TWI369724B - Method for fabricating and testing semiconductor wafer - Google Patents

Method for fabricating and testing semiconductor wafer

Info

Publication number
TWI369724B
TWI369724B TW096146006A TW96146006A TWI369724B TW I369724 B TWI369724 B TW I369724B TW 096146006 A TW096146006 A TW 096146006A TW 96146006 A TW96146006 A TW 96146006A TW I369724 B TWI369724 B TW I369724B
Authority
TW
Taiwan
Prior art keywords
fabricating
semiconductor wafer
testing semiconductor
testing
wafer
Prior art date
Application number
TW096146006A
Other languages
Chinese (zh)
Other versions
TW200826170A (en
Inventor
Mou Shiung Lin
Shih Hsiung Lin
Original Assignee
Megica Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Megica Corp filed Critical Megica Corp
Publication of TW200826170A publication Critical patent/TW200826170A/en
Application granted granted Critical
Publication of TWI369724B publication Critical patent/TWI369724B/en

Links

TW096146006A 2006-12-04 2007-12-04 Method for fabricating and testing semiconductor wafer TWI369724B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86835306P 2006-12-04 2006-12-04

Publications (2)

Publication Number Publication Date
TW200826170A TW200826170A (en) 2008-06-16
TWI369724B true TWI369724B (en) 2012-08-01

Family

ID=44772314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096146006A TWI369724B (en) 2006-12-04 2007-12-04 Method for fabricating and testing semiconductor wafer

Country Status (1)

Country Link
TW (1) TWI369724B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472782B (en) * 2013-04-10 2015-02-11 Inotera Memories Inc Semiconctor device inspecting method and semiconctor device inspecting method system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113337860B (en) * 2021-08-02 2021-11-09 华芯半导体研究院(北京)有限公司 Method for electroplating on surface of chip wafer and application thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472782B (en) * 2013-04-10 2015-02-11 Inotera Memories Inc Semiconctor device inspecting method and semiconctor device inspecting method system

Also Published As

Publication number Publication date
TW200826170A (en) 2008-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees