TWI389123B - System for operating a memory array and method of the same - Google Patents
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本發明大體上是關於一種記憶體元件(memory device)且更特別地是關於一種操作記憶體元件之系統以及方法。The present invention generally relates to a memory device and more particularly to a system and method for operating a memory device.
快閃記憶體為一種類型之非揮發性記憶體,其可多次被寫入以及抹除且可在無功率消耗之情況下保持其內容。氮化物唯讀記憶體(Nitride read only memory,NROM)作為快閃記憶體的一種類型,可包括用於資料儲存之NROM單元(cells)的N列乘M行陣列。每一NROM單元可包括具有形成在P型基板上之源極、汲極以及堆疊閘極結構的金屬氧化物半導體(metal oxide semiconductor,MOS)電晶體。閘極結構可包括覆蓋氧化物/氮化物/氧化物(oxide/nitride/oxide,ONO)堆疊層之多晶矽層,其中氮化物層充當電子陷入層(eleetron trapping layer)。Flash memory is a type of non-volatile memory that can be written and erased multiple times and can retain its contents without power consumption. Nitride read only memory (NROM), a type of flash memory, can include an array of N columns by M rows of NROM cells for data storage. Each of the NROM cells may include a metal oxide semiconductor (MOS) transistor having a source, a drain, and a stacked gate structure formed on the P-type substrate. The gate structure can include a polysilicon layer overlying an oxide/nitride/oxide (ONO) stack layer, wherein the nitride layer acts as an eletron trapping layer.
每一NROM單元可儲存資料之一或多個位元。舉例而言,雙位元記憶體元件允許在單一單元中儲存資料之兩個位元,一位元被儲存在鄰近源極區域之陷入層中且另一個被儲存在鄰近汲極區域之陷入層中。在陷入層之一區域中存在或不存在負電荷可表示相應位元之狀態。Each NROM unit can store one or more bits of data. For example, a two-bit memory component allows two bits of data to be stored in a single cell, one bit being stored in a trapped layer adjacent to the source region and the other being stored in a trapped layer adjacent to the drain region in. The presence or absence of a negative charge in one of the regions of the trapped layer may indicate the state of the corresponding bit.
在利用ONO堆疊層來儲存電荷之多位元記憶體元件中,應將在程式化以及抹除操作期間添加或移除之電荷限制在單元之各別源極以及汲極區域中。然而,事實上,在 源極以及汲極區域中之一者中累積以及移除電荷可能會影響到另一區域中之電荷,因此隨時間改變了單元之讀取、程式化以及抹除特徵。最終,電荷之累積改變了用於判定單元中之各別位元之狀態的臨限電壓(threshold voltage)。這歸因於單元之兩個區域間的交互作用而產生之臨限電壓偏移,普遍稱作位元干擾(bit disturb)。另外,在記憶體單元之重複循環後的電荷損失(charge loss)亦導致臨限電壓(尤其是程式臨限電壓)偏移。由於位元干擾及/或電荷損失而發生之臨限電壓改變,阻止了記憶體元件正確地感測單元之每一位元的狀態。In a multi-bit memory device that utilizes an ONO stacked layer to store charge, the charge added or removed during the stylization and erase operations should be limited to the respective source and drain regions of the cell. However, in fact, at The accumulation and removal of charge in one of the source and drain regions may affect the charge in another region, thus changing the read, program, and erase features of the cell over time. Finally, the accumulation of charge changes the threshold voltage used to determine the state of the individual bits in the cell. This is due to the threshold voltage shift due to the interaction between the two regions of the cell, commonly referred to as bit disturb. In addition, the charge loss after repeated cycles of the memory cells also causes the threshold voltage (especially the program threshold voltage) to shift. The threshold voltage change due to bit interference and/or charge loss prevents the memory component from correctly sensing the state of each bit of the cell.
藉由將來自記憶體單元之值(例如,資料位元之電壓位準)與參考值(reference value)進行比較,來判定多位元單元之每一位元的狀態(包括程式化狀態或處於抹除狀態)。大體而言,在初始製造期間將參考單元預程式化並設定為抹除狀態以使得可提供穩定之參考值。當來自記憶體單元之值大於參考值時,判定記憶體單元為處於抹除狀態。另一方面,當記憶體單元之值小於參考值時,判定記憶體單元為處於程式化狀態。圖1說明一說明記憶體元件之感測裕度(sensing margin)的圖式。線102表示記憶體單元隨時間的理想程式臨限電壓。線104表示在考慮諸如位元干擾以及電荷損失之效應的情況下記憶體單元之程式臨限電壓隨時間之改變的實例。線106表示記憶體單元隨時間之理想抹除臨限電壓。線108表示在考慮諸如位元干擾以及電荷損失之效應的情況下記憶體單元之抹除臨限電 壓隨時間之改變的實例。線110表示在先前技術中由記憶體元件之參考單元所提供的參考值,其如圖1所示隨時間保持恆定值。參看圖1,歸因於如位元干擾及/或電荷損失效應之效應,參考值110與記憶體單元之程式臨限電壓104之間的感測裕度112會隨時間而減小,這將增加感測誤差之可能性且降低記憶體元件之可靠性。Determining the state of each bit of a multi-bit cell (including stylized state or at least by comparing the value from the memory cell (eg, the voltage level of the data bit) with a reference value Erase status). In general, the reference cells are pre-programmed and set to an erased state during initial fabrication so that a stable reference value can be provided. When the value from the memory unit is greater than the reference value, it is determined that the memory unit is in the erased state. On the other hand, when the value of the memory unit is less than the reference value, it is determined that the memory unit is in a stylized state. Figure 1 illustrates a diagram illustrating the sensing margin of a memory component. Line 102 represents the ideal program threshold voltage for the memory cell over time. Line 104 represents an example of a change in the program threshold voltage of a memory cell over time, taking into account effects such as bit interference and charge loss. Line 106 represents the ideal erase voltage for the memory cell over time. Line 108 represents the erasure of the memory cell in consideration of effects such as bit interference and charge loss. An example of a change in pressure over time. Line 110 represents the reference value provided by the reference unit of the memory element in the prior art, which maintains a constant value over time as shown in FIG. Referring to FIG. 1, the sensing margin 112 between the reference value 110 and the program threshold voltage 104 of the memory cell may decrease over time due to effects such as bit interference and/or charge loss effects, which will Increase the likelihood of sensing errors and reduce the reliability of memory components.
與本發明一致之一實例提供一種用於操作記憶體元件之系統。這種記憶體元件可包括:具有若干記憶體單元之記憶體陣列(memory array);各自耦接至相應列中之記憶體單元中之至少一者的若干字元線(word line);各自耦接至相應行中之記憶體單元中之至少一者的若干位元線(bit line);以及若干動態參考單元(dynamic referenee cells),其各自耦接至字元線中之一者,以提供用於判定相關聯之記憶體單元中之至少一者之狀態的動態參考值。動態參考值能夠反映出相關聯之記憶體單元中之至少一者的臨限值(threshold value)的變化。One example consistent with the present invention provides a system for operating a memory component. Such a memory component can include: a memory array having a plurality of memory cells; a plurality of word lines each coupled to at least one of the memory cells in the respective columns; a plurality of bit lines connected to at least one of the memory cells in the corresponding row; and a plurality of dynamic reference cells, each coupled to one of the word lines, to provide A dynamic reference value used to determine the state of at least one of the associated memory cells. The dynamic reference value can reflect a change in the threshold value of at least one of the associated memory cells.
在另一實例中,一種用於操作記憶體元件之系統可包括:具有若干記憶體單元之記憶體陣列;各自耦接至相應列中之記憶體單元中之至少一者的若干字元線;各自耦接至相應行中之記憶體單元中之至少一者的若干位元線;若干動態參考單元,其各自耦接至字元線中之一者以用於提供用於判定相關聯之記憶體單元中之至少一者之狀態的動態參考值;以及控制電路,其用於程式化動態參考單元, 以使得動態參考值能夠反映出相關聯之記憶體單元中之至少一者的臨限值變化。In another example, a system for operating a memory component can include: a memory array having a plurality of memory cells; a plurality of word lines each coupled to at least one of the memory cells in the respective column; a plurality of bit lines each coupled to at least one of the memory cells in the respective row; a plurality of dynamic reference cells each coupled to one of the word lines for providing an associated memory for determining a dynamic reference value of a state of at least one of the body units; and a control circuit for programming the dynamic reference unit, So that the dynamic reference value can reflect a change in the threshold value of at least one of the associated memory cells.
與本發明一致之又一實例提供一種操作記憶體元件之方法。方法可包括:程式化動態參考單元;產生能夠反映出記憶體單元之臨限值變化的動態參考值;讀取來自記憶體單元之單元值;以及根據動態參考值來判定記憶體單元之狀態。Yet another example consistent with the present invention provides a method of operating a memory component. The method can include: stylizing a dynamic reference unit; generating a dynamic reference value that reflects a change in a threshold value of the memory unit; reading a unit value from the memory unit; and determining a state of the memory unit based on the dynamic reference value.
將理解以上大體描述以及以下詳細描述兩者均僅為例示性且闡釋性的且不限制本發明,如申請專利範圍所主張的。The above general description and the following detailed description are to be considered as illustrative and not restrictive
以下概述以及對本發明之以下詳細描述在結合隨附例示性圖式進行閱讀時將得以更好地理解。然而,應理解,本發明不限於所示精確配置以及手段。The following summary, as well as the following detailed description of the embodiments of the invention However, it should be understood that the invention is not limited to the precise arrangements and instrumentalities shown.
圖2說明在與本發明一致之實例中之用於操作諸如NROM陣列之記憶體元件之系統10的例示性圖式。系統10可包括記憶體陣列12、一組動態參考單元14、小型單元參考陣列16、若干主感測放大器18、動態參考感測放大器(dynamie referenee sensing amplifier)20、若干比較器22以及若干輸入/輸出(Input/Output,I/O)電路30。2 illustrates an illustrative diagram of a system 10 for operating a memory component, such as an NROM array, in an example consistent with the present invention. System 10 can include a memory array 12, a set of dynamic reference cells 14, a small cell reference array 16, a number of main sense amplifiers 18, a dynamie referenee sensing amplifier 20, a number of comparators 22, and a number of inputs/ Output (Input/Output, I/O) circuit 30.
在一實例中,可將系統10提供在單一基板上。這個基板可具有一或多個高密度區域(high density regions)以及低密度周邊區域(low density peripheral regions)。可將一或多個M×N記憶體陣列12置放在高密度區域中。在一實例 中,動態參考單元14與基板之高密度區域中之一者中的記憶體陣列12相鄰。前述周邊區域包括感測放大器(sensing amplifiers)18以及20、比較器(comparators)22以及I/O電路30。在一實例中,亦可將具有若干小型參考單元之小型單元參考陣列(mini-cell referenee array)16置放在周邊區域中。In one example, system 10 can be provided on a single substrate. This substrate can have one or more high density regions and low density peripheral regions. One or more M x N memory arrays 12 can be placed in a high density region. In an instance The dynamic reference unit 14 is adjacent to the memory array 12 in one of the high density regions of the substrate. The aforementioned peripheral area includes sensing amplifiers 18 and 20, comparators 22, and I/O circuit 30. In an example, a mini-cell referenee array 16 having a plurality of small reference cells can also be placed in the peripheral area.
記憶體陣列12可包括配置在M行以及N列中之若干記憶體單元。記憶體單元中之每一者可包括具有堆疊閘極結構之MOS電晶體。堆疊閘極結構可包括位於ONO層上之多晶矽層,ONO層具有夾在兩個二氧化矽層之間的氮化矽層。位於同一列中之記憶體單元可經由字元線24連接,而位於同一行中之記憶體單元可經由位元線26連接。換言之,系統10可具有各自耦接至相應列中之一或多個記憶體單元的若干字元線24以及各自耦接至相應行中之一或多個記憶體單元的若干位元線26。The memory array 12 can include a number of memory cells arranged in M rows and N columns. Each of the memory cells can include a MOS transistor having a stacked gate structure. The stacked gate structure may include a polysilicon layer on the ONO layer, the ONO layer having a tantalum nitride layer sandwiched between two ruthenium dioxide layers. Memory cells located in the same column may be connected via word line 24, while memory cells located in the same row may be connected via bit line 26. In other words, system 10 can have a number of word lines 24 each coupled to one or more memory cells in a respective column and a plurality of bit lines 26 each coupled to one or more memory cells in a respective row.
該組動態參考單元14可包括經由位元線28相互連接之若干動態參考單元。動態參考單元可經置放,以鄰接或耦接至記憶體陣列12。在一實例中,動態參考單元中之每一者經由一列之字元線耦接至記憶體單元。動態參考單元中之每一者為相關聯之記憶體單元提供動態參考值(諸如一實例中之讀取臨限電壓)以判定記憶體單元之狀態。藉由與記憶體單元共用相同的字元線,動態參考單元中之每一者可操作經過與相關聯之記憶體單元相同的循環(cyclos),且藉此經歷與記憶體單元上之效應相同或類似的 效應,諸如電荷損失。The set of dynamic reference units 14 can include a number of dynamic reference units that are interconnected via a bit line 28. The dynamic reference cells can be placed adjacent to or coupled to the memory array 12. In an example, each of the dynamic reference cells is coupled to the memory cell via a column of word lines. Each of the dynamic reference cells provides a dynamic reference value (such as a read threshold voltage in an example) for the associated memory cell to determine the state of the memory cell. By sharing the same word line with the memory cells, each of the dynamic reference cells can operate through the same cyclos as the associated memory cells, and thereby experience the same effects as on the memory cells. Or similar Effects such as charge loss.
小型單元參考陣列16包括耦接至主感測放大器18中之每一者以用於提供靜態參考值的至少一小型參考單元。可藉由記憶體製造者以固定值程式化該小型參考單元一次,以使其隨時間為實質上穩定的。在一實例中,其中動態參考單元可在系統10之讀取模式中提供動態參考值,小型單元參考陣列16可在諸如程式驗證模式(program verify mode)之驗證模式中,提供用於記憶體單元之穩定參考值。在一實例中,動態參考單元可在系統10之讀取模式以及驗證模式兩者中提供用於記憶體單元之參考值。The small cell reference array 16 includes at least one small reference cell coupled to each of the main sense amplifiers 18 for providing a static reference value. The small reference unit can be programmed once at a fixed value by the memory manufacturer to be substantially stable over time. In an example, where the dynamic reference unit can provide a dynamic reference value in the read mode of system 10, small unit reference array 16 can be provided for the memory unit in a verify mode, such as a program verify mode. Stable reference value. In an example, the dynamic reference unit can provide a reference value for the memory unit in both the read mode and the verify mode of system 10.
主感測放大器18以及動態參考感測放大器20可被置放在周邊區域中。主感測放大器18中之每一者可耦接至位元線26中之一者,以用於讀取一行之記憶體單元中之一者的單元值。動態參考感測放大器20可耦接至位元線28,以用於讀取動態參考單元中之一者的參考值。The main sense amplifier 18 and the dynamic reference sense amplifier 20 can be placed in a peripheral area. Each of the main sense amplifiers 18 can be coupled to one of the bit lines 26 for reading a cell value of one of the memory cells of a row. Dynamic reference sense amplifier 20 can be coupled to bit line 28 for reading a reference value of one of the dynamic reference cells.
每一比較器22可連接至主感測放大器18、動態參考感測放大器20以及小型單元參考單元中之一者其中之一。在一實例中,可使用比較器22以藉著將由相關聯之主感測放大器18所提供之單元值與動態參考感測放大器20所提供之動態參考值進行比較,來判定記憶體單元之狀態。根據上述比較,可判定記憶體單元之狀態。隨後可向I/O電路30中之一者提供比較結果以供輸出。Each comparator 22 can be coupled to one of the main sense amplifier 18, the dynamic reference sense amplifier 20, and a small unit reference unit. In an example, comparator 22 can be used to determine the state of the memory cell by comparing the cell value provided by associated main sense amplifier 18 to the dynamic reference value provided by dynamic reference sense amplifier 20. . Based on the above comparison, the state of the memory cell can be determined. A comparison result can then be provided to one of the I/O circuits 30 for output.
在一些實例中,可預程式化動態參考單元,以使得參考值可視記憶體單元之程式化臨限電壓(Program Vt)而 變化。作為一實例,可在記憶體系統之製造過程期間進行預程式化。圖3為展示程式化動態參考單元之例示性過程的流程圖300。參看圖3,前述過程可由步驟302(預抹除程式化)開始,其間可選擇字元線且可向相關聯之記憶體單元之氮化物儲存層施加諸如約0至10伏特之電荷的負電荷。可在相關聯之記憶體單元上施加若干電荷脈衝直至單元電壓超過驗證位準(verifieation level)為止。超過驗證位準所需要之脈衝數目(亦即,脈衝計數)可反映出程式化臨限電壓之低邊界(low boundary)。可將脈衝計數之資訊記錄在暫存器(register)或熔斷器(fuse)中,其亦為負責儲存與字元線相關聯之操作相關資訊的記憶體單元類型。In some examples, the dynamic reference unit can be pre-programmed such that the reference value is visible to the programized threshold voltage (Program Vt) of the memory unit. Variety. As an example, pre-programming can be performed during the manufacturing process of the memory system. 3 is a flow diagram 300 showing an exemplary process of a stylized dynamic reference unit. Referring to Figure 3, the foregoing process can begin with step 302 (pre-erase stylization) during which a word line can be selected and a negative charge such as a charge of about 0 to 10 volts can be applied to the nitride storage layer of the associated memory cell. . A number of charge pulses can be applied to the associated memory cell until the cell voltage exceeds the verify level. The number of pulses required to exceed the verification level (ie, the pulse count) reflects the low boundary of the programmed threshold voltage. The pulse count information can be recorded in a register or fuse, which is also the type of memory unit responsible for storing operational related information associated with the word line.
在步驟302之後,在步驟304,可施加諸如約-5伏特至5伏特之電荷的電荷以抹除所有記憶體單元中的資料。隨後執行步驟306(抹除驗證以及過抹除單元偵測)以驗證並偵測是否適當地抹除了所有記憶體單元中的資料。對於過抹除單元,執行步驟308(後抹除程式化)以向過抹除單元(over-erased eells)施加負電荷。重複進行步驟306以及308,直到將所有記憶體單元驗證為處於抹除狀態為止。此後,在步驟310藉由以在步驟302中獲得之每一字元線之脈衝計數的資訊來程式化(亦即,寫入)動態參考單元而執行對動態參考單元之初始化。Subsequent to step 302, at step 304, a charge such as a charge of about -5 volts to 5 volts may be applied to erase data in all of the memory cells. Then step 306 (erasing verification and over erasing unit detection) is performed to verify and detect whether the data in all the memory cells is properly erased. For the over erase unit, step 308 (post-erase stylization) is performed to apply a negative charge to the over-erased eells. Steps 306 and 308 are repeated until all memory cells are verified to be in the erased state. Thereafter, initialization of the dynamic reference unit is performed at step 310 by programmatically (i.e., writing) the dynamic reference unit with information of the pulse count of each word line obtained in step 302.
圖4為說明與本發明一致之實例之感測裕度的例示性圖式。線402表示記憶體單元之隨時間維持恆定的理想程式臨限電壓。線404表示記憶體單元之程式臨限電壓隨時 間的變化,變化可由諸如位元干擾以及電荷損失之效應所導致。線406表示記憶體單元之同樣地隨時間保持恆定的理想抹除臨限電壓。408表示記憶體單元之抹除臨限電壓隨時間的變化,變化可由諸如位元干擾以及電荷損失之效應所導致。線410說明由動態參考單元提供之動態參考值的實例。在一實例中,動態參考值可隨時間變化。舉例而言,可根據上文所描述之過程,程式化動態參考值410,以向相關聯之記憶體提供能夠反映出記憶體之特徵的參考值,參考值可隨時間變化。在一實例中,可使參考值與記憶體單元之相應程式臨限電壓404之間的差值隨時間維持實質上穩定。換言之,感測裕度412(亦即,程式臨限電壓404與動態參考410之間的差值)可為實質上穩定的。4 is an illustrative diagram illustrating a sensing margin for an example consistent with the present invention. Line 402 represents the ideal program threshold voltage for the memory cell to remain constant over time. Line 404 represents the program threshold voltage of the memory unit at any time. The change, the change can be caused by effects such as bit interference and charge loss. Line 406 represents the ideal erase threshold voltage for the memory cell that remains constant over time. 408 represents the change in the threshold voltage of the memory cell over time, and the change can be caused by effects such as bit interference and charge loss. Line 410 illustrates an example of a dynamic reference value provided by a dynamic reference unit. In an example, the dynamic reference value can vary over time. For example, the dynamic reference value 410 can be programmed according to the process described above to provide a reference value to the associated memory that reflects the characteristics of the memory, which can vary over time. In one example, the difference between the reference value and the corresponding program threshold voltage 404 of the memory unit can be maintained substantially stable over time. In other words, the sense margin 412 (ie, the difference between the program threshold voltage 404 and the dynamic reference 410) can be substantially stable.
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
10‧‧‧系統10‧‧‧System
12‧‧‧記憶體陣列12‧‧‧ memory array
14‧‧‧動態參考單元14‧‧‧Dynamic reference unit
16‧‧‧小型單元參考陣列16‧‧‧Small unit reference array
18‧‧‧主感測放大器18‧‧‧Main sense amplifier
20‧‧‧動態參考感測放大器20‧‧‧Dynamic Reference Sense Amplifier
22‧‧‧比較器22‧‧‧ Comparator
24‧‧‧字元線24‧‧‧ character line
26、28‧‧‧位元線26, 28‧‧‧ bit line
30‧‧‧輸入/輸出電路30‧‧‧Input/output circuits
102、104、106、108、110‧‧‧線Lines 102, 104, 106, 108, 110‧‧
112、412‧‧‧感測裕度112, 412‧‧‧Sense margin
300‧‧‧流程圖300‧‧‧ Flowchart
302~310‧‧‧步驟302~310‧‧‧Steps
402、404、406、408、410‧‧‧線Lines 402, 404, 406, 408, 410‧‧
圖1為先前技術中之記憶體元件之感測裕度的圖式。1 is a diagram of the sensing margin of a memory element in the prior art.
圖2為根據本發明之一種NROM記憶體之的例示性實施例的方塊圖。2 is a block diagram of an exemplary embodiment of an NROM memory in accordance with the present invention.
圖3為展示程式化動態參考單元之例示性過程的流程圖。3 is a flow chart showing an exemplary process of a stylized dynamic reference unit.
圖4為本發明之例示性實施例之感測裕度的圖式。4 is a diagram of a sensing margin of an exemplary embodiment of the present invention.
10‧‧‧系統10‧‧‧System
12‧‧‧記憶體陣列12‧‧‧ memory array
14‧‧‧動態參考單元14‧‧‧Dynamic reference unit
16‧‧‧小型單元參考陣列16‧‧‧Small unit reference array
18‧‧‧主感測放大器18‧‧‧Main sense amplifier
20‧‧‧動態參考感測放大器20‧‧‧Dynamic Reference Sense Amplifier
22‧‧‧比較器22‧‧‧ Comparator
24‧‧‧字元線24‧‧‧ character line
26、28‧‧‧位元線26, 28‧‧‧ bit line
30‧‧‧輸入/輸出電路30‧‧‧Input/output circuits
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