TWI381544B - Method for manufacturing light emitting diode device with multiple wavelengths - Google Patents

Description

Method for manufacturing multi-wavelength light-emitting diode element

The invention relates to a method for manufacturing a multi-wavelength light-emitting diode element, in particular to a light-emitting diode element capable of generating multi-wavelength light by a fluorescent material.

Because the light emitting diode (LED) has the advantages of small size, high luminous efficiency and long life, it is considered to be the best light source for the next generation of green energy-saving lighting. In addition, the rapid development of liquid crystal displays and the trend of full-color screens make white light-emitting diodes not only be used for indicators and large display screens, but also into consumer electronics such as mobile phones and PDAs.

1 is a schematic view of a conventional liquid crystal display. The light emitting diode module 20 is located on the side of the liquid crystal display panel 11, and the light emitted by the light emitting diode module 20 is transmitted to the bottom surface of the entire liquid crystal display panel 11 through a light guide plate (LGP) 12. Finally, the light is emitted from above the liquid crystal display panel 11 and enters the line of sight of the user.

2 is a perspective view of the LED module 20. The LED module 20 includes a housing 21, a plurality of LED components 24, and a pair of external electrodes 22 and 23, wherein the LEDs 24 emit light from one side of the opening of the housing 21. Further, in order to prevent the light-emitting diode element 24 from being damaged by an external force, a transparent plastic material 25 may be injected into the casing 21 to protect it. At present, the main body 21 is mainly made of two kinds of plastic materials, one is nylon (Nylon) which has poor coupling with the lead frame of the light-emitting diode element 24, and the other is a combination with the lead frame. Polyphthalamide (PPA) or polybutyne (PPB).

At present, a heat dissipating component is embedded in the bottom of the high-power LED component 24, so that a corresponding heat dissipating post 26 is embedded in the bottom side of the housing 21, as shown in FIG. Figure 3 is a cross-sectional view taken along line 1-1 of Figure 2.

4 is a schematic cross-sectional view of the light emitting diode element 24 of FIG. The light-emitting diode element 20 mainly comprises a light-emitting diode die 242 fixed at a 243 cup structure of a lead frame, and the light-emitting diode die 242 is respectively connected to the lead frame by the metal wire 245. The cathode 243a and the anode 243b of 243 are electrically connected. The light-emitting diode crystal 242 is a light-emitting diode of a nitride-based semiconductor. The phosphor layer material 241 capable of emitting light of different spectral bands is filled in the cup type structure, so when the light emitting diode die 242 receives the external power supply, an initial light is emitted, and the fluorescent material 241 covering the periphery thereof is The initial ray is excited and thus produces a fluorescent light having a spectral band that is different from the initial ray. The initial light and the fluorescent light are mixed into a white light, and finally the white light passes through the mold member 244 to be emitted.

Most of the fluorescent material 241 is discharged by a proper amount of the gel-like fluorescent material 241 by a general dispensing device, and is potted in the cup-shaped structure. However, the amount of glue that is spit out often changes with parameter settings, viscosity, and time, so maintaining uniformity is not an easy task. In addition, the solid particles in the gel-like phosphor material 241 are precipitated by gravity to the bottom of the cup-shaped structure, and the longer the bake time from curing, the more severe the precipitation phenomenon. Obviously, the LED component 244 produced according to the conventional process will change the light characteristics with the lot, so it is no longer possible Meet the basic requirements of low variation in color and related quality.

In addition, there is a conventional technique in which a fluorescent material is mixed in the transparent plastic material 25 of the LED module 20 instead of covering the cup structure. However, since the crystal grains of the light source and the phosphor material that generates the excited light are located far apart, the uniformity after the light mixing is not good.

In summary, there is a need in the market for a light-emitting diode component with stable optical characteristics, which can improve the quality of the light-emitting diode component and can be widely applied to a light-emitting module as a backlight.

The object of the present invention is to provide a method for fabricating a multi-wavelength light-emitting diode element having stable optical characteristics, wherein the light-emitting diode element is provided with at least one layer of phosphor material on the light-emitting diode die and the package carrier. between. The layer of phosphor material is used to fix the light emitting diode die on the package carrier or to cover the surface of the photodiode grain surface.

To achieve the above object, the present invention discloses a method of fabricating a multi-wavelength light emitting diode element. A non-circuit surface on a wafer is formed to form a phosphor layer, and the wafer having the phosphor layer is formed into a plurality of light-emitting diode crystal grains. A light emitting diode die is fixed on a package carrier, wherein the phosphor material layer is disposed between the light emitting diode die and the package carrier. And the phosphor material layer is used for fixing the light emitting diode die on the package carrier; or the phosphor material layer covers the surface of the photodiode die, and the surface of the phosphor material layer is attached to Interlocking with the package carrier.

The invention discloses a multi-wavelength light emitting module. The multi-wavelength light emitting module package The invention comprises a light guide plate, at least one light emitting diode die and a fluorescent material. The light-emitting diode crystal grains generate initial light, and the fluorescent material and the light guide plate are disposed on opposite sides of the light-emitting diode crystal grains. The light guide plate can uniformly transmit the multi-wavelength light of the initial light and the secondary light mixed by the fluorescent material to the surface to penetrate.

Figure 5 is a schematic cross-sectional view of a light emitting diode device of the present invention. The light-emitting diode element 50 mainly comprises a light-emitting diode die 52 fixed to a light-emitting component of a lead-frame 53-cup structure, and the die 52 is respectively connected to the cathode 53a of the lead frame 53 by a metal wire 55. The anode 53b is electrically connected. The crystal grain 52 is a light-emitting diode of a nitride-based semiconductor. At the bottom of the die 52 is a glue 51 having a fluorescent material, so that when the die 52 receives an external power supply, it emits initial light, and a portion of the light penetrates the transparent substrate (sapphire) of the die 52. The excitation glue 51 generates a secondary light of a fluorescent or phosphorescent light, and the spectral band of the secondary light is different from the initial light. The initial light and the secondary light are mixed into a white light, and finally the white light passes through the mold member 54 and is emitted. Since the secondary light is generated very close to the initial light generation, the white light after the light mixing is very uniform. In addition, the adhesive 51 mixed with the fluorescent material replaces the silver paste which is required in the conventional packaging process, so that the present invention can be manufactured without adding an additional process (as in the art of FIG. 4).

Fig. 6(a) is a schematic cross-sectional view showing a surface mount (SMD) type of light-emitting diode element 60 of the present invention. The light-emitting diode die 62 is fixed on the surface of the N-type conductive copper foil 63b on the insulating layer 63c by the adhesive 61 with a fluorescent material, and is electrically conductive by the metal wire 65 and the P-type conductive copper foil 63a and the N-type. Copper foil 63b Electrically connected, the P-type conductive copper foil 63a, the N-type conductive copper foil 63b, and the insulating layer 63c constitute a substrate 63 having a circuit. Similarly, the die 62 receives an external power supply to emit an initial light, and a portion of the light penetrates the transparent substrate of the die 62 to excite the adhesive 61 to generate a secondary light of the fluorescent or phosphorescent light, and a spectrum of the secondary light. The strap is different from the initial ray. The initial light and the secondary light are mixed into a white light, and finally the white light passes through the mold member 64 to be emitted.

Compared with FIG. 6( a ), FIG. 6( b ) is first covered with a phosphor material layer 61 ′ on the surface of the substrate of the photodiode, and the reusable silver between the phosphor material layer 61 ′ and the substrate 63 . Glue or glue (not shown) is fixed. Since the phosphor layer 61' can be formed directly on the wafer, and the thickness and distribution of the phosphor material can be better controlled, the LED element 60' can have stable optical characteristics.

Figure 7 is a top plan view of the lighting module of the present invention. The illuminating module 70 includes a illuminating diode module 72 and a light guiding plate 71. The illuminating diode module 72 is composed of a housing 721 and a plurality of illuminating diode elements 50. The glue 51 and the light guide plate 71 are disposed on opposite sides of the light-emitting diode die 52.

The technical and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims

11‧‧‧LCD panel

12‧‧‧Light guide plate

20‧‧‧Lighting diode module

21‧‧‧ housing

22, 23‧‧‧ External electrodes

24‧‧‧Lighting diode components

25‧‧‧Transparent plastic materials

26‧‧‧ Heatsink

50‧‧‧Lighting diode components

51‧‧‧Adhesives with fluorescent materials

52‧‧‧Light Emitter Wafer

53‧‧‧ lead frame

53a‧‧‧ cathode

53b‧‧‧Anode

54‧‧‧Mold components

55‧‧‧Metal wire

60, 60'‧‧‧Lighting diode components

61, 61'‧‧‧Fluorescent material layer

62‧‧‧Light-emitting diode grains

63‧‧‧Substrate

63a‧‧‧P type conductive copper foil

63b‧‧‧N type conductive copper foil

63c‧‧‧Insulation

64‧‧‧Mold components

65‧‧‧Metal wire

70‧‧‧Lighting module

71‧‧‧Light guide plate

72‧‧‧Lighting diode module

241‧‧‧Fluorescent materials

242‧‧‧Light-emitting diode grains

243‧‧‧ lead frame

243a‧‧‧ cathode

243b‧‧‧Anode

244‧‧‧Mold components

245‧‧‧Metal wire

721‧‧‧shell

Figure 1 is a schematic view of a conventional liquid crystal display; 2 is a schematic view of a light-emitting diode module; FIG. 3 is a cross-sectional view taken along line 1-1 of FIG. 2; FIG. 4 is a schematic cross-sectional view of the light-emitting diode element of FIG. 3; FIG. 6(a) to 6(b) are schematic cross-sectional views showing a surface-adhesive type of light-emitting diode element 60 of the present invention; and FIG. 7 is a top view of the light-emitting module of the present invention.

50‧‧‧Lighting diode components

51‧‧‧Adhesives with fluorescent materials

52‧‧‧Light-emitting diode grains

53‧‧‧ lead frame

53a‧‧‧ cathode

53b‧‧‧Anode

54‧‧‧Mold components

55‧‧‧Metal wire

Claims (5)

A method for manufacturing a multi-wavelength light-emitting diode element, comprising the steps of: forming a layer of a phosphor material on a wafer, the layer of phosphor material being mixed with a phosphor material to form a paste; The wafer of the optical material layer is divided into a plurality of light emitting diode crystal grains; and a light emitting diode die is fixed on a package carrier by an adhesive in the fluorescent material layer; wherein the fluorescent light A material layer is disposed between the light emitting diode die and the package carrier. The method of manufacturing a multi-wavelength light-emitting diode element according to claim 1, wherein the package carrier is a lead frame or a substrate. According to the manufacturing method of the multi-wavelength light-emitting diode element of claim 1, wherein the light-emitting diode crystal grains emit initial light, and a part of the light of the initial light penetrates the transparent surface of the light-emitting diode The substrate excites the layer of phosphor material to generate secondary light of the fluorescent or phosphorescent light, and the spectral band of the secondary light is different from the initial light. A method of manufacturing a multi-wavelength light-emitting diode element according to claim 1, wherein the light-emitting diode crystal grain is a light-emitting diode of a nitride-based semiconductor. A method for manufacturing a backlight module includes the steps of: providing a light emitting diode module; and providing a light guide plate; wherein the light emitting diode module comprises a reflective housing and a plurality of light emitting diode components, And the plurality of light emitting diode elements are formed by the following steps: Forming a phosphor material layer on a wafer, the phosphor material layer is formed by mixing a phosphor material in the adhesive; and dividing the wafer having the phosphor material layer into a plurality of light emitting diode crystals And illuminating the light-emitting diode dies on the package carrier by the adhesive in the phosphor material layer; wherein the phosphor material layer and the light guide plate are respectively located on the light-emitting diode dies On both sides, and part of the initial light emitted by the light-emitting diode dies passes through the light-emitting diode grains and excites the phosphor material layer to generate secondary light having a wavelength different from the initial light, and the initial light The light mixed light forms a substantially uniform white light.