1374694 3l309twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於-種電路板模組，且特別是有關於 種具有絕緣結構的電路板模組。 【先前技術】 在設計電源供應器或相關裝置時，為符合安全規格（例 如：UL Standa⑷㈣範以及確保電源供應器能正常運 作，通常需考量電源供應器内部電路板上的各個電子 之間的絕緣等級。例如：設計者需考量兩相鄰電子元件之 間的安規距離（safety dista職），其包括沿面距離（c 及空間距離（dear_ dlst_)，以藉‘ 免電子兀件之間導通而導致電性短路，並防止由導腳輸入 之瞬間尚電壓直接跳越至低壓端，而危害使用者安全。’ 然^當現今電源供應器朝向小型化的潮流而ς行設 為了達到空間極小化的要求卻必須將電路板上 子兀=之_距_縮脑，此時設計者到+ 子元件的配额安全規m的輯衝突。 至u 【發明内容】 本發明提供—種電路板模組，其巾 件之間具有完全絕緣的絲。 _板上的元 本發明的一實施例提出—種用於電源 板模組，包括電路板、多個電子元件以及絕緣=的電路 • — ~ —— 丄 d M694 -51309twf.doc/n . 板具有相對的第一面與第二面。電路板具有貫穿槽，貫穿 槽貫穿，路板並連接第-面與第二面。電子元件配置在電 ，板的第-面上，且貫穿槽位於兩減的好元件之間。 絕緣結構包括底板與隔板。底板組裝在電路板的第二面 上。隔板立於底板表面並朝向電路板延伸。隔板穿過電路 板的貫穿槽並隔離兩相鄰的電子元件。 ，本發明之—實關巾，上述之隔板相對於電路板的 咼度大於兩栢鄰電子元件相對於電路板的高度。 在本剌m财，電路㈣& 勾’3= 爾。、節卡料電路；^ 在本發明之一實施例中， 件，配置在底板盥電路板之n 、、'，更匕括夕個間隔 距離。 、電路板之間’以使電路板與底板保持- 在本發明之一實施例中，泰 勾，配置在絲鱗。輯结構更包括多個卡 ,在树批—纽财，路板上。 p -------:：ί^ 在本發明之一實施例今， 的結構。 a之絕緣結構為一體成型 在本發明之一實施例中， 側與二次側，電子元件包括相鄰ί八:=應器具有-次 側的苐一電子元件與第二♦刀別位於—次側與二次 電子元件與第二電子元件二兀*1 ，而隔板用以隔離第— 1374694 31309twf.doc/n ，於上述，在本發⑽上述實施财，藉由絕緣結構 自電路板的第二面穿過貫穿槽而隔離位於電路板第一面的 兩相鄰電子元件，使電路板的電子元狀間達到絕緣的效 果’亚使電路板歡目有效的空間彻而具雜小的體積。 —為讓本發明之上述賴和優點缺购祕，下文)寺 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖1是依照本發明一實施例之—種電路板模組的示意 圖。圖2是圖1之電路板模組於另一視角的示意圖。請同 時參考圖1及® 2’電路板模組⑽狀—電源供應器（未 繪不），此電路板模組1〇〇包括一電路板11〇、多個電子 元件120、160以及一絕緣結構13〇。 圖3疋圖1之電路板模組中電路板與電子元件的示意 圖。圖4是圖1之電路板模組中絕緣結構的示意圖。請同 j考圖3及圖4,電路板11G具有相對的-第-面S1與 二=一面S2，且電路板11〇亦具有多個貫穿槽112，這些 二牙槽112貫穿電路板11〇並連接第一面81與第二面s2。 電子兀件120、160配置在電路板11〇的第一面S1上，且 上述這些貫穿槽112位於兩相鄰的電子元件12〇、16〇之 間。絕緣結構130包括一底板132與多個隔板134。底板 132組裝在電路板11〇的第二面S2上。隔板134立於底板 132表面並朝向電路板11〇延伸，且隔板134會穿過電路 板110的貫穿槽112並隔離兩相鄰的電子元件12〇、16〇。 1374694 3I309twf.doc/n . 基於上述，在本實施例中的電路板模組100，其藉由 位於兩相鄰的電子元件120、160之間的隔板134，而增加 兩相鄰電子元件120、160之間的安規距離，因而隔板134 能對此兩相鄰的電子元件120、16〇產生絕緣的效果。另一 方面，當絕緣結構130組裝至電路板11〇時，此隔板134 是從電路板110的第二面S2穿過貫穿槽U2而突出於電 路板110的第一面S1之上。此舉使電路板模組1〇〇能因 有效的空間利用率而減少體積，其在組裝上亦能有效地簡 W 化組裝工序。 此外，電源供應益具有一次側與二次側，而本實施例 的隔板134亦可用於隔離分別位於電源供應器之一次側與 二次側的電子元件。在此以圖1的電路板模组 了 其中位於-雜⑽一電子元件16〇例如是電二:擾 (electromagnetic mterference，EM1)濾波器、整流元件與儲 • 能元件（例如電容及電感）等，以作為電流自電源輸[端 ^ (未繪示）傳遞至變壓11 (未繪示）之前的相關元件。另 • 外’位於二次側A2的第二電子元件⑽例如是整流淚波 元件、電壓調整元件與儲能元件等，以作為電流自變壓器 傳遞至電源输出端（未繪示）的相關元件。 為了避免位於-次側A1的第—電子元件16〇與位於 一次側A2的第一電子元件120因鬲、低電壓差距而可能 產生的放電效應導致元件120、160損壞，在本實施例中二 隔板134即用以隔離一次側A1與二次侧A2的第一電子元 件160與第二電子元件120,其目的即在增加電=元 1374694 31309twf.doc/n 120、160之間的安規距離以避免損壞。 請再參考圖1，在本實施例的電路板模組1〇〇中，隔 板134相對於電路板11〇的高度H1大於兩相鄰電子元: 120相對於電路板11〇的高度H2。此舉確保兩相鄰電子元 件120能被隔板134有效地隔離，以藉此增加兩相鄰電子 凡件12〇之間的安規距離，以避免通電後的電子元件120 或160因沿面放電而造成電子元件12〇或16〇損壞。在本 實施例中，隔板134以塑膠材質製成，亦可以其他絕緣材 料製作，本實施例並未對此進行限制。 請再參考圖4，在本實施例中，電路板模組1〇〇更包 括多個卡勾140與多個間隔件150。卡勾14〇配置在底板 132的周緣，以使絕緣結構130藉由這些卡勾14〇而卡掣 於電路板110上。惟本實施例並未限定電路板11〇與絕緣 結構130之間的卡固結構，任何能將絕緣結構13〇卡固於 電路板110上的結構皆適用於本實施例。 再者，睛同時參考圖2及圖4 ,間隔件150配置在底 板132與電路板11〇之間，以使電路板11〇與底板132保 持一距離L，藉此容納電子元件丨2〇、16〇位於電路板11〇 的第二面S2的接腳。另外，值得一提的是，由於隔板134 疋立於底板132上並朝向電路板11〇延伸，因此容納在電 路板110與底板132之間的這些電子元件12〇、16〇的接腳 亦能藉由隔板134而達到絕緣的效果。 此外，本實施例的絕緣結構13〇亦可將底板132、隔 板134、卡勾140與間隔件15〇統整製作成一體成型的結 313〇9twf.doc/n =節省電路板模組⑽的製造工序並能更方便地進行 位於發明之電路板模組與電源供應器，其中 之間=:===兩相鄰， 使電路板模組與電祕應器能符 絶緣’ 作用的隔板是自電路板的第 貝牙槽而隔離兩相鄰之電子元件， _ 組步路板弟—面的接腳，而卡勾則是#絕緣結構 田I至a路板上時提供電路板與絕緣結構之間的卡固作 分皆板第-面與第二面的部 雖然本發明已以實施例揭露如上，然其並非用以 本發明，任何所屬技術領域巾具有財知識者，在 本發明之精神和範圍内，當可作些許之更動與潤饰， 發明之保護範圍當視後附之申請專利範圍所界定者為準。 圖式簡單說明】 種電路板模組的示意 圖1是依照本發明一實施例之一 圖 1374694 31309twf.doc/n 圖2是圖1之電路板模組於另一視角的示意圖。 圖3是圖1之電路板模組中電路板與電子元件的示意 圖。 圖4是圖1之電路板模組中絕緣結構的不意圖。 【主要元件符號說明】 100 :電路板模組 110 :電路板 112 :貫穿槽 120 :第二電子元件 130 .絕緣結構 132 :底板 134 •隔板 140 :卡勾 150 :間隔件 160 :第一電子元件 A1 一次側 A2 二次側 H1、 H2 :高度 S1 ： 第一面 S2 ： 第二面1374694 3l309twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a circuit board module, and more particularly to a circuit board module having an insulating structure. [Prior Art] When designing a power supply or related device, in order to comply with safety specifications (for example, UL Standa (4) (4) and to ensure that the power supply can operate normally, it is usually necessary to consider the insulation between the various electronic circuits on the internal circuit board of the power supply. Level. For example, the designer needs to consider the safety distance between two adjacent electronic components (safety dista), including the creeping distance (c and spatial distance (dear_ dlst_), to lead to the conduction between the electronic components. Electrical short circuit, and prevent the voltage from being directly jumped to the low voltage end by the input of the lead pin, which is harmful to the user's safety. 'When the current power supply is facing the trend of miniaturization, it is set to achieve space minimization. The requirement is that the board must be _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ There is a completely insulated wire between the napkins. _ On-board element An embodiment of the invention is proposed for a power board module, including a circuit board and a plurality of electronic components. Insulation = circuit • — —— 丄d M694 -51309twf.doc/n . The board has opposite first and second sides. The circuit board has a through slot, through which the slot runs, and the board connects the first side and the first The electronic component is disposed on the first surface of the board, and the through slot is located between the two components of the subtraction. The insulating structure includes a bottom plate and a partition plate. The bottom plate is assembled on the second surface of the circuit board. Extending on the surface of the bottom plate and facing the circuit board. The partition plate passes through the through slot of the circuit board and isolates two adjacent electronic components. In the present invention, the thickness of the partition plate relative to the circuit board is greater than two cypresses. The height of the adjacent electronic component relative to the circuit board. In the present invention, the circuit (4) & the hook '3 = er., the card loading circuit; ^ In one embodiment of the invention, the component is disposed in the bottom plate 盥 circuit board n , , ', more than a distance, between the boards to keep the circuit board and the bottom plate - in one embodiment of the invention, the Thai hook, configured in the wire scale. Card, in the tree batch - New Finance, road board. p -------:: ί^ in this The structure of one embodiment of the present invention. The insulating structure of a is integrally formed in one embodiment of the present invention, the side and the secondary side, and the electronic component includes an adjacent one: the first side of the electronic device The component and the second yoke are located at the secondary side and the secondary electronic component and the second electronic component 兀*1, and the spacer is used to isolate the first 1374694 31309 twf.doc/n, as described above in the present invention (10) The insulation structure is used to isolate two adjacent electronic components located on the first side of the circuit board through the through-groove from the second side of the circuit board, so as to achieve an insulating effect between the electronic components of the circuit board. The effective space is completely small and has a small volume. - In order to make the above-mentioned advantages and disadvantages of the present invention lack, the following examples are given in detail, and are described in detail below with reference to the drawings. [Embodiment] FIG. 1 is a schematic view of a circuit board module in accordance with an embodiment of the present invention. 2 is a schematic view of the circuit board module of FIG. 1 from another perspective. Please refer to FIG. 1 and FIG. 2' circuit board module (10)-power supply (not shown). The circuit board module 1 includes a circuit board 11 〇, a plurality of electronic components 120, 160 and an insulation. Structure 13〇. Figure 3 is a schematic view of a circuit board and electronic components in the circuit board module of Figure 1. 4 is a schematic view of an insulating structure in the circuit board module of FIG. 1. Referring to FIG. 3 and FIG. 4, the circuit board 11G has opposite-first-surface S1 and two-side S2, and the circuit board 11A also has a plurality of through slots 112, and the two sockets 112 extend through the circuit board 11 And connecting the first surface 81 and the second surface s2. The electronic components 120, 160 are disposed on the first surface S1 of the circuit board 11A, and the through slots 112 are located between two adjacent electronic components 12A, 16B. The insulating structure 130 includes a bottom plate 132 and a plurality of partitions 134. The bottom plate 132 is assembled on the second surface S2 of the circuit board 11''. The spacer 134 stands on the surface of the bottom plate 132 and extends toward the circuit board 11, and the spacer 134 passes through the through slot 112 of the circuit board 110 and isolates two adjacent electronic components 12, 16A. 1374694 3I309twf.doc/n. Based on the above, in the circuit board module 100 of the present embodiment, two adjacent electronic components 120 are added by a spacer 134 located between two adjacent electronic components 120, 160. The safety distance between 160 and 160, so that the spacer 134 can have an insulating effect on the two adjacent electronic components 120, 16A. On the other hand, when the insulating structure 130 is assembled to the circuit board 11, the spacer 134 protrudes from the second surface S2 of the circuit board 110 through the through slot U2 to protrude above the first surface S1 of the circuit board 110. This allows the board module 1 to be reduced in size due to efficient space utilization, and it can also be effectively assembled in assembly. Further, the power supply has advantages of the primary side and the secondary side, and the spacer 134 of this embodiment can also be used to isolate electronic components respectively located on the primary side and the secondary side of the power supply. Here, the circuit board of FIG. 1 is configured such that the electronic component 16 is, for example, an electromagnetic mterference (EM1) filter, a rectifying component, and a memory component (such as a capacitor and an inductor). , as the current is transmitted from the power supply [terminal ^ (not shown) to the relevant components before the transformer 11 (not shown). The second electronic component (10) on the secondary side A2 is, for example, a rectifying tear wave element, a voltage adjusting element, an energy storage element, or the like, as a related element that is transmitted from the transformer to a power supply output terminal (not shown). In order to avoid damage to the components 120, 160 caused by the discharge effect of the first electronic component 16 位于 on the primary side A1 and the first electronic component 120 located on the primary side A2 due to a low voltage difference, in the present embodiment, The partition 134 is used to isolate the first electronic component 160 and the second electronic component 120 of the primary side A1 and the secondary side A2, and the purpose thereof is to increase the safety distance between the electric=1374694 31309twf.doc/n 120, 160. To avoid damage. Referring to FIG. 1, in the circuit board module 1 of the embodiment, the height H1 of the spacer 134 relative to the circuit board 11 is greater than the height H2 of two adjacent electronic components: 120 with respect to the circuit board 11A. This ensures that two adjacent electronic components 120 can be effectively isolated by the spacers 134, thereby increasing the safety distance between two adjacent electronic components 12〇 to prevent the electronic components 120 or 160 after the energization from being discharged by creeping surface. Causes the electronic component 12 or 16 〇 to be damaged. In the present embodiment, the spacer 134 is made of a plastic material, and may be made of other insulating materials, which is not limited in this embodiment. Referring to FIG. 4 again, in the embodiment, the circuit board module 1 further includes a plurality of hooks 140 and a plurality of spacers 150. The hooks 14 are disposed on the periphery of the bottom plate 132 so that the insulating structure 130 is caught on the circuit board 110 by the hooks 14 . However, the embodiment does not limit the fastening structure between the circuit board 11 and the insulating structure 130. Any structure capable of clamping the insulating structure 13 to the circuit board 110 is applicable to the embodiment. Furthermore, referring to FIG. 2 and FIG. 4 at the same time, the spacer 150 is disposed between the bottom plate 132 and the circuit board 11 , so that the circuit board 11 保持 is kept at a distance L from the bottom plate 132, thereby accommodating the electronic component 〇2〇, 16〇 is located at the pin of the second side S2 of the circuit board 11〇. In addition, it is worth mentioning that since the spacer 134 stands on the bottom plate 132 and extends toward the circuit board 11 , the pins of the electronic components 12 〇 and 16 容纳 between the circuit board 110 and the bottom plate 132 are also The insulation effect can be achieved by the partition 134. In addition, the insulating structure 13 of the embodiment can also form the bottom plate 132, the partition plate 134, the hook 140 and the spacer 15 into a integrally formed knot 313〇9twf.doc/n=saving the circuit board module (10) The manufacturing process can more conveniently carry out the circuit board module and the power supply device in the invention, wherein ===== two adjacent, so that the circuit board module and the electric secret device can be insulated. The board is the first bayonet slot of the circuit board to isolate two adjacent electronic components, the _ group step board-side pin, and the hook is the #insert structure I to a board when the board is provided The present invention has been disclosed in the above embodiments, but it is not used in the present invention, and any technical field in the art has financial knowledge. In the spirit and scope of the present invention, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a circuit board module according to an embodiment of the present invention. FIG. 1 is a schematic diagram of a circuit board module of FIG. 3 is a schematic view of a circuit board and electronic components in the circuit board module of FIG. 1. 4 is a schematic view of an insulating structure in the circuit board module of FIG. 1. [Main component symbol description] 100: circuit board module 110: circuit board 112: through slot 120: second electronic component 130. insulation structure 132: bottom plate 134; spacer 140: hook 150: spacer 160: first electronic Element A1 Primary side A2 Secondary side H1, H2: Height S1: First side S2: Second side