TWI395730B - Indium tin oxide compound coating liquid and its manufacturing method and application - Google Patents
Indium tin oxide compound coating liquid and its manufacturing method and application Download PDFInfo
- Publication number
- TWI395730B TWI395730B TW98138571A TW98138571A TWI395730B TW I395730 B TWI395730 B TW I395730B TW 98138571 A TW98138571 A TW 98138571A TW 98138571 A TW98138571 A TW 98138571A TW I395730 B TWI395730 B TW I395730B
- Authority
- TW
- Taiwan
- Prior art keywords
- alkoxyindium
- tin
- anhydrous
- tin compound
- indium
- Prior art date
Links
Landscapes
- Paints Or Removers (AREA)
Description
本發明係有關於一種烷氧銦錫化合物塗佈液之製造方法,尤其是一種可得極高純度之烷氧銦錫化合物塗佈液之製造方法。The present invention relates to a method for producing an alkoxyindium tin compound coating liquid, and more particularly to a method for producing an extremely high purity alkoxyindium tin compound coating liquid.
烷氧銦化合物(Indium alkoxide,In(OR)3 )之合成已見諸文獻,如「J. Indian Chem. Soc. Vol LIII,September 1976,pp. 867-869」描述有關烷氧銦化合物之合成法。如三異丙烷氧銦化合物(Indium tri-isopropoxide)之合成是將無水氯化銦(InCl3 ,anhydrous)與三異丙醇(isopropanol)於三異丙氧化鈉(Sodium isopropoxide)存在下迴流反應而製得。再將三異丙烷氧銦化合物醇解可得其他烷氧銦化合物。但此法所得之三異丙烷氧銦化合物常含有鈉,不為特定行業所接受;且不易溶於有機溶劑,不利於塗佈作業。The synthesis of indium alkoxide (In(OR) 3 ) has been described in the literature, as described in "J. Indian Chem. Soc. Vol LIII, September 1976, pp. 867-869" for the synthesis of alkoxyin compounds. law. For example, the synthesis of indium tri-isopropoxide is carried out by refluxing anhydrous indium chloride (InCl 3 , anhydrous) with tripropanol (isopropanol) in the presence of sodium isopropoxide. be made of. Further, the triisopropane indium oxide compound is subjected to alcoholysis to obtain other alkoxyin indium compounds. However, the triisopropane indium oxide compound obtained by this method often contains sodium, which is not accepted by a specific industry; and is not easily dissolved in an organic solvent, which is disadvantageous for coating work.
另有其他專利描述有關烷氧金屬化合物之合成法,是將金屬鹵化物於鹼性環境下與醇類反應而得,如下段說明。Other patents describe the synthesis of alkoxide metal compounds by reacting a metal halide with an alcohol in an alkaline environment, as described in the following paragraphs.
如美國專利第3946056號揭示兩步驟法合成烷氧錫化合物(Stannic alkoxide,Sn(OR)4 ):首先是將氯化錫(SnCl4 )與烷基胺類反應(第一步驟),所得之產品再與三級醇反應(第二步驟),製得烷氧錫化合物。此法不適合烷氧銦化合物之合成,因為在第一步驟時就先生成氯化銦/烷基胺錯合體,此錯合體相當穩定且不易再與醇類反應。A two-step synthesis of alkoxytin compounds (Stannic alkoxide, Sn(OR) 4 ) is disclosed, for example, in U.S. Patent No. 3,946,056. First, tin chloride (SnCl 4 ) is reacted with an alkylamine (first step). The product is then reacted with a tertiary alcohol (second step) to produce an alkoxy tin compound. This method is not suitable for the synthesis of an alkoxyindium compound because in the first step, it is an indium chloride/alkylamine complex, which is quite stable and is not easily reacted with an alcohol.
再如美國專利第4681959號揭示兩步驟法合成有機溶劑不可溶之烷氧金屬化合物(metal alkoxides)。其方法是將金屬鹵化物先與適量之醇類反應(第一步驟),此時所產生之鹵化氫可輕易被趕走;然後將此中間產物於特定溶劑及胺類環境下,與更多之醇類反應(第二步驟),得到不溶於此特定溶劑之烷氧金屬化合物,但所生成之鹽類卻是可溶於此特定溶劑。此專利亦揭示一步驟法合成有機溶劑不可溶之烷氧金屬化合物(metal methoxides)。其方法是將金屬鹵化物於特定溶劑及胺類環境下,與適量之醇類反應所得。此烷氧金屬化合物不溶於此特定溶劑。雖然所舉例子皆為烷氧錫化合物(Stannic alkoxide)之合成,但此發明亦可用於烷氧銦化合物(Indium alkoxide)之合成。但此法所得之烷氧金屬化合物因不溶於溶劑,因此不適合於塗佈作業。Further, a two-step process for synthesizing organic solvent insoluble metal alkoxides is disclosed in U.S. Patent No. 4,681,959. The method comprises the steps of: reacting a metal halide with an appropriate amount of an alcohol (first step), wherein the hydrogen halide produced can be easily removed; and then the intermediate product is in a specific solvent and an amine environment, and more The alcohol reaction (second step) gives an alkoxy metal compound which is insoluble in the specific solvent, but the resulting salt is soluble in the specific solvent. This patent also discloses a one-step synthesis of organic solvent insoluble metal methoxides. The method comprises the steps of: reacting a metal halide with a suitable amount of an alcohol in a specific solvent and an amine environment. This alkoxy metal compound is insoluble in this particular solvent. Although the examples are all the synthesis of astannic alkoxide, the invention can also be used for the synthesis of an indium alkoxide. However, the alkoxy metal compound obtained by this method is not suitable for a coating operation because it is insoluble in a solvent.
再如美國專利第5237081號揭示一步驟法合成有機溶劑可溶之烷氧銦化合物(Indium alkoxides)。其方法是將氯化銦(InCl3 )於有機溶劑及強鹼(pKa>10)環境下,與C3 -C20 之醇類反應所得。反應介質必須無水;有機溶劑必須是可溶所反應之醇類,或是極性溶劑;強鹼必須是低親核性。但此法會伴隨產生氯化銦/烷基胺錯合體,其量介於10%-30%,甚至有些系統高於90%。雖然此錯合體亦可當作摻質(dopant),但其生成量卻不易控制,會嚴重影響塗佈液之品質。此錯合體相當穩定且不利於塗膜之導電性。Further, a one-step synthesis of organic solvent-soluble indium alkoxides is disclosed in U.S. Patent No. 5,327,081. The method comprises the steps of: reacting indium chloride (InCl 3 ) in an organic solvent and a strong base (pKa>10) with an alcohol of C 3 -C 20 . The reaction medium must be anhydrous; the organic solvent must be a soluble alcohol or a polar solvent; the strong base must be low nucleophilic. However, this method is accompanied by the formation of indium chloride/alkylamine complexes in amounts ranging from 10% to 30%, and even some systems are higher than 90%. Although this mismatch can also be used as a dopant, the amount of formation is not easily controlled, which seriously affects the quality of the coating liquid. This mismatch is quite stable and is not conducive to the conductivity of the coating film.
有些專利文獻揭示了可以塗佈用之銦錫氧化物(Indium Tin oxide,ITO)水溶液之製造方法,如台灣專利538121、美國專利第4594182號、美國專利第6533966號B1、美國專利第6936100號B2等。而這些皆是已經形成無機物(金屬氧化物)之塗佈液,不是本發明所揭示之有機化合物之塗佈液。而有機化合物之塗佈液也有以銦錫有機螯合物錯合體而揭示者,如美國專利第4268539號、美國專利第4391743號等。其揭示之銦錫有機螯合物錯合體為In(X) l (Y) m 及Sn(X)2 or Sn(Y) m ’ 之混合物,其中X為β-雙酮(如乙醯丙酮,acetylacetone)或其酯類(如乙醯醋酸甲酯,methyl acetoacetate)所形成之螯合環(chelate ring),Y為醇類所形成之烷氧基。此等銦錫有機螯合物錯合體相當穩定,必須高於550℃以上始能將有機物質劣解形成ITO薄膜。不似本發明所揭示之烷氧銦錫化合物(In(OR)3 ,Sn(OR)4 ),可以於較低溫(50-200℃)與水氣進行水解再縮合之反應而形成ITO薄膜。同時,上述專利也揭示了銦錫有機螯合物錯合體塗佈液中每100部分銦化合物中必須有5-20部分錫化合物。Some patent documents disclose a method for producing an indium tin oxide (ITO) aqueous solution which can be coated, such as Taiwan Patent No. 538121, U.S. Patent No. 4,594,182, U.S. Patent No. 6,533,966 B1, U.S. Patent No. 6,316,100 B2 Wait. All of these are coating liquids in which an inorganic substance (metal oxide) has been formed, and are not coating liquids of the organic compound disclosed in the present invention. The coating solution of the organic compound is also disclosed by an indium tin organic chelate complex, such as U.S. Patent No. 4,268,539, U.S. Patent No. 4,391,743, and the like. The disclosed indium tin organic chelate complex is a mixture of In(X) l (Y) m and Sn(X) 2 or Sn(Y) m ' , wherein X is a β-diketone (such as acetamidine, A chelate ring formed by acetylacetone or an ester thereof (such as methyl acetoacetate), and Y is an alkoxy group formed by an alcohol. These indium tin organic chelate complexes are quite stable, and must be above 550 ° C to decompose the organic material to form an ITO film. Unlike the alkoxyindium tin compound (In(OR) 3 , Sn(OR) 4 ) disclosed in the present invention, an ITO film can be formed by a hydrolysis and recondensation reaction with water vapor at a relatively low temperature (50-200 ° C). Meanwhile, the above patent also discloses that there must be 5-20 parts of tin compounds per 100 parts of the indium compound in the indium tin organic chelate compounding solution coating liquid.
銦錫氧化物(Indium Tin oxide,ITO)即為錫摻雜氧化銦,可以In2 O3 :Sn表示,利用摻雜不同的雜質可以使ITO成為p-type或n-type的半導體。ITO屬於一種高透明性且具有高導電性的金屬氧化物薄膜(Transparent Conducting oxide,TCO),ITO為n型半導體材料,其主要成分為In2 O3 ,而In2 O3 本身在結構上就容易失去氧而形成氧空缺,因此在製備ITO薄膜的過程中就存在著許多氧空缺,這些氧空缺取代原先O2- 的位置,當失去氧原子後這些位置就留下具有負二價的靜電荷(2e- ),而產生施體中心(donor site)。這就是In2 O3 本身具有導電性質的原因。Indium tin oxide (ITO) is tin-doped indium oxide, which can be represented by In 2 O 3 :Sn, and ITO can be made into a p-type or n-type semiconductor by doping different impurities. ITO belongs to a highly transparent and highly conductive metal oxide film (TCO). ITO is an n-type semiconductor material whose main component is In 2 O 3 , and In 2 O 3 itself is structurally It is easy to lose oxygen and form oxygen vacancies. Therefore, there are many oxygen vacancies in the process of preparing ITO film. These oxygen vacancies replace the original O 2- position, and when they lose oxygen atoms, these sites leave negative static electricity. Load (2e - ), and produce a donor site. This is why In 2 O 3 itself has conductive properties.
另一方面當In2 O3 在添加SnO2 後,因為In3+ (離子半徑為0.79)與Sn4+ (離子半徑為0.69)具有相近的離子半徑,所以Sn4+ 會取代In3+ 而提供一個自由電子當做施體中心。當錫摻雜量少時,主要是以Sn4+ 為主並以施體的角色存在晶格當中,可以提高導電度;當錫參雜量多時,則以Sn2+ 為主,比In3+ 少一個電子,而成為受體中心(acceptor site),降低導電度。此外,摻雜過多的錫會使晶格扭曲,降低載子的移動力,也會降低導電度。由此可知,適當的錫摻雜量可以降低的導電性質,而且不同的製備方法其錫最大參雜量也不同。利用濺鍍法(Sputtering method)製備ITO film,其所使用的靶材(target)可為銦錫合金靶材,或是In2 O3 及SnO2 混合燒結而成的氧化物靶材,通常In:Sn=90:10(wt.%),若是利用溶膠-凝膠法製備ITO sol,其錫的摻雜量(Sn/In+Sn)將會有最適量以達較低的電阻率。On the other hand, when In 2 O 3 is added with SnO 2 , because of In 3+ (ion radius is 0.79) ) with Sn 4+ (ion radius 0.69) ) has a similar ionic radius, so Sn 4+ replaces In 3+ and provides a free electron as the center of the donor. When the amount of tin doping is small, it is mainly in the form of Sn 4+ and exists in the lattice of the donor body, which can improve the conductivity; when the amount of tin is large, the Sn 2+ is dominant, and the ratio is more than In. 3+ less one electron, and become an acceptor site, reducing conductivity. In addition, excessive doping of tin can distort the crystal lattice, reduce the mobility of the carrier, and also reduce the conductivity. It can be seen that the appropriate amount of tin doping can reduce the conductivity of the conductive, and the maximum amount of tin in the different preparation methods is also different. An ITO film is prepared by a sputtering method, and the target used may be an indium tin alloy target or an oxide target obtained by mixing and sintering In 2 O 3 and SnO 2 , usually In :Sn=90:10 (wt.%). If ITO sol is prepared by the sol-gel method, the tin doping amount (Sn/In+Sn) will have an optimum amount to achieve a lower resistivity.
在製造烷氧金屬化合物(metal alkoxide)方面,不論是一步驟法(美國專利第4681959號,美國專利第5237081號)或兩步驟法(如美國專利第3946056號,美國專利第4681959號)皆是製造單一成分之烷氧金屬化合物,如烷氧銦化合物或是烷氧錫化合物。而單一成分之烷氧金屬化合物所形成之金屬氧化物之傳導率較低。同時其所製造出來之烷氧金屬化合物純度不高,常含有如氯化銦/烷基胺錯合體等之雜質,無法於低溫下除去,導致嚴重影響傳導率。因此,本發明為採取兩步驟法或三步驟法所製造出來且有特定錫的摻雜量(Sn/In+Sn)組成之烷氧銦錫化合物(In(OR)3 ,Sn(OR)4 )混合塗佈液。且本發明所採取之兩步驟法不同於前述專利之兩步驟法(將於發明內容內詳述之),因本發明所採取之兩步驟法可得極高純度之烷氧銦錫化合物,利於低溫下(50~200℃)與水(外加於塗佈液中或於蒸氣室裡)進行水解及縮合反應,而形成無雜質之銦錫氧化物(ITO)薄膜,可以得到較低的電阻率及90%以上的光穿透度。與一般銦錫有機錯合物(Indium-Tin Organic complex)溶液施作化學濕式法時需600℃以上之施作條件不同。In the manufacture of a metal alkoxide, either a one-step process (US Pat. No. 4,681,959, U.S. Patent No. 5,237,801) or a two-step process (e.g., U.S. Patent No. 3,946,056, U.S. Patent No. 4,681,959) A single component alkoxy metal compound such as an alkoxyin compound or an alkoxy tin compound is produced. The metal oxide formed by the single-component alkoxide metal compound has a low conductivity. At the same time, the alkoxy metal compound produced is not high in purity, and often contains impurities such as indium chloride/alkylamine complex, which cannot be removed at a low temperature, resulting in a serious influence on conductivity. Therefore, the present invention is an alkoxyindium tin compound (In(OR) 3 , Sn(OR) 4 which is produced by a two-step method or a three-step method and has a specific tin doping amount (Sn/In+Sn). ) Mix the coating solution. Moreover, the two-step method adopted by the present invention is different from the two-step method of the aforementioned patent (which will be described in detail in the Summary of the Invention), and the two-step method adopted by the present invention can obtain an extremely high purity alkoxyindium tin compound, which is advantageous for Hydrolysis and condensation reaction at low temperature (50~200 °C) with water (added to the coating liquid or in the vapor chamber) to form an impurity-free indium tin oxide (ITO) film, which can obtain a lower resistivity. And more than 90% of the light penetration. It is required to apply a chemical wet method to a general indium-Tin Organic complex solution at 600 ° C or higher.
既有技術之缺點如下:The shortcomings of the existing technologies are as follows:
1.以合成可溶於反應介質之烷氧金屬化合物但可析出鹽類雜質之方法,其缺點是只製造出單一成份的烷氧金屬化合物,同時易殘留鹽類雜質或鹵化銦(錫)/烷基胺錯合體,影響品質。1. A method for synthesizing an alkoxy metal compound soluble in a reaction medium but capable of precipitating a salt impurity, which has the disadvantage of producing only a single component alkoxy metal compound, and at the same time easily remaining a salt impurity or an indium halide (tin) / Alkylamines are mismatched and affect quality.
2.以合成不溶於反應介質而析出烷氧金屬化合物之方法,其缺點是只製造出單一成份的烷氧金屬化合物,同時因不溶於反應介質,不適合塗佈作業。2. A method for synthesizing an alkoxy metal compound by synthesizing insoluble in a reaction medium, which has the disadvantage of producing only a single component alkoxy metal compound, and is insoluble in a reaction medium, and is not suitable for coating work.
3.以合成銦錫有機螯合物錯合體之方法,此方法雖是製得兩主成份之方法,但此螯合物錯合體必須高於550℃以上始能將有機物質劣解形成ITO薄膜。3. A method for synthesizing an indium tin organic chelate complex, which is a method for preparing two main components, but the chelate complex must be higher than 550 ° C to decompose the organic material to form an ITO film. .
本發明人有鑑於配製銦錫氧化物之前驅物之既有技術有諸多缺點,經過長時間的研究以及不斷試驗後,終於發明出此烷氧銦錫化合物塗佈液及其製造方法。The present inventors have invented the alkoxyindium tin compound coating liquid and a method for producing the same, after a long period of research and continuous testing, in view of the shortcomings of the prior art of preparing indium tin oxide.
本發明之目的在於提供一種極高純度且為含特定錫摻雜量之非單一主成分之烷氧銦錫化合物塗佈液,並可於低溫下與水進行水解及縮合反應,而形成無雜質之銦錫氧化物薄膜。The object of the present invention is to provide an alkoxyindium tin compound coating liquid which is of a very high purity and which is not a single main component containing a specific tin doping amount, and can be hydrolyzed and condensed with water at a low temperature to form an impurity-free substance. Indium tin oxide film.
為達上述目的,本發明所運用的技術手段係在於提供一種烷氧銦錫化合物塗佈液之製造方法,係包括:將無水級鹵化銦(InX3 )、無水級鹵化錫(SnX4 )與醇類依特定比例配方溶於第一溶劑,於低溫條件下進行反應一段時間,形成澄清溶液,再慢慢加入稀釋過之鹼類觸媒,再於低溫條件下進行反應一段時間,濾去鹽類沉澱物後,獲得該烷氧銦錫化合物塗佈液。In order to achieve the above object, the technical means used in the present invention is to provide a method for producing an alkoxyindium tin compound coating liquid, which comprises: a non-aqueous level indium halide (InX 3 ), a non-aqueous level tin halide (SnX 4 ) and The alcohol is dissolved in the first solvent according to a specific ratio formula, and the reaction is carried out under a low temperature condition for a certain period of time to form a clear solution, and then the diluted alkali catalyst is slowly added, and the reaction is carried out under a low temperature condition for a while, and the salt is filtered off. After the precipitate was obtained, the alkoxyindium tin compound coating liquid was obtained.
其中,於加入稀釋過之鹼類觸媒於低溫條件下進行反應一段時間並濾去鹽類沉澱物後,濃縮除去溶劑,該溶劑包含第一溶劑及未反應之醇類;再依特定比列加入第二溶劑,即獲得該烷氧銦錫化合物塗佈液。Wherein, after adding the diluted alkali catalyst to the reaction under a low temperature condition for a period of time and filtering off the salt precipitate, the solvent is concentrated and removed, the solvent comprises the first solvent and the unreacted alcohol; The second solvent is added to obtain the alkoxyindium tin compound coating liquid.
其中,所述之無水級鹵化銦係選自由下列所述之化合物所組成之群組:無水級氯化銦(InCl3 ,anhydrous)與無水級溴化銦(InBr3 ,anhydrous),所述之無水級鹵化錫係選自由下列所述之化合物所組成之群組:無水級氯化錫(SnCl4 ,anhydrous)與無水級溴化錫(SnBr4 ,anhydrous)。Wherein the anhydrous indium halide is selected from the group consisting of anhydrous indium chloride (InCl 3 , anhydrous) and anhydrous indium bromide (InBr 3 , anhydrous), The anhydrous grade tin halide is selected from the group consisting of anhydrous grade tin chloride (SnCl 4 , anhydrous) and anhydrous grade tin bromide (SnBr 4 , anhydrous).
其中,該醇類係選自由下列所述之化合物所組成之群組:碳三~碳二十(C3~C20)之一級醇、環己醇及其混合物。Wherein the alcohol is selected from the group consisting of the following compounds: a carbon tri-carbon 20 (C3 to C20) mono-alcohol, cyclohexanol, and mixtures thereof.
較佳的是,該醇類係選自由下列所述之化合物所組成之群組:碳四~碳八(C4~C8)之一級醇、1-丁醇、1-戊醇、環己醇及其混合物。Preferably, the alcohol is selected from the group consisting of the following compounds: carbon tetra-carbon eight (C4~C8) mono-alcohol, 1-butanol, 1-pentanol, cyclohexanol and Its mixture.
其中,所述之第一溶劑係選自由下列所述之化合物所組成之群組:氯仿(chloroform)、二甲基甲醯胺(dimethylformamide,DMF)、乙腈(acetonitrile)、四氫呋喃(THF)、二甲基碸(DMSO)、丙酮、1,4二氧六雜環(1,4 dioxane)、醋酸乙酯及其混合物。Wherein the first solvent is selected from the group consisting of chloroform, dimethylformamide (DMF), acetonitrile, tetrahydrofuran (THF), Methyl hydrazine (DMSO), acetone, 1,4 dioxane (1,4 dioxane), ethyl acetate, and mixtures thereof.
較佳的是,所述之第一溶劑係為四氫呋喃。Preferably, the first solvent is tetrahydrofuran.
其中,所述之鹼類觸媒係為高pKa值、低親核性且帶有受阻氮之強鹼,其係選自由下列所述之化合物所組成之群組:三甲基胺(trimethylamine,TMA)、三乙基胺(triethylaminq,TEA)、1,1,3,3-四甲基胍(1,1,3,3-tetramethylguanidine,TMG)、1,8-二氮雜二環[5,4,0]十一碳七烯(diazabicyclo[5,4,0]undec-7-ene,DABU)、1,5-二氮雜二環[4,3,0]壬五烯(1,5-diazabicyclo[4,3,0]non-5-ene,DABN)、1,8-雙二甲氨基萘(1,8-bis(dimethylamino)naphthalene(Proton sponge))。Wherein the base-based catalyst is a high pKa value, a low nucleophilicity and a strong base with hindered nitrogen selected from the group consisting of trimethylamine (trimethylamine, TMA), triethylaminq (TEA), 1,1,3,3-tetramethylguanidine (TMG), 1,8-diazabicyclo[5 , 4,0] diazabicyclo[5,4,0]undec-7-ene,DABU), 1,5-diazabicyclo[4,3,0]nonanequine (1, 5-diazabicyclo[4,3,0]non-5-ene,DABN), 1,8-bis(dimethylaminonaphthalene (Proton sponge).
較佳的是,所述之鹼類觸媒係為三乙基胺。Preferably, the base catalyst is triethylamine.
其中,所述之第二溶劑係選自由下列所述之化合物所組成之群組:碳三~碳二十(C3~C20)之醇類及與鹵化銦鹵化錫反應之醇類、氯仿、二甲基甲醯胺(DMF)、乙腈(acetonitrile)、四氫呋喃(THF)、二甲基碸(DMSO)、丙酮、1,4二氧六雜環(1,4 dioxane)、醋酸乙酯及其混合物。Wherein, the second solvent is selected from the group consisting of the following compounds: carbon tri-carbon 20 (C3 ~ C20) alcohols and alcohols reacted with indium halides, chloroform, two Methylformamide (DMF), acetonitrile, tetrahydrofuran (THF), dimethylhydrazine (DMSO), acetone, 1,4 dioxane (1,4 dioxane), ethyl acetate, and mixtures thereof .
其中,於濾去鹽類沉澱物後係進一步添加螯合劑以獲得該烷氧銦錫化合物塗佈液,所述之螯合劑係選自由下列所述之化合物所組成之群組:β-雙酮及其酯類。Wherein, after the salt precipitate is filtered off, a chelating agent is further added to obtain the alkoxyindium tin compound coating liquid, and the chelating agent is selected from the group consisting of the following compounds: β-diketone And its esters.
其中,於依特定比列加入第二溶劑後,係添加螯合劑以獲得該烷氧銦錫化合物塗佈液,所述之螯合劑係選自由下列所述之化合物所組成之群組:β-雙酮及其酯類。Wherein, after adding the second solvent to the specific ratio, a chelating agent is added to obtain the alkoxyindium tin compound coating liquid, and the chelating agent is selected from the group consisting of the following compounds: β- Diketones and their esters.
較佳的是,所述之螯合劑係選自由下列所述之化合物所組成之群組:乙醯醋酸甲酯(methyl acetoacetate)及乙醯丙酮(acetylacetone)及其混合物。Preferably, the chelating agent is selected from the group consisting of methyl acetoacetate and acetylacetone and mixtures thereof.
更佳的是,所述之螯合劑係為乙醯丙酮(acetylacetone)。More preferably, the chelating agent is acetylacetone.
其中,所述之無水級鹵化銦(InX3 )與無水級鹵化錫(SnX4 )係依該無水級鹵化錫為該無水級鹵化銦與該無水級鹵化錫之二者總合的5~15mole%之比例混合(即SnX4 /(InX3 +SnX4 )之摩爾百分比)。Wherein, the anhydrous-grade indium halide (InX 3 ) and the anhydrous-grade tin halide (SnX 4 ) are based on the anhydrous-grade tin halide, and the total of the anhydrous-grade indium halide and the anhydrous-grade tin halide are 5 to 15 mole. The ratio of % is mixed (ie, the molar percentage of SnX 4 /(InX 3 +SnX 4 )).
較佳的是,所述之無水級鹵化銦與無水級鹵化錫係依該無水級鹵化錫為該無水級鹵化銦與該無水級鹵化錫之二者總合的8~13mole%之比例混合。Preferably, the anhydrous-grade indium halide and the anhydrous-grade tin halide are mixed according to the anhydrous-grade tin halide in a ratio of 8 to 13 mole% of the total of the anhydrous-grade indium halide and the anhydrous-grade tin halide.
其中,所述之醇類之使用量為該醇類為該無水級鹵化銦與該無水級鹵化錫之二者總合的310mole%~600mole%(即(醇類)/(無水級鹵化銦+無水級鹵化錫)之摩爾百分比)。Wherein, the alcohol is used in an amount of from 310 mole% to 600 mole% of the total of the anhydrous grade indium halide and the anhydrous grade tin halide (ie (alcohol) / (anhydrous indium halide +) The molar percentage of anhydrous-grade tin halide).
較佳的是,所述之醇類之使用量為該醇類為該無水級鹵化銦與該無水級鹵化錫之二者總合的380mole%~450mole%。Preferably, the alcohol is used in an amount of from 380 mole% to 450 mole% of the total of the anhydrous grade indium halide and the anhydrous grade tin halide.
其中,所述之第一溶劑之特定比例配方的總量配比為該第一溶劑為該無水級鹵化銦、該無水級鹵化錫與該醇類之三者總合的320wt%~1290wt%(即(第一溶劑)/(無水級鹵化銦+無水級鹵化錫+醇類)之重量百分比)。Wherein, the total ratio of the specific ratio of the first solvent is that the first solvent is 320 wt% to 1290 wt% of the anhydrous grade indium halide, the anhydrous grade tin halide and the alcohol. That is (the first solvent) / (anhydrous indium halide + anhydrous grade tin halide + alcohol) by weight).
較佳的是,所述之第一溶劑之特定比例配方的總量配比為該第一溶劑為該無水級鹵化銦、該無水級鹵化錫與該醇類之三者總合的430wt%~810wt%。Preferably, the total ratio of the specific ratio of the first solvent is that the first solvent is 430 wt% of the anhydrous grade indium halide, the anhydrous grade tin halide and the alcohol. 810 wt%.
其中,所述之鹼類觸媒之使用配比為該鹼類觸媒為無水級鹵化銦與該無水級鹵化錫之二者總合的310~500mole%(即(鹼類觸媒)/(無水級鹵化銦+無水級鹵化錫)之摩爾百分比)。Wherein, the base catalyst is used in a ratio of 310 to 500 mole% (ie (alkali catalyst) / (the total amount of the anhydrous-grade indium halide and the anhydrous-grade tin halide). The molar percentage of anhydrous grade indium halide + anhydrous grade tin halide).
較佳的是,所述之鹼類觸媒之使用配比為該鹼類觸媒為該無水級鹵化銦與該無水級鹵化錫之二者總合的310~400mole%。Preferably, the base catalyst is used in a ratio of 310 to 400 mole% of the total of the anhydrous grade indium halide and the anhydrous grade tin halide.
其中,所述之稀釋過之鹼類觸媒的使用配比為該鹼類觸媒為醇類或第一溶劑的10~50wt%,而所述之醇類之使用量及所述之第一溶劑之使用量已涵蓋於前述之醇類及第一溶劑之使用總量之內。Wherein the diluted base catalyst is used in a ratio of 10 to 50% by weight of the alkali catalyst or the first solvent, and the amount of the alcohol used and the first The amount of the solvent used is included in the total amount of the aforementioned alcohol and the first solvent.
其中,所述之低溫條件為-40℃~60℃。Wherein, the low temperature condition is -40 ° C ~ 60 ° C.
較佳的是,所述之低溫條件為0℃~10℃。Preferably, the low temperature condition is from 0 ° C to 10 ° C.
其中,將無水級鹵化銦、無水級鹵化錫與醇類依特定比例配方溶於第一溶劑後,於低溫條件下進行反應而形成澄清溶液;再慢慢加入稀釋過之鹼類觸媒,再於低溫條件下進行反應超過而獲得大量鹽類析出。Wherein, the anhydrous-grade indium halide, the anhydrous-grade tin halide and the alcohol are dissolved in the first solvent according to a specific ratio formula, and then reacted under a low temperature condition to form a clear solution; and then the diluted alkali-based catalyst is slowly added, and then The reaction was carried out under low temperature conditions to obtain a large amount of salt precipitation.
較佳的是,將無水級鹵化銦、無水級鹵化錫與醇類依特定比例配方溶於第一溶劑後,於低溫條件下進行反應0.5小時而形成澄清溶液,再慢慢加入稀釋過之鹼類觸媒,再於低溫條件下進行反應超過1小時而獲得大量鹽類析出。Preferably, the anhydrous-grade indium halide, the anhydrous-grade tin halide and the alcohol are dissolved in the first solvent according to a specific ratio, and then reacted at a low temperature for 0.5 hours to form a clear solution, and then slowly added the diluted alkali. The catalyst is reacted under low temperature conditions for more than one hour to obtain a large amount of salt precipitation.
其中,將無水級鹵化銦、無水級鹵化錫(SnX4 )與醇類依特定比例配方溶於第一溶劑,並於低溫條件下進行反應一段時間後,係於半小時內完成加入稀釋過之鹼類觸媒的步驟。Wherein, the anhydrous grade indium halide, the anhydrous grade tin halide (SnX 4 ) and the alcohol are dissolved in the first solvent according to a specific ratio formula, and the reaction is carried out under a low temperature condition for a period of time, and then the dilution is completed within half an hour. The step of a base catalyst.
本發明還關於一種烷氧銦錫化合物塗佈液,其係如前述之烷氧銦錫化合物塗佈液之製造方法所製成者。The present invention also relates to an alkoxyindium tin compound coating liquid which is produced by the above-described method for producing an alkoxyindium tin compound coating liquid.
本發明又關於一種烷氧銦錫化合物塗佈液,其係包括:烷氧銦錫化合物、第二溶劑,該烷氧銦錫化合物係由銦和錫依特定原子比例溶於該等溶劑中。The present invention further relates to an alkoxyindium tin compound coating liquid comprising: an alkoxyindium tin compound, and a second solvent, wherein the alkoxyindium tin compound is dissolved in the solvent by a specific atomic ratio of indium and tin.
其中,該烷氧銦錫化合物塗佈液尚包含螯合劑。Wherein, the alkoxyindium tin compound coating liquid further contains a chelating agent.
其中,該螯合劑係為乙醯醋酸甲酯(methyl acetoacetate)、乙醯丙酮(acetylacetone)及其混合物。Wherein, the chelating agent is methyl acetoacetate, acetylacetone and a mixture thereof.
其中,烷氧銦錫化合物是烷氧銦化合物和烷氧錫化合物之混合物。Among them, the alkoxyindium tin compound is a mixture of an alkoxyindium compound and an alkoxy tin compound.
較佳的是,該烷氧銦錫化合物係為無水級鹵化銦、無水級鹵化錫與醇類所產生之烷氧銦錫化合物,且該無水級鹵化銦係選自由下列所述之化合物所組成之群組:無水級氯化銦(InCl3 ,anhydrous)與無水級溴化銦(InBr3 ,anhydrous),該無水級鹵化錫係選自由下列所述之化合物所組成之群組:無水級氯化錫(SnCl4 ,anhydrous)與無水級溴化錫(SnBr4 ,anhydrous),該醇類係選自由下列所述之化合物所組成之群組:碳三~碳二十(C3~C20)之一級醇、1-丁醇、1-戊醇、環己醇及其混合物;該第二溶劑係選自由下列所述之化合物所組成之群組:碳三~碳二十(C3~C20)之醇類及與鹵化銦鹵化錫反應之醇類、氯仿、二甲基甲醯胺(DMF)、乙腈(acetonitrile)、四氫呋喃(THF)、二甲基碸(DMSO)、丙酮、1,4二氧六雜環(1,4 dioxane)、醋酸乙酯及其混合物。Preferably, the alkoxyindium tin compound is an alkoxyindium tin compound produced by a anhydrous-grade indium halide, an anhydrous-grade tin halide and an alcohol, and the anhydrous-grade indium halide is selected from the group consisting of the following compounds. Group: anhydrous grade indium chloride (InCl 3 , anhydrous) and anhydrous grade indium bromide (InBr 3 , anhydrous), the anhydrous grade tin halide is selected from the group consisting of the following compounds: anhydrous chlorine Tin (SnCl 4 , anhydrous) and anhydrous grade tin bromide (SnBr 4 , anhydrous), the alcohol is selected from the group consisting of the following compounds: carbon tri-carbon 20 (C3 ~ C20) a primary alcohol, 1-butanol, 1-pentanol, cyclohexanol, and mixtures thereof; the second solvent is selected from the group consisting of the following compounds: carbon tri-carbon 20 (C3 to C20) Alcohols and alcohols reacted with indium halides, chloroform, dimethylformamide (DMF), acetonitrile, tetrahydrofuran (THF), dimethylhydrazine (DMSO), acetone, 1,4 dioxo Hexacyclic (1,4 dioxane), ethyl acetate and mixtures thereof.
其中,該烷氧銦錫化合物係選自由下列所述之化合物所組成之群組:1-丁烷氧銦錫化合物、1-戊烷氧銦錫化合物、環己烷氧銦錫化合物及其混合物。Wherein the alkoxyindium tin compound is selected from the group consisting of 1-butane indium tin oxide compounds, 1-pentane indium tin oxide compounds, cyclohexane indium tin compounds, and mixtures thereof .
其中,烷氧銦錫化合物中之錫原子數為錫與銦原子數之總合的5at%~15at%(即Sn/(Sn+In)之原子數百分比)。The number of tin atoms in the alkoxyindium tin compound is 5 at% to 15 at% (i.e., the atomic percentage of Sn/(Sn+In)) of the total of the number of tin and indium atoms.
較佳的是,錫原子數為錫與銦原子數之總合的8at%~13at%。Preferably, the number of tin atoms is from 8 at% to 13 at% of the total of the number of tin and indium atoms.
較佳的是,該螯合劑之濃度為烷氧銦錫化合物之濃度的5~300mole%。Preferably, the concentration of the chelating agent is from 5 to 300 mole% of the concentration of the alkoxy tin indium compound.
更佳的是,該螯合劑之濃度為烷氧銦錫化合物之濃度的30~100mole%。More preferably, the concentration of the chelating agent is from 30 to 100 mole% of the concentration of the alkoxy tin indium compound.
較佳的是,烷氧銦錫化合物之濃度為該烷氧銦錫化合物塗佈液之5wt%~20wt%。Preferably, the concentration of the alkoxyindium tin compound is 5 wt% to 20 wt% of the alkoxyindium tin compound coating liquid.
更佳的是,烷氧銦錫化合物之濃度為該烷氧銦錫化合物塗佈液之8wt%~15wt%。More preferably, the concentration of the alkoxyindium tin compound is from 8 wt% to 15 wt% of the alkoxyindium tin compound coating liquid.
本發明又關於一種銦錫氧化物薄膜之製法,係包括:提供一基材;提供一烷氧銦錫化合物塗佈液;將該烷氧銦錫化合物塗佈液塗佈於該基材,並於50~200℃進行水解及縮合反應並除去所產生之醇類物質,及殘留之各溶劑與螯合劑而得到該銦錫氧化物(ITO)薄膜。The invention further relates to a method for preparing an indium tin oxide film, comprising: providing a substrate; providing an alkoxyindium tin compound coating solution; coating the alkoxyindium tin compound coating solution on the substrate, and The indium tin oxide (ITO) film is obtained by performing hydrolysis and condensation reaction at 50 to 200 ° C to remove the produced alcoholic substance, and residual solvent and chelating agent.
其中,在將該烷氧銦錫化合物塗佈液塗佈於該基材之前尚包括將該烷氧銦錫化合物塗佈液加水稀釋。Here, before applying the alkoxyindium tin compound coating liquid to the substrate, the alkoxyindium tin compound coating liquid is diluted with water.
其中,於水解及縮合反應之後,進一步進行燒結,該燒結溫度係大於200℃,燒結時間係大於30分鐘。Wherein, after the hydrolysis and condensation reaction, sintering is further carried out, the sintering temperature is greater than 200 ° C, and the sintering time is greater than 30 minutes.
較佳的是,於水解及縮合反應之後,進一步進行燒結,該燒結溫度係大於300℃。Preferably, the sintering is further carried out after the hydrolysis and condensation reaction, and the sintering temperature is greater than 300 °C.
較佳的是,將該烷氧銦錫化合物塗佈液加水稀釋時,其加入水份量之水比烷氧銦錫化合物為100~300mole%。Preferably, when the alkoxyindium tin compound coating liquid is diluted with water, the amount of water added to the water is 100 to 300 mole% more than the alkoxyindium tin compound.
更佳的是,將該烷氧銦錫化合物塗佈液加水稀釋時,其加入水份量之水比烷氧銦錫化合物為170~230mole%。More preferably, when the alkoxyindium tin compound coating liquid is diluted with water, the amount of water added to the water is 170 to 230 mole% more than the alkoxy tin indium compound.
本發明所提供之烷氧銦錫化合物塗佈液及其製造方法,藉由上述技術手段,可以獲得的優點及功效增進至少包括:The alkoxyindium tin compound coating liquid provided by the present invention and the method for producing the same, the advantages and the enhancements obtained by the above technical means include at least:
1、本發明所採取之製造方法可得極高純度之烷氧銦錫化合物之塗佈液。1. The production method adopted in the present invention can obtain a coating liquid of an alkoxyindium tin compound of extremely high purity.
2、本發明所採取之製造方法所製造出之塗佈液為非單一主成分之塗佈液,而是含特定錫的摻雜量(Sn/In+Sn)組成之烷氧銦錫化合物(In(OR)3 ,Sn(OR)4 )混合塗佈液。2. The coating liquid produced by the manufacturing method of the present invention is a coating liquid other than a single main component, but an alkoxyindium tin compound containing a specific tin doping amount (Sn/In+Sn) ( In(OR) 3 , Sn(OR) 4 ) Mixed coating solution.
3、本發明所製造出之烷氧銦錫化合物(In(OR)3 ,Sn(OR)4 )混合塗佈液可於低溫下(50~200℃)與水(外加於塗佈液中或於蒸氣室裡)進行水解及縮合反應,而形成無雜質之銦錫氧化物(ITO)薄膜,可以得到較低的電阻率及90%以上的光穿透度。因此可大量使用於無法耐高溫之基材上。3. The mixed solution of the alkoxyindium tin compound (In(OR) 3 , Sn(OR) 4 ) produced by the present invention can be applied to the coating liquid at a low temperature (50 to 200 ° C) or water (or Hydrolysis and condensation reactions are carried out in a vapor chamber to form an impurity-free indium tin oxide (ITO) film, which results in a lower resistivity and a light transmittance of 90% or more. Therefore, it can be used in a large amount on substrates which cannot withstand high temperatures.
一般濕式塗佈法施作可利用銦錫氧化物(Indium Tin oxide,ITO)水溶液、銦錫有機螯合物錯合體塗佈液(In(X) l (Y) m 及Sn(X)2 or Sn(Y) m )、及烷氧銦錫化合物(In(OR)3 ,Sn(OR)4 )混合塗佈溶液者。而銦錫氧化物(Indium Tin oxide,ITO)水溶液是利用分散劑分散ITO奈米顆粒,其ITO奈米顆粒成本高;另一塗佈液,銦錫有機螯合物錯合體塗佈液須靠極高溫(約600℃以上)始能裂解其有機物質,形成ITO薄膜;而目前專利中之烷氧銦錫化合物溶液者也僅限於製造單一成分之烷氧金屬化合物,如烷氧銦化合物或是烷氧錫化合物。而單一成分之烷氧金屬化合物所形成之金屬氧化物之傳導率較低。同時其所製造出來之烷氧金屬化合物純度不高,常含有如氯化銦/烷基胺錯合體等之雜質,無法於低溫下除去,導致嚴重影響傳導率。Generally, the wet coating method can be carried out by using an indium tin oxide (ITO) aqueous solution or an indium tin organic chelate compound coating liquid (In(X) l (Y) m and Sn(X) 2 . Or Sn(Y) m ), and alkoxyindium tin compound (In(OR) 3 , Sn(OR) 4 ) mixed coating solution. The indium tin oxide (ITO) aqueous solution disperses the ITO nano particles by using a dispersing agent, and the ITO nano particles are high in cost; the other coating liquid, the indium tin organic chelate compound coating liquid depends on the coating liquid At very high temperatures (above 600 ° C), the organic material can be cracked to form an ITO film; and the solution of the alkoxy tin indium compound in the current patent is limited to the manufacture of a single component alkoxy metal compound, such as an alkoxyin compound or Alkoxy tin compound. The metal oxide formed by the single-component alkoxide metal compound has a low conductivity. At the same time, the alkoxy metal compound produced is not high in purity, and often contains impurities such as indium chloride/alkylamine complex, which cannot be removed at a low temperature, resulting in a serious influence on conductivity.
因此,為了解决上述的問題和可於較低溫下形成高純度及高傳導率之銦錫氧化物(ITO)薄膜,可使用於無法耐高溫之基材上(如PET,PI或其他塑膠基材),本發明提供了烷氧銦錫化合物塗佈液及其製造方法與運用。Therefore, in order to solve the above problems and form a high-purity and high-conductivity indium tin oxide (ITO) film at a lower temperature, it can be used on substrates that cannot withstand high temperatures (such as PET, PI or other plastic substrates). The present invention provides an alkoxyindium tin compound coating liquid, a method for producing the same, and an application thereof.
其係包括:烷氧銦錫化合物塗佈液之製造方法;以及烷氧銦錫化合物塗佈液之組成,該烷氧銦錫化合物塗佈液係由銦和錫依所設計之原子比例,以烷氧銦錫化合物方式溶於有機溶劑所構成,以及塗佈在基材上形成銦錫氧化物(ITO)之運用。The method includes: a method for producing an alkoxyindium tin compound coating liquid; and a composition of an alkoxyindium tin compound coating liquid, wherein the alkoxyindium tin compound coating liquid is an atomic ratio designed by indium and tin The alkoxyindium tin compound is dissolved in an organic solvent and applied to a substrate to form indium tin oxide (ITO).
本發明係利用無水級鹵化銦(InX3 ,anhydrous)、無水級鹵化錫(SnX4 ,anhydrous)及醇類(alcohol)依特定化學計量,於特定之反應介質(第一溶劑)中,用鹼性觸媒以兩步驟方式製備成高純度之烷氧銦錫化合物(In(OR)3 ,Sn(OR)4 )混合塗佈溶液:或以三步驟方式,將上述混合溶液抽真空,去除溶劑可得高純度之烷氧銦錫化合物,再以特定溶劑(第二溶劑)調配成特定濃度之烷氧銦錫化合物塗佈液。此烷氧銦錫化合物塗佈液於濕式塗佈時,可於較低溫下(50~200℃)與水(外加於塗佈液中或於蒸氣室裡)進行水解及縮合反應,而形成銦錫氧化物(ITO)薄膜,並釋放出易揮發之醇類物質。此烷氧銦錫化合物塗佈液所得之銦錫氧化物(ITO)薄膜較均勻且不龜裂。因為此塗佈液可於較低溫下就可經由溶膠-凝膠法(sol-gel method)形成銦錫氧化物(ITO),可形成抗靜電材料;或可於300℃下燒結成可導電之銦錫氧化物(ITO)。因此可大量使用於無法耐高溫之基材上。如有需要,更可高於300℃燒結,且燒結時間大於30分鐘,得更高導電之銦錫氧化物(ITO)。與一般銦錫有機錯合物(Indium-Tin Organic complex)溶液施作化學濕式法時必需600℃以上之施作條件不同。The invention utilizes anhydrous grade indium halide (InX 3 , anhydrous), anhydrous grade tin halide (SnX 4 , anhydrous) and alcohol (alcohol) according to a specific stoichiometry, in a specific reaction medium (first solvent), using a base The catalyst is prepared into a high-purity mixed solution of alkane indium tin compound (In(OR) 3 , Sn(OR) 4 ) in a two-step manner: or the vacuum solution is removed in a three-step manner to remove the solvent. A high purity alkoxyindium tin compound can be obtained, and a specific concentration of the alkoxyindium tin compound coating liquid can be prepared in a specific solvent (second solvent). When the coating solution of the alkoxyindium tin compound is wet-coated, it can be hydrolyzed and condensed at a lower temperature (50 to 200 ° C) with water (added to a coating liquid or in a vapor chamber) to form a coating solution. An indium tin oxide (ITO) film that releases volatile alcohols. The indium tin oxide (ITO) film obtained from the alkoxyindium tin compound coating liquid is relatively uniform and does not crack. Since the coating liquid can form indium tin oxide (ITO) by a sol-gel method at a lower temperature, an antistatic material can be formed; or it can be sintered to be electrically conductive at 300 ° C. Indium tin oxide (ITO). Therefore, it can be used in a large amount on substrates which cannot withstand high temperatures. If necessary, it can be sintered above 300 ° C, and the sintering time is more than 30 minutes, resulting in a more conductive indium tin oxide (ITO). When it is applied to the chemical wet method with a general Indium-Tin Organic complex solution, it is necessary to have different application conditions of 600 ° C or higher.
本發明之製備烷氧銦錫化合物塗佈液所需之銦錫鹵化物為無水級氯化銦(InCl3 ,anhydrous)、無水級氯化錫(SnCl4 ,anhydrous),或無水級溴化銦(InBr3 ,anhydrous)、無水級溴化錫(SnBr4 ,anhydrous)。The indium tin halide required for preparing the alkoxyindium tin compound coating liquid of the present invention is anhydrous grade indium chloride (InCl 3 , anhydrous), anhydrous grade tin chloride (SnCl 4 , anhydrous), or anhydrous indium bromide. (InBr 3 , anhydrous), anhydrous grade tin bromide (SnBr 4 , anhydrous).
本發明之製備烷氧銦錫化合物塗佈液所需之醇類(alcohol)為可溶於反應介質(稱為第一溶劑)中並可與銦錫鹵化物反應者。通常是較小分子為佳。但甲醇及乙醇並不適合,因其所形成之烷氧銦錫化合物並不溶解於一般溶劑。較佳者為環己醇(cyclohexanol)及C4 -C20 一級醇,如1-丁醇、1-戊醇等。如塗佈作業於300℃下燒結,則醇類只可選沸點較低之C4 -C8 一級醇。The alcohol required for preparing the alkoxyindium tin compound coating liquid of the present invention is one which is soluble in a reaction medium (referred to as a first solvent) and which is reactive with indium tin halide. Usually smaller molecules are preferred. However, methanol and ethanol are not suitable because the alkoxyindium tin compound formed is not dissolved in a general solvent. Preferred are cyclohexanol and C 4 -C 20 primary alcohols such as 1-butanol, 1-pentanol and the like. If the coating operation is to be sintered at 300 ° C, the alcohol can only be selected from C 4 -C 8 primary alcohols having a lower boiling point.
本發明之製備烷氧銦錫化合物塗佈液所需之鹼性觸媒為高pKa值且低親核性。通常為帶有受阻氮之強鹼(hindered nitrogen strong base)。較佳者為三甲基胺(trimethylamine,TMA)、三乙基胺(triethylamine,TEA)、1,1,3,3-四甲基胍(1,1,3,3-tetramethylguanidine,TMG)、1,8-二氮雜二環[5,4,0]十一碳七烯(diazabicyclo[5,4,0]undec-7-ene,DABU)、1,5-二氮雜二環[4,3,0]壬五烯(1,5-diazabicyclo[4,3,0]non-5-ene,DABN)、1,8-雙二甲氨基萘(1,8-bis(dimethylamino)naphthalene(Proton sponge))The basic catalyst required for the preparation of the alkoxyindium tin compound coating liquid of the present invention has a high pKa value and low nucleophilicity. It is usually a hindered nitrogen strong base. Preferred are trimethylamine (TMA), triethylamine (TEA), 1,1,3,3-tetramethylguanidine (TMG), 1,8-diazabicyclo[5,4,0]undecene (dizabicyclo[5,4,0]undec-7-ene,DABU), 1,5-diazabicyclo[4 , 3,0] pentane (1,5-diazabicyclo[4,3,0]non-5-ene,DABN), 1,8-bis(dimethylamino)naphthalene (1,8-bis(dimethylamino)naphthalene (1,8-bis(dimethylamino)naphthalene (1,8-bis(dimethylamino)naphthalene) Proton sponge))
本發明之製備烷氧銦錫化合物塗佈液所需之反應介質(第一溶劑)必須能與上述所選之醇類及鹼性觸媒相溶。同時最佳能析出反應所產生之鹽類,如HCl.NR3 者或所產生之諸如氯化銦/烷基胺錯合體者。如不帶OH基且不與銦錫鹵化物形成錯合體者之極性溶劑常當本發明之反應介質(第一溶劑),如氯仿(chloroform)、二甲基甲醯胺(dimethylformamide,DMF)、乙腈(acetonitrile)、四氫呋喃(THF)、二甲基碸(DMSO)、丙酮、1,4二氧六雜環(1,4 dioxane)、醋酸乙酯等。反應介質(第一溶劑)可單獨使用或相互混合使用。最佳為四氫呋喃(THF)。The reaction medium (first solvent) required for the preparation of the alkoxyindium tin compound coating liquid of the present invention must be compatible with the above selected alcohols and basic catalyst. At the same time, it is preferred to precipitate the salts produced by the reaction, such as HCl.NR 3 or those produced such as indium chloride/alkylamine complexes. A polar solvent such as chloroform, dimethylformamide (DMF), or a polar solvent which does not have an OH group and does not form a complex with an indium tin halide. Acetonitrile, tetrahydrofuran (THF), dimethylhydrazine (DMSO), acetone, 1,4-dioxane (1,4 dioxane), ethyl acetate, and the like. The reaction medium (first solvent) may be used singly or in combination with each other. Most preferred is tetrahydrofuran (THF).
若以三步驟方式調配成特定濃度之烷氧銦錫化合物塗佈液所需之特定溶劑(稱為第二溶劑),除了上述第一溶劑可當第二溶劑外,在反應系統中與銦錫鹵化物反應之醇類,或其他C3 -C20 醇類亦可當第二溶劑。If a specific solvent (referred to as a second solvent) required for a specific concentration of the alkoxyindium tin compound coating liquid is formulated in a three-step manner, in addition to the above first solvent, the second solvent may be used in the reaction system with indium tin. The halide-reacted alcohol, or other C 3 -C 20 alcohol, can also be the second solvent.
特別必須強調是:反應系統所用之化學品(銦錫鹵化物、醇類、鹼性觸媒、第一溶劑及第二溶劑)必須不含任何水分。In particular, it must be emphasized that the chemicals used in the reaction system (indium tin halides, alcohols, alkaline catalysts, first solvent and second solvent) must be free of any moisture.
反應步驟:Reaction steps:
本發明之二步驟方式備製烷氧銦錫化合物塗佈液之製造方法係由一種由無水級鹵化銦(InX3 ,anhydrous)與無水級鹵化錫(SnX4 ,anhydrous)與醇類依化學劑量(stoichiometric amount)於反應介質(第一溶劑)中、通氮氣乾燥及於低溫條件下,進行反應一段時間(第一步驟),此時會產生鹵化氫。另外,將依化學劑量之鹼性觸媒事先溶於反應介質(第一溶劑)中,以稀釋鹼性觸媒之濃度。然後將此稀釋過之鹼性觸媒溶液慢慢添加入於第一步驟所得之溶液中反應一段時間(第二步驟),此外,係可於半小時內將鹼性觸媒加入於第一步驟所得之溶液中。此時鹼性觸媒會與產生之鹵化氫產物形成鹽類,如HX.NR3 ,於反應介質(第一溶劑)中析出。過濾除去鹽類,即可得高純度之烷氧銦錫化合物塗佈液。【本發明之第二步驟與先前專利(美國專利第4681959號)所述之第二步驟不同,先前專利所述之第二步驟是將第一步驟所得之溶液慢慢添加入於純鹼性觸媒中。此法由於瞬間接觸大量鹼性觸媒,會生成高度穩定性之鹵化銦/烷基胺錯合體,其量介於10%-30%,其生成量也不易控制,也不易除去,會嚴重影響塗佈液之品質,不利於塗膜之導電性。同時美國專利第4681959號所揭示兩步驟法是合成有機溶劑不可溶之烷氧金屬化合物(metal alkoxides),而本專利是選擇適當溶劑,使其為有機溶劑可溶之烷氧金屬化合物】The method for preparing an alkoxyindium tin compound coating liquid according to the two-step method of the present invention comprises a chemical-based dosage of an anhydrous indium halide (InX 3 , anhydrous) and a nonaqueous anhydrous tin (SnX 4 , anhydrous) and an alcohol. Stoichiometric amount is carried out in a reaction medium (first solvent), dried under nitrogen and at a low temperature for a period of time (first step), at which time a hydrogen halide is produced. Further, a chemically dosed alkaline catalyst is previously dissolved in the reaction medium (first solvent) to dilute the concentration of the basic catalyst. Then, the diluted alkaline catalyst solution is slowly added to the solution obtained in the first step for a certain period of time (second step), and in addition, the alkaline catalyst can be added to the first step within half an hour. In the resulting solution. At this time, the basic catalyst forms a salt with the hydrogen halide product produced, such as HX.NR 3 , and precipitates in the reaction medium (first solvent). The salt is removed by filtration to obtain a high purity alkoxyindium tin compound coating liquid. [The second step of the present invention is different from the second step described in the prior patent (U.S. Patent No. 4,681,959). The second step described in the prior patent is to slowly add the solution obtained in the first step to the pure alkaline catalyst. in. This method generates a highly stable indium halide/alkylamine complex due to the instantaneous contact with a large amount of alkaline catalyst, and the amount thereof is between 10% and 30%, and the amount thereof is also difficult to control and difficult to remove, which may seriously affect The quality of the coating liquid is not conducive to the conductivity of the coating film. At the same time, the two-step method disclosed in U.S. Patent No. 4,681,959 is to synthesize organic alkoxides which are insoluble in organic solvents, and this patent is an alkoxy metal compound which is selected from a suitable solvent to be an organic solvent.
本發明中無水級鹵化銦(InX3 ,anhydrous)與無水級鹵化錫(SnX4 ,anhydrous)係依Sn原子數/(Sn+In)原子數為5~15at%之比例混合會得較高之傳導率;亦即SnX4 /(InX3 +SnX4 )以5~15mole%之比例混合,期望所製得之烷氧銦錫化合物(In(OR)3 ,Sn(OR)4 )混合塗佈液中之Sn(OR)4 /(In(OR)3 +Sn(OR)4 )為5~15mole%之比例混合會得較高之傳導率。SnX4 /(InX3 +SnX4 )較佳為8~13mole%之比例混合。In the present invention, the anhydrous-grade indium halide (InX 3 , anhydrous) and the anhydrous-grade tin halide (SnX 4 , anhydrous) are mixed at a ratio of the number of Sn atoms/(Sn+In) atoms of 5 to 15 at%. Conductivity; that is, SnX 4 /(InX 3 +SnX 4 ) is mixed at a ratio of 5 to 15 mole%, and it is desired to mix and coat the obtained alkoxyindium tin compound (In(OR) 3 , Sn(OR) 4 ). When the ratio of Sn(OR) 4 /(In(OR) 3 +Sn(OR) 4 ) in the liquid is 5 to 15 mole%, a higher conductivity is obtained. SnX 4 /(InX 3 +SnX 4 ) is preferably mixed in a ratio of 8 to 13 mole%.
本發明中之醇類之使用量,基本上最低量是依化學劑量(stoichiometric amount)計算。最低使用量之醇類摩爾數為SnX4 摩爾數乘以4倍加上InX3 摩爾數乘以3倍之量。但為了讓反應更完全,確保無SnX4 及InX3 殘留,通常會適當加量醇類。但量太多時會不利HX.NR3 鹽類之析出,因此,較佳醇類之使用量為:(醇類)/(無水級鹵化銦+無水級鹵化錫)為310mole%~600mole%,最佳為380mole%~450mole%。The amount of the alcohol used in the present invention is substantially the lowest amount calculated based on the stoichiometric amount. The minimum amount of alcohol used is the number of moles of SnX 4 times 4 times plus the number of moles of InX 3 multiplied by 3 times. However, in order to make the reaction more complete, and to ensure no SnX 4 and InX 3 residues, it is usually appropriate to add alcohol. However, when the amount is too large, the precipitation of HX.NR 3 salt is disadvantageous. Therefore, the preferred amount of alcohol used is: (alcohol) / (anhydrous indium halide + anhydrous grade tin halide) is 310 mole% to 600 mole%, The best is 380mole%~450mole%.
本發明中反應介質(第一溶劑)中最佳是能析出反應所產生之鹽類者,其量並不限制,但其量必須足夠能均勻溶解無水級鹵化銦與無水級鹵化錫。為了利於析出HX.NR3 鹽類,適當過量反應介質(第一溶劑)是必須的,但如果其量太大,會因反應系統濃度太低導致反應速度太慢,且所得之烷氧銦錫化合物塗佈液之濃度太低,不利作業。但如果反應溶劑太多導致濃度太低,亦可於反應完畢後抽去部分溶劑,以利作業。雖然第一溶劑之量並不限制,但為了達到所需之有效成份之濃度(其較佳烷氧銦錫化合物濃度為5wt%~20wt%。最佳濃度為8wt%~15wt%),較佳使用第一溶劑之總量配比為(第一溶劑)/(無水級鹵化銦+無水級鹵化錫+醇類)為320wt%~1290wt%,最佳為430wt%~810wt%。In the reaction medium (first solvent) of the present invention, the salt produced by the precipitation reaction is preferably the same, and the amount thereof is not limited, but the amount thereof must be sufficient to uniformly dissolve the anhydrous-grade indium halide and the anhydrous-grade tin halide. In order to facilitate the precipitation of HX.NR 3 salts, a suitable excess of the reaction medium (first solvent) is necessary, but if the amount is too large, the reaction rate is too slow due to the too low concentration of the reaction system, and the obtained alkoxyindium tin The concentration of the compound coating liquid is too low, which is unfavorable. However, if the reaction solvent is too much, the concentration is too low, and some of the solvent may be removed after the reaction is completed to facilitate the operation. Although the amount of the first solvent is not limited, in order to attain the concentration of the active ingredient required (the preferred alkoxyindium tin compound concentration is 5 wt% to 20 wt%, and the optimum concentration is 8 wt% to 15 wt%), preferably The total amount of the first solvent used is (first solvent) / (anhydrous indium halide + anhydrous grade tin halide + alcohol) is from 320 wt% to 1290 wt%, most preferably from 430 wt% to 810 wt%.
本發明中之鹼性觸媒之使用量,基本上最低量是依化學劑量(stoichiometric amount)計算。最低使用量之鹼性觸媒摩爾數為SnX4 摩爾數乘以4倍加上InX3 摩爾數乘以3倍之量。但為了完全除去鹵元素,適當過量鹼性觸媒是必須的,以便形成HX.NR3 鹽類而析出。但如果過量太多,會有形成高度穩定性之鹵化銦/烷基胺錯合體之虞,不易除去,會嚴重影響塗佈液之品質。因此,較佳使用配比之(鹼類觸媒)/(無水級鹵化銦十無水級鹵化錫)為310~500mole%,最佳為310~400mole%。使用時,可事先混於少量之反應介質(第一溶劑)或該反應系統相同之醇類內,以便降低其濃度。較佳使用配比之(鹼類觸媒)/(醇類或第一溶劑)為10~50wt%。而此醇類或第一溶劑使用之量涵蓋於前述所言明之總量內。The amount of the basic catalyst used in the present invention is substantially the lowest amount calculated based on the stoichiometric amount. The minimum amount of base catalyst moles is SnX 4 moles multiplied by 4 times plus InX 3 moles multiplied by 3 times. However, in order to completely remove the halogen element, a suitable excess of the basic catalyst is necessary in order to form a HX.NR 3 salt and precipitate. However, if the excess is too large, there is a flaw in the formation of a highly stable indium halide/alkylamine complex, which is difficult to remove and seriously affects the quality of the coating liquid. Therefore, it is preferred to use a ratio of (alkali-based catalyst)/(anhydrous indium halide ten anhydrous-grade tin halide) of 310 to 500 mole%, preferably 310 to 400 mole%. When used, it may be mixed in a small amount of the reaction medium (first solvent) or the same alcohol in the reaction system in order to lower the concentration. It is preferred to use a ratio of (base catalyst) / (alcohol or first solvent) of 10 to 50% by weight. The amount of the alcohol or the first solvent used is within the total amount stated above.
本發明中之反應溫度通常介於-40℃~60℃之間,因為低溫反應較不易有副反應,也較不易生成鹵化銦/烷基胺錯合體。較佳反應溫度為0℃~10℃。The reaction temperature in the present invention is usually between -40 ° C and 60 ° C because the low temperature reaction is less prone to side reactions and less likely to form an indium halide/alkylamine complex. The preferred reaction temperature is from 0 ° C to 10 ° C.
本發明中之第一步驟及第二步驟反應時間沒有特別限制,通常是時間越長越好。但第一步驟起碼反應時間必須使反應系統成澄清溶液,而第二步驟起碼反應時間必須於反應系統中看到大量鹽類析出。The reaction time of the first step and the second step in the present invention is not particularly limited, and usually the longer the time, the better. However, in the first step, the reaction time must be such that the reaction system becomes a clear solution, and in the second step, at least the reaction time must be observed in the reaction system to precipitate a large amount of salts.
當完成第二步驟反應後,過濾除去鹽類,即可得高純度之烷氧銦錫化合物溶液。特別必須強調的是過濾作業過程必須隔絕任何水氣。如果將第二步驟反應後之溶液置於較低溫度之環境(如冰箱內),更利於鹽類之析出。因此,如此作業均仍屬於本發明技術特徵範圍。當過濾除去鹽類,所得之高純度之烷氧銦錫化合物溶液,即可為塗佈液。此發明所得之烷氧銦錫化合物(In(OR)3 ,Sn(OR)4 )混合塗佈溶液,因為對水氣有高度之敏感性,因此為了塗佈液之安定,可適當加入β-雙酮(如乙醯丙酮,acetylacetone)或其酯類(如乙醯醋酸甲酯,methyl acetoacetatae)螯合劑,以安定塗佈液,便於長期儲存,同時讓此烷氧銦錫化合物塗佈液所得之銦錫氧化物(ITO)薄膜較均勻且不龜裂。考慮除去螯合劑所需溫度,以乙醯丙酮為佳,其較佳濃度為乙醯丙酮比烷氧銦錫化合物5~300mole%;最佳濃度為30~100mole%。After the completion of the second step reaction, the salt is removed by filtration to obtain a high purity alkoxyindium tin compound solution. In particular, it must be emphasized that any moisture must be isolated during the filtration process. If the solution after the second step is placed in a lower temperature environment (such as a refrigerator), it is more conducive to the precipitation of salts. Therefore, such an operation still falls within the technical scope of the present invention. When the salt is removed by filtration, the resulting high purity alkoxyindium tin compound solution is used as a coating liquid. The mixed solution of the alkoxyindium tin compound (In(OR) 3 , Sn(OR) 4 ) obtained by the invention has high sensitivity to moisture, so that for the stability of the coating liquid, β- can be appropriately added. A diketone (such as acetacetone, acetylacetone) or an ester thereof (such as methyl acetoacetatae) chelating agent to stabilize the coating solution for long-term storage, and to obtain the alkoxyindium tin compound coating solution The indium tin oxide (ITO) film is relatively uniform and does not crack. Considering the temperature required to remove the chelating agent, acetonitrile is preferred, and the preferred concentration is acetonitrile to acetone 5 to 300 mole% of the alkoxyindium tin compound; the optimum concentration is 30 to 100 mole%.
為了考慮塗佈作業,本發明之二步驟方式備製烷氧銦錫化合物塗佈液,其較佳烷氧銦錫化合物濃度為5wt%~20wt%。最佳濃度為8wt%~15wt%。但如果溶劑太多,亦可於反應完畢後抽去部分溶劑,以利作業。In order to consider the coating operation, the two-step method of the present invention prepares an alkoxyindium tin compound coating liquid, which preferably has a concentration of the alkoxyindium tin compound of 5 wt% to 20 wt%. The optimum concentration is 8 wt% to 15 wt%. However, if there are too many solvents, some of the solvent may be removed after the reaction is completed to facilitate the operation.
本發明之三步驟方式備製烷氧銦錫化合物塗佈液之製造方法係由一種由前述二步驟方式備製所得之溶液,經濾去鹽類後之高純度之烷氧銦錫化合物溶液,再將濾液濃縮除去第一溶劑,可得烷氧銦錫化合物;再依特定比列加入第二溶劑及螯合劑,即可得烷氧銦錫化合物塗佈液(第三步驟)。其中螯合劑是便於塗佈液長期儲存,同時讓所得之銦錫氧化物(ITO)薄膜較均勻且不龜裂。螯合劑仍以乙醯丙酮為佳,其較佳濃度為乙醯丙酮比烷氧銦錫化合物5~300mole%;最佳濃度為30~100mole%。The method for producing an alkoxyindium tin compound coating liquid according to the three-step method of the present invention comprises a solution prepared by the above two-step method, and a high-purity alkoxyindium tin compound solution after filtering the salt, Further, the filtrate is concentrated to remove the first solvent to obtain an alkoxyindium tin compound; and the second solvent and the chelating agent are added in a specific ratio to obtain an alkoxyindium tin compound coating liquid (third step). The chelating agent is convenient for long-term storage of the coating liquid, and the obtained indium tin oxide (ITO) film is relatively uniform and does not crack. The chelating agent is still preferably acetonitrile. The preferred concentration is acetonitrile to acetone 5 to 300 mole% of the alkoxyindium tin compound; the optimum concentration is 30 to 100 mole%.
本發明之三步驟方式備製烷氧銦錫化合物塗佈液,除了上述第一溶劑可當第二溶劑外,在反應系統中與銦錫鹵化物反應之醇類,或其他C3 -C20 醇類亦可當第二溶劑。較佳者為環己醇(cyclohexanol)及C4 -C20 一級醇,如1-丁醇、1-戊醇等。如塗佈作業於300℃下燒結,則醇類只可選沸點較低之C4 -C8 一級醇。另外,其第二溶劑之較佳量,為使烷氧銦錫化合物濃度為5wt%~20wt%之量;最佳量為使烷氧銦錫化合物濃度為濃度為8wt%~15wt%,以利作業。The three-step method of the present invention prepares an alkoxyindium tin compound coating liquid, in addition to the above first solvent, which can be used as a second solvent, an alcohol reacted with an indium tin halide in a reaction system, or other C 3 -C 20 The alcohol can also be used as the second solvent. Preferred are cyclohexanol and C 4 -C 20 primary alcohols such as 1-butanol, 1-pentanol and the like. If the coating operation is to be sintered at 300 ° C, the alcohol can only be selected from C 4 -C 8 primary alcohols having a lower boiling point. In addition, the preferred amount of the second solvent is such that the concentration of the alkoxy tin indium compound is 5 wt% to 20 wt%; the optimum amount is such that the concentration of the alkoxy tin indium compound is 8 wt% to 15 wt%. operation.
綜合二步驟方式及三步驟方式備製本發明之烷氧銦錫化合物塗佈液之組成為烷氧銦錫化合物、溶劑(含第一溶劑及第二溶劑)及螯合劑等成分。如果組成物中含有少許之未除去之雜質,均仍屬於本發明技術特徵範圍。組成中較佳烷氧銦錫化合物濃度為5wt%~20wt%,最佳濃度為8wt%~15wt%。其中烷氧銦錫化合物較佳組成Sn(OR)4 /(In(OR)3 +Sn(OR)4 )為5~15mole%,最佳為8~13mole%之比例混合。組成中螯合劑為β-雙酮或其酯類等,但仍以乙醯丙酮為佳,其較佳濃度為乙醯丙酮比烷氧銦錫化合物5~300mole%;最佳濃度為30~100mole%。組成中除了烷氧銦錫化合物及螯合劑外,其餘為溶劑。組成中之溶劑含第一溶劑或第二溶劑,可單獨使用或相互混合使用。The composition of the alkoxyindium tin compound coating liquid of the present invention is prepared by a two-step method and a three-step method, and is composed of an alkoxyindium tin compound, a solvent (including a first solvent and a second solvent), and a chelating agent. If the composition contains a small amount of unremoved impurities, it still falls within the technical scope of the present invention. The preferred concentration of the indium azide tin compound in the composition is 5 wt% to 20 wt%, and the optimum concentration is 8 wt% to 15 wt%. The alkoxyindium tin compound preferably has a composition of Sn(OR) 4 /(In(OR) 3 +Sn(OR) 4 ) of 5 to 15 mole%, preferably 8 to 13 mole%. The chelating agent in the composition is β-diketone or its ester, etc., but acetonitrile is still preferred, and the preferred concentration is acetonitrile acetone 5~300 mole% than the alkoxyindium tin compound; the optimal concentration is 30~100 mole %. The composition is a solvent other than the alkoxyindium tin compound and the chelating agent. The solvent in the composition contains the first solvent or the second solvent, and they may be used singly or in combination with each other.
以上凡是涉及THF溶劑者皆以wt%表示,其餘用mole%表示。All of the above are related to THF solvent, expressed in wt%, and the rest are expressed in mole%.
本發明之將烷氧銦錫化合物塗佈液塗佈在基材上形成銦錫氧化物(ITO)之運用,係指將烷氧銦錫化合物塗佈液加入適量水份,於室溫塗佈於玻璃或塑膠基材上(厚度約在1μm左右),然後於50~200℃進行水解及縮合反應(進行溶膠凝膠法)並除去所產生之醇類物質,及殘留之各類溶劑與螯合劑。或將烷氧銦錫化合物塗佈液於室溫塗佈於玻璃或塑膠基材上(厚度約在1μm左右),然後於50~200℃之蒸氣室中進行水解及縮合反應,而形成銦錫氧化物(ITO)薄膜,並釋放出易揮發之醇類物質。然後於50~200℃除去所產生之醇類物質,及殘留之各類溶劑與螯合劑。必要時,可於高於200℃下燒結成可導電之銦錫氧化物(ITO)。然而燒結之最佳溫度條件並非本專利之範疇。The application of the indium azide tin compound coating liquid on the substrate to form indium tin oxide (ITO) in the present invention means adding the alkoxyindium tin compound coating liquid to an appropriate amount of water and coating at room temperature. On a glass or plastic substrate (about 1 μm in thickness), then hydrolyzed and condensed at 50-200 ° C (for sol-gel method) and removed the alcohols produced, and the residual solvents and chelate mixture. Or coating the alkoxyindium tin compound coating solution on a glass or plastic substrate (about 1 μm in thickness) at room temperature, and then performing hydrolysis and condensation reaction in a vapor chamber at 50 to 200 ° C to form indium tin An oxide (ITO) film that releases volatile alcohols. Then, the produced alcohols and the remaining solvents and chelating agents are removed at 50 to 200 °C. If necessary, it can be sintered to a conductive indium tin oxide (ITO) at above 200 °C. However, the optimum temperature conditions for sintering are not within the scope of this patent.
烷氧金屬化合物需要在含有H2 O的條件下才會進行水解反應;另一方面在進行縮合反應的過程中則會脫除掉水分子,因此在溶膠-凝膠製程中H2 O/metal alkoxide摩爾比值(r)不能過多或過少,在低的r比值時矽烷氧化合物不易水解使反應不易進行,另一方面在高水量的環境下水解反應雖然可以完全但縮合反應相對被抑制,因此會造成膠體結構的改變。另一方面,當r值小於2時易進行醇縮合,若r值大於2時易與水進行縮合。本發明之將烷氧銦錫化合物塗佈液塗佈在基材上形成銦錫氧化物(ITO)之運用時所加入水份量之水比烷氧銦錫化合物為100~300mole%;最佳濃度為170~230mole%(r=1.7~2.3)。The alkoxy metal compound needs to be hydrolyzed under the condition of containing H 2 O; on the other hand, the water molecule is removed during the condensation reaction, so H 2 O/metal in the sol-gel process The alkoxide molar ratio (r) should not be too much or too little. When the ratio of low r is low, the decane oxygen compound is not easily hydrolyzed to make the reaction difficult to carry out. On the other hand, in a high water environment, the hydrolysis reaction can be completely but the condensation reaction is relatively suppressed, so Causes a change in the structure of the colloid. On the other hand, when the r value is less than 2, alcohol condensation is easily performed, and if the r value is more than 2, it is easily condensed with water. The application of the alkoxyindium tin compound coating liquid on the substrate to form indium tin oxide (ITO) in the present invention is carried out in an amount of water of 100 to 300 mole% than the alkoxyindium tin compound; It is 170~230mole% (r=1.7~2.3).
第一步驟:首先分別將無水級鹵化銦(InX3 ,anhydrous)與無水級鹵化錫(SnX4 ,anhydrous)溶於醇類及反應介質(第一溶劑)中,於低溫下且通氮氣乾燥環境下,各自攪拌或混合攪拌均勻,直至澄清無色,分別得到鹵化銦澄清溶液及鹵化錫澄清溶液。然後將上述兩溶液混合,繼續反應約半小時以上,得澄清混合溶液。The first step: firstly dissolving anhydrous grade indium halide (InX 3 , anhydrous) and anhydrous grade tin halide (SnX 4 , anhydrous) in alcohol and reaction medium (first solvent), drying at low temperature and passing nitrogen gas Then, each of them is stirred or mixed and stirred until clear and colorless, and an indium halide clear solution and a tin halide clear solution are respectively obtained. The above two solutions were then mixed and the reaction was continued for about half an hour to obtain a clear mixed solution.
其中配方依下列比例調配:SnX4 /(InX3 +SnX4 )以5~15mole%之比例混合;與鹵化銦反應之醇類用量為(醇類)/(無水級鹵化銦)為300mole%~580mole%,反應醇類總用量為(醇類)/(無水級鹵化銦+無水級鹵化錫)為310mole%~600mole%,第一溶劑較佳使用總量為(第一溶劑)/(無水級鹵化銦+無水級鹵化錫+醇類)為320wt%~1290wt%。The formula is formulated according to the following ratios: SnX 4 /(InX 3 +SnX 4 ) is mixed at a ratio of 5 to 15 mole%; the amount of alcohol reacted with indium halide is (alcohol) / (anhydrous indium halide) is 300 mole%~ 580mole%, the total amount of reactive alcohols is (alcohol) / (anhydrous indium halide + anhydrous grade tin halide) is 310 mole% ~ 600 mole%, the first solvent is preferably used in total (first solvent) / (no water grade The indium halide + anhydrous grade tin halide + alcohol) is from 320 wt% to 1290 wt%.
第二步驟:將依化學劑量之鹼性觸媒事先溶於反應介質(第一溶劑)或該反應系統相同之醇類內中,以稀釋鹼性觸媒之濃度。然後將此鹼性觸媒溶液慢慢添加入於第一步驟所得之溶液中,於低溫下反應一段時間,直至大量鹽類沉澱物產生。此時得到烷氧銦錫化合物溶液及沉澱物。然後將沉澱物濾去,得到烷氧銦錫化合物溶液。但如果溶劑太多,亦可於反應完畢後抽去部分溶劑,使其較佳烷氧銦錫化合物濃度為5wt%~20wt%,以利作業。如有必要,可加入適量螯合劑為安定溶液用。The second step: pre-dissolving the chemical dose-based alkaline catalyst in the reaction medium (first solvent) or the same alcohol in the reaction system to dilute the concentration of the alkaline catalyst. This alkaline catalyst solution is then slowly added to the solution obtained in the first step, and reacted at a low temperature for a while until a large amount of salt precipitate is produced. At this time, an alkoxyindium tin compound solution and a precipitate were obtained. The precipitate was then filtered off to obtain an alkoxyindium tin compound solution. However, if the solvent is too much, a part of the solvent may be removed after the reaction is completed, so that the concentration of the alkoxy tin indium tin compound is preferably 5 wt% to 20 wt% for the operation. If necessary, add a suitable amount of chelating agent to the solution.
反應中所添加之鹼量依下列比值為(鹼類觸媒)/(無水級鹵化銦十無水級鹵化錫)為310~500mole%。使用之反應介質(第一溶劑)或該反應系統相同之醇類,較佳使用配比之(鹼類觸媒)/(醇類或第一溶劑)為10~50wt%。而此醇類或第一溶劑使用之量涵蓋於前述第一步驟所言明之總量內。螯合劑與烷氧銦錫化合物比為5~300mole%。The amount of alkali added in the reaction is 310 to 500 mole% in terms of the following ratio (base catalyst) / (anhydrous indium halide ten anhydrous tin halide). The reaction medium (first solvent) to be used or the alcohol having the same reaction system is preferably used in an amount of from 10 to 50% by weight based on the base (alkali catalyst) / (alcohol or first solvent). The amount of the alcohol or first solvent used is within the total amount stated in the first step above. The ratio of the chelating agent to the alkoxyindium tin compound is 5 to 300 mole%.
本發明之三步驟方式備製烷氧銦錫化合物塗佈液之製造方法係由一種由前述二步驟方式備製所得之溶液,經濾去鹽類後之高純度之烷氧銦錫化合物溶液,再將濾液濃縮除去第一溶劑,可得烷氧銦錫化合物;再依特定比列加入第二溶劑或適量螯合劑,即可得烷氧銦錫化合物塗佈液(第三步驟)。The method for producing an alkoxyindium tin compound coating liquid according to the three-step method of the present invention comprises a solution prepared by the above two-step method, and a high-purity alkoxyindium tin compound solution after filtering the salt, Further, the filtrate is concentrated to remove the first solvent to obtain an alkoxyindium tin compound; and a second solvent or an appropriate amount of a chelating agent is added in a specific ratio to obtain an alkoxyindium tin compound coating liquid (third step).
加入第二溶劑及螯合劑之量使烷氧銦錫化合物濃度較佳組成為5wt%~20wt%。螯合劑較佳濃度為螯合劑比烷氧銦錫化合物為5~300mole%;最佳濃度為30~100mole%。The amount of the second solvent and the chelating agent is added so that the concentration of the alkoxy tin indium compound is preferably from 5% by weight to 20% by weight. The preferred concentration of the chelating agent is 5 to 300 mole% of the chelating agent than the alkoxyindium tin compound; the optimum concentration is 30 to 100 mole%.
將烷氧銦錫化合物塗佈液塗佈在基材上形成銦錫氧化物(ITO)之運用:Application of coating an alkoxyindium tin compound coating solution on a substrate to form indium tin oxide (ITO):
本發明之將烷氧銦錫化合物塗佈液塗佈在基材上形成銦錫氧化物(ITO)之運用,係指將烷氧銦錫化合物塗佈液加入適量水份,於室溫塗佈於玻璃或塑膠基材上(厚度約在1μm左右),然後於60~200℃進行水解及縮合反應(進行溶膠凝膠法)並除去所產生之醇類物質,及殘留之各類溶劑與螯合劑。或將烷氧銦錫化合物塗佈液於室溫塗佈於玻璃或塑膠基材上(厚度約在1μm左右),然後於60~200℃之蒸氣室中進行水解及縮合反應,而形成銦錫氧化物(ITO)薄膜,並釋放出易揮發之醇類物質。然後於60~200℃除去所產生之醇類物質,及殘留之各類溶劑與螯合劑。適必要時,可於高於200℃以上燒結成可導電之銦錫氧化物(ITO)。然而燒結之最佳溫度條件並非本專利之範疇。The application of the indium azide tin compound coating liquid on the substrate to form indium tin oxide (ITO) in the present invention means adding the alkoxyindium tin compound coating liquid to an appropriate amount of water and coating at room temperature. On a glass or plastic substrate (about 1 μm in thickness), then hydrolyzed and condensed at 60-200 ° C (solugel method) and removed the alcohols produced, and the residual solvent and chelation mixture. Or coating the alkoxyindium tin compound coating solution on a glass or plastic substrate (about 1 μm in thickness) at room temperature, and then performing hydrolysis and condensation reaction in a steam chamber at 60 to 200 ° C to form indium tin An oxide (ITO) film that releases volatile alcohols. Then, the produced alcohols and the remaining solvents and chelating agents are removed at 60 to 200 °C. When necessary, it can be sintered to a conductive indium tin oxide (ITO) above 200 °C. However, the optimum temperature conditions for sintering are not within the scope of this patent.
本發明之將烷氧銦錫化合物塗佈液塗佈在基材上形成銦錫氧化物(ITO)之運用時所加入水份量之水比烷氧銦錫化合物為100~300mole%;最佳濃度為170~230mole%(r=1.7~2.3)。The application of the alkoxyindium tin compound coating liquid on the substrate to form indium tin oxide (ITO) in the present invention is carried out in an amount of water of 100 to 300 mole% than the alkoxyindium tin compound; It is 170~230mole% (r=1.7~2.3).
上述烷氧銦錫化合物塗佈液之整個反應製造流程如圖(一)所示。The entire reaction production process of the above alkoxyindium tin compound coating liquid is shown in (a).
本發明其他的特徵及優點將可明顯見於下列較佳具體事實及申請專利範圍。Other features and advantages of the present invention will be apparent from the following detailed description of the invention.
實施例一:(三步驟法)Embodiment 1: (three-step method)
首先配製溶液A(solution A)與溶液B(solution B)。取無水級InCl3 (0.885g,0.004mole)溶於1-butanol(1.18g,0.016mole)及20ml(17.76g)THF混合溶劑中在室溫下均勻攪拌後即為Solution A。另取無水級SnCl4 (0.16g,0.00044mole)溶於1-butanol(0.13g,0.0017mole)溶劑中於室溫下均勻攪拌即為Solution B。Solution A與Solution B均呈現無色。本實施例固定錫的摻雜量(Sn/(Sn+In)=SnCl4 /(InCl3 +SnCl4 ))為10mole%(=10 atomic %)。以逐滴滴入的方式將Solution B滴入Solution A後,於室溫下攪拌後呈現透明無色。之後將反應系統溫度設定為5℃,並反應0.5小時(第一步驟)。並利用逐滴滴入的方式將稀釋過之三乙基胺溶液(內含0.5ml(0.405g,0.00547mole)1-butanol,4.5ml(4g)THF及1.4g(0.0139mole)三乙基胺(triethylamine))慢慢滴入反應系統中,在溫度為5℃的條件下反應1hr,即可獲得含有沉澱物之烷氧銦錫化合物溶液。將含有沉澱物之烷氧銦錫化合物溶液置入冷凍庫中靜置隔夜之後,再利用離心過濾法將沉澱物過濾掉,即獲得可塗佈用之透明無色烷氧銦錫化合物溶液(第二步驟)。利用旋轉真空濃縮機將烷氧銦錫化合物溶液之溶劑抽除後,得粉狀丁烷氧銦錫化合物約1.5g(0.004mole),接著加入13.15g(16.23ml)1-butanol與0.4g(0.004mole)之acetylacetone(螯合劑),配製成固含量為10wt.%的烷氧銦錫化合物塗佈液(第三步驟)。Solution A (solution A) and solution B (solution B) were first prepared. Solvent A was prepared by dissolving anhydrous grade InCl 3 (0.885 g, 0.004 mole) in a mixed solvent of 1-butanol (1.18 g, 0.016 mole) and 20 ml (17.76 g) in THF at room temperature. Further, anhydrous grade SnCl 4 (0.16 g, 0.00044 mole) was dissolved in 1-butanol (0.13 g, 0.0017 mole) solvent and uniformly stirred at room temperature to obtain Solution B. Both Solution A and Solution B are colorless. The doping amount (Sn / (Sn + In) = SnCl 4 / (InCl 3 + SnCl 4 )) of the fixed tin in this example was 10 mole% (= 10 atomic %). Solution B was added dropwise to Solution A in a drop-in manner, and it was transparent and colorless after stirring at room temperature. Thereafter, the temperature of the reaction system was set to 5 ° C and reacted for 0.5 hour (first step). The diluted triethylamine solution (containing 0.5 ml (0.405 g, 0.00547 mole) of 1-butanol, 4.5 ml (4 g) of THF and 1.4 g (0.0139 mole) of triethylamine was added dropwise by dropwise addition. (triethylamine)) was slowly dropped into the reaction system, and reacted at a temperature of 5 ° C for 1 hr to obtain a solution of the alkoxyindium tin compound containing the precipitate. The solution of the alkoxyindium tin compound containing the precipitate is placed in a freezer and left to stand overnight, and then the precipitate is filtered by centrifugal filtration to obtain a transparent colorless alkoxyindium tin compound solution for coating (second step) ). After extracting the solvent of the alkoxyindium tin compound solution by a rotary vacuum concentrator, about 1.5 g (0.004 mole) of the powdered butane indium tin oxide compound was obtained, followed by the addition of 13.15 g (16.23 ml) of 1-butanol and 0.4 g ( 0.004 mole) of acetylacetone (chelating agent) is formulated into a coating solution of alkoxyindium tin compound having a solid content of 10 wt.% (third step).
所得粉狀之烷氧銦錫化合物經H-NMR鑑定,如圖示(二)說明,證明是高純度丁烷氧銦錫化合物(In(OBu)3 +Sn(OBu)4 ),沒有其他有機物質存在。丁烷氧銦化合物與丁烷氧錫化合物之H-NMR圖譜是相同的。The obtained powdery alkoxyindium tin compound was identified by H-NMR and proved to be a high-purity butane-oxyn-indium tin compound (In(OBu) 3 +Sn(OBu) 4 ) as shown in the figure (II). The substance exists. The H-NMR spectrum of the butane-oxygen indium compound and the butane-oxygen compound is the same.
在進行濕式塗佈之前,加入0.144g之H2 O於上述烷氧銦錫化合物塗佈液,並均勻攪拌。本實施例利用旋轉塗佈的方式(1000rpm旋轉30sec)將加水之烷氧銦錫化合物塗佈液塗佈於玻璃基材、PET與PI薄膜表面上,接著將sample置於60℃下熱處理30min,再於150℃下抽真空1小時,以去除殘留之溶劑。Before the wet coating, 0.144 g of H 2 O was added to the above alkoxyindium tin compound coating liquid, and uniformly stirred. In this embodiment, the water-added alkoxyindium tin compound coating liquid was applied onto the surface of the glass substrate, the PET and the PI film by spin coating (rotation at 1000 rpm for 30 sec), and then the sample was heat-treated at 60 ° C for 30 minutes. Further, vacuum was applied at 150 ° C for 1 hour to remove the residual solvent.
1.首先將上述ITO-玻璃基材之樣品,其ITO薄膜經EDS(Energy Dispersive Spectrometer,能量散發圖譜儀)分析,已為ITO(Indium-Tin oxide),不含有氯之物質(意即InCl3 及SnCl4 反應完全且不含如HCl.NR3 鹽類或所產生之氯化銦/烷基胺錯合體之雜質)。但含有極少量之有機物質(C/(In+Sn)=1at%)。ITO薄膜中Sn/(Sn+In)=10.8%。1. First, a sample of the above ITO-glass substrate, the ITO film is analyzed by an EDS (Energy Dispersive Spectrometer), which is an ITO (Indium-Tin oxide), which does not contain chlorine (ie, InCl 3 ) The reaction with SnCl 4 is complete and free of impurities such as the HCl.NR 3 salt or the indium chloride/alkylamine complex produced. However, it contains a very small amount of organic matter (C/(In+Sn) = 1 at%). Sn/(Sn+In) = 10.8% in the ITO film.
退火條件如果採用300℃退火4hr,其ITO薄膜經EDS分析,只含In、Sn及O元素,確為ITO(Indium-Tin oxide),不含有氯及有機碳之物質。ITO薄膜中Sn/(Sn+In)=11%。此ITO-玻璃基材之樣品可獲得表面電阻率約為4×106 Ω/□,且可見光範圍內透光度達95%;退火條件如果採用500℃退火1hr,亦得到不含有氯及碳之物質之純ITO薄膜,有較低表面電阻率約為2×104 Ω/□,且可見光範圍內透光度達91%;退火條件如果採用800℃退火1hr,得較低表面電阻率約為2×10-3 Ω/□,透光度達88%。Annealing conditions If annealed at 300 ° C for 4 hr, the ITO film is analyzed by EDS, containing only In, Sn and O elements, which is ITO (Indium-Tin oxide), does not contain chlorine and organic carbon. Sn/(Sn+In) = 11% in the ITO film. The sample of the ITO-glass substrate can obtain a surface resistivity of about 4×10 6 Ω/□ and a transmittance of 95% in the visible light range; if the annealing condition is annealed at 500 ° C for 1 hr, no chlorine or carbon is obtained. The pure ITO film of the material has a lower surface resistivity of about 2×10 4 Ω/□ and a transmittance of 91% in the visible range; if the annealing condition is annealed at 800 ° C for 1 hr, a lower surface resistivity is obtained. It is 2 × 10 -3 Ω / □, and the transmittance is 88%.
2.上述ITO-PET基材之樣品,退火條件如果採用200℃的真空條件下進行退火12hr,即可獲得表面電阻率約為4×107 Ω/□,是抗靜電材料。且可見光範圍內透光度達95%。(PET基材只得耐200℃)2. The sample of the above ITO-PET substrate, if the annealing condition is annealed under vacuum at 200 ° C for 12 hr, a surface resistivity of about 4 × 10 7 Ω / □ is obtained, which is an antistatic material. And the transmittance in the visible range is 95%. (PET substrate only has to withstand 200 ° C)
3.上述ITO-PI基材之樣品,退火條件如果採用300℃下進行退火12hr,即可獲得表面電阻率約為4×106 Ω/□,且可見光範圍內透光度達95%。(PET基材只得耐300℃至400℃)3. For the sample of the above ITO-PI substrate, if the annealing condition is performed at 300 ° C for 12 hr, the surface resistivity is about 4 × 10 6 Ω / □, and the transmittance in the visible light range is 95%. (PET substrate only has to withstand 300 ° C to 400 ° C)
本實施例一中:In the first embodiment:
第一步驟中各類物質配比:The ratio of various substances in the first step:
SnCl4 /(InCl3 +SnCl4 )=10mole%SnCl 4 /(InCl 3 +SnCl 4 )=10mole%
1-butanol(醇類)/(InCl3 +SnCl4 )=399mole%1-butanol (alcohol) / (InCl 3 + SnCl 4 ) = 399 mole%
THF(第一溶劑)/(InCl3 +SnCl4 +1-butanol)=754wt%THF (first solvent) / (InCl 3 + SnCl 4 + 1-butanol) = 754 wt%
第二步驟中各類物質配比:The ratio of various substances in the second step:
鹼性觸媒三乙基胺(TEA)/(InCl3 +SnCl4 )=312mole%Basic catalyst triethylamine (TEA) / (InCl 3 + SnCl 4 ) = 312 mole%
鹼性觸媒三乙基胺(TEA)/THF=35wt%Basic catalyst triethylamine (TEA) / THF = 35wt%
鹼性觸媒三乙基胺(TEA)/(THF+醇類)=32wt%Basic catalyst triethylamine (TEA) / (THF + alcohol) = 32wt%
THF/(InCl3 +SnCl4 +1-butanol)=786wt%(第一步驟+第二步驟)THF / (InCl 3 + SnCl 4 + 1-butanol) = 786 wt% (first step + second step)
1-butanol(醇類)/(InCl3 +SnCl4 )=522mole%(第一步驟+第二步驟)1-butanol (alcohol) / (InCl 3 + SnCl 4 ) = 522 mole% (first step + second step)
第三步驟:The third step:
固形份:是指丁烷氧銦錫化合物為1.5g/(1.5g+第二溶劑+螯合劑)=10wt%螯合劑/(In(OBu)3 +Sn(OBu)4 )=100mole%以上凡是涉及THF溶劑者皆以wt%表示。Solid content: refers to butane indium tin oxide compound is 1.5g / (1.5g + second solvent + chelating agent) = 10wt% chelating agent / (In (OBu) 3 + Sn (OBu) 4 ) = 100 mole% or more The THF solvent is expressed in wt%.
實施例二:(三步驟法)Embodiment 2: (three-step method)
本實施例配方與實施例一相同,只是將第一溶劑之THF改為DMF。其ITO薄膜經EDS分析,仍含有氯之物質(意即InCl3 及SnCl4 反應可能不完全,或HCl.NR3 鹽類或所產生之氯化銦/烷基胺錯合體無法由DMF中完全析出)。Cl/(In+Sn)=1.5at%及含碳之有機物質(C/(In+Sn)=5.2at%)。ITO薄膜中Sn/(Sn+In)=10.6%。這表示DMF之效果不如THF。The formulation of this example was the same as in Example 1, except that the THF of the first solvent was changed to DMF. Which ITO film by EDS analysis, it still contains chlorine species (meaning InCl 3 and SnCl 4 reaction may be incomplete, or salts or HCl.NR 3 arising indium chloride / alkylamine assembly error can not be completely made of DMF Precipitate). Cl / (In + Sn) = 1.5 at% and carbon-containing organic matter (C / (In + Sn) = 5.2 at%). Sn/(Sn+In) = 10.6% in the ITO film. This means that the effect of DMF is not as good as THF.
實施例三:(二步驟法)Embodiment 3: (two-step method)
本實施例採二步驟法,配方與實施例一雷同,只將實施例一之第一步驟裡之溶劑THF量由20ml(17.76g)改為11ml(8.8g),並於完成第二步驟後,接著加入0.4g(0.004mole)之acetylacetone(螯合劑)後,直接當烷氧銦錫化合物塗佈液。In this embodiment, the two-step method is adopted, and the formulation is the same as that in the first embodiment. Only the amount of the solvent THF in the first step of the first embodiment is changed from 20 ml (17.76 g) to 11 ml (8.8 g), and after the completion of the second step. Then, after adding 0.4 g (0.004 mole) of acetylacetone (chelating agent), it is directly used as an alkoxyindium tin compound coating liquid.
本實施例三中:In the third embodiment:
第一步驟中各類物質配比:The ratio of various substances in the first step:
THF(第一溶劑)/(InCl3 +SnCl4 +1-butanol)=565wt%THF (first solvent) / (InCl 3 + SnCl 4 + 1-butanol) = 565 wt%
第二步驟中各類物質配比:The ratio of various substances in the second step:
THF/(InCl3 +SnCl4 +1-butanol)=627wt%(第一步驟+第二步驟)THF / (InCl 3 + SnCl 4 + 1-butanol) = 627 wt% (first step + second step)
固形份(是指丁烷氧銦錫化合物):10wt%Solid fraction (refers to butane indium tin oxide compound): 10wt%
其餘各比值與實施例一相同。The remaining ratios are the same as in the first embodiment.
在進行濕式塗佈之前,加入0.144g之H2 O於上述烷氧銦錫化合物塗佈液,並均勻攪拌。本實施例之施作與實施例一相同。Before the wet coating, 0.144 g of H 2 O was added to the above alkoxyindium tin compound coating liquid, and uniformly stirred. The application of this embodiment is the same as that of the first embodiment.
其ITO薄膜經EDS分析,純度與實施例一相同。不含有氯之物質,但含有極少量之有機物質(C/(In+Sn)=1.1at%)。ITO薄膜中Sn/(Sn+In)=10.5%。而其表面電阻率依溫度處理條件不同而異,其結果與實施例一雷同。The ITO film was analyzed by EDS and the purity was the same as in Example 1. A substance that does not contain chlorine, but contains a very small amount of organic matter (C/(In+Sn) = 1.1 at%). Sn/(Sn+In) = 10.5% in the ITO film. The surface resistivity varies depending on the temperature treatment conditions, and the results are similar to those in the first embodiment.
實施例四:(二步驟法)Embodiment 4: (two-step method)
本實施例採二步驟法,配方與實施例三雷同。但不加螯合劑,且在進行濕式塗佈之前,亦不加H2 O。This embodiment adopts a two-step method, and the formulation is the same as that of the third embodiment. However, no chelating agent was added and no H 2 O was added prior to the wet coating.
將sample置於60℃下熱處理30min,再於150℃下抽真空1小時,其ITO薄膜經EDS分析,不含有氯之物質,但含有較多量之有機物質(C/(In+Sn)=8.2at%)。ITO薄膜中Sn/(Sn+In)=11.5%。表示塗佈液不加水時,即使於無螯合劑情況下亦無法於150℃下抽真空1小時下完全形成ITO,會殘留有機物質,影響其電傳導率。The sample was heat-treated at 60 ° C for 30 min, and then vacuumed at 150 ° C for 1 hour. The ITO film was analyzed by EDS and contained no chlorine, but contained a large amount of organic matter (C/(In+Sn)=8.2 At%). Sn/(Sn+In) = 11.5% in the ITO film. When the coating liquid was not added with water, even when the chelating agent was not used, the ITO could not be completely formed at 150 ° C for 1 hour, and organic substances were left, which affected the electrical conductivity.
實施例五:(二步驟法)Embodiment 5: (two-step method)
將實施例四經熱處理所得之sample,繼續於300℃加熱4小時。其ITO薄膜經EDS分析,結果是不含有氯及不含有氯及有機碳之物質。表示300℃加熱4小時時繼續分解殘留之有機物質。如此會增加其電傳導率。The sample obtained by heat treatment of Example 4 was further heated at 300 ° C for 4 hours. The ITO film was analyzed by EDS, and as a result, it contained no chlorine and no chlorine and organic carbon. It means that the residual organic matter continues to be decomposed when heated at 300 ° C for 4 hours. This will increase its electrical conductivity.
實施例六:(先前技術之二步驟法)Embodiment 6: (Two-step method of prior art)
本實施例採先前技術(美國專利第4681959號)之二步驟法之順序,配方與實施例三雷同,不同之處在於實施例三第二步驟中,是將稀釋過之鹼性觸媒溶液慢慢添加入於第一步驟所得之溶液中反應一段時間;但本實施例是將第一步驟所得之溶液直接加入於沒稀釋過之純鹼性觸媒中反應一段時間(順序顛倒)。同時,先前技術(美國專利第4681959號)之二步驟法所揭示兩步驟法是合成有機溶劑不可溶之烷氧金屬化合物(metal alkoxides),而本實施例是選擇適當溶劑,使其為有機溶劑可溶之烷氧金屬化合物。This embodiment adopts the sequence of the two-step method of the prior art (U.S. Patent No. 4,681,959), and the formulation is the same as that of the third embodiment, except that in the second step of the third embodiment, the diluted alkaline catalyst solution is slow. The reaction is slowly added to the solution obtained in the first step for a certain period of time; however, in this embodiment, the solution obtained in the first step is directly added to the undiluted pure alkaline catalyst for a certain period of time (inverted order). Meanwhile, the two-step method disclosed in the two-step method of the prior art (U.S. Patent No. 4,681,959) is to synthesize organic solvent-insoluble metal alkoxides, and in this embodiment, an appropriate solvent is selected to be an organic solvent. A soluble alkoxy metal compound.
本實施例之塗佈液內亦加入0.4g(0.004mole)之acetylacetone(螯合劑),但在進行濕式塗佈之前,不加H2 O。0.4 g (0.004 mole) of acetylacetone (chelating agent) was also added to the coating liquid of this example, but no H 2 O was added before the wet coating.
將sample置於60℃下熱處理30min,再於150℃下抽真空1小時,其ITO薄膜經EDS分析,仍含有氯之物質(意即InCl3 及SnCl4 反應可能不完全,或HCl.NR3 鹽類或所產生之氯化銦/烷基胺錯合體無法由DMF中完全析出)。Cl/(In+Sn)=2.5at%及含碳之有機物質(C/(In+Sn)=8.8at%)。ITO薄膜中Sn/(Sn+In)=11.6%。這表示先前技術之二步驟法無法得到高純度之烷氧銦錫化合物(In(OBu)3 +Sn(OBu)4 )。The sample was heat-treated at 60 ° C for 30 min, and then vacuumed at 150 ° C for 1 hour. The ITO film was analyzed by EDS and still contained chlorine (meaning that InCl 3 and SnCl 4 may not be completely reacted, or HCl.NR 3 Salts or the resulting indium chloride/alkylamine complexes cannot be completely precipitated from DMF). Cl / (In + Sn) = 2.5 at% and carbon-containing organic matter (C / (In + Sn) = 8.8 at%). Sn/(Sn+In) = 11.6% in the ITO film. This indicates that the high-purity alkoxyindium tin compound (In(OBu) 3 +Sn(OBu) 4 ) could not be obtained by the two-step method of the prior art.
以上所述,僅是本發明的較佳實施例,並非對本發明作任何形式上的限制,因此任何所屬技術領域中具有通常知識者,若在不脫離本發明所提技術特徵的範圍內,利用本發明所揭示技術內容所做出局部更動或修飾等效實施例,並且未脫離本發明的技術特徵內容,均仍屬於本發明技術特徵範圍。The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, any person skilled in the art can use it without departing from the technical features of the present invention. The embodiments of the present invention have been made to modify or modify the equivalent embodiments without departing from the technical features of the present invention.
第一圖係本發明烷氧銦錫化合物塗佈液之整個反應製造流程圖。The first figure is a flow chart for the entire reaction production of the alkoxyindium tin compound coating liquid of the present invention.
第二圖係本發明實施例一所得之1-丁烷氧銦錫化合物之H1 -NMR圖譜(1-丁烷氧銦化合物與1-丁烷氧錫化合物有相同之H1 -NMR圖譜)。FIG lines obtained from a second embodiment of the present invention is indium tin oxide butane 1- H 1 -NMR spectrum of Compound (1-oxo-butane indium compound and tin compound 1- butylene oxide of the same H 1 -NMR spectrum) .
Claims (45)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98138571A TWI395730B (en) | 2009-11-13 | 2009-11-13 | Indium tin oxide compound coating liquid and its manufacturing method and application |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98138571A TWI395730B (en) | 2009-11-13 | 2009-11-13 | Indium tin oxide compound coating liquid and its manufacturing method and application |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201116507A TW201116507A (en) | 2011-05-16 |
TWI395730B true TWI395730B (en) | 2013-05-11 |
Family
ID=44934860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98138571A TWI395730B (en) | 2009-11-13 | 2009-11-13 | Indium tin oxide compound coating liquid and its manufacturing method and application |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI395730B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013212017A1 (en) * | 2013-06-25 | 2015-01-08 | Evonik Industries Ag | Process for the preparation of indium alkoxide compounds, the process-producible indium alkoxide compounds and their use |
-
2009
- 2009-11-13 TW TW98138571A patent/TWI395730B/en not_active IP Right Cessation
Non-Patent Citations (2)
Title |
---|
A Beaurain,"Effect of annealing temperature and heat-treatment duration on electrical properties of sol-gel derived indium-tin-oxide thin films",Thin Solid Films, vol. 516, page 4102-4106 2007/10/13 * |
楊長亮,「濕式塗佈ITO於帶有羰基高分子薄膜之研究」,國立高雄應用科技大學化學工程與材料工程系 * |
Also Published As
Publication number | Publication date |
---|---|
TW201116507A (en) | 2011-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9353433B2 (en) | Method of fabricating liquid for oxide thin film | |
US20120289728A1 (en) | Process for the preparation of indium chlordialkoxides | |
Chen et al. | Ethanolamine-assisted synthesis of size-controlled indium tin oxide nanoinks for low temperature solution deposited transparent conductive films | |
Gulino et al. | Synthesis and characterization of novel self-generating liquid MOCVD precursors for thin films of zinc oxide | |
WO2021027373A1 (en) | Crystal seed and method for manufacturing perovskite solar cell thereby | |
CN114619039A (en) | Spherical silver powder, preparation method thereof and conductive paste | |
Hamid et al. | Synthesis of isostructural cage complexes of copper with cobalt and nickel for deposition of mixed ceramic oxide materials | |
CN101857379B (en) | Fluorine-doped tin oxide conductive film spraying liquid and preparation method thereof | |
TWI395730B (en) | Indium tin oxide compound coating liquid and its manufacturing method and application | |
Suh et al. | Precursor Oxidation State Control of Film Stoichiometry in the Metal− Organic Chemical Vapor Deposition of Tin Oxide Thin Films | |
CN102400123B (en) | A kind of preparation method of Na-Mg weak doping p-type ZnO film | |
CN106450002A (en) | Perovskite type photovoltaic-conversion composite sol and preparation method thereof | |
CN106590618B (en) | A kind of NiO/rGO laminated film and preparation method thereof with clad structure | |
Johnson et al. | Inorganic and organozinc fluorocarboxylates: Synthesis, structure and materials chemistry | |
Blandamer et al. | Iron (II)-diimine complex [Fe (CH3N: CHCH: NCH3) 3] 2+: its structure and its solvation and reactivity in aqueous-organic solvent mixtures | |
CN102115308B (en) | Method for preparing composition containing indium alcoholate and tin alcoholate and composition containing indium alcoholate and tin alcoholate prepared thereby | |
Chen et al. | Crystal structure, Hirshfeld surface analysis, optical properties and stability of organic-inorganic compound (C6H5CH2NH3) 2 (CH3CH3NH2) 3Bi2Br11 | |
CN106245007A (en) | A kind of preparation method being orientated ito thin film | |
JP2016534993A (en) | Formulation for producing an indium oxide-containing layer, method for producing the layer and use of the layer | |
US20120070690A1 (en) | Composition and Method for Producing ITO Powders or ITO Coatings | |
JP6373373B2 (en) | Method for producing indium alkoxide compound, indium alkoxide compound that can be produced according to the method, and use of the compound | |
JP2014077197A (en) | Zinc oxide precursor and method of depositing zinc oxide-based thin film using the same | |
KR100760238B1 (en) | Process for preparing indium tin oxide sol | |
Nazari et al. | Stabilizing vanadyl acetylacetonate using imidazolium Ionic liquids for VO2 thermochromic thin films | |
CN103011262B (en) | The preparation method of tin ash base conductive material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |