TWI400598B - Heat sink and method of manufacturing the same - Google Patents

Description

Radiator and method of manufacturing same

The present invention relates to a heat sink and a method of manufacturing the same, and more particularly to a heat sink for an electronic component and a method of manufacturing the same.

With the rapid development of information technology, the computing speed of computer central processing units is getting faster and faster, and the heat generated by them is increasing. If too much heat is not discharged in time, it will seriously affect the stability of the central processing unit. . To this end, the industry typically installs a heat sink on the top surface of the central processor that uses a heat sink to help dissipate heat to ensure that the central processor is operating at the proper temperature. As the electronic components become smaller and smaller, their heat generation is more concentrated, and the heat dissipation performance of the heat sink needs to be improved.

In the prior art, the heat sink often uses a pedestal attached to the central processing unit and a plurality of heat dissipating fins fixed to the pedestal. Since the solder material used for soldering increases the heat transfer impedance between the pedestal and the heat sink fins, it affects the overall performance of the heat sink. In order to overcome this technical problem, the conventional technique also uses a die forging method to insert the heat dissipation fins into the grooves of the substrate. As shown in FIG. 6-7, a heat sink includes a base 3 and a plurality of heat sink fins 4. A plurality of grooves 31 are formed on one surface of the base to correspondingly insert the heat dissipation fins 4. Each trench 31 has two straight sidewalls to contact the heat sink fins 4. a slit is provided between each adjacent two grooves 31 . When the heat dissipating fins 4 are placed in the grooves 31 of the susceptor 3, the knives 41 of the plurality of squeezing dies press the slits to plastically deform the side walls of the grooves 31, pushing the fins 4 to dissipate heat. The fins 4 are tightly embedded in the grooves 31.

However, since the heat dissipating fins 4 and the side walls of the grooves 31 are gap-fitted before the plastic deformation of the side walls of the grooves 31, the position thereof is not easily fixed; and since the cutter 41 punches the base 3 from the top to the bottom, the base 3 The amount of deformation near the bottom of the heat dissipating fin 4 is insufficient, so that the sidewall of the trench 31 is easy to loosen and form a gap for the heat dissipating fin 4, reducing the contact area between the heat dissipating fin 4 and the pedestal 3, and reducing the heat sink. Thermal conductivity affects the heat dissipation of the entire heat sink.

In view of the above, it is necessary to provide a heat pipe capable of preventing the occurrence of overflow tin during the assembly of the heat pipe and the base and a method of manufacturing the same.

A heat pipe includes a heat absorption section, a heat release section, and a connection section connecting the heat absorption section and the heat release section, and the outer wall surface of the heat absorption section is provided with a dimple. Compared with the prior art, the outer wall of the heat pipe of the invention has a dimple, which increases the surface roughness of the outer wall of the heat pipe, improves the adhesion of the surface of the heat pipe to the solder paste, and effectively prevents the tin from being generated during the welding process of the heat pipe and other components.

A method for manufacturing a heat pipe, comprising the steps of: (1) providing a heat pipe; (2) bending the heat pipe into a U-shaped heat pipe, wherein the heat pipe has a heat absorption section, a heat release section, and a heat absorption section and a heat release section. a connecting section; (3) providing a mold having a convex wall on the inner wall, and using the mold to heat the bending The endothermic section of the tube is rounded so that the endothermic section of the tube is pressed with a dent.

3‧‧‧Base

31‧‧‧ trench

4‧‧‧Heat fins

41‧‧‧Tools

10‧‧‧floor

13‧‧‧ jack

20‧‧‧ Heat sink

22‧‧‧ Department of heat dissipation

24‧‧‧ Riveting Department

26‧‧‧Installation Department

30‧‧‧Tools

1 is an exploded perspective view of a heat sink of the present invention.

Figure 2 is an assembled view of the heat sink of Figure 1.

Figure 3 is a cross-sectional view of the heat sink III-III of Figure 2 with the tool in a pre-punched state.

Figure 4 is a diagram showing the state of the tool of Figure 3 in the stamping of the heat sink.

Figure 5 is a diagram showing the state of the tool of Figure 3 after stamping the heat sink.

Figure 6 is a front elevational view of a conventional heat sink prior to die forging.

Figure 7 is an assembled view of a conventional heat sink after swaging.

Please refer to FIG. 1 and FIG. 2 for a preferred embodiment of the heat sink of the present invention. The heat sink includes a bottom plate 10 and a plurality of cylindrical heat sinks 20.

The bottom plate 10 has a substantially rectangular design with a bottom surface that is smooth to contact the top surface of the electronic component to remove heat from the electronic component. A plurality of evenly distributed jacks 13 are disposed thereon. Each of the insertion holes 13 is a circular through hole penetrating vertically through the upper surface of the bottom plate 10, and has the same inner diameter.

Each of the heat dissipating bodies 20 is integrally formed and has a cylindrical shape as a whole, and includes a heat dissipating portion 22 at one end of the heat dissipating body 20, a short mounting portion 26 at the other end of the heat dissipating body 20, and a connecting heat dissipating portion 22 and a mounting portion 26 . Riveting portion 24. The heat radiating portion 22, the caulking portion 24, and the mounting portion 26 are coaxial cylinders. Wherein the mounting portion 26 The outer diameter is slightly larger than the inner diameter of the insertion hole 13 of the bottom plate 10, so that the mounting portion 26 can be inserted into the insertion hole 13 of the bottom plate 10 with an interference fit; the outer diameter of the heat dissipation portion 22 is larger than the outer diameter of the mounting portion 26, that is, greater than the insertion. The inner diameter of the hole 13; the outer diameter of the staking portion 24 is smaller than the outer diameter of the mounting portion 26. Therefore, the outer diameter of the heat dissipating portion 22 is larger than the outer diameter of the caulking portion 24, so that the bottom portion of the heat dissipating portion 22 forms a toroidal surface (not shown). The bottom of the mounting portion 26 is a smooth plane. The total axial length of the mounting portion 26 and the staking portion 24 is the same as the thickness of the bottom plate 10.

Referring to FIGS. 3 to 5, the mounting portion 26 and the caulking portion 24 of the heat sink 20 are inserted into the insertion holes 13 of the bottom plate 10 by tools. The mounting portion 26 of each of the heat sinks 20 is coupled to the lower half of the socket 13 of the bottom plate 10 in an interference fit. The bottom surface of the mounting portion 26 is flush with the bottom surface of the bottom plate 10 to collectively contact the top surface of the electronic component. The bottom annular surface of the heat dissipating portion 22 of each of the heat radiating bodies 20 abuts against the top surface of the bottom plate 10 on the periphery of the corresponding insertion hole 13 of the heat dissipating body 20. At this time, the caulking portion 24 of each of the heat radiating bodies 20 is placed on the upper half of the insertion hole 13 of the bottom plate 10, and the outer wall thereof is spaced apart from the inner wall of the insertion hole 13 by a certain gap.

After the heat sink 20 is inserted into the bottom plate 10, the top of the bottom plate 10 is punched at the periphery of each heat sink 20 by a cutter 30 of a die, so that the upper portion of the bottom plate 10 of the periphery of the heat sink 20 is plastically deformed. The inner wall of the socket 13 is deformed and the rivet 24 of the heat sink 20 is tightly pressed. Therefore, the gap between the staking portion 24 and the insertion hole 13 of the bottom plate 10 disappears, and the heat sink 20 is in close contact with the bottom plate 10 and fixed in the insertion hole 13. All the heat sinks 10 are completed in the stamping process, and after the cutter 30 of the extrusion die is taken out, the entire heat sink is completed. It can be understood that the number of the cutters 30 can be the same as the number of the heat sinks 20, so that one punching at the same time The riveting process of all the heat sinks 20 is completed.

Since the mounting portion 26 of the lower end of each heat sink 20 is first fixed to the bottom plate 10 with an interference fit and then stamped, the heat sink 20 can be well positioned before punching; and, the inner wall of the socket 13 after punching The sufficient contact with the staking portion 24 avoids the problem that the amount of deformation at the bottom of the bottom plate 10 is insufficient and the heat sink 10 is not clamped. After the stamping, the inner wall of the socket 13 is deformed to completely contact the rivet portion 24 of the heat sink 20 and is jammed, thereby improving the heat conduction effect of the heat sink, so that the heat sink 20 can be more firmly mounted on the bottom plate 10 on. In addition, the two-stage design of the heat sink 20 of the present invention relatively completely adopts the conventional technique of interference fit, thereby avoiding assembly difficulties due to the interference fit distance being too long.

The present invention provides a method for manufacturing a heat sink. The main steps include: (1) preparing a bottom plate 10, and providing a uniformly distributed jack 13 on the bottom plate 10, each of the jacks 13 extending perpendicularly through the upper surface of the bottom plate 10 a circular through hole; (2) a plurality of cylindrical heat radiating bodies 20 are provided, each of the heat radiating bodies 20 includes a coaxial heat radiating portion 22, a riveting portion 24, and a mounting portion 26 disposed at a middle portion, wherein the outer diameter of the mounting portion 26 Slightly larger than the inner diameter of the insertion hole 13 of the bottom plate 10, the outer diameter of the heat dissipation portion 22 is larger than the outer diameter of the mounting portion 26, and the outer diameter of the staking portion 24 is smaller than the outer diameter of the mounting portion 26; (3) the installation of the heat dissipation body 20 The portion 26 is inserted into the insertion hole 13 of the mounting base 10 with an interference fit, wherein the bottom annular surface of the heat dissipation portion 22 abuts against the top surface of the bottom plate 10, and the bottom surface of the mounting portion 26 is flush with the bottom surface of the bottom plate 10; and (4) A cutter 30 for squeezing a die is pressed against the top surface of the bottom plate 10 at the periphery of each heat sink 20, so that a portion above the bottom plate 10 of the periphery of the heat sink 20 is generated. The plastic deformation is such that the inner wall of the insertion hole 13 is deformed and the staking portion 24 of the heat sink 20 is tightly pressed.

In this embodiment, the interference fit of the mounting portion 26 of the heat sink 20 and the riveting of the riveting portion 24 can be used to position the heat sink 20 well, and the heat sink 20 is firmly coupled. There is a larger contact area between the bottom plate 10 and the bottom plate 10 to improve the heat conduction effect of the heat sink.

It can be understood that, in other embodiments, the jack of the bottom plate of the heat sink of the present invention is disposed as a rectangular through hole, and the heat dissipating body is correspondingly arranged as a column having a rectangular cross section, and the heat dissipating body includes a heat dissipation of a rectangular body at both ends. a portion, a mounting portion, and a riveting portion connecting the heat dissipating portion and the mounting portion, wherein the mounting portion is received in the jack by an interference fit, and the riveting portion is received in the jack and the cross-sectional dimension thereof is smaller than a cross-sectional dimension of the mounting portion. The cross-sectional dimension of the heat dissipating portion corresponds to a cross-sectional dimension of the mounting portion.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧floor

13‧‧‧ jack

20‧‧‧ Heat sink

22‧‧‧ Department of heat dissipation

24‧‧‧ Riveting Department

26‧‧‧Installation Department

Claims (8)

A heat sink for dissipating heat generated by an electronic component, comprising a bottom plate in contact with the electronic component, and a plurality of cylindrical heat dissipating bodies, wherein the bottom plate is provided with a plurality of circular jacks for receiving the heat dissipating body, and the improvement is The heat dissipating body includes a heat dissipating portion at the two ends thereof, a mounting portion, and a riveting portion that is connected to the heat dissipating portion and the mounting portion. The mounting portion is received in the jack by an interference fit, and the riveting portion and the bottom plate jack are received. The inner wall is in close contact with each other and has an outer diameter smaller than an outer diameter of the mounting portion. The outer diameter of the heat dissipating portion is larger than the outer diameter of the mounting portion, and each of the heat dissipating portions has an annular bottom surface abutting against the top surface of the bottom plate. The heat sink of claim 1, wherein each of the jacks is a through hole extending through a top surface and a bottom surface of the bottom plate. The heat sink of claim 2, wherein the bottom surface of each mounting portion is flush with the bottom surface of the bottom plate to collectively contact the electronic component. A heat sink for dissipating heat generated by an electronic component, comprising: a bottom plate in contact with the electronic component; a columnar heat sink having a plurality of square sections; the base plate is provided with a plurality of square jacks for receiving the heat sink, The improvement is that the heat dissipating body includes a heat dissipating portion at the two ends thereof, a mounting portion, and a riveting portion that connects the heat dissipating portion and the mounting portion, and the mounting portion is received in the jack by an interference fit, and the riveting portion and the bottom plate are The inner wall of the jack is in close contact and the cross-sectional dimension thereof is smaller than the cross-sectional dimension of the mounting portion. The cross-sectional dimension of the heat dissipating portion corresponds to a cross-sectional dimension of the mounting portion, and each heat dissipating portion has an annular bottom surface abutting against the top surface of the bottom plate. A method for manufacturing a heat sink includes the following steps: (1) preparing a bottom plate, and uniformly distributing the jacks on the bottom plate, each jack being a through hole penetrating vertically through the lower surface of the bottom plate; (2) preparing a plurality of heat dissipation holes Each of the heat dissipating bodies includes a coaxial heat dissipating portion, a riveting portion and a mounting portion disposed in the middle portion, wherein a cross-sectional dimension of the mounting portion corresponds to a size of a socket slightly larger than the bottom plate, and a cross-sectional dimension of the heat dissipating portion corresponds to a mounting portion The cross-sectional dimension, the cross-sectional dimension of the riveting portion corresponds to a cross-sectional dimension of the mounting portion, and each heat dissipating portion has an annular bottom surface abutting against the top surface of the bottom plate; (3) inserting and installing the mounting portion of the heat dissipating body with an interference fit Inserting the mounting portion of the heat sink fin into the groove of the bottom plate in the socket of the bottom plate; and (4) preparing a die for pressing the die to press the top surface of the bottom plate at the periphery of each heat sink body, so that the periphery of the heat sink body The upper portion of the bottom plate is plastically deformed to deform the inner wall of the socket and tightly press the rivet portion of the heat sink. The method of manufacturing a heat sink according to claim 5, wherein the bottom surface of each mounting portion is flush with the bottom surface of the bottom plate. The method of manufacturing a heat sink according to claim 5, wherein each of the heat sinks has a cylindrical shape, and each of the insertion holes is a corresponding circular hole. The heat sink manufacturing method of claim 5, wherein each of the heat sinks is a rectangular cylinder, and each of the jacks is a corresponding square hole.