TWI383393B - Solid state disk module - Google Patents

Description

Solid state hard disk module

The invention relates to a solid state hard disk module.

Solid state hard disk is a new data storage technology that uses a plurality of solid-state memories to simulate a single hard disk in the structure of a disk array. Compared with the traditional method of using a head and a liquid bearing, the solid state disk has The ability to read a few degrees is sufficient for data access. In addition, since the memory access mode of the solid state hard disk is different from the conventional hard disk, it also has excellent impact resistance and shock resistance.

However, the current solid-state hard disk using solid-state memory as a storage medium does not have the function of allowing the user to select the capacity of the hard disk, and the solid-state memory has a certain access life, so when the solid state memory is damaged, The only way to deal with it is to replace the entire hard drive, which is a flaw in the design.

In order to solve the above problems, one object of the present invention is to provide a solid state hard disk module that utilizes a switching device to allow a user to freely select a stored memory capacity. In addition, when the memory module is destroyed, it is easy to replace it individually to save costs.

In order to achieve the above object, a solid state hard disk module according to an embodiment of the invention includes a substrate, wherein the substrate includes a plurality of external contacts; a plurality of memory modules are disposed on the substrate; and a control chip is disposed on the substrate and An external connection is electrically connected; and a switching component is disposed on the substrate and electrically connected to the memory module and the control chip respectively The control chip is configured to control the switching component to selectively read at least one of the plurality of memory modules.

The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the appended claims.

The detailed description is as follows, and the preferred embodiment is not intended to limit the invention.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a solid state hard disk module according to an embodiment of the present invention. The solid state hard disk module according to an embodiment of the invention comprises: a substrate 10, wherein the substrate 10 comprises a plurality of external contacts 12. A plurality of memory modules, such as memory modules 20, 22, are disposed on the substrate 10 in a suitable manner. A control wafer 30 is disposed on the substrate 10 in an appropriate manner and electrically connected to the external contacts 12 on the substrate 10. A switching component 40 is disposed on the substrate 10 and electrically connected to the memory modules 20 and 22 and the control wafer 30, respectively.

Following the above description, in this embodiment, each of the memory modules 20, 22, such as a flash memory module, each includes a plurality of memory packages, such as memory packages 21, 23, and each memory The body packages 20, 22 include at least one wafer. In another embodiment, the storage capacity of each of the memory modules 20 and 22 may be different. The user may select different memory storage by using a computer device or an electronic device and adjusting the switching element 40 through the external contact 12 . capacity. The external contacts 12 may form an Advanced Technology Attachment (ATA), Serial ATA (SATA, Serial ATA), SATA2, eSATA (external SATA), etc., or other future development speeds may be faster. The interface is connected to a computer device/electronic device.

In addition, in an embodiment, please refer to FIG. 2, which is a schematic diagram of the connection state between the memory modules 20, 22, the switching element 40 and the control wafer 30. , The switching element 40 of each memory module having a connecting line between the 20 and 22 as shown, such as the line C _1, C ₂ and C _3, the user can operate through computer or electronic device to control wafer 30 To adjust the line that the switching element 40 needs to conduct. In this way, the user is free to choose the space and capacity to be stored. In one embodiment, the conductive line when the C ₃ will make the storage capacity of the SSD Module maximum capacity will be approximately the sum capacity of the memory module 20 and the memory module 22. In addition, it is to be understood that the drawings are only an embodiment and are not intended to limit the scope of the invention.

In addition, the solid state hard disk module of the embodiment of the present invention further includes at least one passive component 50 disposed on the substrate 10 and electrically connected to the substrate 10 . In yet another embodiment, the package types of the memory packages 20, 22 include a thin small outline package (TSOP) and a ball grid array (BGA), which are very flexible in design.

In summary, the present invention provides a solid state hard disk module that utilizes a switching element to allow a user to freely select a stored memory capacity. In addition, when the memory module is destroyed, it is easy to replace it individually to save costs.

The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.

10. . . Substrate

12. . . External contact

20,22. . . Memory module

21,23. . . Memory package

30. . . Control chip

40. . . Switching element

50. . . Passive component

C ₁ , C ₂ , C ₃ . . . line

1 is a schematic structural view of a solid state hard disk module according to an embodiment of the present invention.

2 is a schematic diagram showing a connection state between a memory module, a switching element, and a control wafer according to an embodiment of the present invention.

10. . . Substrate

12. . . External contact

20,22. . . Memory module

21,23. . . Memory package

30. . . Control chip

40. . . Switching element

50. . . Passive component

Claims (6)

A solid state hard disk module comprises: a substrate, wherein the substrate comprises a plurality of external contacts; a plurality of memory modules are disposed on the substrate; a control chip is disposed on the substrate and externally connected to the substrate a switching device is disposed on the substrate and electrically connected to the memory module and the control chip, wherein the control chip is configured to control the switching component to selectively read the plurality of memories At least one of the body modules. The solid state hard disk module of claim 1, further comprising at least one passive component disposed on the substrate and electrically connected to the substrate. The solid state hard disk module of claim 1, wherein the memory modules are flash memory modules. The solid state hard disk module of claim 1, wherein each of the memory modules comprises a plurality of memory packages. The solid state hard disk module of claim 4, wherein the package type of the memory package comprises a thin small package and a ball gate array. The solid state hard disk module of claim 4, wherein each of the memory packages comprises at least one wafer.