TWI403261B - Wireless communication device and electromagnetic shielding apparatus thereof - Google Patents
Wireless communication device and electromagnetic shielding apparatus thereof Download PDFInfo
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- TWI403261B TWI403261B TW96141434A TW96141434A TWI403261B TW I403261 B TWI403261 B TW I403261B TW 96141434 A TW96141434 A TW 96141434A TW 96141434 A TW96141434 A TW 96141434A TW I403261 B TWI403261 B TW I403261B
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- 239000010410 layer Substances 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 24
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 22
- 239000011247 coating layer Substances 0.000 claims description 13
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 11
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 7
- 229920005372 Plexiglas® Polymers 0.000 claims description 7
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims 1
- 239000000075 oxide glass Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002594 fluoroscopy Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- GRPQBOKWXNIQMF-UHFFFAOYSA-N indium(3+) oxygen(2-) tin(4+) Chemical compound [Sn+4].[O-2].[In+3] GRPQBOKWXNIQMF-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Description
本發明涉及一種無線通訊設備，尤其涉及一種採用電磁遮罩裝置的無線通訊設備。 The present invention relates to a wireless communication device, and more particularly to a wireless communication device using an electromagnetic shielding device.
目前，無線通訊技術已較為成熟，各種無線通訊設備得到廣泛應用。常見的無線通訊設備一般有手機、個人數位助理(PDA，Personal Digital Assistant)、具有無線網卡的電腦等等。所述無線通訊設備一般通過電磁波來傳輸信號。而電磁波會對所述無線通訊設備中其他電子元件造成電磁干擾，還有可能對用戶的身體健康造成一定的影響。因此，有必要提供電磁遮罩裝置以遮罩所述電磁波。 At present, wireless communication technology is relatively mature, and various wireless communication devices are widely used. Common wireless communication devices generally include mobile phones, personal digital assistants (PDAs), computers with wireless network cards, and the like. The wireless communication device typically transmits signals through electromagnetic waves. The electromagnetic wave may cause electromagnetic interference to other electronic components in the wireless communication device, and may also have a certain impact on the user's physical health. Therefore, it is necessary to provide an electromagnetic shielding device to shield the electromagnetic waves.
圖1為手機100的結構示意圖。其中，手機100包括前蓋110、後蓋120、印刷電路板(PCB，Printed Circuit Board)130及電磁遮罩裝置140。印刷電路板130被收容在前蓋110及後蓋120之間。電磁遮罩裝置140設置在印刷電路板130與後蓋120之間。前蓋110具有透視玻璃112以保護印刷電路板130正面的顯示視窗(圖未示)。印刷電路板130背面具有射頻收發模組132以接收或發送電磁波。電磁遮罩裝置140對應射頻收 發模組132的位置進行設置，以遮罩射頻收發模組132除正常收發電磁波之外向其他周邊散發的電磁波。電磁遮罩裝置140一般採用金屬製成，比如鋁及錫。 FIG. 1 is a schematic structural view of a mobile phone 100. The mobile phone 100 includes a front cover 110, a rear cover 120, a printed circuit board (PCB) 130, and an electromagnetic shielding device 140. The printed circuit board 130 is housed between the front cover 110 and the rear cover 120. The electromagnetic shielding device 140 is disposed between the printed circuit board 130 and the back cover 120. The front cover 110 has a see-through glass 112 to protect a display window (not shown) on the front side of the printed circuit board 130. The back side of the printed circuit board 130 has a radio frequency transceiver module 132 for receiving or transmitting electromagnetic waves. The electromagnetic shielding device 140 corresponds to the radio frequency receiving The position of the hair module 132 is set to mask the electromagnetic waves radiated by the RF transceiver module 132 to other peripherals except for the normal transmission and reception of electromagnetic waves. The electromagnetic shielding device 140 is generally made of metal such as aluminum and tin.
雖然金屬製成的電磁遮罩裝置140對電磁波具有較好的衰減作用，然而在實際生產中，當射頻收發模組132出現問題時，工程人員需要先撤下設置在射頻收發模組132上方的電磁遮罩裝置140，然後才能查看射頻收發模組132。所述操作較為不便。 Although the electromagnetic shielding device 140 made of metal has a good attenuation effect on the electromagnetic wave, in actual production, when there is a problem in the RF transceiver module 132, the engineer needs to first remove the setting above the RF transceiver module 132. The electromagnetic shielding device 140 can be used to view the RF transceiver module 132. The operation is inconvenient.
有鑒於此，有必要提供一種可透視的電磁遮罩裝置。 In view of this, it is necessary to provide a see-through electromagnetic shielding device.
還有必要提供一種具有可透視的電磁遮罩裝置的無線通訊設備。 It is also necessary to provide a wireless communication device having a see-through electromagnetic shielding device.
一種電磁遮罩裝置用於遮罩電磁波。所述電磁遮罩裝置包括有機玻璃層及在所述有機玻璃層上鍍的氧化銦錫鍍膜層。 An electromagnetic shielding device is used to cover electromagnetic waves. The electromagnetic shielding device includes an organic glass layer and an indium tin oxide plating layer plated on the organic glass layer.
一種無線通訊設備包括印刷電路板、電磁遮罩裝置及後蓋。所述印刷電路板具有射頻收發模組。所述電磁遮罩裝置對應地設置在所述射頻收發模組與所述後蓋之間。所述電磁遮罩裝置包括有機玻璃層及在所述有機玻璃層上鍍的氧化銦錫鍍膜層。 A wireless communication device includes a printed circuit board, an electromagnetic shielding device, and a back cover. The printed circuit board has a radio frequency transceiver module. The electromagnetic shielding device is correspondingly disposed between the radio frequency transceiver module and the back cover. The electromagnetic shielding device includes an organic glass layer and an indium tin oxide plating layer plated on the organic glass layer.
上述無線通訊設備採用的電磁遮罩裝置以透明的有機玻璃層及在所述有機玻璃層上鍍的氧化銦錫鍍膜層構成。所述電磁遮罩裝置在較好的完成對電磁波的遮罩的同時提供了可透視 的功能，從而在對所述射頻收發模組進行檢測時，無需拆除所述電磁遮罩裝置，即可查看所述射頻收發模組。 The electromagnetic shielding device used in the wireless communication device is composed of a transparent organic glass layer and an indium tin oxide plating layer plated on the organic glass layer. The electromagnetic shielding device provides a fluoroscopy while completing a mask for electromagnetic waves The function is such that when the RF transceiver module is detected, the RF transceiver module can be viewed without removing the electromagnetic shielding device.
100‧‧‧手機 100‧‧‧Mobile phones
110‧‧‧前蓋 110‧‧‧ front cover
112‧‧‧透視玻璃 112‧‧‧Perspective glass
120‧‧‧後蓋 120‧‧‧Back cover
130‧‧‧印刷電路板 130‧‧‧Printed circuit board
132‧‧‧射頻收發模組 132‧‧‧RF transceiver module
140‧‧‧電磁遮罩裝置 140‧‧‧Electromagnetic shielding device
300‧‧‧無線通訊設備 300‧‧‧Wireless communication equipment
310‧‧‧前蓋 310‧‧‧ front cover
312‧‧‧透視玻璃 312‧‧‧Perspective glass
320‧‧‧後蓋 320‧‧‧Back cover
330‧‧‧印刷電路板 330‧‧‧Printed circuit board
332‧‧‧射頻收發模組 332‧‧‧RF transceiver module
340、540‧‧‧電磁遮罩裝置 340, 540‧‧ ‧ electromagnetic shielding device
342‧‧‧有機玻璃層 342‧‧‧ plexiglass layer
344‧‧‧二氧化矽鍍膜層 344‧‧‧2 bismuth oxide coating
346‧‧‧氧化銦錫鍍膜層 346‧‧‧Indium tin oxide coating
542‧‧‧蜂巢式網孔 542‧‧‧ Honeycomb mesh
888‧‧‧普通玻璃的電磁遮罩曲線 888‧‧‧Electromagnetic mask curve of ordinary glass
999‧‧‧氧化銦錫玻璃的電磁遮罩曲線 Electromagnetic mask curve of 999‧‧‧ indium tin oxide glass
圖1係一傳統的手機的結構示意圖。 FIG. 1 is a schematic structural view of a conventional mobile phone.
圖2係本發明一較佳實施方式的無線通訊設備的結構示意圖。 2 is a schematic structural diagram of a wireless communication device according to a preferred embodiment of the present invention.
圖3係本發明一較佳實施方式的電磁遮罩裝置的結構示意圖。 3 is a schematic structural view of an electromagnetic shielding device according to a preferred embodiment of the present invention.
圖4係氧化銦錫玻璃及普通玻璃對電磁波的遮罩效果曲線圖。 Fig. 4 is a graph showing the effect of the indium oxide tin glass and the ordinary glass on the electromagnetic wave.
圖5係本發明一較佳實施方式的氧化銦錫玻璃的示意圖。 Figure 5 is a schematic illustration of an indium tin oxide glass in accordance with a preferred embodiment of the present invention.
如圖2所示，一較佳實施方式揭示的無線通訊設備300包括前蓋310、後蓋320、印刷電路板330及電磁遮罩裝置340。印刷電路板330被收容在前蓋310及後蓋320之間。電磁遮罩裝置340設置在印刷電路板330與後蓋320之間。前蓋310具有透視玻璃312以保護印刷電路板330正面的顯示視窗(圖未示)。印刷電路板330背面具有射頻收發模組332以接收或發送電磁波。電磁遮罩裝置340對應地設置在射頻收發模組332的上方，以遮罩射頻收發模組332周圍的電磁波。 As shown in FIG. 2, a wireless communication device 300 disclosed in a preferred embodiment includes a front cover 310, a rear cover 320, a printed circuit board 330, and an electromagnetic shielding device 340. The printed circuit board 330 is housed between the front cover 310 and the rear cover 320. The electromagnetic shielding device 340 is disposed between the printed circuit board 330 and the back cover 320. The front cover 310 has a see-through glass 312 to protect a display window (not shown) on the front side of the printed circuit board 330. The back side of the printed circuit board 330 has a radio frequency transceiver module 332 for receiving or transmitting electromagnetic waves. The electromagnetic shielding device 340 is correspondingly disposed above the RF transceiver module 332 to shield electromagnetic waves around the RF transceiver module 332.
如圖3所示，電磁遮罩裝置340主要以透明的氧化銦錫(ITO，indium tin oxide)玻璃製成。電磁遮罩裝置340包括有機 玻璃層342、二氧化矽鍍膜層344及氧化銦錫鍍膜層346。其中，有機玻璃層342作為主要承載部分，以確保電磁遮罩裝置340的強度。透明的二氧化矽鍍膜層344位於有機玻璃層342與氧化銦錫鍍膜層346之間。由於直接在有機玻璃層342上鍍氧化銦錫的附著力較低，故本施實例中的二氧化矽鍍膜層344用於增加有機玻璃層342、二氧化矽鍍膜層344及氧化銦錫鍍膜層346之間的附著力。氧化銦錫鍍膜層346用於對電磁波進行遮罩操作。在另一實施例中，可以直接在有機玻璃層鍍上氧化銦錫以形成氧化銦錫玻璃。 As shown in FIG. 3, the electromagnetic shielding device 340 is mainly made of transparent indium tin oxide (ITO) glass. Electromagnetic masking device 340 includes organic The glass layer 342, the ruthenium dioxide coating layer 344, and the indium tin oxide plating layer 346. Among them, the organic glass layer 342 serves as a main load bearing portion to ensure the strength of the electromagnetic shielding device 340. The transparent ceria coating layer 344 is located between the organic glass layer 342 and the indium tin oxide plating layer 346. Since the adhesion of indium tin oxide directly on the plexiglass layer 342 is low, the ruthenium dioxide coating layer 344 in the present embodiment is used to increase the plexiglass layer 342, the yttria coating layer 344, and the indium tin oxide coating layer. Adhesion between 346. The indium tin oxide plating layer 346 is used to perform a masking operation on electromagnetic waves. In another embodiment, indium tin oxide may be plated directly onto the plexiglass layer to form indium tin oxide glass.
如圖4所示，由普通玻璃的電磁遮罩曲線888可以看出：針對100MHz-1500MHz頻段的電磁波，普通玻璃幾乎不產生遮罩效應。因此，所述頻段的電磁波可以穿透普通玻璃，從而對其他電子元件產生干擾。由氧化銦錫玻璃的電磁遮罩曲線999可以看出：針對100MHz-1500MHz頻段的電磁波，氧化銦錫玻璃可以產生較好的遮罩效應，至少可以衰減電磁波至20dB以上。 As shown in FIG. 4, it can be seen from the electromagnetic mask curve 888 of ordinary glass that ordinary glass has almost no mask effect for electromagnetic waves in the frequency band of 100 MHz to 1500 MHz. Therefore, electromagnetic waves in the frequency band can penetrate ordinary glass, thereby causing interference to other electronic components. It can be seen from the electromagnetic mask curve 999 of indium tin oxide glass that for the electromagnetic wave in the frequency band of 100MHz-1500MHz, the indium tin oxide glass can produce a better masking effect, and at least can attenuate the electromagnetic wave to more than 20dB.
因此，採用氧化銦錫鍍膜層346的電磁遮罩裝置340對電磁波具有較好的遮罩效果。由於電磁遮罩裝置340為透明的氧化銦錫玻璃，故具有較高的透光性能。在對射頻收發模組332進行檢測時，無需拆除電磁遮罩裝置340，即可查看射頻收發模組332。此外，如圖5所示，在另一較佳實施方式中，以氧化銦錫玻璃製成的電磁遮罩裝置540還可以形成有以多個蜂巢式網孔542構成的陣列結構。電磁遮罩裝置540在具有較 好電磁遮罩性能及可透視性能的基礎上，進一步增加了較好的散熱性能。 Therefore, the electromagnetic shielding device 340 using the indium tin oxide plating layer 346 has a good masking effect on electromagnetic waves. Since the electromagnetic shielding device 340 is transparent indium tin oxide glass, it has high light transmission performance. When the RF transceiver module 332 is detected, the RF transceiver module 332 can be viewed without removing the electromagnetic mask device 340. In addition, as shown in FIG. 5, in another preferred embodiment, the electromagnetic shielding device 540 made of indium tin oxide glass may also be formed with an array structure composed of a plurality of honeycomb cells 542. The electromagnetic shielding device 540 has a comparison On the basis of good electromagnetic shielding performance and see-through performance, it further increases the better heat dissipation performance.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在援依本案創作精神所作之等效修飾或變化，皆應包含於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above descriptions are only the preferred embodiments of the present invention, and those skilled in the art will be able to include equivalent modifications or variations in the spirit of the present invention.
340‧‧‧電磁遮罩裝置 340‧‧‧Electromagnetic shielding device
342‧‧‧有機玻璃層 342‧‧‧ plexiglass layer
344‧‧‧二氧化矽鍍膜層 344‧‧‧2 bismuth oxide coating
346‧‧‧氧化銦錫鍍膜層 346‧‧‧Indium tin oxide coating
Claims (6)
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| TW96141434A TWI403261B (en) | 2007-11-02 | 2007-11-02 | Wireless communication device and electromagnetic shielding apparatus thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| TW96141434A TWI403261B (en) | 2007-11-02 | 2007-11-02 | Wireless communication device and electromagnetic shielding apparatus thereof |
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| TWI403261B true TWI403261B (en) | 2013-07-21 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM241450U (en) * | 2002-10-08 | 2004-08-21 | Jang Guo Ying | Structure of cellular electromagnetic protection wall |
| TWI236970B (en) * | 2002-07-24 | 2005-08-01 | Tdk Corp | A functional film with functional layers for transfer uses, an object with imparted functional layer and its production method |
| TWI247675B (en) * | 2004-12-29 | 2006-01-21 | Sch Electronics Co Ltd | Lamination composite optical material |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI236970B (en) * | 2002-07-24 | 2005-08-01 | Tdk Corp | A functional film with functional layers for transfer uses, an object with imparted functional layer and its production method |
| TWM241450U (en) * | 2002-10-08 | 2004-08-21 | Jang Guo Ying | Structure of cellular electromagnetic protection wall |
| TWI247675B (en) * | 2004-12-29 | 2006-01-21 | Sch Electronics Co Ltd | Lamination composite optical material |
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