TWI367204B - - Google Patents

Info

Publication number
TWI367204B
TWI367204B TW094109188A TW94109188A TWI367204B TW I367204 B TWI367204 B TW I367204B TW 094109188 A TW094109188 A TW 094109188A TW 94109188 A TW94109188 A TW 94109188A TW I367204 B TWI367204 B TW I367204B
Authority
TW
Taiwan
Application number
TW094109188A
Other languages
Chinese (zh)
Other versions
TW200609207A (en
Inventor
Mitsuo Akutsu
Masaaki Shimizu
Yoshie Makabe
Naomi Sato
Tomohito Ishiguro
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW200609207A publication Critical patent/TW200609207A/en
Application granted granted Critical
Publication of TWI367204B publication Critical patent/TWI367204B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/17—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings containing other rings in addition to the six-membered aromatic rings, e.g. cyclohexylphenol
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/28—Ethers with hydroxy compounds containing oxirane rings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Compounds (AREA)
TW094109188A 2004-03-25 2005-03-24 Novel phenol compound and novel epoxy resin derivable from such phenol compound TW200609207A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004090129 2004-03-25

Publications (2)

Publication Number Publication Date
TW200609207A TW200609207A (en) 2006-03-16
TWI367204B true TWI367204B (en) 2012-07-01

Family

ID=35056117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109188A TW200609207A (en) 2004-03-25 2005-03-24 Novel phenol compound and novel epoxy resin derivable from such phenol compound

Country Status (4)

Country Link
JP (1) JP4698586B2 (en)
CN (1) CN100386298C (en)
TW (1) TW200609207A (en)
WO (1) WO2005092826A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4198101B2 (en) * 2004-09-17 2008-12-17 株式会社Ａｄｅｋａ Alkali developable resin composition
JP4198173B2 (en) 2004-09-17 2008-12-17 凸版印刷株式会社 Colored alkali-developable photosensitive resin composition and color filter using the colored alkali-developable photosensitive resin composition
WO2006137257A1 (en) * 2005-06-20 2006-12-28 Toppan Printing Co., Ltd. Colored alkali-developable photosensitive resin composition and color filters made by using the same
JP4916224B2 (en) * 2005-06-20 2012-04-11 株式会社Ａｄｅｋａ Alkali-developable photosensitive resin composition
JP4878845B2 (en) * 2006-01-10 2012-02-15 凸版印刷株式会社 SUBSTRATE WITH PROJECT FOR CONTROLLING LIQUID CRYSTAL ORIENTATION CONTROL FORMED USING ALKALINE DEVELOPING PHOTOSENSITIVE RESIN COMPOSITION
JP4738190B2 (en) * 2006-02-01 2011-08-03 株式会社Ａｄｅｋａ Epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition
JP4667261B2 (en) * 2006-02-01 2011-04-06 株式会社Ａｄｅｋａ Alkali-developable photosensitive resin composition
JP4878876B2 (en) * 2006-03-15 2012-02-15 株式会社Ａｄｅｋａ Epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition
JP5546093B2 (en) 2006-12-26 2014-07-09 株式会社Ａｄｅｋａ Polymerizable compound and polymerizable composition
JP5311750B2 (en) * 2007-02-28 2013-10-09 株式会社Ａｄｅｋａ Phenol resin, epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition
SG181486A1 (en) 2009-12-02 2012-07-30 Dow Global Technologies Llc Coating compositions
SG181461A1 (en) 2009-12-02 2012-07-30 Dow Global Technologies Llc Epoxy resin compositions
WO2011068643A2 (en) * 2009-12-02 2011-06-09 Dow Global Technologies Inc. Composite compositions
JP7465673B2 (en) 2020-02-25 2024-04-11 株式会社Adeka Polymers, molded articles and optical materials

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987006243A1 (en) * 1986-04-14 1987-10-22 Hughes Aircraft Company Structural epoxy paste adhesive curable at ambient temperature and process for preparation thereof
JP3200123B2 (en) * 1991-11-27 2001-08-20 住友化学工業株式会社 Epoxy resin composition for sealing electronic parts
JP3173629B2 (en) * 1992-02-12 2001-06-04 日本化薬株式会社 Epoxy resin composition and cured product thereof
JPH05295089A (en) * 1992-04-21 1993-11-09 Daihachi Chem Ind Co Ltd Curable resin composition
SG63691A1 (en) * 1996-02-09 1999-03-30 Nippon Kayaku Kk Epoxy resin epoxy resin composition and hardened product thereof
JP2000239206A (en) * 1998-12-25 2000-09-05 Honshu Chem Ind Co Ltd Asymmetric alkylidene polyhydric phenols and production thereof
JP2002316963A (en) * 2001-02-15 2002-10-31 Osaka Gas Co Ltd Bisphenol with low activity as endocrine disruptor
JP2003064121A (en) * 2001-08-23 2003-03-05 Tosoh Corp Method of producing polyolefin
JP4067974B2 (en) * 2002-02-15 2008-03-26 本州化学工業株式会社 1,3,5-tris (4-hydroxyphenyl) adamantanes and process for producing the same

Also Published As

Publication number Publication date
JP4698586B2 (en) 2011-06-08
CN100386298C (en) 2008-05-07
TW200609207A (en) 2006-03-16
JPWO2005092826A1 (en) 2008-02-14
CN1771219A (en) 2006-05-10
WO2005092826A1 (en) 2005-10-06

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