TWI398621B - Position rectifying device - Google Patents

Description

Position correction device

The present invention relates to a position correcting device, and more particularly to a position correcting device for machining a workpiece in a computer numerical control system.

At present, in the mold processing process of the computer numerical control system, the first program to be carried out is to place the workpiece on the processing platform, that is, the calibration mold. The conventional model is to place a piece of gauge on the vise in parallel, then place the workpiece on the block gauge, then place the soft material metal gasket on both sides of the vise, and finally tighten the vise. During the process of tightening the workpiece, since the vise and the surface of the workpiece are not completely parallel, the workpiece will be slightly inclined after tightening. At this time, the hammer should be used for slight tapping. On the one hand, the vise will tighten the workpiece, on the other hand, The workpiece is kept at a certain level to facilitate processing. The way to judge whether the surface level of the workpiece is normal or not is judged by the tightness of the block gauge. If it is not only time-consuming and horizontal, it is not easy to measure. Moreover, the conventional holding method cannot monitor the radial pressure of the workpiece during processing, as shown in FIG. 1, a workpiece 2 is placed on a gauge 3, and the cutter 1 is cut to the workpiece 2. In the middle, the excessive radial pressure tends to cause the workpiece 2 to warp, and finally the workpiece 2 is deformed by machining.

In view of the above, it is necessary to provide a position correcting device capable of judging whether the surface of the workpiece is horizontal or not and capable of adjusting the level of the surface of the workpiece.

A position correcting device comprising a measuring platform for placing a workpiece to be processed; a sensor module disposed on the measuring platform for sensing pressure at different positions on the measuring platform and converting the voltage into a voltage a frequency signal; an amplifier module connected to the output of the sensor module for amplifying the voltage frequency signal outputted by the sensor module; and a single chip module connected to the output end of the amplifier module for receiving The amplified voltage frequency signal, when the single chip module receives and determines that the voltage frequency signals of the respective locations transmitted by the sensor module are not equal, adjusting a machine tool connected to the output end of the single chip module Processing parameters.

The position correcting device samples the force of each position on the measuring platform through a sensor module, and amplifies and transmits the signal to a single chip module through an amplifier module, and the single chip module is in various positions on the measuring platform. When the force is different, the machining parameters of the machine tool connected to the output end thereof are adjusted, so that the machining speed and the cutting force of the machine tool are reduced, so that the machining surface of the workpiece is kept horizontal.

Referring to FIG. 2, a preferred embodiment of the position correction device of the present invention includes a measurement platform 100, a sensor module 200, an amplifier module 300, a single wafer module 400, and a machine tool 500 for working on a workpiece 600. The position is corrected.

The measuring platform 100 is a uniformly distributed square platform for placing the workpiece 600. The workpiece 600 is placed at a central position on the upper surface of the measuring platform 100 to ensure uniform force in all directions of the measuring platform 100.

The sensor module 200 includes four pressure sensors S1, S2, S3, and S4, and the pressure sensors S1, S2, S3, and S4 are evenly distributed on the four corners of the measuring platform 100 for sensing. The force on the four corners of the measuring platform 100 is measured and converted into a voltage frequency signal output.

The amplifier module 300 includes four amplifiers L1, L2, L3, and L4, and the input terminals of the amplifiers L1, L2, L3, and L4 are respectively connected to the output ends of the pressure sensors S1, S2, S3, and S4. The voltage frequency signal output by the sensor module 200 is amplified.

The single-chip module 400 is connected to an output of the amplifiers L1, L2, L3, and L4, and the single-chip module 400 receives the amplified voltage and frequency signals. The voltage frequency signals are compared, and the processing parameters of the power tool 500 are automatically adjusted according to the comparison result and transmitted to the machine tool 500.

Before the workpiece 600 is processed, it is placed on the measuring platform 100 and fixed by a fixing device such as a vise. The workpiece 600 may be slightly tilted due to being tightened. At this time, the measuring platform 100 is four. The force on the corners is different. If the four voltages output by the amplifier module 300 are inconsistent, it can be corrected by a slight tap on the hammer.

During the processing of the workpiece 600, tilting may occur due to a radial processing pressure. The pressure sensors S1, S2, S3, and S4 are extremely sensitive, and can be sensed when the force on the four corners of the measuring platform 100 is slightly different, and are instantly adjusted through the single chip module 400. The machining parameters of the machine tool 500 are used to instantly adjust the surface level of the workpiece.

The single wafer module 400 stores the raw parameters of the tooling machine 500 for processing the workpiece 600 prior to processing. During the processing, the pressure sensors S1, S2, S3, and S4 continuously sample the pressures at the four corners of the measurement platform 100 and amplify them through the amplifier module 300 and transmit the same to the single wafer module 400. . When the voltage comparison of the single-wafer module 400 is performed to obtain the same four voltages, it means that the force is applied to the four corners of the measuring platform 100. When the processing surface of the workpiece 600 is horizontal, the machine tool 500 continues to be the original. The workpiece speed is processed by the machining speed and the cutting force; if the cutter feed speed of the machine tool 500 is too fast during the machining process, the workpiece 600 is subjected to excessive radial pressure, and the pressure sensors S1 and S2 are excessively pressed. The pressures sensed by S3 and S4 are different. When the voltage comparison of the single-chip module 400 confirms that the four voltages are inconsistent, for example, when the output voltages of the amplifiers L1 and L2 are not equal to the output voltages of the amplifiers L3 and L4, It is indicated that the workpiece 600 may be tilted. At this time, the single-wafer module 400 automatically adjusts the processing parameters of the machine tool 500, that is, the processing speed and the cutting force of the machine tool 500 are reduced to reduce the radial pressure of the workpiece 600. Until the output voltages of the amplifiers L1, L2 are equal to the output voltages of the amplifiers L3, L4, thereby maintaining the processed surface level of the workpiece 600.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

Measuring platform. . . 100

Sensor module. . . 200

Pressure sensor. . . S1, S2, S3, S4

Amplifier module. . . 300

Amplifier. . . L1, L2, L3, L4

Single chip module. . . 400

Machine tool. . . 500

Workpiece. . . 600

Fig. 1 is a schematic view showing a state in which a workpiece is warped in the prior art.

Figure 2 is a block diagram of a preferred embodiment of the position correcting device of the present invention.

Measuring platform. . . 100

Sensor module. . . 200

Pressure sensor. . . S1, S2, S3, S4

Amplifier module. . . 300

Amplifier. . . L1, L2, L3, L4

Single chip module. . . 400

Machine tool. . . 500

Workpiece. . . 600

Claims (4)

A position correction device comprising: a measurement platform for placing a workpiece to be processed; a sensor module disposed on the measurement platform for sensing pressure at different positions on the measurement platform and converting it into a voltage frequency signal; an amplifier module connected to the output end of the sensor module for amplifying the voltage frequency signal outputted by the sensor module; and a single chip module connected to the output end of the amplifier module, Receiving the amplified voltage frequency signal, when the single chip module receives and determines that the voltage frequency signals of the respective locations transmitted by the sensor module are not equal, adjusting a power tool connected to the output end of the single chip module Processing parameters. The position correcting device of claim 1, wherein the measuring platform is a uniformly distributed square platform. The position correcting device of claim 2, wherein the sensor module comprises four pressure sensors, the four pressure sensors being evenly distributed on the four corners of the measuring platform. The position correcting device of claim 3, wherein the amplifier module comprises four amplifiers, and the input ends of the four amplifiers are respectively connected to the outputs of the four pressure sensors.