TWI402871B - Nickel paste for monolithic laminating ceramic capacitors - Google Patents

Nickel paste for monolithic laminating ceramic capacitors Download PDF

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TWI402871B
TWI402871B TW94133444A TW94133444A TWI402871B TW I402871 B TWI402871 B TW I402871B TW 94133444 A TW94133444 A TW 94133444A TW 94133444 A TW94133444 A TW 94133444A TW I402871 B TWI402871 B TW I402871B
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nickel
dithiol
paste
binder
weight
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Hirotaka Takahashi
Tadakuni Naya
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Sumitomo Metal Mining Co
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積層陶瓷電容用鎳糊Nickel paste for laminated ceramic capacitors

本發明係關於為了形成積層陶瓷電容(MLCC)之內部電極所使用的鎳糊。The present invention relates to a nickel paste used for forming an internal electrode of a laminated ceramic capacitor (MLCC).

近年來,伴隨著電子機器的小型化而急速地進行各種電子構件的小型化,在積層陶瓷電容中亦進行著小型.高容量化。積層陶瓷電容具有交互重疊、燒結並一體化陶瓷介電體層與內部電極層的構造。還有,積層陶瓷電容的內部電極材料方面,雖從以往以來使用著鈀等貴重金屬,但現在則為了成本降低而以鎳成為主流。In recent years, with the miniaturization of electronic devices, various electronic components have been rapidly miniaturized, and small-sized multilayer ceramic capacitors have also been used. High capacity. The multilayer ceramic capacitor has a structure of mutually overlapping, sintered and integrated ceramic dielectric layer and internal electrode layer. Further, in the case of the internal electrode material of the multilayer ceramic capacitor, precious metals such as palladium have been used in the past, but now, nickel has become the mainstream for cost reduction.

一般而言,在積層陶瓷電容的製造步驟中,例如印刷分散作為內部電極材料之鎳粉於媒液中的鎳糊於陶瓷基板或陶瓷綠板上,在將其多層地堆疊的狀態下加熱壓著而一體化。其次,在氧化性氛圍氣體或非活性氛圍氣體中,以500℃以下進行脫黏合劑,然後在未氧化內部電極下,在還原氛圍氣體中進行加熱燒成。In general, in the manufacturing step of the laminated ceramic capacitor, for example, a nickel paste in which a nickel powder as an internal electrode material is dispersed in a vehicle liquid is printed on a ceramic substrate or a ceramic green plate, and heated in a state in which the layers are stacked in multiple layers. And integration. Next, in an oxidizing atmosphere gas or an inert atmosphere, a binder is removed at 500 ° C or lower, and then heated and fired in a reducing atmosphere under an unoxidized internal electrode.

然而,在上述燒成步驟中,由於陶瓷介電體層與鎳內部電極層之燒結-收縮的不契合,容易產生所謂層間剝離或龜裂的構造缺陷。特別是伴隨著小型.高容量化,除了積層數變多或除了陶瓷介電體層的厚度變薄之外,構造缺陷的產生變得顯著。However, in the above-described firing step, since the ceramic dielectric layer does not conform to the sintering-contraction of the nickel internal electrode layer, structural defects such as interlayer peeling or cracking tend to occur. Especially with small size. The capacity is increased, and the generation of structural defects becomes remarkable, in addition to the increase in the number of layers or the thinning of the thickness of the ceramic dielectric layer.

相對於相關之問題,正熱烈地研究減少鎳內部電極層的厚度,並緩和燒結-收縮的不契合。用於其中之一方法方面,有使鎳粉的粒子形狀變成球形且表面變得光滑,來改善鎳粒子之充填性的方法(國際公開99/42237號小冊子)。Relative to the related problems, it is eagerly studied to reduce the thickness of the internal electrode layer of nickel and to alleviate the mismatch of sintering-contraction. For one of the methods, there is a method of making the particle shape of the nickel powder into a spherical shape and smoothing the surface to improve the filling property of the nickel particles (International Publication No. 99/42237 pamphlet).

又,在脫黏合劑步驟中氧化鎳粉,並在後來之還原氛圍氣體中的燒成步驟中與還原同時進行激烈的燒結-收縮,其結果為擴大燒結-收縮的不契合,容易助長層間剝離。故提案有添加磷(P)於鎳粉的方法(特開2002-150834號公報),或控制鎳粉表面的氧化皮膜來提升耐氧化性的方法(特開2001-152202號公報)等作為其對策。Further, in the debinding agent step, the nickel oxide powder is oxidized and subjected to intense sintering-shrinkage simultaneously with the reduction in the subsequent calcination step in the reducing atmosphere gas, and as a result, the sintering-contraction is not integrated, and the interlayer peeling is easily promoted. . Therefore, there is a method of adding phosphorus (P) to nickel powder (Japanese Laid-Open Patent Publication No. 2002-150834), or a method of controlling an oxide film on the surface of a nickel powder to improve oxidation resistance (Japanese Laid-Open Patent Publication No. 2001-152202). Countermeasures.

然而,近年來,更加進行陶瓷介電體層及鎳內部電極層的薄層化、或陶瓷介電體層與鎳內部電極層之積層數的增大,伴隨於此而僅以如上述的方法,則難以充分地消除構造缺陷。However, in recent years, the thinning of the ceramic dielectric layer and the nickel internal electrode layer or the increase in the number of layers of the ceramic dielectric layer and the nickel internal electrode layer are further increased, and the method is as described above. It is difficult to sufficiently eliminate structural defects.

本發明係鑑於上述之習知問題者,以在積層陶瓷電容的脫黏合劑步驟及之後的燒成步驟中,提供可防止層間剝離等之構造缺陷的產生,並適合於鎳內部電極之形成的鎳糊為目的。In view of the above-mentioned conventional problems, the present invention provides a structure defect preventing interlayer peeling or the like in the debonding step of the laminated ceramic capacitor and the subsequent firing step, and is suitable for the formation of the nickel internal electrode. Nickel paste is for the purpose.

發明者等對於在積層陶瓷電容的製造過程中之構造缺陷的產生,專心一志研究的結果,發現藉由脫黏合劑步驟中之鎳粉與黏合劑的相互作用,來變化陶瓷介電體層與鎳內部電極層之燒結-收縮的不契合。The inventors have focused on the occurrence of structural defects in the fabrication process of laminated ceramic capacitors, and have found that the ceramic dielectric layer and nickel are changed by the interaction of the nickel powder and the binder in the debonding step. The sintering-contraction of the internal electrode layer does not fit.

即,在習知之鎳糊中,在脫黏合劑步驟途中,藉由鎳粒子表面的觸媒活性來加速黏合劑的熱分解,例如在黏合劑為乙基纖維素等的情況下,在約260℃附近熱分解,判斷引起激烈的氣體產生。於該時點的黏合劑熱分解則限定於鎳粒子的表面附近,其他的黏合劑則大致上未分解。因此,了解到因黏合劑的部分分解導致產生的氣體成為封閉在該處內的情形,因該氣體而擴大鎳內部電極層與陶瓷介電體層之間隙。That is, in the conventional nickel paste, the thermal decomposition of the binder is accelerated by the catalytic activity on the surface of the nickel particles in the middle of the debonding step, for example, in the case where the binder is ethyl cellulose or the like, at about 260. Thermal decomposition near °C, judged to cause intense gas generation. The thermal decomposition of the binder at this point is limited to the vicinity of the surface of the nickel particles, and the other binders are substantially undecomposed. Therefore, it is understood that the gas generated by the partial decomposition of the binder is enclosed in the space, and the gap between the nickel internal electrode layer and the ceramic dielectric layer is enlarged by the gas.

由於因在該等脫黏合劑步驟途中之黏合劑的部分分解所導致之激烈的氣體產生,鎳內部電極層與陶瓷介電體層的密著力變弱,或產生部份的層間剝離,其為經過後來的燒成步驟而引起積層陶瓷電容之構造缺陷的原因。近年來因鎳內部電極層的單層薄層化而使鎳粒子的粒徑變得更小,因而同時使鎳粒子表面的觸媒活性亦變得更大,上述現象則變成更大的問題。The adhesion of the nickel internal electrode layer to the ceramic dielectric layer is weakened due to the intense gas generation caused by the partial decomposition of the binder on the way of the debonding step, or a partial interlayer peeling occurs. The subsequent firing step caused the structural defects of the laminated ceramic capacitor. In recent years, since the particle size of the nickel particles is made smaller by the thinning of the single layer of the nickel internal electrode layer, the catalytic activity on the surface of the nickel particles is also increased, and the above phenomenon becomes a larger problem.

為了解決上述問題,本發明者等重複專心一志的研究,發現藉由添加少量含硫化合物於鎳糊中,可抑制對於黏合劑熱分解之鎳粒子表面的觸媒活性,防止因在脫黏合劑步驟途中之部分熱分解所導致之激烈的氣體產生,進而完成本發明。In order to solve the above problems, the inventors of the present invention have repeatedly studied intensively and found that by adding a small amount of a sulfur-containing compound to the nickel paste, the catalytic activity on the surface of the nickel particles thermally decomposed by the binder can be suppressed, and the debonding agent can be prevented from being removed. The present invention has been completed by the intense gas generation caused by the partial thermal decomposition of the steps.

即,本發明所提供之積層陶瓷電容用鎳糊,係以在黏合劑溶解於溶液而成的媒液中將鎳分散,而且包含含硫有機化合物為特徵。該含硫有機化合物的含量以相對於鎳之硫換算係0.01~1重量%為佳。In other words, the nickel paste for laminated ceramic capacitors provided by the present invention is characterized in that nickel is dispersed in a vehicle liquid in which a binder is dissolved in a solution, and a sulfur-containing organic compound is contained. The content of the sulfur-containing organic compound is preferably 0.01 to 1% by weight in terms of sulfur relative to nickel.

又,在由上述本發明而來的積層陶瓷電容用鎳糊中,以前述含硫有機化合物為選自三硫醇類及含硫酸根化合物之至少1種為佳。Further, in the nickel paste for laminated ceramic capacitors according to the above aspect of the invention, the sulfur-containing organic compound is selected from the group consisting of three At least one of a mercaptan and a sulfate-containing compound is preferred.

根據本發明,在積層陶瓷電容製造的脫黏合劑步驟中,可抑制因於糊中之鎳粒子表面的黏合劑熱分解與伴隨其而來之激烈的氣體產生,防止在之後燒成步驟中之層間剝離等構造缺陷的產生。因此,不控制鎳粉的形狀或粒徑,又雖然有所使用的黏合劑或溶劑,但是僅添加極少量的含硫有機化合物於鎳糊中,仍可簡單地製造無構造缺陷的積層陶瓷電容。According to the present invention, in the debonding step of the laminated ceramic capacitor, the thermal decomposition of the binder on the surface of the nickel particles in the paste and the intense gas generation accompanying it can be suppressed, preventing the subsequent firing step. The formation of structural defects such as interlayer peeling. Therefore, the shape or particle size of the nickel powder is not controlled, and although a binder or a solvent is used, only a very small amount of a sulfur-containing organic compound is added to the nickel paste, and a multilayer ceramic capacitor having no structural defects can be easily manufactured. .

本發明中之積層陶瓷電容之內部電極形成用的鎳糊,係於黏合劑溶解於溶劑而成的媒液中,分散鎳粉而得之糊,而且包含含硫有機化合物。The nickel paste for forming an internal electrode of the multilayer ceramic capacitor in the present invention is a paste obtained by dispersing a nickel powder in a vehicle solution in which a binder is dissolved in a solvent, and further contains a sulfur-containing organic compound.

添加於鎳糊的含硫有機化合物為含硫(S)的有機化合物,有不造成糊之黏度特性重大影響者的必要。又,含硫有機化合物係在脫黏合劑步驟中,由於在鎳糊之黏合劑成分開始分解的溫度以下分解.消失,故不可期待所希望的效果,又亦殘留於脫黏合劑步驟之後時,則其本身在高溫下碳化而有部分地阻礙鎳粉燒結的可能性。由該等觀點來看,含硫有機化合物的熱分解溫度係依照通常之脫黏合劑條件,以在含氧的氛圍氣體下為200℃以上、400℃以下,在非活性氛圍氣體下為200℃以上、700℃以下為佳。The sulfur-containing organic compound added to the nickel paste is an organic compound containing sulfur (S), and it is necessary to have a significant influence on the viscosity characteristics of the paste. Further, the sulfur-containing organic compound is decomposed in the debonding step because the temperature at which the binder component of the nickel paste starts to decompose. When it disappears, the desired effect cannot be expected, and when it remains after the debonding step, it itself carbonizes at a high temperature and partially hinders the possibility of sintering the nickel powder. From these viewpoints, the thermal decomposition temperature of the sulfur-containing organic compound is 200 ° C or more and 400 ° C or less in an oxygen-containing atmosphere gas and 200 ° C in an inert atmosphere gas in accordance with a normal debinding agent condition. Above, 700 ° C or less is preferred.

例如即使鎳的硫酸鹽或硫單體的微粉末,雖被認為有類似之激烈的氣體產生防止效果,但從所謂均勻分散於較細微鎳粉表面上的觀點來看,以使用溶解於一般糊用的溶劑者為佳。又,由於僅使可添加量變少,以藉由少量來選擇性地作用於鎳粒子表面,並發揮抑制黏合劑之熱分解的效果者為佳。For example, even if a fine powder of nickel sulfate or sulfur monomer is considered to have a similar gas generation preventing effect, it is dissolved in a general paste from the viewpoint of being uniformly dispersed on the surface of the fine nickel powder. The solvent used is preferred. Moreover, since only the amount of addition can be reduced, it is preferable to selectively act on the surface of the nickel particles with a small amount and to exhibit an effect of suppressing thermal decomposition of the binder.

由該等觀點來看,含硫有機化合物方面,可適當地使用三硫醇類及/或含硫酸根化合物,可使用其中1種或2種以上。所謂三硫醇類,係例如具有示於下述化學式1之構造的化合物群,通式中的R係表示-SH基、-NHR1 基、-NR2 R3 基(其中,R1 、R2 、R3 係表示脂肪族或芳香族的烴基的意思)。From these points of view, in the case of sulfur-containing organic compounds, three can be suitably used. One type or two or more types may be used for the thiol group and/or the sulfate group-containing compound. So-called three The thiol is, for example, a compound group having a structure shown by the following Chemical Formula 1, wherein R is a -SH group, a -NHR 1 group, or a -NR 2 R 3 group (wherein R 1 , R 2 , R 3 means an aliphatic or aromatic hydrocarbon group).

即使示於化學式1之三硫醇類之中,從上述熱分解溫度及溶解性等觀點來看,較佳的三硫醇類方面,可舉出有R為-SH的1,3,5-三-2,4,6-三硫醇、R為-N(C4 H9 )2 之6-二丁胺基-1,3,5-三-2,4-二硫醇、R為-N(C6 H1 3 )2 之6-二己胺基-1,3,5-三-2,4-二硫醇、R為-N(C8 H1 7 )2 之6-二辛胺基-1,3,5-三-2,4-二硫醇、R為-N(C1 0 H2 1 )2 之6-二癸胺基-1,3,5-三-2,4-二硫醇、R為-N(C1 2 H2 5 )2 之6-二-十二胺基-1,3,5-三-2,4-二硫醇。Even shown in Chemical Formula 1 Among the mercaptans, from the viewpoints of the above thermal decomposition temperature and solubility, the preferred three In terms of mercaptans, 1,3,5-three having R as -SH is exemplified. -2,4,6-trithiol, R is -N(C 4 H 9 ) 2 6-dibutylamino-1,3,5-tri -2,4-dithiol, R is -N(C 6 H 1 3 ) 2 6-dihexylamino-1,3,5-three -2,4-dithiol, R is -N(C 8 H 1 7 ) 2 6-dioctylamino-1,3,5-three -2,4-dithiol, R is -N(C 1 0 H 2 1 ) 2 6-diaminol-1,3,5-three -2,4-dithiol, R is -N(C 1 2 H 2 5 ) 2 6-di-dodecyl-1,3,5-tri -2,4-dithiol.

又,除了示於化學式1以外,亦可使用以鈉取代化學式1中硫醇基之H的1,3,5-三-2,4,6-三硫醇.單鈉(FMN)、或1,3,5-三-2,4,6-三硫醇.單鉀、1,3,5-三-2,4,6-三硫醇.單乙醇胺(FME)、1,3,5-三-2,4,6-三硫醇.二乙醇胺(FDE)、1,3,5-三-2,4,6-三硫醇.三乙胺(F.TEA)、1,3,5-三-2,4,6-三硫醇.辛胺、1,3,5-三-2,4,6-三硫醇.四丁基銨鹽、1,3,5-三-2,4,6-三硫醇.雙(四丁基銨鹽)(F2A)、6-苯胺基-1,3,5-三-2,4-二硫醇(AF)、6-苯胺基-1,3,5-三-2,4-二硫醇.單鈉(AMN)、6-苯胺基-1,3,5-三-2,4-二硫醇.三乙胺、6-二丁胺基-1,3,5-三-2,4-二硫醇.單鈉(DBMN)、6-二丁胺基-1,3,5-三-2,4-二硫醇.單乙醇胺(DBME)、6-二丁胺基-1,3,5-三-2,4-二硫醇.乙胺、6-二丁胺基-1,3,5-三-2,4-二硫醇.三乙胺、6-二丁胺基-1,3,5-三-2,4-二硫醇.丁胺(DBB)、6-二丁胺基-1,3,5-三-2,4-二硫醇.四丁基銨鹽(DBA)、6-二丁胺基-1,3,5-三-2,4-二硫醇.四丁基鏻鹽、6-二芳胺基-1,3,5-三-2,4-二硫醇、6-二芳胺基-1,3,5-三-2,4-二硫醇.單鈉(DAMN)、6-二芳胺基-1,3,5-三-2,4-二硫醇.單乙醇胺(DAME)、6-二芳胺基-1,3,5-三-2,4-二硫醇.丁胺、6-二芳胺基-1,3,5-三-2,4-二硫醇.乙二胺、6-二芳胺基-1,3,5-三-2,4-二硫醇.伸乙基三胺、6-辛胺基-1,3,5-三-2,4-二硫醇、6-辛胺基-1,3,5-三-2,4-二硫醇.單鈉等之三硫醇類。Further, in addition to the chemical formula 1, it is also possible to use 1,3,5-three which replaces the H of the thiol group in the chemical formula 1 with sodium. -2,4,6-trithiol. Single sodium (FMN), or 1,3,5-three -2,4,6-trithiol. Single potassium, 1,3,5-three -2,4,6-trithiol. Monoethanolamine (FME), 1,3,5-three -2,4,6-trithiol. Diethanolamine (FDE), 1,3,5-three -2,4,6-trithiol. Triethylamine (F.TEA), 1,3,5-three -2,4,6-trithiol. Octamine, 1,3,5-three -2,4,6-trithiol. Tetrabutylammonium salt, 1,3,5-three -2,4,6-trithiol. Bis(tetrabutylammonium) (F2A), 6-anilino-1,3,5-three -2,4-dithiol (AF), 6-anilino-1,3,5-three -2,4-dithiol. Monosodium (AMN), 6-anilino-1,3,5-three -2,4-dithiol. Triethylamine, 6-dibutylamino-1,3,5-three -2,4-dithiol. Monosodium (DBMN), 6-dibutylamino-1,3,5-three -2,4-dithiol. Monoethanolamine (DBME), 6-dibutylamino-1,3,5-three -2,4-dithiol. Ethylamine, 6-dibutylamino-1,3,5-three -2,4-dithiol. Triethylamine, 6-dibutylamino-1,3,5-three -2,4-dithiol. Butylamine (DBB), 6-dibutylamino-1,3,5-three -2,4-dithiol. Tetrabutylammonium salt (DBA), 6-dibutylamino-1,3,5-three -2,4-dithiol. Tetrabutyl phosphonium salt, 6-diarylamino-1,3,5-three -2,4-dithiol, 6-diarylamino-1,3,5-three -2,4-dithiol. Monosodium (DAMN), 6-diarylamino-1,3,5-three -2,4-dithiol. Monoethanolamine (DAME), 6-diarylamino-1,3,5-three -2,4-dithiol. Butylamine, 6-diarylamino-1,3,5-three -2,4-dithiol. Ethylenediamine, 6-diarylamino-1,3,5-three -2,4-dithiol. Ethyltriamine, 6-octylamino-1,3,5-three -2,4-dithiol, 6-octylamino-1,3,5-three -2,4-dithiol. Single sodium Mercaptans.

又,含硫酸根化合物方面,有包含硫酸根SO3 之脂肪族或芳香族的烴化合物或其鹽類,具體來說可舉出有十二基硫酸鈉CH3 (CH2 )1 1 SO3 Na、十二基苯磺酸鈉C1 2 H2 5 C6 H4 SO3 Na等。Further, the sulfate-containing compound may be an aliphatic or aromatic hydrocarbon compound containing sulfate SO 3 or a salt thereof, and specifically, sodium dodecyl sulfate CH 3 (CH 2 ) 1 1 SO 3 may be mentioned. Na, sodium dodecylbenzenesulfonate C 1 2 H 2 5 C 6 H 4 SO 3 Na, and the like.

雖然未說明有關該等含硫有機化合物抑制在脫黏合劑步驟途中之激烈的氣體產生的作用,但是認為是因為包含如三硫醇類的SH或含硫酸根化合物的SO3 的硫部分吸附於鎳粒子表面,使其無觸媒活性,而防止黏合劑的部分熱分解。特別認為是三硫醇係經由SH基的S而顯示與金屬的強反應性,因而更牢固地吸附於鎳粉粒子表面。又,吸附著含硫有機化合物的鎳粒子亦有所謂同時於媒液中的分散性或耐腐蝕性均改善的優點。Although it is not described that the sulfur-containing organic compounds inhibit the intense gas generation on the way of the debonding step, it is considered to be because The sulfur of the mercaptan-based SH or the sulfuric acid-containing SO 3 is adsorbed on the surface of the nickel particles to make it free from catalytic activity, and to prevent partial thermal decomposition of the binder. Especially considered to be three Since the thiol exhibits strong reactivity with the metal via the S group of the SH group, it is more strongly adsorbed on the surface of the nickel powder particles. Further, the nickel particles to which the sulfur-containing organic compound is adsorbed have an advantage that both the dispersibility and the corrosion resistance in the vehicle are improved.

鎳糊中之含硫有機化合物的含量,相對於鎳重量,以硫換算則以0.01~1重量%的範圍為佳,以0.02~0.5重量%的範圍為更佳。該含硫有機化合物的含量在0.01重量%以下時,則抑制黏合劑熱分解的效果不足。又,即使含量超過0.5重量%亦不認為有效果的增大,除了單純增加成本之外,更因超過1重量%時對於電子構件特性造成不良影響的可能性增加而不佳。還有,在使用組合於鎳糊的其他材料或糊之製程的條件下,即使含硫有機化合物超過1重量%的含量,亦有可適用的情況。The content of the sulfur-containing organic compound in the nickel paste is preferably in the range of 0.01 to 1% by weight in terms of sulfur, and more preferably in the range of 0.02 to 0.5% by weight, based on the weight of the nickel. When the content of the sulfur-containing organic compound is 0.01% by weight or less, the effect of suppressing thermal decomposition of the binder is insufficient. Further, even if the content is more than 0.5% by weight, it is not considered to have an effectful increase, and in addition to simply increasing the cost, the possibility of adversely affecting the characteristics of the electronic component when it exceeds 1% by weight is not preferable. Further, under the conditions of the process of using other materials or pastes combined with the nickel paste, even if the content of the sulfur-containing organic compound exceeds 1% by weight, it is also applicable.

該等含硫有機化合物係因包含如SH或SO3 之硫部分集中於鎳粒子表面來作用,故以極少之添加量而得到充分的效果,有以遠少於例如均勻分散硫於鎳粒子內部情況的量而得到充分之效果的可能。而且,於糊中包含過剩之鎳以外的添加成分時,由於有對於最終電子構件之信賴性造成不良影響的可能性,故以極少量而得到充分之效果的含硫有機化合物在此觀點上亦為有利。These sulfur-containing organic compounds are mainly composed of a sulfur-containing portion such as SH or SO 3 concentrated on the surface of the nickel particles, so that a sufficient effect is obtained with a very small amount of addition, which is much less than, for example, uniformly dispersing sulfur inside the nickel particles. The amount of the effect is sufficient. Further, when the paste contains an additive component other than the excess nickel, there is a possibility that the reliability of the final electronic component is adversely affected, so that the sulfur-containing organic compound having a sufficient effect in a very small amount is also considered from this viewpoint. For the benefit.

含硫有機化合物的添加方法方面,係以於糊製造時與其他添加劑同時添加為佳。例如,亦可採取如在通常所製作的糊中添加之前的既定量來再度混練等的方法,從所謂以含硫有機化合物有效地均勻被覆鎳粒子的觀點來看,以預先溶解含硫有機化合物於溶解黏合劑於溶劑所構成的媒液中為佳。又,在使用分散劑作為添加劑的情況下,由於亦認為是優先吸附該等於鎳粒子而阻礙含硫有機化合物之作用的情況,在該等情況下則希望調整適宜分散劑的添加順序。The method of adding the sulfur-containing organic compound is preferably added simultaneously with other additives in the production of the paste. For example, a method of re-kneading or the like before adding the paste prepared in the usual manner may be employed, and the sulfur-containing organic compound is dissolved in advance from the viewpoint of effectively uniformly coating the nickel particles with the sulfur-containing organic compound. It is preferred to dissolve the binder in a vehicle composed of a solvent. Further, in the case where a dispersant is used as the additive, it is considered that the action of adsorbing the nickel particles is preferentially inhibited and the action of the sulfur-containing organic compound is inhibited. In these cases, it is desirable to adjust the order of addition of the suitable dispersant.

還有,對於構成鎳糊的溶劑、黏合劑、及鎳粉,可使用與習知相同者。例如,溶劑方面,可使用萜品醇、丁基卡必醇乙酸酯、丁基卡必醇、二氫萜品醇、二氫萜品醇乙酸酯、其他石蠟系烴溶劑等。又,黏合劑方面,可使用乙基纖維素等之纖維素類、聚乙烯基丁縮醛等。Further, the solvent, the binder, and the nickel powder constituting the nickel paste may be the same as those conventionally known. For example, in terms of a solvent, terpineol, butyl carbitol acetate, butyl carbitol, dihydroterpineol, dihydroterpene alcohol acetate, other paraffinic hydrocarbon solvent, or the like can be used. Further, as the binder, cellulose such as ethyl cellulose or polyvinyl butyral can be used.

以下,具體說明本發明的實例。Hereinafter, examples of the invention will be specifically described.

顯示於鎳糊之脫黏合劑步驟途中(約260℃附近)之黏合劑的部分熱分解與伴隨其之激烈的氣體產生程度之基準方面,測定黏合劑之熱分解溫度及從脫黏合劑開始達到300℃之時點的黏合劑的重量減少量,評估對於上述熱分解漿體中之鎳粒子的影響、以及添加於糊中之含硫有機化合物的效果。Determining the thermal decomposition temperature of the binder and starting from the debonding agent in terms of the partial thermal decomposition of the binder on the way to the debonding step of the nickel paste (around 260 ° C) and the degree of intense gas generation associated with it The amount of weight reduction of the binder at 300 ° C was evaluated for the effect on the nickel particles in the above thermally decomposed slurry and the effect of the sulfur-containing organic compound added to the paste.

[對照例][Comparative example]

首先,使用塗布輥,以100 μ m厚度塗布由乙基纖維素與萜品醇所構成的媒液(不包含鎳粉)於PET膜上,以90℃乾燥6小時後,於乳缽中僅粉碎乾燥膜,用100網目(mesh)篩子作篩選,得到媒液乾燥體粉末。First, a coating liquid composed of ethyl cellulose and terpineol (excluding nickel powder) was applied to a PET film at a thickness of 100 μm using a coating roll, and dried at 90 ° C for 6 hours, and then only in the mortar. The dried film was pulverized and sieved with a 100 mesh sieve to obtain a dry liquid of the vehicle liquid.

針對該媒液乾燥體粉末,為了評估黏合劑的熱分解溫度及於300℃的重量減少量,而使用差示熱分析裝置(布魯卡耶一克斯耶斯公司製,TG-DTA2000SA),在200ml/min氮氣流量的氮氣流中,以5℃/min升溫速度來分析評估。In order to evaluate the thermal decomposition temperature of the binder and the weight loss at 300 ° C for the vehicle-dried body powder, a differential thermal analyzer (TG-DTA2000SA, manufactured by Brukaykes, Inc., TG-DTA2000SA) was used. The evaluation was carried out at a heating rate of 5 ° C / min in a nitrogen flow of a nitrogen flow rate of 200 ml / min.

該結果為黏合劑的分解溫度為325℃,重量減少約略同樣地進行,未引起黏合劑的部分熱分解及伴隨其之激烈的氣體產生。又,從在媒液的差示熱分析中之在300℃的重量減少量,在藉由下述計算式求得鎳糊中之黏合劑的理論重量減少量的情況為0.06重量%。As a result, the decomposition temperature of the binder was 325 ° C, and the weight reduction was performed approximately in the same manner, and partial thermal decomposition of the binder and intense gas generation accompanying the same were not caused. In addition, the amount of weight loss at 300 ° C in the differential thermal analysis of the vehicle liquid was 0.06 wt% in the case where the theoretical weight reduction amount of the binder in the nickel paste was determined by the following calculation formula.

[計算式][calculation]

鎳糊中之黏合劑的理論重量減少量(重量%)=於媒液乾燥粉末差示熱分析中之在300℃的重量減少量(重量%)×鎳糊中之黏合劑的重量比例Theoretical weight reduction of the binder in the nickel paste (% by weight) = weight loss at 300 ° C (% by weight) in the differential thermal analysis of the vehicle liquid × weight ratio of the binder in the nickel paste

[實例1~10][Examples 1~10]

於50重量份鎳粉[住友金屬礦山股份有限公司製、製品名YH-641、0.4 μ m平均粒徑]中,同時添加50重量份與對照例相同之由乙基纖維素與萜品醇所構成的媒液(但是,調整乙基纖維素重量成為相對於Ni為3重量%),與示於下述表1的三硫醇(TST)類,以三輥研磨機[井上製作所股份有限公司製,43/4×11 S型輥輪機]來進行混練,混練至以FOG規格(粒子規格)之粒徑成為10 μ m以下來調整鎳糊。50 parts by weight of nickel powder [manufactured by Sumitomo Metal Mining Co., Ltd., product name YH-641, 0.4 μm average particle size], 50 parts by weight of ethyl cellulose and terpineol were added in the same manner as in the comparative example. The composition of the vehicle (however, the weight of the adjusted ethyl cellulose is 3% by weight relative to Ni), and is shown in Table 3 below. Mercaptan (TST), which is kneaded by a three-roll mill [manufactured by Inoue Co., Ltd., 43/4×11 S-type rolling mill], and kneaded to a particle size of 10 μm in FOG specifications (particle size). The following is to adjust the nickel paste.

還有,所使用的三硫醇(TST)的種類,係如下表所示,對應於化學式1中的R,而R=-N(C4 H9 )2 的6-二丁胺基-1,3,5-三-2,4-二硫醇(DB)、R=-N(C6 H1 3 )2 的6-二己胺基-1,3,5-三-2,4-二硫醇(DH)、R=-N(C8 H1 7 )2 的6-二辛胺基-1,3,5-三-2,4-二硫醇(DO)、R=-N(C1 0 H2 1 )2 的6-二癸胺基-1,3,5-三-2,4-二硫醇(DD)、R=-N(C1 2 H2 5 )2 的6-二-十二胺基-1,3,5-三-2,4-二硫醇(DL)中任一者。又,示於表1之三硫醇(TST)的添加量,係以相對於鎳重量之量的硫換算者。Also, the three used The type of thiol (TST) is as shown in the following table, corresponding to R in the chemical formula 1, and R=-N(C 4 H 9 ) 2 6-dibutylamino-1,3,5-three -2,4-dithiol (DB), R=-N(C 6 H 1 3 ) 2 6-dihexylamino-1,3,5-three -2,4-dithiol (DH), R=-N(C 8 H 1 7 ) 2 6-dioctylamino-1,3,5-three -2,4-dithiol (DO), R=-N(C 1 0 H 2 1 ) 2 6-diamidino-1,3,5-three -2,4-dithiol (DD), R=-N(C 1 2 H 2 5 ) 2 6-di-dodecyl-1,3,5-tri -2,4-dithiol (DL). Also, shown in Table 1 The amount of thiol (TST) added is in terms of sulfur relative to the weight of nickel.

與對照例相同地,使用塗布輥,以100 μ m厚度塗布所得之實例1~10的各鎳糊於PET膜上,以90℃乾燥6小時。然後,以乳缽僅粉碎乾燥膜,用100網目(mesh)篩子作篩選,得到鎳糊乾燥體粉末。In the same manner as the comparative example, each of the obtained nickel pastes of Examples 1 to 10 was applied to a PET film at a thickness of 100 μm using a coating roll, and dried at 90 ° C for 6 hours. Then, the dried film was pulverized only with a mortar, and sieved with a 100 mesh sieve to obtain a dried nickel powder paste.

針對該等鎳糊乾燥體粉末,為了評估黏合劑之熱分解溫度及重量減少來與上述對照例比較,使用差示熱分析裝置(布魯卡耶一克斯耶斯公司製,TG-DTA2000SA),在200ml/min氮氣流量的氮氣流中,以5℃/min升溫速度來分析評估。For the nickel paste dry powder, in order to evaluate the thermal decomposition temperature and weight reduction of the binder, a differential thermal analyzer (TG-DTA2000SA, manufactured by Brukaykes, Inc.) was used in comparison with the above comparative example. The analysis was carried out at a temperature increase rate of 5 ° C / min in a nitrogen flow of a nitrogen flow rate of 200 ml / min.

又,從由差示熱分析所求得之在300℃的重量減少量(重量%),與於上述對照例所求得的理論重量減少量,算出以理論重量減少量(0.06重量%之在300℃的重量減少量)為1時之在300℃之減量比[即,在300℃之重量減少量(重量%)/理論重量減少量(重量%)。彙整該等評估結果而示於下述表1。Further, from the weight loss amount (% by weight) determined by differential thermal analysis at 300 ° C, and the theoretical weight reduction amount obtained in the above Comparative Example, the theoretical weight reduction amount (0.06% by weight) was calculated. The weight reduction amount at 300 ° C) is a reduction ratio at 300 ° C at 1 [i.e., weight loss at 300 ° C (% by weight) / theoretical weight loss (% by weight). The results of these assessments are summarized in Table 1 below.

[實例11][Example 11]

除了三硫醇類的添加時期為糊混練後之外,與實例4同樣地進行。即,於50重量份鎳粉[住友金屬礦山股份有限公司製,製品名YH-641,0.4 μ m平均粒徑]中,添加50重量份由乙基纖維素與萜品醇所構成的媒液(調整乙基纖維素重量成為相對於Ni為3重量%),以三輥研磨機混練之後,於所得之糊中改成添加混練三硫醇類(TST)的DB。Except three The addition period of the thiol was carried out in the same manner as in Example 4 except that the paste was kneaded. Specifically, 50 parts by weight of a vehicle composed of ethyl cellulose and terpineol was added to 50 parts by weight of nickel powder [manufactured by Sumitomo Metal Mining Co., Ltd., product name YH-641, 0.4 μm average particle diameter]. (Adjusting the weight of ethyl cellulose to 3 wt% with respect to Ni), after kneading in a three-roll mill, changing the obtained paste into adding kneading three DB of mercaptans (TST).

針對所得之鎳糊,與上述同樣地,製作鎳粉乾燥體粉末,藉由差示熱分析求得黏合劑的熱分解溫度、在300℃之重量減少量與減量比,將其結果合併示於下述表1。With respect to the obtained nickel paste, a nickel powder dried body powder was prepared in the same manner as above, and the thermal decomposition temperature of the binder and the weight reduction amount and the reduction ratio at 300 ° C were determined by differential thermal analysis, and the results were combined. Table 1 below.

[參考例][Reference example]

除了使用十二基硫酸鈉(SDS)來取代三硫醇(TST)類之外,與實例4同樣地來製作鎳糊。針對所得之鎳糊,與上述同樣地,製作鎳粉乾燥體粉末,藉由差示熱分析求得黏合劑的熱分解溫度、在300℃之重量減少量與減量比,將其結果合併示於下述表1。In addition to using sodium dodecyl sulfate (SDS) instead of three A nickel paste was produced in the same manner as in Example 4 except for the mercaptan (TST). With respect to the obtained nickel paste, a nickel powder dried body powder was prepared in the same manner as above, and the thermal decomposition temperature of the binder and the weight reduction amount and the reduction ratio at 300 ° C were determined by differential thermal analysis, and the results were combined. Table 1 below.

[比較例][Comparative example]

製作未添加任何一種三硫醇(TST)類及十二基硫酸鈉(SDS)之習知的鎳糊作為比較例。即,於50重量份鎳粉[住友金屬礦山股份有限公司製,製品名YH-641,0.4μm平均粒徑]中,添加50重量份由乙基纖維素與萜品醇所構成的媒液(但是,調整乙基纖維素重量成為相對於Ni為3重量%),以三輥研磨機混練而成為糊。Production did not add any kind of three A conventional nickel paste of a mercaptan (TST) type and sodium dodecyl sulfate (SDS) is used as a comparative example. Specifically, 50 parts by weight of a vehicle composed of ethyl cellulose and terpineol was added to 50 parts by weight of nickel powder [manufactured by Sumitomo Metal Mining Co., Ltd., product name YH-641, 0.4 μm average particle diameter]. However, the weight of the ethyl cellulose was adjusted to be 3% by weight based on Ni, and it was kneaded by a three-roll mill to form a paste.

與上述對照例及實例相同地,使用塗布輥,以100μm厚度塗布該比較例的鎳糊於PET膜上,以90℃乾燥6小時,以乳缽僅粉碎乾燥膜,用100網目(mesh)篩子作篩選,得到鎳糊乾燥體粉末。The nickel paste of the comparative example was applied onto a PET film at a thickness of 100 μm in the same manner as the above-mentioned comparative examples and examples, and dried at 90 ° C for 6 hours to pulverize only the dried film with a mortar, using a 100 mesh sieve. For screening, a nickel paste dried body powder was obtained.

針對該比較例的鎳糊乾燥體粉末,與上述對照例與實例同樣地,藉由差示熱分析評估黏合劑的熱分解溫度、在300℃之重量減少量與減量比,將其結果合併示於下述表1。With respect to the nickel paste dried body powder of this comparative example, the thermal decomposition temperature of the adhesive, the weight reduction amount at 300 ° C, and the reduction ratio were evaluated by differential thermal analysis in the same manner as in the above Comparative Example and Example, and the results were combined. See Table 1 below.

如由該表1中之比較例的評估結果所得知,在未添加任何一種三硫醇(TST)類及十二基硫酸鈉(SDS)之習知的鎳糊中,不僅在其為通常之黏合劑分解溫度的325℃,在途中之約260℃附近引起黏合劑劇烈的熱分解。該結果為在300℃之重量減少量大如1.75重量%,而僅有媒液之對照例中的理論重量減少量為1時之在300℃的減量比變成極大的29.1。因此,已知由於隨其而來之大量的氣體產生,最終在積層陶瓷電容中容易產生層間剝離等的構造缺陷。As is known from the evaluation results of the comparative examples in Table 1, no one is added The conventional nickel paste of mercaptan (TST) and sodium dodecyl sulfate (SDS) causes the intense heat of the binder not only at 325 ° C which is the decomposition temperature of the usual binder, but also around 260 ° C on the way. break down. The result was that the weight loss at 300 ° C was as large as 1.75 wt%, and the reduction ratio at 300 ° C when the theoretical weight reduction in the comparative example of only the vehicle was 1 was extremely large 29.1. Therefore, it is known that a large amount of gas is generated therefrom, and structural defects such as interlayer peeling are likely to occur in the laminated ceramic capacitor.

另外,在關於本發明之各實例的鎳糊中,藉由添加三硫醇(TST)類及十二基硫酸鈉(SDS)中任一種,比較於未包含該等之比較例的鎳糊,任何一種之在300℃的減量比均大幅地降低。又,已知未引起在約260℃附近之熱分解,約略同時地進行重量減少,而且由於黏合劑的分解溫度上升至比325℃高,抑制於脫黏合劑步驟途中之劇烈的氣體產生。因而,在經過其後之燒成步驟而於最終所得的積層陶瓷電容中,已知降低並改善層間剝離等之構造缺陷的產生。In addition, in the nickel paste relating to each example of the present invention, by adding three Any of the mercaptan (TST) type and sodium dodecyl sulfate (SDS) was compared with the nickel paste which did not contain such comparative examples, and the reduction ratio at any of 300 ° C was greatly lowered. Further, it is known that thermal decomposition at a temperature of about 260 ° C is not caused, and the weight reduction is performed approximately simultaneously, and since the decomposition temperature of the binder rises to be higher than 325 ° C, the generation of a strong gas in the middle of the debonding step is suppressed. Therefore, it is known to reduce and improve the occurrence of structural defects such as interlayer peeling in the laminated ceramic capacitor finally obtained after the subsequent firing step.

Claims (3)

一種積層陶瓷電容用鎳糊,其係用於積層陶瓷電容之內部電極的形成,其特徵為在黏合劑溶解於溶劑而成的媒液中,分散鎳粉,而且包含由三二硫醇或三三硫醇所構成之三硫醇類。A nickel paste for a laminated ceramic capacitor, which is used for forming an internal electrode of a laminated ceramic capacitor, characterized in that a nickel powder is dispersed in a vehicle liquid in which a binder is dissolved in a solvent, and Dithiol or tri Three of trithiols Mercaptans. 如申請專利範圍第1項之積層陶瓷電容用鎳糊,其中該三硫醇類的含量,以相對於鎳之硫換算係0.01~1重量%。For example, the nickel paste for the multilayer ceramic capacitor of the first application of the patent scope, wherein the three The content of the thiol is 0.01 to 1% by weight in terms of sulfur relative to nickel. 如申請專利範圍第1或2項之積層陶瓷電容用鎳糊,其中該三硫醇類係1,3,5-三-2,4,6-三硫醇、6-二丁胺基-1,3,5-三-2,4-二硫醇、6-二己胺基-1,3,5-三-2,4-二硫醇、6-二辛胺基-1,3,5-三-2,4-二硫醇、6-二癸胺基-1,3,5-三-2,4-二硫醇、及6-二-十二胺基-1,3,5-三-2,4-二硫醇之任一者。For example, the nickel paste for laminated ceramic capacitors of claim 1 or 2, wherein the three Mercaptans 1,3,5-three -2,4,6-trithiol, 6-dibutylamino-1,3,5-three -2,4-dithiol, 6-dihexylamino-1,3,5-three -2,4-dithiol, 6-dioctylamino-1,3,5-three -2,4-dithiol, 6-diaminol-1,3,5-three -2,4-dithiol, and 6-di-dodecyl-1,3,5-three -2,4-dithiol.
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