TWI369764B - Chip with routes and clean method thereof and package incorporating the same - Google Patents
Chip with routes and clean method thereof and package incorporating the sameInfo
- Publication number
- TWI369764B TWI369764B TW094139333A TW94139333A TWI369764B TW I369764 B TWI369764 B TW I369764B TW 094139333 A TW094139333 A TW 094139333A TW 94139333 A TW94139333 A TW 94139333A TW I369764 B TWI369764 B TW I369764B
- Authority
- TW
- Taiwan
- Prior art keywords
- routes
- chip
- same
- clean method
- package incorporating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094139333A TWI369764B (en) | 2005-11-09 | 2005-11-09 | Chip with routes and clean method thereof and package incorporating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094139333A TWI369764B (en) | 2005-11-09 | 2005-11-09 | Chip with routes and clean method thereof and package incorporating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200719445A TW200719445A (en) | 2007-05-16 |
TWI369764B true TWI369764B (en) | 2012-08-01 |
Family
ID=55856089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094139333A TWI369764B (en) | 2005-11-09 | 2005-11-09 | Chip with routes and clean method thereof and package incorporating the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI369764B (zh) |
-
2005
- 2005-11-09 TW TW094139333A patent/TWI369764B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW200719445A (en) | 2007-05-16 |
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