六、發明說明： 【發明所屬之技術領域】 本發明係關於一種基板分裂裝置及其使用之基板分裂方 法；具體而言，本發明係關於一種玻璃基板分裂裝置及其使用 之玻璃基板分裂方法。 【先前技術】 玻璃板材、有機聚合物板材及其他各式板材係廣泛應用於 液晶平面顯示裝置及其他平面顯示裝置中。板材之應用係包含 作為薄膜電晶體之基板、作為一般電路之基板、作為光學元件 或其他之應用。為配合不同尺寸之顯示裝置生產，需將整塊之 板材裁切成各種不同之尺寸。此外，在進行板材裁切時需考慮 各式板材之材料性質’並兼顧裁切後之板材結構強度，以確保 產品之良率。 以玻璃基板之裁切為例。圖丨所示為傳統對玻璃基板進行 裁切之機台設備示意圖。如圖1所示，裁切機台包含有台面 70。台面70上係由流片輸送設置載入玻璃基板2〇。機台7〇 上並架設一支架30。支架30下方則掛設有基板裂塊50。基板 裂塊50係可相對於支架3〇上下移動，並對應於玻璃基板2〇 底面之一預裂紋(未繪示）。基板裂塊之上方係設有一錘擊 裝置，當錘擊裝置向下擊落時，基板裂塊5〇即向下移動，並 錘擊玻璃基板20頂面上相對於預裂紋之位置。此時玻璃基板 2〇則自預裂紋之橫切方向裂開並分為兩半，以達到切割玻璃 基板20之目的。 1373458 然而在此-切财式巾，_轉使基板裂塊知產生之速 度較快，因此容易造成玻璃基板2〇之破裂。未減少破片之狀 況，需將賴紋之深度加深。然而預裂紋之位置係為未來切割 完成後玻璃基板20之邊緣所在。於加深預裂紋時，由於其加 工方式係狀玻璃基板2G之結構造成影響，鼠同時會影響 切割後玻璃基板之邊緣結構強度。 曰 【發明内容】 • 本發明之一目的在於提供一種基板分裂裝置及其使用方 法，供提升分割後基板邊緣之結構強度。 本發明之Ρ目的祕提供—錄板分魏置及其使用方 法，可提升產品之良率。 ' 本發—㈣在於提供-縣板分裂裝置及其使用方 . 法’可配合較薄基板之切割製程。 基板分裂裝置包含飼服馬達、傳動裝置、基板愿裂塊及機 纟。其中機台具有-機台台面’做馬達、傳動裝置及基板壓 • 聽均設置於機台“上方。傳練置之—職直接或間接連 接於伺服騎’供馳馬達之動力。基板縣塊係直接或 間接連接於傳動裝置之另1，台之機台台面係相對於基板 壓裂塊且祠服馬達係藉由傳動裝置驅動基板壓裂塊朝向機台 台面移動。基板係設置於機台台面上，且其底面係形成有預裂 紋。基板壓裂塊之延伸方向係與預裂紋相同，且触馬達係驅 動基板壓裂塊在朝向或遠離預裂紋之方向上移動。 本發明之基板分裂方式係包含下列步驟：首先於基板上形 5 成預裂紋。接著控制伺服馬達驅動基板壓裂塊朝基板移動。最 後控制基板壓裂塊自預裂紋對應位置壓迫基板4中词服馬達 ，姐步驟-係—包^當基板壓裂塊於不同行程位置時，等、變伺％^ Q之驅，度义及藉由壓力感測裝置偵測基板之頂面位 以決定改變伺服馬達速度之位置。此外，基板壓迫步驟包含藉 由壓力感測裝置感測基板壓裂塊上之壓力值；當壓力值到達一 預設壓力值時，即停止基板壓裂塊之前進。 【實施方式】 本發明係提供一種基板分裂裝置及其使用之基板分裂方 法。此處所言之基板係較佳係為平面顯示裝置基板；然而在不 同實施例中，基板亦可為電路基板、晶圓基板及其他各式基 板。此外，在較佳實施例中，基板之材質係為玻璃材質；然而 在其他實施例中，基板亦可以有機樹脂或其他不同材質所形 成。 r 在圖2所示之實施例中’基板分裂裝置包含伺服馬達1〇〇、 傳動裝置300、基板壓裂塊500及機台700。其中機台700具 有一機台台面710 ’而伺服馬達1〇〇、傳動裝置3⑻及基板壓 裂塊500均設置於機台台面710上方。伺服馬達1〇〇較佳係指 ____ _ 秦. 得控制速度或驅動路徑之馬達100,其種類包<@伺服馬) 達、變速伺服馬達、直流伺服馬達、交流伺服馬達及其他型式 之伺服馬達。 如圖2所示，傳動裝置300之一端係直接或間接連接於伺 服馬達100，供輸出伺服馬達1〇〇之動力。在圖2所示之實施 1373458 例中’傳動裝置300具有動力輸入端3i〇及動力輸出端330， 其中動力輸入端310係直接或間接連接於伺服馬達1〇〇。伺服 馬達100包含有轉動螺桿110，而傳動裝置3〇〇之動力輸入端 310没有相應之螺孔。螺孔係套合轉動螺桿11〇。當轉動螺桿 110轉動，並同時限制動力輸入端31〇不作相應之旋轉時，即 可驅動傳動裝置300沿轉動螺桿n〇軸向之方向產生位移。[Technical Field] The present invention relates to a substrate splitting apparatus and a substrate splitting method therefor; and more particularly to a glass substrate splitting apparatus and a glass substrate splitting method therefor. [Prior Art] Glass sheets, organic polymer sheets, and various other types of sheets are widely used in liquid crystal flat display devices and other flat display devices. The application of the sheet material includes a substrate as a thin film transistor, a substrate as a general circuit, an optical element, or the like. In order to match the production of display devices of different sizes, it is necessary to cut the entire piece of sheet into various sizes. In addition, the material properties of each type of sheet should be considered when cutting the sheet, and the structural strength of the sheet after cutting should be taken into consideration to ensure the yield of the product. Take the cutting of the glass substrate as an example. Figure 丨 shows a schematic diagram of a conventional machine for cutting a glass substrate. As shown in Figure 1, the cutting machine includes a table top 70. The table top 70 is loaded onto the glass substrate 2 by a sheet transport setting. A bracket 30 is mounted on the machine 7 。. A substrate split 50 is hung below the bracket 30. The substrate crack 50 is movable up and down with respect to the holder 3, and corresponds to one of the bottom surfaces of the glass substrate 2 (not shown). A hammering device is disposed above the substrate block. When the hammer device is shot down, the substrate block 5 is moved downward, and the position of the top surface of the glass substrate 20 relative to the pre-crack is hammered. At this time, the glass substrate 2 裂 is split from the transverse direction of the pre-crack and is divided into two halves for the purpose of cutting the glass substrate 20. 1373458 However, in this case, the cut-off of the substrate is known to be faster, and thus the glass substrate 2 is easily broken. If the fragmentation is not reduced, the depth of the smear should be deepened. However, the position of the pre-crack is the edge of the glass substrate 20 after the completion of the future cutting. When the pre-crack is deepened, the effect of the structure of the glass substrate 2G is affected, and the rat also affects the edge structure strength of the glass substrate after cutting. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate splitting apparatus and a method of using the same for improving the structural strength of a substrate edge after division. The secret of the present invention is provided by the secret board, which can be used to improve the yield of the product. 'This issue—(4) is to provide a - county plate splitting device and its user. The method can be combined with the cutting process of a thinner substrate. The substrate splitting device includes a feeding motor, a transmission, a substrate splitting block, and a casing. Among them, the machine has a machine table top to make the motor, transmission and substrate pressure. The sound is set on the top of the machine. The transmission is directly or indirectly connected to the servo rider. Directly or indirectly connected to the other of the transmission device, the table top of the table is opposite to the substrate fracturing block and the motor is driven by the transmission device to drive the substrate fracturing block toward the machine table. The substrate is set on the machine table. a pre-crack is formed on the top surface of the mesa, and the substrate fracturing block extends in the same direction as the pre-crack, and the contact motor drive substrate fracturing block moves in a direction toward or away from the pre-crack. The method comprises the following steps: firstly forming a pre-crack on the substrate, and then controlling the servo motor to drive the substrate fracturing block to move toward the substrate. Finally, the control substrate fracturing block presses the vocal motor in the substrate 4 from the corresponding position of the pre-crack. - system - package ^ when the substrate fracturing block is in different stroke positions, etc., change the servo drive, determine the top surface of the substrate by pressure sensing device to determine the change In addition, the substrate pressing step comprises sensing the pressure value on the substrate fracturing block by the pressure sensing device; when the pressure value reaches a preset pressure value, stopping the substrate fracturing block before proceeding. The present invention provides a substrate splitting device and a substrate splitting method therefor. The substrate system as described herein is preferably a flat display device substrate; however, in different embodiments, the substrate may also be a circuit substrate or a wafer. The substrate and other various substrates. Further, in the preferred embodiment, the material of the substrate is made of glass; however, in other embodiments, the substrate may be formed of organic resin or other materials. In the embodiment, the substrate splitting device comprises a servo motor 1 , a transmission device 300 , a substrate fracturing block 500 and a machine table 700. The machine table 700 has a machine table 710 ′ and a servo motor 1 传动 and a transmission device 3 ( 8 ) The substrate fracturing blocks 500 are all disposed above the machine table 710. The servo motor 1 〇〇 preferably means ____ _ Qin. The motor 100 that controls the speed or the driving path, the type of package ≪ @servo horse), variable speed servo motor, DC servo motor, AC servo motor and other types of servo motor. As shown in Figure 2, one end of the transmission device 300 is directly or indirectly connected to the servo motor 100 for output servo The power of the motor is 1. In the example of the implementation of the 1373458 shown in Fig. 2, the transmission 300 has a power input terminal 3i and a power output terminal 330, wherein the power input terminal 310 is directly or indirectly connected to the servo motor 1A. The servo motor 100 includes a rotating screw 110, and the power input end 310 of the transmission device 3 has no corresponding screw hole. The screw hole is sleeved with the rotating screw 11〇. When the rotating screw 110 rotates, and simultaneously limits the power input end 31〇 When the rotation is not performed, the transmission device 300 can be displaced in the direction of the axial direction of the rotary screw n〇.
基板壓裂塊500係連接於傳動裝置3〇〇,且較佳係直接或間 接地連接於傳動裝置300之動力輸出端33〇。此外’基板壓裂 塊500亦可採可分離的方式與傳動裝置3⑻連接；亦即基板壓 裂塊500與傳動裝置300間亦可有相對位移之產生。如圖2及 圖3所示，基板壓裂塊500係呈一長條狀設置，且橫切於機台 台面7U)。基板壓裂塊500之材質較佳係為有機樹脂；然而: 不同實施例中’亦可採用金屬或其他材質。The substrate fracturing block 500 is coupled to the transmission 3A and is preferably connected directly or indirectly to the power take-off end 33 of the transmission 300. In addition, the substrate fracturing block 500 can also be detachably coupled to the transmission 3 (8); that is, there is also a relative displacement between the substrate fracturing block 500 and the transmission 300. As shown in Figures 2 and 3, the substrate fracturing block 500 is disposed in a strip shape and is transverse to the machine table 7U). The material of the substrate fracturing block 500 is preferably an organic resin; however, in various embodiments, metal or other materials may also be used.
如圖2及圖3所示，機台700之機台台面71〇係相對於基 板壓裂塊· ’且舰馬達係#由傳練£ 3⑻驅動基板 壓裂塊500朝向機台台面710移動。基板2〇〇較佳係藉由一流 片機構(糖示)傳送至機台台面彻上。基板2〇〇之底面較佳 係形成有縣紋21G，其軸方式包含_、鑽孔或其他機械、 雷射或化學加工方式。基板縣塊以財⑽與預裂紋 21〇相同’且伺服馬達100係驅動基板壓裂塊5〇〇在 離預裂紋之方向上移動。 〆 如圖2及圖3所示，基板分裂裝置並包含有導軌偏。傳動 裝置300與基板壓裂塊5〇〇係設置於導執上。導軌働較 7 佳係垂直於機台台面710 ;換言之，導執400係導引傳動裝置 300與基板壓裂塊500在接近及遠離機台台面710之方向上移 動，並限制傳動裝置300與基板壓裂塊500在其他方向上之位 移或轉動。導執4〇〇係直接設置於機台700上；然而在不同實 施例中’導軌400亦可以懸吊方式設置於機台台面71〇上方。 在如圖4a所示之實施例中，傳動裝置300與基板壓裂塊5〇〇 在導軌400上亦可產生相對位移。換言之，傳動裝置3〇〇係以 可刀離方式與基板壓裂塊5〇〇連接。如圖4b所示，當傳動裝 置300受伺服馬達100驅動沿導軌4〇〇接觸基板壓裂塊5〇〇 時’傳動裝置300之動力輸出端330即推動基板壓裂塊5〇〇朝 機台台面710前進。 如圖5a所示，以基板壓裂塊50〇之底面為參考點而言，基 板壓裂塊500係具有第一行程61〇及第二行程620，其中第二 行程620係較第一行程610接近機台台面710。以圖5a之角 度觀之，基板壓裂塊500係經由第一行程610進入第二行程 620後始得靠近機台台面71〇並與其上設置之基板2〇〇接觸。 在較佳實施例中，第二行程620之起始位置與基板2〇〇表面之 距離係小於2mm ;換言之，機台台面710之距離係小於2_ 加上基板200之厚度。第二行程620之起始位置即等同於第一 行程610之結束位置。在較佳實施例中，基板壓裂塊5〇〇於此 一位置時，係已完成減速過程，將下降速度由第一速度減至第 二速度。 如圖5a所示’當基板壓裂塊500在第一行程61〇之範圍内 時’伺服馬達100驅動基板壓裂塊500前進之速度係為第—速 度。如圖5b所示’當基板壓裂塊500在第二行程62〇之範圍 内時’祠服馬達1〇〇驅動基板壓裂塊500前進之速度係為第一 速度。在此實施例中’第一速度係大於第二速度，以節省製程 之整體時間；然而在不同實施例中’伺服馬達100亦可自始至 終均驅動基板壓裂塊500維持一定速前進。此外，第二速卢較 佳係小於l〇mm/s ;然而在更佳實施例中，第二速度係小於 2mm/s。當以較慢之第二速度作為與基板200之接觸速度時， 基板壓裂塊500之緩壓作用即可將具有較淺預裂紋21〇之基板 200分裂，以增加分裂後基板200之邊緣結構強度。特別是針 對厚度較薄之基板200 ’基板壓裂塊5〇〇需使用較慢之第二速 度進行壓裂。例如當基板200厚度小於〇.3mm時，第二速度 較佳係小於2mm/s。 在圖6a及圖6b所示之實施例中，基板分裂裝置另包含連 接軸750。傳動裝置500係藉由連接軸750軸接基板壓裂塊5〇〇 之中段部分，且連接轴750係垂直於傳動裝置5〇〇之移動方 向。在此實施例中，連接軸750係橫切基板壓裂塊5〇〇，並與 機台台面710平行。當基板壓裂塊5〇〇與基板2〇〇接觸時，如 圖6b所示，可能因基板厚度不均或其他原因，導致基板壓裂 塊500之底面與基板2〇〇表面未能平行。此時連接軸75〇即允 許基板壓裂塊500略旋轉至與基板2〇〇表面平行之狀態，以避 免產生因應力集中造成之良率下降。 在圖7所示之實施例中，基板分裂裝置進一步包含吸震裝 置770。吸震裝置770係設置於連接轴750之外側，亦即與連 接轴750位於不同錯直線上。吸震裝置770係位於傳動裂置 500與基板壓裂塊500之間；當基板壓裂塊500相對於連接軸 750旋轉時，吸震裝置770即可吸收轉動帶來的能量，並減緩 基板壓裂塊500轉動之速度。在此較佳實施例中，吸震裝置 770係成對設置於連接軸750之兩側；然而在不同實施例中， 吸震裝置770亦可僅設置於連接軸750之一側。此外，吸震裝 置770較佳係包含阻尼裝置，供轉化基板壓裂塊5〇〇旋轉產生 之動能；然而吸震裝置770亦可包含彈簣等彈性元件。 如圖8a所示’基板分裂裝置另包含伺服處理器91〇及壓力 感測裝置930。伺服處理器910係訊號連接於伺服馬達100， 供控制伺服馬達100之輸出功率或速度。壓力感測裝置93〇係 直接或間接連接於基板壓裂塊500，並訊號連接於伺服處理器 910。在圖8a所示之實施例中，壓力感測裝置93〇係直接設置 於基板壓裂塊500之頂端’並對應於傳動裝置3〇〇之動力輸出 端330。當傳動裝置300下壓使動力輸出端33〇接觸基板壓裂 塊500之頂端時’需先壓迫壓力感測裝置930方能驅動基板壓 塊500。此時壓力感測裝置930係以與基板壓裂塊5〇〇串聯之 方式感測基板壓裂塊500上之壓力。然而在不同實施例中，如 圖8b所示，壓力感測裝置930亦可設置於傳動裝置3〇〇之動 力輸出端330上。當動力輸出端33〇壓迫基板壓裂塊5〇〇時， 壓力感測裝置930亦可偵得基板壓裂塊5〇〇上之壓力。此外， 壓力感測裝置930亦可與基板壓裂塊5〇()以並聯方式連接。 1373458 在圖9所示之實施例中，傳動裝置300包含分離之動力輸 入部301及動力輸出部303。動力輸入部301係可移動地連接 於伺服馬達100,其中動力輸入端310係設置於動力輸入部3〇1 上。動力輸出部303係與基板壓裂塊500連動，亦即基板壓裂 塊500係藉由連接軸750轴接於動力輸出部3〇3上。吸震裝置 770係設置於動力輸出部3〇3頂端之凸緣與基板壓裂塊5〇〇之 間。動力輪入部301及動力輸出部303較佳均設置於導軌4〇〇 φ 上’並可沿垂直機台台面710之方向產生相對位移。 如圖9所示，壓力感測裝置930係設置於動力輸入部3〇1 及動力輸出部303之間，且位於動力輸出部303上。然而在不 同實施例中，壓力感測裝置930亦可設置於動力輸入部3〇1 . 上。此時壓力感測裝置930係間接與基板壓裂塊500連接。在 圖9之實施例中，當伺服馬達100驅動傳動裝置3〇〇之動力輸 入部301時’動力輸入部301即驅動壓力感測裝置93〇以推動 動力輸出部303。此時壓力感測裝置930即可偵得基板壓裂塊 # 5⑼上承受之壓力。 在圖10所示之實施例中，本發明之基板分裂方式較佳包含 步驟麵，於基板上形成預裂紋21〇。預裂紋21〇之形成 方式包含切削、鑽孔或其他機械、雷射或化學加工方式。步驟 1030為控制伺服馬達1〇〇驅動基板壓裂塊5〇〇朝基板移 動。在較佳實施例中，伺服馬達100輸出之轉動動力係經由傳 動裝置3〇〇轉換為線性動力後始輸出驅動基板壓裂塊5〇〇。步 驟1050包含控制基板壓裂塊5〇〇自預裂紋21〇對應位置壓迫 1373458 基板200。基板壓裂塊500之延伸方向較佳係平行於預裂紋210 之方向。此外，由於預裂紋210較佳係形成於基板200之底面， 而基板壓裂塊500係壓迫基板200之頂面，因此基板壓裂塊 500較佳係壓迫預裂紋210之對面。 在圖11所示之實施例中’伺服馬達控制步驟丨〇3〇包含步 驟1031 ’於基板壓裂塊500於第一行程610内時，控制基板 壓裂塊500以第一速度前進；以及步驟1033，於基板壓裂塊 500於第二行程620内時’控制基板壓裂塊5〇〇以第二速度前 進。第二行程620係較接近基板200，且第一速度係大於第二 · 速度。然而在不同實施例中’伺服馬達1〇〇亦可控制基板壓裂 塊500維持一固定速度移動。第二速度較佳係小於i〇mm/s ; 然而在更佳實施例中’第二速度係小於2mm/s。當以較慢之第 二速度作為與基板200之接觸速度時’基板壓裂塊5〇〇之緩壓 . 作用即可將具有較淺預裂紋210之基板200分裂，以增加分裂 後基板200之邊緣結構強度。特別是針對厚度較薄之基板 200，基板壓裂塊500需使用較慢之第二速度進行壓裂。例如 當基板2〇0厚度小於(Umm時，第二速度較<圭係小於加牆。· 如圖11所示，伺服馬達控制步驟1030更可包含步驟 以壓力感測裝置930偵測基板200之頂面位置。此一步驟通常 於整批基板200中之第一片基板200載入時。在此步驟中，伺 服馬達驅動基板壓裂塊5〇〇下降與基板2〇〇接觸。當壓力感測 裝置930起始偵得基板壓裂塊5〇〇之壓力值時，即可定位為合 時基板壓裂塊5〇〇之底面位置為基板2⑻之頂面位置。步驟田 12 1037包含根據頂面位置決定第二行程620之起始位置。在較佳 實施例中，第二行程620之起始位置與基板200頂面位置之距 離係小於2mm。此外，在圖11所示之實施例中，亦可省略步 驟1035及步驟1037。頂面位置之定位及第二行程62〇之起始 位置係可由直接手動設定伺服處理器910以控制伺服馬達1〇〇 之方式代替。 在圖12所示之實施例中，基板壓迫步驟105〇包含步驟 1051，設置壓力感測裝置930直接或間接連接基板壓裂塊 5〇〇。其中壓力感測裝置930與基板壓裂塊500之連接方式係 包含串聯連接及並聯連接。步驟1053包含藉由壓力感測裝置 930偵測基板壓裂塊500承受之壓力。此一壓力係為基板壓裂 塊500壓迫基板2〇〇時產生之反力所形成。因此當基板壓裂塊 500壓迫基板2〇〇越多時，此一壓力值亦隨之增加。 步驟1055包含當壓力達到—預設壓力值時，即停止基板壓 裂塊500之前進。由於基板2⑻之厚度及預裂紋21〇之深度均 可事先設^，因此可齡實驗或其齡析方式得知造成基板 2〇〇上預裂紋210位置斷製時所需之壓力。此一壓力即可設定 在舰處理器9H)中作為預設動。當壓力感測裝置93〇侧 基板壓裂塊5〇0上之㈣達到此一預設壓力時，即可判斷基板 2〇〇已於預裂紋時斷裂。此時伺服處理器91〇即控·服馬達 綱停止輸出動力或反向輸出動力，以停止基板壓裂塊谓之 前進。 基板分裂方式更可包含設置吸震袋置770於傳動裝置· 與基板壓裂塊500間。藉由此吸震裝置770之設置，可吸收基 板壓裂塊500與基板200接觸時產生之震動。此外，亦可以連 接輛750軸接基板壓裂塊500。當基板壓裂塊5〇〇與基板2〇〇 頂面非平行時’連接軸750使基板壓裂塊500旋轉以平均基板 麗裂塊500與基板200接觸時之應力分佈’並進而增加生產之 良率。 本發明已由上述相關實施例加以描述，然而上述實施例僅 為實施本發明之範例。必需指出的是，已揭露之實施例並未限 制本發明之範圍。相反地，包含於申請專利範圍之精神及範圍 之修改及均等設置均包含於本發明之範圍内。 【圖式簡單說明】 圖1為傳統基板分裂裝置之示意圖； 圖2為本發明基板分裂裝置之實施例正視圖； 圖3為圖2所示實施例之側視圖； 圖4a為傳動裝置與基板壓裂塊分離之實施例示意圖； 圖4b為圖4a所示實施例之作動示意圖； 圖5a為基板壓裂塊位於第一行程之實施例示意圖； 圖5b為基板壓裂塊位於第二行程之實施例示意圖； 圖6a為包含連接轴之實施例示意圖； 圖6b為含連接軸之基板壓裂塊與基板接觸之實施例示意圖； 圖7為包含吸震裝置之實施例示意圖； 圖8a為包含伺服處理器及壓力感測裝置之實施例示意圖； 圖8b為壓力感測裝置之另一實施例示意圖；As shown in Fig. 2 and Fig. 3, the table top 71 of the machine 700 is moved relative to the substrate fracturing block and the ship motor system # is driven by the drive £3 (8) to drive the substrate fracturing block 500 toward the table top 710. Preferably, the substrate 2 is transferred to the table top by a first-class sheet mechanism (sugar display). The bottom surface of the substrate 2 is preferably formed with a county 21G, and the shaft mode includes _, drilling or other mechanical, laser or chemical processing. The substrate block is the same as the pre-crack 21' and the servo motor 100 drives the substrate fracturing block 5 to move in the direction away from the pre-crack. As shown in FIG. 2 and FIG. 3, the substrate splitting device includes a rail bias. The transmission device 300 and the substrate fracturing block 5 are disposed on the guide. The guide rail 垂直 is perpendicular to the machine table 710 than the seventh guide; in other words, the guide 400 is guided by the guide transmission 300 and the substrate fracturing block 500 in the direction of approaching and away from the table 710, and restricting the transmission 300 and the substrate. The fracturing block 500 is displaced or rotated in other directions. The guides 4 are directly disposed on the machine table 700; however, in various embodiments, the guide rails 400 can also be suspended above the machine table 71. In the embodiment shown in Figure 4a, the transmission 300 and the substrate fracturing block 5 can also be displaced relative to each other on the rail 400. In other words, the transmission 3 is slidably coupled to the substrate fracturing block 5A. As shown in FIG. 4b, when the transmission device 300 is driven by the servo motor 100 to contact the substrate fracturing block 5 along the guide rail 4, the power output end 330 of the transmission device 300 pushes the substrate fracturing block 5 toward the machine table. Countertop 710 is advanced. As shown in FIG. 5a, the substrate fracturing block 500 has a first stroke 61 〇 and a second stroke 620 with the bottom surface of the substrate fracturing block 50 为 as a reference point, wherein the second stroke 620 is compared to the first stroke 610. Close to the machine table 710. In the perspective of Fig. 5a, the substrate fracturing block 500 enters the second stroke 620 via the first stroke 610 and is brought close to the table top 71 and is in contact with the substrate 2 disposed thereon. In the preferred embodiment, the starting position of the second stroke 620 is less than 2 mm from the surface of the substrate 2; in other words, the distance between the table top 710 is less than 2 mm plus the thickness of the substrate 200. The starting position of the second stroke 620 is equivalent to the end position of the first stroke 610. In the preferred embodiment, when the substrate fracturing block 5 is in this position, the deceleration process has been completed to reduce the descent speed from the first speed to the second speed. As shown in Fig. 5a, 'When the substrate fracturing block 500 is within the range of the first stroke 61?', the servo motor 100 drives the substrate fracturing block 500 to advance at a speed of the first speed. As shown in Fig. 5b, 'when the substrate fracturing block 500 is in the range of the second stroke 62?', the speed at which the motor 1b drives the substrate fracturing block 500 advances is the first speed. In this embodiment, the first speed system is greater than the second speed to save overall time for the process; however, in various embodiments, the servo motor 100 can also drive the substrate fracturing block 500 to maintain a constant speed from start to finish. Further, the second speed rpm is preferably less than 10 mm/s; however, in the more preferred embodiment, the second speed system is less than 2 mm/s. When the second slow speed is used as the contact speed with the substrate 200, the buffering action of the substrate fracturing block 500 can split the substrate 200 having the shallow pre-cracks 21〇 to increase the edge structure of the split substrate 200. strength. In particular, for a thinner substrate 200' substrate fracturing block 5, a slower second speed is required for fracturing. For example, when the thickness of the substrate 200 is less than 〇.3 mm, the second speed is preferably less than 2 mm/s. In the embodiment illustrated in Figures 6a and 6b, the substrate splitting device further includes a coupling shaft 750. The transmission device 500 is coupled to the intermediate portion of the substrate fracturing block 5 by a connecting shaft 750, and the connecting shaft 750 is perpendicular to the moving direction of the transmission 5'. In this embodiment, the connecting shaft 750 is transverse to the substrate fracturing block 5A and is parallel to the table top 710. When the substrate fracturing block 5 is in contact with the substrate 2, as shown in Fig. 6b, the bottom surface of the substrate fracturing block 500 may not be parallel to the surface of the substrate 2 due to uneven substrate thickness or other reasons. At this time, the connection shaft 75 〇 allows the substrate fracturing block 500 to be slightly rotated to be parallel to the surface of the substrate 2 to avoid a decrease in yield due to stress concentration. In the embodiment illustrated in Figure 7, the substrate splitting device further includes a shock absorbing device 770. The shock absorbing device 770 is disposed on the outer side of the connecting shaft 750, that is, on the wrong line with the connecting shaft 750. The shock absorbing device 770 is located between the transmission split 500 and the substrate fracturing block 500; when the substrate fracturing block 500 rotates relative to the connecting shaft 750, the shock absorbing device 770 can absorb the energy brought by the rotation and slow down the substrate fracturing block The speed of 500 rotation. In the preferred embodiment, the shock absorbing devices 770 are disposed in pairs on opposite sides of the connecting shaft 750; however, in various embodiments, the shock absorbing device 770 may be disposed only on one side of the connecting shaft 750. In addition, the shock absorbing device 770 preferably includes a damper for kinetic energy generated by the rotation of the conversion substrate fracturing block 5; however, the shock absorbing device 770 may also include an elastic member such as a magazine. As shown in Fig. 8a, the substrate splitting device further includes a servo processor 91 and a pressure sensing device 930. The servo processor 910 is connected to the servo motor 100 for controlling the output power or speed of the servo motor 100. The pressure sensing device 93 is directly or indirectly connected to the substrate fracturing block 500 and is connected to the servo processor 910. In the embodiment shown in Figure 8a, the pressure sensing device 93 is disposed directly on the top end of the substrate fracturing block 500 and corresponds to the power take-off end 330 of the transmission 3〇〇. When the actuator 300 is depressed to cause the power output terminal 33 to contact the top end of the substrate fracturing block 500, the pressure sensing device 930 must be pressed to drive the substrate block 500. At this time, the pressure sensing device 930 senses the pressure on the substrate fracturing block 500 in series with the substrate fracturing block 5〇〇. However, in various embodiments, as shown in Figure 8b, the pressure sensing device 930 can also be disposed on the power output 330 of the transmission 3〇〇. When the power output end 33〇 presses the substrate fracturing block 5〇〇, the pressure sensing device 930 can also detect the pressure on the substrate fracturing block 5〇〇. In addition, the pressure sensing device 930 can also be connected in parallel with the substrate fracturing block 5〇. 1373458 In the embodiment shown in Figure 9, the transmission 300 includes a separate power input 301 and a power take off 303. The power input unit 301 is movably coupled to the servo motor 100, wherein the power input terminal 310 is disposed on the power input unit 3〇1. The power output unit 303 is interlocked with the substrate fracturing block 500, that is, the substrate fracturing block 500 is axially coupled to the power output unit 3〇3 via the connecting shaft 750. The shock absorbing device 770 is disposed between the flange of the top end of the power output portion 3〇3 and the substrate fracturing block 5〇〇. Preferably, the power wheel entry portion 301 and the power output portion 303 are disposed on the guide rail 4?" and are relatively displaceable in the direction of the vertical table top 710. As shown in FIG. 9, the pressure sensing device 930 is disposed between the power input unit 3〇1 and the power output unit 303, and is located on the power output unit 303. However, in various embodiments, the pressure sensing device 930 can also be disposed on the power input portion 3〇1. At this time, the pressure sensing device 930 is indirectly connected to the substrate fracturing block 500. In the embodiment of Fig. 9, when the servo motor 100 drives the power input portion 301 of the transmission device 3, the power input portion 301 drives the pressure sensing device 93 to push the power output portion 303. At this time, the pressure sensing device 930 can detect the pressure on the substrate fracturing block #5(9). In the embodiment shown in Fig. 10, the substrate splitting method of the present invention preferably comprises a step surface on which a pre-crack 21 is formed. The formation of pre-cracks 21〇 includes cutting, drilling or other mechanical, laser or chemical processing. Step 1030 is to control the servo motor 1 to drive the substrate fracturing block 5 to move toward the substrate. In the preferred embodiment, the rotational power output from the servo motor 100 is converted to linear power via the actuator 3, and then the drive substrate fracturing block 5 is output. Step 1050 includes controlling the substrate fracturing block 5 to press the 1373458 substrate 200 from the pre-crack 21 〇 corresponding position. The direction in which the substrate fracturing block 500 extends is preferably parallel to the direction of the pre-crack 210. In addition, since the pre-crack 210 is preferably formed on the bottom surface of the substrate 200, and the substrate fracturing block 500 presses the top surface of the substrate 200, the substrate fracturing block 500 is preferably pressed against the pre-crack 210. In the embodiment shown in FIG. 11, the 'servo motor control step 〇3〇 includes step 1031' when the substrate fracturing block 500 is within the first stroke 610, the substrate fracturing block 500 is controlled to advance at a first speed; and the steps 1033, when the substrate fracturing block 500 is in the second stroke 620, the control substrate fracturing block 5 is advanced at the second speed. The second stroke 620 is closer to the substrate 200 and the first speed system is greater than the second speed. However, in various embodiments, the servo motor 1 can also control the substrate fracturing block 500 to maintain a fixed speed of movement. The second speed is preferably less than i 〇 mm/s; however, in a more preferred embodiment the second speed system is less than 2 mm/s. When the slower second speed is used as the contact speed with the substrate 200, the substrate 200 having the shallow pre-cracks 210 can be split to increase the post-split substrate 200. Edge structure strength. In particular, for a substrate 200 having a relatively thin thickness, the substrate fracturing block 500 needs to be fractured using a slower second speed. For example, when the thickness of the substrate 2〇0 is less than (Umm, the second speed is less than the wall is smaller than the wall.) As shown in FIG. 11, the servo motor control step 1030 may further include the step of detecting the substrate 200 by the pressure sensing device 930. The top surface position. This step is usually applied when the first substrate 200 in the entire batch of substrates 200 is loaded. In this step, the servo motor drives the substrate fracturing block 5 to drop into contact with the substrate 2〇〇. When the sensing device 930 starts to detect the pressure value of the substrate fracturing block 5, the position of the bottom surface of the substrate fracturing block 5 is positioned as the top surface position of the substrate 2 (8). Step field 12 1037 includes The top surface position determines the starting position of the second stroke 620. In the preferred embodiment, the starting position of the second stroke 620 is less than 2 mm from the top surface position of the substrate 200. Further, the embodiment shown in FIG. Step 1035 and step 1037 may also be omitted. The positioning of the top surface position and the starting position of the second stroke 62〇 may be replaced by directly setting the servo processor 910 to control the servo motor 1〇〇. In the illustrated embodiment, the substrate is pressed 105〇 includes step 1051, and the pressure sensing device 930 is directly or indirectly connected to the substrate fracturing block 5〇〇. The connection manner between the pressure sensing device 930 and the substrate fracturing block 500 includes a series connection and a parallel connection. Step 1053 includes The pressure received by the substrate fracturing block 500 is detected by the pressure sensing device 930. This pressure is formed by the reaction force generated when the substrate fracturing block 500 presses the substrate 2〇〇. Therefore, when the substrate fracturing block 500 presses the substrate The more the 2〇〇, the pressure value also increases. Step 1055 includes when the pressure reaches the preset pressure value, that is, the substrate fracturing block 500 is stopped before entering. Because of the thickness of the substrate 2 (8) and the pre-crack 21 The depth can be set in advance, so the age test or its ageing method can be used to determine the pressure required to break the pre-crack 210 on the substrate 2. This pressure can be set in the ship processor 9H). Preset movement. When (4) of the substrate fracturing block 5〇0 of the pressure sensing device 93 reaches the predetermined pressure, it can be judged that the substrate 2〇〇 has broken at the pre-crack. At this time, the servo processor 91 is controlled to stop the output power or the reverse output power to stop the substrate fracturing block. The substrate splitting method may further include providing a shock absorbing bag 770 between the transmission device and the substrate fracturing block 500. By the arrangement of the shock absorbing device 770, the vibration generated when the substrate fracturing block 500 comes into contact with the substrate 200 can be absorbed. Alternatively, a 750-axis substrate fracturing block 500 can be attached. When the substrate fracturing block 5 is non-parallel to the top surface of the substrate 2, the connecting shaft 750 rotates the substrate fracturing block 500 to average the stress distribution when the substrate cleat 500 contacts the substrate 200, and further increases the production. Yield. The present invention has been described by the above related embodiments, but the above embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments are not intended to limit the scope of the invention. On the contrary, modifications and equivalents of the spirit and scope of the invention are included in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional substrate splitting apparatus; FIG. 2 is a front view of an embodiment of the substrate splitting apparatus of the present invention; FIG. 3 is a side view of the embodiment shown in FIG. Figure 4b is a schematic view of the operation of the embodiment shown in Figure 4a; Figure 5a is a schematic view of the embodiment of the substrate fracturing block in the first stroke; Figure 5b is the substrate fracturing block located in the second stroke Figure 6a is a schematic view of an embodiment including a connecting shaft; Figure 6b is a schematic view of an embodiment in which a substrate fracturing block including a connecting shaft is in contact with a substrate; Figure 7 is a schematic view of an embodiment including a shock absorbing device; A schematic diagram of an embodiment of a processor and a pressure sensing device; FIG. 8b is a schematic diagram of another embodiment of a pressure sensing device;