TWI370711B - Fine line structure with improved adhesion and method for fabricating the same - Google Patents

Fine line structure with improved adhesion and method for fabricating the same

Info

Publication number
TWI370711B
TWI370711B TW098100138A TW98100138A TWI370711B TW I370711 B TWI370711 B TW I370711B TW 098100138 A TW098100138 A TW 098100138A TW 98100138 A TW98100138 A TW 98100138A TW I370711 B TWI370711 B TW I370711B
Authority
TW
Taiwan
Prior art keywords
fabricating
same
line structure
fine line
improved adhesion
Prior art date
Application number
TW098100138A
Other languages
Chinese (zh)
Other versions
TW201028059A (en
Inventor
Hsieh Han Lai
Hsien Chieh Lin
Kuo Chun Chiang
Shing Fun Ho
Original Assignee
Nan Ya Printed Circuit Board
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Printed Circuit Board filed Critical Nan Ya Printed Circuit Board
Priority to TW098100138A priority Critical patent/TWI370711B/en
Publication of TW201028059A publication Critical patent/TW201028059A/en
Application granted granted Critical
Publication of TWI370711B publication Critical patent/TWI370711B/en

Links

TW098100138A 2009-01-06 2009-01-06 Fine line structure with improved adhesion and method for fabricating the same TWI370711B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW098100138A TWI370711B (en) 2009-01-06 2009-01-06 Fine line structure with improved adhesion and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098100138A TWI370711B (en) 2009-01-06 2009-01-06 Fine line structure with improved adhesion and method for fabricating the same

Publications (2)

Publication Number Publication Date
TW201028059A TW201028059A (en) 2010-07-16
TWI370711B true TWI370711B (en) 2012-08-11

Family

ID=44853393

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098100138A TWI370711B (en) 2009-01-06 2009-01-06 Fine line structure with improved adhesion and method for fabricating the same

Country Status (1)

Country Link
TW (1) TWI370711B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484539B (en) * 2010-12-24 2015-05-11 Asahi Kasei E Materials Corp Insulating structure and manufacturing method thereof
US10276465B2 (en) * 2016-09-29 2019-04-30 Mediatek Inc. Semiconductor package assembly

Also Published As

Publication number Publication date
TW201028059A (en) 2010-07-16

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