1377003 101年07月03日修正替換頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子系統散熱需求確認方法，特別指一 ^ 種可精確確認電子系統散熱需求的方法。 _ 【先前技術】 [0002] 目前，隨著電子系統如個人電腦、伺服器、投影儀等的 功率不斷提高，其散熱問題越來越受到重視。為此，需 要藉由檢測方法來確認特定電子系統的實際散熱需求， 從而確保電子系統工作于正常的溫度範圍内。 [0003] 常用的電子系統散熱需求確認方法為：在電子系統開發 階段，先將散熱模組按照一定的條件在生產線上測試； 然後，將藉由生產線測試的複數個如N個散熱模組放入電 子系統中進行程式測試，若測試均通過則將該等散熱模 組的散熱效能之製程管制上限（UCL，upper control limit)視為該電子系統的散熱需求。 [0004] 然而，上述電子系統散熱需求確認方法中以N個散熱模組 進行測試驗證，僅僅考量散熱模組的製程變異，卻未考 · 量電子系統製程變異所導致的單一電子系統散熱需求的 不同，如此，電子系統量產時將有散熱效能不符的風險 ，而影響電子產品的品質。 【發明内容】 [0005] 有鑒於此，有必要提供一種可精確確認電子系統散熱需 求的方法。 [0006] —種電子系統散熱需求確認方法，其所採用的設備包括 096151067 表單編號A0101 第4頁/共12頁 1013251812-0 13770031377003 Modified on July 3, 2003, page 6, invention description: [Technical Field] [0001] The present invention relates to a method for confirming heat dissipation requirements of an electronic system, and more particularly to a method for accurately confirming heat dissipation requirements of an electronic system . _ [Prior Art] [0002] At present, as the power of electronic systems such as personal computers, servers, projectors, etc. continues to increase, the problem of heat dissipation is receiving more and more attention. To this end, it is necessary to verify the actual heat dissipation requirements of a particular electronic system by means of detection methods to ensure that the electronic system operates within the normal temperature range. [0003] A commonly used electronic system cooling requirement confirmation method is: in the electronic system development stage, the heat dissipation module is first tested on the production line according to certain conditions; then, a plurality of heat dissipation modules such as N heat dissipation modules are tested by the production line. The program test is performed in the electronic system. If the test passes, the upper control limit (UCL) of the heat dissipation performance of the heat dissipation module is regarded as the heat dissipation requirement of the electronic system. [0004] However, in the above-mentioned electronic system heat dissipation requirement confirmation method, the test is verified by N heat dissipation modules, and only the process variation of the heat dissipation module is considered, but the heat dissipation requirement of the single electronic system caused by the variation of the electronic system process is not tested. Differently, when the electronic system is mass-produced, there will be a risk of inconsistent heat dissipation performance, which will affect the quality of electronic products. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a method for accurately confirming the heat dissipation requirements of an electronic system. [0006] A method for confirming the heat dissipation requirement of an electronic system, the device used therein includes 096151067 Form No. A0101 Page 4 / Total 12 Page 1013251812-0 1377003
101年07月03日修正替換頁 熱傳導分析軟體、經過檢測合格且具有風扇的散熱模組 以及一控制該風扇轉速的轉速控制裝置。該電子系統散 熱需求確認方法包括下列步驟： [0007] (1)將該散熱模組的風扇與外部的轉速控制裝置連接； [0008] (2)打開該電子系統，並藉由熱傳導分析軟體檢測該電子 系統的運行狀態，同時令該風扇運行； [0009] (3)藉由轉速控制裝置降低風扇的轉速，同時藉由熱傳導 分析軟體檢測該電子系統的運行狀態；當該電子系統仍 處於正常運行狀態時，重複本步驟即降低風扇的轉速直 至該電子系統關機，並記錄此時風扇的轉速，即風扇的 臨界轉速； [0010] (4)在開放的空間内令該風扇在上述臨界轉速運行的條件 下，檢測該散熱模組的熱阻，所獲得的熱阻值即為該電 子系統的散熱需求； [0011] (5)重複步驟（1)至（4)檢測出複數個電子系統的散熱需 φ 求Ri ; [0012] (6)藉由該熱傳導分析軟體對上述複數個電子系統的散熱 需求R i進行統計分析，計算出該等電子系統的散熱需求 Ri的平均值& 、標準偏差、標準曲線，進而獲得電子 系統散熱需求的管制下限。 [0013] 與習知技術相比，本發明的電子系統散熱需求確認方法 可檢測出電子系統散熱需求的管制下限，即電子系統製 程變異所產生的單一電子系統不同的散熱需求已經被考 096151067 表單編號A0101 第5頁/共12頁 1013251812-0 1377003 101年07月03日修正替換頁 量，如此，電子系統量產時散熱效能不足的風險大幅降 低，從而確保電子產品的品質。 【實施方式】 [0014] 下面參照附圖結合實施例對本發明作進一步說明。 ‘ [0015] 圖1所示為本發明一實施例中電子系統散熱需求確認方法 的主要流程。該電子系統散熱需求確認方法所採用的設 備包括具有熱傳導分析軟體的電子系統如筆記型電腦、 經過檢測合格且具有風扇的散熱模組以及一控制該風扇 轉速的轉速控制裝置。 | [0016] 該電子系統散熱需求確認方法主要包括下列步驟： [0017] (1)將該散熱模組的風扇與外部的轉速控制裝置連接； [0018] (2)打開該電子系統，並藉由熱傳導分析軟體檢測該電子 系統的運行狀態，同時令該風扇運行； [0019] (3)藉由轉速控制裝置降低風扇的轉速，同時藉由熱傳導 分析軟體檢測該電子系統的運行狀態；當該電子系統仍 處於正常運行狀態時，重複本步驟即降低風扇的轉速直 · 至該電子系統關機，並記錄此時風扇的轉速，即風扇的 臨界轉速； [0020] (4)在開放的空間内並令該風扇在上述臨界轉速運行的條 件下，以傳統的方法檢測該散熱模組的熱阻，所獲得的 熱阻值Ri即為該電子系統的散熱需求； [0021] (5)重複步驟（1)至⑷檢測出複數個電子系統的散熱需 求Ri ;優選地，可以35個電子系統為例，檢測出該35個 1013251812-0 096151067 表單編號A0101 第6頁/共12頁 1377003 「 __^ 101年07月03日修正替換頁' .. 電子系統各自的散熱需求Ri ; 〇 [0022] (6)藉由該熱傳導分析軟體對35個電子系統的散熱需求Ri . 進行統計分析，計算出該35個電子系統的散熱需求Ri的 平均值瓦·、標準偏差、標準曲線，進而獲得電子系統散 熱需求的管制下限（LCL， lower control limit)， 如圖2所示。 [0023] 藉由上述方法可檢測出電子系統散熱需求的管制下限， 即電子系統製程變異所產生的單一電子系統不同的散熱 需求已經被考量’如此’電子系統量產時散熱效能不足 的風險大幅降低，從而確保電子產品的品質。 [0024]Corrected replacement page on July 3, 2011 Thermal conduction analysis software, a qualified cooling module with a fan, and a speed control device that controls the speed of the fan. The method for confirming the heat dissipation requirement of the electronic system includes the following steps: [0007] (1) connecting the fan of the heat dissipation module to an external speed control device; [0008] (2) opening the electronic system and detecting by using a heat conduction analysis software The operating state of the electronic system simultaneously causes the fan to operate; [0009] (3) reducing the rotational speed of the fan by the rotational speed control device, and detecting the operating state of the electronic system by the thermal conduction analysis software; when the electronic system is still in the normal state In the running state, repeat this step to reduce the fan speed until the electronic system is shut down, and record the fan speed at this time, that is, the critical speed of the fan; [0010] (4) in the open space, let the fan at the above critical speed Under the operating conditions, the thermal resistance of the heat dissipation module is detected, and the obtained thermal resistance value is the heat dissipation requirement of the electronic system; [0011] (5) Repeating steps (1) to (4) to detect a plurality of electronic systems The heat dissipation needs to be φ to obtain Ri; [0012] (6) statistically analyzing the heat dissipation requirement R i of the plurality of electronic systems by the heat conduction analysis software, and calculating the dispersion of the electronic systems The average value of the demand Ri &, standard deviation, standard curve, and thus obtain the lower limit of the cooling needs of electronic control systems. [0013] Compared with the prior art, the electronic system heat dissipation requirement confirmation method of the present invention can detect the lower limit of the heat dissipation requirement of the electronic system, that is, the different heat dissipation requirements of the single electronic system generated by the electronic system process variation have been tested 096151067 No. A0101 Page 5 of 12 1013251812-0 1377003 On July 3, 101, the replacement page quantity was corrected. As a result, the risk of insufficient heat dissipation during mass production of the electronic system was greatly reduced, thereby ensuring the quality of electronic products. [Embodiment] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings. [0015] FIG. 1 is a main flow chart of a method for confirming a heat dissipation requirement of an electronic system according to an embodiment of the present invention. The electronic system cooling demand confirmation method includes an electronic system having a heat conduction analysis software such as a notebook computer, a qualified heat dissipation module having a fan, and a rotation speed control device for controlling the rotation speed of the fan. [0016] The electronic system heat dissipation requirement confirmation method mainly includes the following steps: [1] (1) connecting the fan of the heat dissipation module to an external rotation speed control device; [0018] (2) opening the electronic system and borrowing Detecting the operating state of the electronic system by the thermal conduction analysis software while allowing the fan to operate; [0019] (3) reducing the rotational speed of the fan by the rotational speed control device, and detecting the operating state of the electronic system by the thermal conduction analysis software; When the electronic system is still in normal operation, repeat this step to reduce the fan speed until the electronic system is shut down, and record the fan speed at this time, that is, the critical speed of the fan; [0020] (4) In the open space And the fan is used to detect the thermal resistance of the heat dissipation module under the condition of the above critical speed operation, and the obtained thermal resistance value Ri is the heat dissipation requirement of the electronic system; [0021] (5) Repeating steps (1) to (4) detecting the heat dissipation demand Ri of the plurality of electronic systems; preferably, 35 electronic systems can be taken as an example to detect the 35 1013251812-0 096151067 form number A0101 page 6 / Total 12 pages 1377003 " __^ Corrected replacement page on July 03, 101 '.. The respective heat dissipation requirements of the electronic system Ri; 〇 [0022] (6) The heat dissipation requirement of the 35 electronic systems by the thermal conduction analysis software Ri Perform statistical analysis to calculate the average wattage, standard deviation, and standard curve of the heat dissipation demand Ri of the 35 electronic systems, and then obtain the lower control limit (LCL, lower control limit) of the electronic system cooling demand, as shown in FIG. [0023] The above-mentioned method can detect the lower limit of the heat dissipation requirement of the electronic system, that is, the different heat dissipation requirements of the single electronic system generated by the variation of the electronic system process have been considered to be the risk of insufficient heat dissipation during mass production of the electronic system. Greatly reduced to ensure the quality of electronic products. [0024]
[0025] 096151067 在上述步驟基礎之上’可進一步藉由傳統的方法檢測出 散熱模組散熱效能之製程管制上限（UCL, upper eontrol limit) ’並將電子系統散熱需求的管制下限 與該散熱模組散熱效能之製程管制上限進行對比，以衡 1散熱模組能否滿足電子系統的散熱需求，並可衡量能 否可以降低散熱模組成本。 如圏2所不’該散熱模組散熱效能之製程管制上限必須位 於該電子系統散熱需求管制下限的下面，這由於特定的 散熱镇組即使因製程變異導致散熱性能降低，亦要滿足 電子系統最大發熱量時的散熱需求。當該電子系統散熱 ^求言制下限遠大於該散熱模組散熱效能之製程管制上 可以降低散熱模組的成本，即：此時散熱模組的 I、4· &遠大於電子系統的散熱需求，可藉由降低散熱 散熱能力來降低散熱模組的成本。 表單塢號A0101 « 弟 7 頁/共 12 頁 1013251812-0 1377003 101年07月03日修正替換頁 [0026] 如此一·來，雖然會使散熱模組散熱效能之製程管制上限 b 與該電子系統散熱需求的管制下限接近，只要該散熱模 組散熱效能之製程管制上限位於該電子系統散熱需求的 管制下限的下面即可。 · [0027] 综上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 φ [0028] 下面參照附圖結合實施例作進一步描述： [0029] 圖1係本發明一實施例中電子系統散熱需求確認方法的流 程示意圖。 [0030] 圖2係利用圖1中方法獲得的電子系統散熱需求的管制下 限與散熱模組的散熱效能之製程管制上限比較圖。 【主要元件符號說明】 096151067 表單編號A0101 第8頁/共12頁 1013251812-0[0025] 096151067 Based on the above steps, the UCL (upper eontrol limit) can be further detected by a conventional method, and the lower limit of the heat dissipation requirement of the electronic system and the heat dissipation mode are The upper limit of the process control of the heat dissipation performance is compared to determine whether the heat dissipation module can meet the heat dissipation requirements of the electronic system, and whether the cost of the heat dissipation module can be reduced. If the process control limit of the heat dissipation performance of the heat dissipation module must be below the lower limit of the heat dissipation requirement of the electronic system, the heat dissipation performance of the specific heat dissipation group may be reduced even if the heat dissipation performance is reduced due to process variation. Heat dissipation requirements when generating heat. When the heat dissipation of the electronic system is far greater than the process control of the heat dissipation performance of the heat dissipation module, the cost of the heat dissipation module can be reduced, that is, the heat dissipation module I, 4· & is much larger than the heat dissipation of the electronic system. Demand can reduce the cost of the thermal module by reducing the heat dissipation capability. Form Dock A0101 « Brother 7 Pages / Total 12 Pages 1013251812-0 1377003 Correction Replacement Page [0026] on July 03, 101 This is the process control upper limit b of the heat dissipation module of the heat dissipation module and the electronic system. The lower control limit of the heat dissipation requirement is close to the above, as long as the process control upper limit of the heat dissipation performance of the heat dissipation module is below the lower control limit of the heat dissipation requirement of the electronic system. [0027] In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0029] FIG. 1 is a flow chart showing a method for confirming a heat dissipation requirement of an electronic system according to an embodiment of the present invention. 2 is a comparison diagram of a process control upper limit of the heat dissipation requirement of the electronic system obtained by the method of FIG. 1 and the heat dissipation performance of the heat dissipation module. [Main component symbol description] 096151067 Form No. A0101 Page 8 of 12 1013251812-0