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Application filed by Unimicron Technology CorpfiledCriticalUnimicron Technology Corp
Priority to TW097144833ApriorityCriticalpatent/TWI368307B/en
Publication of TW201021175ApublicationCriticalpatent/TW201021175A/en
Application grantedgrantedCritical
Publication of TWI368307BpublicationCriticalpatent/TWI368307B/en
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/11—Manufacturing methods
TW097144833A2008-11-202008-11-20Packaging substrate and method for manufacturing the same
TWI368307B
(en)