression molding process of the special composite alloy composition of the present invention.
第3圖：本發明之特殊複合合金組成物進行微熱壓成型製程之模具壓蓋示意圖。Fig. 3 is a schematic view showing the mold gland of the special composite alloy composition of the present invention subjected to a micro-hot press forming process.
第4圖：經微熱壓成型製程後之金屬微型元件。Figure 4: Metal micro-components after micro-hot press forming process.
第5圖：具有微管道之金屬微型元件。Figure 5: Metal micro-components with micro-pipes.
1．．．滾壓裝置1. . . Rolling device
2．．．金屬薄片2. . . foil
2’．．．滾壓薄片2'. . . Rolling sheet
3．．．銀金屬粉末3. . . Silver metal powder
4．．．金屬組成物4. . . Metal composition
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| US6140402A (en) * | 1993-07-30 | 2000-10-31 | Diemat, Inc. | Polymeric adhesive paste |
| US6093265A (en) * | 1997-07-22 | 2000-07-25 | Olin Corporation | Copper alloy having improved stress relaxation |
| US7514037B2 (en) * | 2002-08-08 | 2009-04-07 | Kobe Steel, Ltd. | AG base alloy thin film and sputtering target for forming AG base alloy thin film |
| US7740420B2 (en) * | 2007-02-13 | 2010-06-22 | Nicolon Corporation | Retaining wall having artificial grass reinforcing fabric and methods for installing the fabric thereto |
-
2009
- 2009-09-23 TW TW098132152A patent/TWI404809B/en active
-
2010
- 2010-08-25 US US12/862,837 patent/US20110070122A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7261760B2 (en) * | 2001-03-06 | 2007-08-28 | Kiyohito Ishida | Member having separation structure and method for manufacture thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016103503A1 (en) | 2015-06-25 | 2016-12-29 | RayShine Photonics Corp. | Silver alloy material and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201111524A (en) | 2011-04-01 |
| US20110070122A1 (en) | 2011-03-24 |
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