1379489 九、發明說明： 【發明所屬之技術領域】 本發明涉及電子元件貼裝技術領域，尤其涉及一種電 子元件貼裝裝置及貼裝方法。 【先前技術】 印刷電路板與積體電路晶片係電子消費產品中大量採 用之零配件，印刷電路板與積體電路晶片上需要貼裝焊接 電子元件，例如電阻、電容、電感元件等。而表面貼裝技 術（Surface Mount Technology，SMT)由於可靠性高、易 於實現自動化等特點，已被廣泛應用於電子元件與印刷電 路板之組裝。請參閱 Stretchable Electronic Systems，IEEE Electronics Packaging Technology Conference, 6-8 Dec. 2006 Page(s):271 - 276。惟，要將小尺寸、多形狀規格之電子元 件貼裝焊接於印刷電路板與積體電路晶片上需要依靠高精 0度與高效率之貼片機。 目前，根據貼片機之貼裝主轴運動控制方式可分為三 大類：第一類係採用傳統之齒輪齒條傳動控制系統，其主 要採用機械方式對貼裝主轴之運動進行控制，若要實現高 精度之控制需增加機構之複雜度，從而會增加貼裝裝置之 體積與重量，增大貼裝主軸向下運動時衝擊力，.降低貼片 機使用壽命。第二類係使用數位或電子設備進行控制，依 靠伺服馬達帶動升降滚珠絲桿運動之傳動控制系統，該傳 動控制系統採用機、光、電組成精密之控制回路，控制精 度南’貼裝效率高，且整機體 雜曰i 枝術可罪。該系統複 雜之控&程式及叩貝之滚珠絲桿造成較大 三類係採用步進馬達盥同牛 不杈幵弟 , 一 Πッ傳廷帶之傳動控制系統，該系 統較為間早，但控制精度不高。 有鏗於此，提供一藉,地供 ^ m ^ ϋ ^ ^ ^ 跬此較好之電子元件貼裝裝置及 知用該貼裝裝置進行貼裝之方法實為必要。 【發明内容】 以下以實施例說明-種貼裝裝置及貼裴方法。 嘴以裝置’其包括飼服馬達、貼裝主軸、貼裝吸 服馬達與貼裝主轴相連接，用於帶 " >旋轉’該貼裝主轴與職吸嘴相連接，用 ^帶^裝吸嘴進行旋轉，該貼褒吸嘴用於吸取電子元件 進订貼裝，該傳感裝置與^ 主軸之旋轉角度並於鮮主細㈣丧用於誠貼裝 、、裝主軸％轉至預定角度時產生感測 I…’以使㈣馬達根據感測訊號帶動貼裝主軸停止旋轉。 用上述貼裝裝置進行貼裝之方法其包括步 f吸f、（貼裝之電路板以及待貼裝之電子元件；利用貼 yr待貼裝之電子元件；飼服馬達帶動貼裝主軸旋 妒輛旋轉至預定角度時，傳感裝置產生感測訊 就，伺服馬達根據感測訊號使貼 嘴帶Μ目Μ 轴停止旋轉；貼裝吸 .、 電子70件與待貼裝之電路板接觸以進行貼 展。 相對於先前技術，本技術方案之貼裝裝置及貼裝方法 1379489 具有以下優點：首先，利用傳感裝置即時感測貼裝主軸之 旋轉角度，並於貼裝主軸旋轉至預定角度時將訊號傳送回 伺服馬達以使伺服馬達根據該感測訊號停止旋轉，從而提 尚其旋轉角度控制精度，使得電子元件與具有—定角度之 貼裝位置進行貼裝時更準確，可有效避免由於電子元件之 貼裝位置偏移而產生之報廢與重工問題；其次，該貼裝裝 置結構緊湊，便於拆卸與更換，應用方便，且可節省檢修 維護時間；再次，該貼裝裝置應用方便，只要於形狀尺寸 上稍加改變便可於先前之貼片機上安裝使用。 【實施方式】 下面將結合附圖及實施例對本技術方案之電子元件貼 裝裝置作進一步之詳細說明。 請參閱圖1，本技術方案實施例提供一種貼裝裝置 100,用於於印刷電路板上貼裝電子元件。該貼裝裝置1〇〇 •包括固定架10、伺服馬達20、聯軸器30、貼裝主軸40、 貼裝吸嘴50、保護彈簧60、傳感裝置7〇以及軸套8〇。 該固定架10包括第一收容架U與第二收容架12。該 2 —收容架11之形狀大小與伺服馬達2〇相對應，用於收 谷該词服馬達2G。該第二收容架12之形狀大小與聯軸器 30 '貼裝主軸40相對應，用於收容聯軸器3〇以及部分貼 裝主轴40。 該伺服馬達20用於驅動貼裝主軸4〇作旋轉運動。伺 服馬達20由定子21與轉子22組成，該定子21相對固定 1379489 ::-收容架u，該轉子22藉由聯轴 相連接，以可帶動貼裝主軸4〇旋轉。 $軸40 ^一併參閲圖i、圖2及圖3,該聯轴器 連接词服馬達20與職主軸4G，其包括導 ^ ==卡塊33。該導向柱31與〜32 與凸肩32均為圓柱體。凸肩％與導向柱^共轴，且該 凸肩32之直徑大於導向柱31之 二 條形之長方形體，其相對地設置丄=卡塊33均為長 7犯"又置於導向柱31之外壁，且始 ^肩32相連接。該兩卡塊％之長度小於導向柱μ之長 度。為便於配合連接該聯軸器3G㈣服馬達Μ 聯軸請具有自凸肩32向導向柱31内開設之第一收容孔 %。該第-收容孔34之尺寸形狀與制服馬達加之轉子 22之尺寸形狀對應配合，從而轉子22配合收容於第— 孔34後，可將轉子22之動力傳遞至聯軸器％，並進 藉由聯軸器30將動力傳遞至貼裝主軸40。 •請-併參閲圖i、圖4及圖5，該貼裝主軸 式階梯抽’依次包括第一轴段41、第二轴段42以及: 段“。其中，該第一轴段41之直徑大於該第二轴段^之 直徑’該第二轴段42之直徑大於該第三軸段43之直徑。 該第一軸段41用於與聯軸器3〇配合固定。第一軸严 41為圓柱形，具有第二收容孔44以及兩凹槽45。該第= 忮谷孔44與導向柱31相對應，該兩凹槽45相對開設於第 二收容孔44之兩側，與該兩卡塊33相對應。從而，該 袖器3〇與第一轴段41配合後’導向柱31可收容固定^第 1379489 二收容孔44，兩卡塊33可收容固定於兩 該兩卡塊33使得第一軸段41 並且 而估法不可相對聯軸器30旋轉，從 而使第一軸段41與聯轴器30密切固定卡人 優tt，該第一轴段41與第二轴段^間可且有一轴 肩46,該輛肩46之直徑大於第—軸段4 例中，該軸肩46之直徑與凸肩32之吉仅本實她 設置保護彈黃6〇。該保護彈簧60為環 ^動= 彈簧’用於緩衝貼裝主… 下運動及取電子凡件進行貼裝時之衝擊力。 ，第二轴段42連接於第—軸段41與第三軸段43之 設有軸套8G，以使得第二轴段42能於轴套 該第三軸段43開設有兩相對之鍵槽47，以固 裝吸嘴％。本實施例中，該鍵槽47為單圓頭鍵槽。、 =併參閱圖i、圖6及圖7,該貼裝吸嘴5〇用於吸 :待：裝之電子元件以將電子元件貼裝到電路板上。該貼 裝吸嘴5G大致為長方體形，其具有相對之第—端面51组 第二端面52。該第-端面51 #近貼裝主軸4()。該第二端 面52則遠離貼裝主轴4〇,為與電子元件接觸以吸附電子元 件之表面。 為便於第三軸段43與貼裝吸嘴5〇連接固定，以將伺 服馬達20之動力傳遞至貼裝吸嘴5〇，貼裝吸嘴5〇具有連 接孔53、鍵槽孔531以及銷孔532。該連接孔幻自第一端 11 面51向内開設，其與第三 與該第三軸段43之鍵槽 3相對應。該鍵槽孔53i 47配合以收容單圓頭鍵（=，°該鍵槽孔別與鍵槽 貼裝吸嘴50之卡緊配a :不，以實現貼裝主轴40與 .周向轉動。該銷二心=50相對貼裝主軸 + 士从、*从 以逆按孔53相連通，且其軸绫 重直於連接孔53之軸線，㈣53_ ^線 以阻止貼裝吸嘴5G相對貼裝主軸4(^向=圖從未不） 貼裝吸嘴50與貼裝主軸4 定配合。 心间精由鍵與銷釘即可實現固 該貼裝吸嘴50還具有真处 55。該貼吸口55自第真j乳官道54以及貼吸口 r, ^ Β. Λ 鳊面52向内開設，該真空抽氣管 道54與貼吸口 55速i甬，*办古〜 並一真二抽氣裴置（圖未示）連 接，以實現對電子元件之真空吸附。 器Λ—Λ參閲圖1及圖8,該傳感震置7〇包括角度感測 器71與感應片72’其用於即時感測貼裝主軸40旋轉角度 :產生感測訊號。該傳感裝置7〇與2〇連接，以使词服馬 ^ 2〇可根據該傳感裝置7〇之感測訊號控制貼裝主轴4〇之 旋轉角度。該感應片72固定於貼裝主轴4〇,角度感測器 % 感應片72相對设置。本實施例中’該角度感測器π 又置於該固定架1〇之第二收容架12，其與貼裝主轴扣之 第轴4又41相對。該感應片72與角度感測器7ι相對，其 固定於該貼裝主軸40之轴肩46。並且’該感應片72與貼 裝主轴4 0之轴線平行。 該角度感測1 71包括兩霍爾感測器73，該兩霍爾感測 12 1379489 器73排列於同一水平線上，且均與感應片72相對。該霍 爾感測器73可利用霍爾效應實現角度之測量。所謂霍爾效 應係指當施加之外磁場垂直於半導體中流過之電流時會 於半導體垂直於電流與磁場之方向上產生霍爾電壓。 該感應片72為多極磁環，其固定於該軸肩扑之圓柱 形外壁。該乡極磁帛之圓柱形表面設置有等間隔分佈之若 干北磁極74與若干南磁極75。當該感應片72之某一北磁 籲極74或南磁極75轉到與霍爾感測器乃相對之位置，且霍 爾感測器73與北磁極74或南磁極75產生之磁場方向垂直 時，即該霍爾感測器73位於北磁極74或南磁極75之磁感 應區内時，霍爾感測器73產生感應電壓。 利用該傳感裝置70進行角度測量之原理過程如下：首 先，伺服馬達20帶動貼裝主軸4〇旋轉，固定於軸肩牝之 感應片72亦隨之轉動，從而多極磁環產生變化之磁場。其 -人，該霍爾感測器73感應到磁場強度之變化，經霍爾感測 籲器73内部電路整形後輸出電壓脈衝。例如，當霍爾感測器 73感應到北磁極74時，其輸出高電平，當霍爾感測器73 感應到南磁極75時，其輸出低電平，從而形成高低電平相 間之波形圖。再次，由於兩霍爾感測器73於空間上錯位安 裝，旋轉之北磁極74與南磁極75先後經過兩霍爾感測器 73,因而兩霍爾感測器73感應到之磁場變化存在時間差， 兩輸出之電壓脈衝之間就存在時間差，兩霍爾感測器乃形 成之波形圖存在相位差。最後，根據波形圖中電壓脈衝相 位之超前或滞後可判斷貼裝主軸4〇之旋轉方向，同時對單 13 1379489 位時間内之脈衝個數計數，並結合每個磁極對應轉軸之弧 度即可得到角位移，算出貼裝主軸4〇之旋轉角度。 當然’其他具有角度感測能力之傳感裝置亦可應用於 本技術方案。 該貼裝裝置100由於採用了傳感裝置7〇即時感應貼裝 主軸40之旋轉角度，因而提高了貼裝吸嘴5〇與電路板貼 裝時之位置精度。 • 下面簡要說明使用該貼裝裝置100將待貼裝之電子元 等件貼裝於待貼裝之電路板之過程。 裝之電子70 第一步，提供待貼裝之電路板以及待貼裝之電子元 =壯該㈣裝之電子元件需旋轉m後才能貼裝 貼裝之電路板上。 之貼裝吸嘴50吸取待貼裝 第二步’利用貼裝裝置100 之電子元件。 I主軸鐘 達20帶動貼裝主轴40旋轉，當貼裝 ，主軸^轉至預定角度時，傳感裝置7G產生感測訊號。 上之^ Η 20帶動貼裝主轴40旋轉時，貼裝主軸 72=二亦會同時旋轉’角度感測器71藉由感應片 預定角Hi雁4〇之旋轉角度。當貼裝主轴4_至該 器71感測到該旋:〜 5〇亦隨之停止轉動。 軸40停止旋轉’貼裝吸嘴 “79489 第五步，貼裝吸嘴5〇帶動待貼裝之電子元件與待貼裝 之電路板接觸以進行貼裝。 利用伺服馬達20帶動貼裝主軸4〇以及貼裝吸嘴5〇運 動時，由於保護彈蒉60可緩衝貼裝主軸4〇之衝擊力從 而可有效避免貼裝吸嘴50向下運動與電路板接觸進行貼裝 過程中壓傷電子元件，從而可提高電子元件貼裝之良率。 貼裝完成後，貼裝主軸40可回復原位，以待吸取下一 鲁電子元件進行貼裝。 相對於先前技術，本技術方案中之貼裝裝置及貼裝方 法具有以下優點：首先，利用傳感裝置即時感測貼裝主軸 之旋轉角度，並於貼裝主軸旋轉至預定角度時將訊號傳送 回伺服馬達以使伺服馬達根據該感測訊號停止旋轉，從而 提高其旋轉角度控制精度’使得電子元件與具有一定角度 之貼裝位置進行貼裝時更準確，可有效避免由於電子元件 之貼裝位置偏移而產生之報廢與重工問題；其次，該貼裝 鲁裝置結構緊湊，便於拆卸與更換，可節省檢修維護時間； 再次’該貼裝裝置應用方便，只要於形狀尺寸上稍加改變 便可於先前之貼片機上安裝使用。 絲上所述’本發明確已符合發明專利之要件’遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 15 1379489 圖1係本技術方案實施例提供之貼裝裝置之結構示意 圖2係圖1中貼裝裝置之聯軸器之示意圖。 圖3係圖2中貼裝裝置之聯軸器之俯視圖。 圖4係圖1中貼裝裝置之貼裝主軸之示意圖。 圖5係圖4中貼裝裝置之貼裝主軸之俯視圖。 圖6係圖1中貼裝裝置之貼裝吸嘴之示意圖。 圖7係圖6中貼裝裝置之貼裝吸嘴之俯視圖。 圖8係圖1中貼裝裝置之傳感裝置之示意圖。1379489 IX. Description of the Invention: [Technical Field] The present invention relates to the field of electronic component mounting technology, and more particularly to an electronic component mounting device and a mounting method. [Prior Art] Printed circuit boards and integrated circuit chips are widely used in electronic consumer products. On printed circuit boards and integrated circuit chips, soldered electronic components such as resistors, capacitors, and inductor components are required. Surface Mount Technology (SMT) has been widely used in the assembly of electronic components and printed circuit boards due to its high reliability and automation. See Stretchable Electronic Systems, IEEE Electronics Packaging Technology Conference, 6-8 Dec. 2006 Page(s): 271-276. However, it is necessary to rely on a high-precision 0-degree and high-efficiency placement machine to mount small-sized, multi-shape electronic components on printed circuit boards and integrated circuit chips. At present, according to the mounting motion control mode of the placement machine, it can be divided into three categories: the first type uses the traditional rack and pinion transmission control system, which mainly controls the movement of the mounted spindle by mechanical means. The high precision control needs to increase the complexity of the mechanism, which will increase the volume and weight of the mounting device, increase the impact force when the mounting spindle moves downward, and reduce the life of the placement machine. The second type is controlled by digital or electronic equipment, and relies on the servo motor to drive the transmission control system of the lifting ball screw. The transmission control system adopts a precise control circuit composed of machine, light and electricity, and the control accuracy is high. And the whole body is a sin. The system's complex control & program and the ball screw of the mussels cause the larger three types of systems to use the stepper motor and the same cow, and the transmission control system of the tunnel is relatively early. However, the control accuracy is not high. In view of this, it is necessary to provide a borrowing, ground supply, m ^ ϋ ^ ^ ^ for this preferred electronic component mounting device and a method for mounting the mounting device. SUMMARY OF THE INVENTION Hereinafter, a mounting apparatus and a mounting method will be described by way of examples. The mouth is connected to the mounting spindle by the device, which includes a feeding motor, a mounting spindle, and a mounting suction motor, and is used for connecting the spindle with the nozzle, and is provided with ^^^ The nozzle is rotated, and the nozzle is used for sucking and placing electronic components. The rotation angle of the sensing device and the main shaft is used for the fine mounting, and the spindle is transferred to the spindle. When the angle is predetermined, the sensing I...' is generated to cause the (four) motor to drive the mounting spindle to stop rotating according to the sensing signal. The method for mounting by the above-mentioned mounting device includes the steps f suction f, (the mounted circuit board and the electronic component to be mounted; the electronic component to be mounted by using the sticker yr; the feeding motor drives the mounting spindle to rotate When the vehicle rotates to a predetermined angle, the sensing device generates a sensing signal, and the servo motor stops the rotation of the nozzle according to the sensing signal; the mounting suction and the electronic component 70 are in contact with the circuit board to be mounted. Compared with the prior art, the mounting device and mounting method 1379489 of the present invention has the following advantages: First, the sensing device directly senses the rotation angle of the mounting spindle, and rotates the mounting spindle to a predetermined angle. The signal is transmitted back to the servo motor to stop the servo motor from rotating according to the sensing signal, thereby improving the rotation angle control precision, so that the electronic component and the mounting position with the fixed angle are more accurate, which can effectively avoid The scrapping and heavy work problems caused by the offset of the mounting position of the electronic components; secondly, the mounting device is compact, easy to disassemble and replace, and is convenient to use and can be used. The inspection and maintenance time is saved; again, the placement device is convenient to apply, and can be installed and used on the previous placement machine as long as the shape and size are slightly changed. [Embodiment] The technical solution will be described below with reference to the accompanying drawings and embodiments. The electronic component mounting device is further described in detail. Referring to Fig. 1, an embodiment of the present invention provides a mounting device 100 for mounting electronic components on a printed circuit board. The mounting device 1 includes fixing The frame 10, the servo motor 20, the coupling 30, the mounting spindle 40, the mounting nozzle 50, the protection spring 60, the sensing device 7〇, and the sleeve 8〇. The holder 10 includes a first receiving frame U and a first The second receiving frame 12. The 2-shaped receiving frame 11 has a shape corresponding to the servo motor 2A, and is used for receiving the word motor 2G. The shape and size of the second receiving frame 12 and the coupling 30' mounting spindle 40 corresponds to the housing 3 〇 and the partial mounting spindle 40. The servo motor 20 is used to drive the mounting spindle 4 for rotational movement. The servo motor 20 is composed of a stator 21 and a rotor 22, the stator 21 is opposite Fixed 1379489:-- The rotor 22 is connected by a coupling shaft to drive the mounting spindle 4 to rotate. $Axis 40 ^ Referring to Figures i, 2 and 3, the coupling is connected to the motor 20 and The main spindle 4G includes a guide == block 33. The guide posts 31 and 322 and the shoulder 32 are both cylindrical. The shoulder % is coaxial with the guide post ^, and the diameter of the shoulder 32 is larger than the guide post 31 bis strip-shaped rectangular body, which is oppositely disposed 丄 = the block 33 is long and the culprits are placed on the outer wall of the guide post 31, and the shoulders 32 are connected. The length of the two blocks is less than the guide The length of the column μ. In order to facilitate the connection of the coupling 3G (4), the motor Μ coupling has a first receiving hole % opened from the shoulder 32 to the inside of the column 31. The size of the first receiving hole 34 is matched with the size of the rotor motor 22, so that the rotor 22 can be coupled to the first hole 34, and the power of the rotor 22 can be transmitted to the coupling %. The shaft 30 transmits power to the mounting spindle 40. • Please - and referring to Figures i, 4 and 5, the mounting spindle step pumping 'in turn comprises a first shaft section 41, a second shaft section 42 and: a segment". wherein the first shaft section 41 The diameter of the second shaft section 42 is larger than the diameter of the third shaft section 43. The first shaft section 41 is for fixing and fixing with the coupling 3〇. The first recessed hole 44 is opposite to the guide post 31, and the two recesses 45 are opposite to each other on the two sides of the second receiving hole 44. The two blocks 33 correspond to each other. Thus, the sleeve 3 is engaged with the first shaft portion 41, and the guide post 31 can receive and fix the first receiving hole 44, and the two blocks 33 can be received and fixed to the two blocks. 33 causes the first shaft segment 41 and the evaluation is not rotatable relative to the coupling 30, so that the first shaft segment 41 and the coupling 30 are closely fixed, the first shaft segment 41 and the second shaft segment ^ There may be a shoulder 46, the shoulder 46 has a larger diameter than the first section. In the fourth example, the diameter of the shoulder 46 and the shoulder 32 are only provided by the protector. The spring 60 is a ring spring = spring 'for buffering the main load... The lower arm 42 is connected to the first shaft section 41 and the third shaft section 43 when the movement is performed and the electronic component is mounted. The sleeve 8G is provided so that the second shaft section 42 can be provided with two opposite key grooves 47 in the third shaft section 43 to fix the suction nozzle %. In the embodiment, the key groove 47 is a single circle. Head key slot., = and referring to Figures i, 6 and 7, the mounting nozzle 5 is used for suction: to be mounted: electronic components to mount electronic components on the circuit board. The mounting nozzle 5G The utility model has a substantially rectangular parallelepiped shape, and has a second end surface 52 opposite to the first end surface 51. The first end surface 51 is closely mounted to the main shaft 4 (). The second end surface 52 is away from the mounting spindle 4〇, and is an electronic component. Contacting to absorb the surface of the electronic component. In order to facilitate the connection and fixation of the third shaft segment 43 and the mounting nozzle 5〇, the power of the servo motor 20 is transmitted to the mounting nozzle 5〇, and the mounting nozzle 5 has a connecting hole. 53. A keyway hole 531 and a pin hole 532. The connection hole is opened inwardly from the first end 11 surface 51, and corresponds to the third key slot 3 of the third shaft segment 43. The keyway hole 53i 47 is matched to receive the single round head key (=, ° the keyway hole is tightly coupled with the keyway mounting nozzle 50: a: no, to achieve the mounting spindle 40 and the circumferential rotation. Heart = 50 relative to the mounting spindle + ± slave, * from the reverse pressing hole 53 and its axis is perpendicular to the axis of the connecting hole 53, (4) 53_ ^ line to prevent the mounting nozzle 5G from the relative mounting spindle 4 ( ^向=图 never never) The mounting nozzle 50 is matched with the mounting spindle 4. The heart can be fixed by the key and the pin. The mounting nozzle 50 also has the true position 55. The suction port 55 is self-reported. j milk official road 54 and sticking mouth r, ^ Β. 鳊 鳊 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 Connected to achieve vacuum adsorption of electronic components. Referring to Figures 1 and 8, the sensing sensor 7 includes an angle sensor 71 and an inductive sheet 72' for instantly sensing the angle of rotation of the mounting spindle 40: generating a sensing signal. The sensing device 7 is connected to 2〇 so that the rotation angle of the mounting spindle 4〇 can be controlled according to the sensing signal of the sensing device 7〇. The sensing piece 72 is fixed to the mounting spindle 4〇, and the angle sensor % sensing piece 72 is oppositely disposed. In the present embodiment, the angle sensor π is placed in the second receiving frame 12 of the fixing frame 1 , which is opposite to the first shaft 41 and 41 of the mounting spindle. The sensing piece 72 is opposite to the angle sensor 7i and is fixed to the shoulder 46 of the mounting spindle 40. And the sensing piece 72 is parallel to the axis of the mounting spindle 40. The angle sensing 1 71 includes two Hall sensors 73 that are arranged on the same horizontal line and are opposite to the sensing sheet 72. The Hall sensor 73 can measure the angle using the Hall effect. The Hall effect refers to the generation of a Hall voltage in a direction perpendicular to the current and the magnetic field of the semiconductor when the applied magnetic field is perpendicular to the current flowing through the semiconductor. The sensing piece 72 is a multi-pole magnetic ring that is fixed to the cylindrical outer wall of the shoulder. The cylindrical surface of the magnetic pole is provided with a plurality of south magnetic poles 74 and a plurality of south magnetic poles 75. When a certain north magnetic pole 74 or south magnetic pole 75 of the sensing piece 72 is turned to be opposite to the Hall sensor, and the Hall sensor 73 is perpendicular to the magnetic field generated by the north magnetic pole 74 or the south magnetic pole 75. When the Hall sensor 73 is located in the magnetic sensing region of the north magnetic pole 74 or the south magnetic pole 75, the Hall sensor 73 generates an induced voltage. The principle of the angle measurement by the sensing device 70 is as follows: First, the servo motor 20 drives the mounting spindle 4 to rotate, and the sensing piece 72 fixed to the shoulder pad rotates accordingly, so that the multi-pole magnetic ring generates a changing magnetic field. . The person sensor, the Hall sensor 73 senses a change in the strength of the magnetic field, and outputs a voltage pulse after shaping the internal circuit of the Hall sensor 73. For example, when the Hall sensor 73 senses the north magnetic pole 74, its output is high, and when the Hall sensor 73 senses the south magnetic pole 75, it outputs a low level, thereby forming a waveform between high and low phases. Figure. Again, since the two Hall sensors 73 are spatially dislocated, the rotating north magnetic pole 74 and the south magnetic pole 75 pass through the two Hall sensors 73 in sequence, so that there is a time difference between the magnetic field changes induced by the two Hall sensors 73. There is a time difference between the voltage pulses of the two outputs, and the waveform diagram formed by the two Hall sensors has a phase difference. Finally, according to the lead or lag of the voltage pulse phase in the waveform diagram, the rotation direction of the mounting spindle 4〇 can be judged, and the number of pulses in the single 13 1379489 bit time can be counted, and the arc of each magnetic pole corresponding to the rotation axis can be combined. The angular displacement was obtained, and the rotation angle of the mounting spindle 4〇 was calculated. Of course, other sensing devices with angular sensing capabilities can also be applied to the present technical solution. Since the mounting device 100 employs the sensing device 7 to instantly sense the rotation angle of the mounting spindle 40, the positional accuracy of the mounting nozzle 5〇 and the board is improved. • The following briefly describes the process of attaching the electronic component to be mounted to the circuit board to be mounted using the mounting device 100. The first step is to provide the circuit board to be mounted and the electronic component to be mounted. If the electronic components installed in the (4) package need to be rotated m, the mounted circuit board can be mounted. The mounting nozzle 50 picks up the component to be mounted. The second step utilizes the electronic components of the mounting device 100. The I spindle clock 20 drives the mounting spindle 40 to rotate, and when the mounting and the spindle ^ are rotated to a predetermined angle, the sensing device 7G generates a sensing signal. When the mounting spindle 40 rotates, the mounting spindle 72=2 will also rotate at the same time. The angle sensor 71 is rotated by the angle of the predetermined angle of the sensing blade. When the mounting spindle 4_ to the device 71 senses the rotation: ~5〇 also stops rotating. The shaft 40 stops rotating 'mounting nozzles' 79489. In the fifth step, the mounting nozzles 5 〇 drive the electronic components to be mounted into contact with the circuit board to be mounted for mounting. The servo motor 20 drives the mounting spindle 4 When the 吸 and the mounting nozzle 5 〇 move, the protective magazine 60 can buffer the impact force of the mounting spindle 4从而, thereby effectively preventing the mounting nozzle 50 from moving downward and contacting the circuit board to crush the electronic during the mounting process. The component can improve the placement rate of the electronic component. After the mounting is completed, the mounting spindle 40 can be returned to the original position, so as to pick up the next electronic component for mounting. Compared with the prior art, the sticker in the technical solution The mounting device and the mounting method have the following advantages: firstly, the sensing device directly senses the rotation angle of the mounting spindle, and transmits the signal back to the servo motor when the mounting spindle rotates to a predetermined angle to make the servo motor according to the sensing The signal stops rotating, which improves the accuracy of the rotation angle control', making the electronic components more accurate when placed at a certain angle of the mounting position, which can effectively avoid the placement of electronic components. The scrap and heavy work problems caused by the offset; secondly, the mounting device is compact, easy to disassemble and replace, and saves maintenance and repair time; again, the mounting device is convenient to apply, as long as the shape and size are slightly changed. It can be installed and used on the previous placement machine. The above-mentioned 'the invention has indeed met the requirements of the invention patent', the patent application is filed according to law. However, the above is only the preferred embodiment of the invention, and it cannot be This is to limit the scope of the patent application in this case. Any equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the scope of the following claims. [Simplified illustration] 15 1379489 2 is a schematic view of a mounting device of the mounting device of FIG. 1. FIG. 3 is a plan view of the coupling of the mounting device of FIG. 2. FIG. Figure 5 is a plan view of the mounting spindle of the mounting device of Figure 4. Figure 6 is a schematic view of the mounting nozzle of the mounting device of Figure 1. 6 is a top view of the mounting nozzle of the mounting device. Fig. 8 is a schematic view of the sensing device of the mounting device of Fig. 1.
【主要元件符號說明】 貼裝裝置 100 固定架 10 伺服馬達 20 聯軸器 30 貼裝主軸 40 貼裝吸嘴 50 保護彈簧 60 傳感裝置 70 軸套 80 第一收容架 11 第二收容架 12 定子 21 轉子 22 16 1379489 導向柱 31 . 凸肩 32 .卡塊 33 第一收容孔 34 第一轴段 41 第二轴段 42 第三轴段 43 第二收容孔 44 .·凹槽 45 轴肩 46 鍵槽 47 第一端面 51 第二端面 52 連接孔 53 鍵槽孔 531 鲁銷孔 532 真空抽氣管道 54 貼吸口 55 角度感測器 71 ’感應片 72 霍爾感測73 北磁極 74 南磁極 75 17[Main component symbol description] Mounting device 100 Fixing frame 10 Servo motor 20 Coupling 30 Mounting spindle 40 Mounting nozzle 50 Protection spring 60 Sensing device 70 Bushing 80 First receiving frame 11 Second receiving frame 12 Stator 21 Rotor 22 16 1379489 Guide post 31. Shoulder 32. Block 33 First receiving hole 34 First shaft section 41 Second shaft section 42 Third shaft section 43 Second receiving hole 44 · Groove 45 Shaft shoulder 46 Keyway 47 First end face 51 Second end face 52 Connection hole 53 Keyway hole 531 Lu pin hole 532 Vacuum suction pipe 54 Sticking suction port 55 Angle sensor 71 'Induction piece 72 Hall sensing 73 North magnetic pole 74 South magnetic pole 75 17