TWI382801B - - Google Patents

Info

Publication number
TWI382801B
TWI382801B TW98144866A TW98144866A TWI382801B TW I382801 B TWI382801 B TW I382801B TW 98144866 A TW98144866 A TW 98144866A TW 98144866 A TW98144866 A TW 98144866A TW I382801 B TWI382801 B TW I382801B
Authority
TW
Taiwan
Application number
TW98144866A
Other languages
Chinese (zh)
Other versions
TW201124022A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW98144866A priority Critical patent/TW201124022A/en
Publication of TW201124022A publication Critical patent/TW201124022A/en
Application granted granted Critical
Publication of TWI382801B publication Critical patent/TWI382801B/zh

Links

TW98144866A 2009-12-24 2009-12-24 Method of manufacturing multi-layer circuit board and its structure thereof. TW201124022A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98144866A TW201124022A (en) 2009-12-24 2009-12-24 Method of manufacturing multi-layer circuit board and its structure thereof.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98144866A TW201124022A (en) 2009-12-24 2009-12-24 Method of manufacturing multi-layer circuit board and its structure thereof.

Publications (2)

Publication Number Publication Date
TW201124022A TW201124022A (en) 2011-07-01
TWI382801B true TWI382801B (en) 2013-01-11

Family

ID=45046938

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98144866A TW201124022A (en) 2009-12-24 2009-12-24 Method of manufacturing multi-layer circuit board and its structure thereof.

Country Status (1)

Country Link
TW (1) TW201124022A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI461698B (en) * 2010-09-30 2014-11-21 Mpi Corp Probe unit and its making method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200908850A (en) * 2007-08-10 2009-02-16 Microelectonics Technology Inc Multilayer circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200908850A (en) * 2007-08-10 2009-02-16 Microelectonics Technology Inc Multilayer circuit board

Also Published As

Publication number Publication date
TW201124022A (en) 2011-07-01

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