TWI366897B - Structure and process of heat dissipation substrate - Google Patents

Structure and process of heat dissipation substrate

Info

Publication number
TWI366897B
TWI366897B TW097135701A TW97135701A TWI366897B TW I366897 B TWI366897 B TW I366897B TW 097135701 A TW097135701 A TW 097135701A TW 97135701 A TW97135701 A TW 97135701A TW I366897 B TWI366897 B TW I366897B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation substrate
substrate
heat
dissipation
Prior art date
Application number
TW097135701A
Other languages
Chinese (zh)
Other versions
TW201013863A (en
Inventor
Tzu Shih Shen
yu chen Su
Original Assignee
Subtron Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Subtron Technology Co Ltd filed Critical Subtron Technology Co Ltd
Priority to TW097135701A priority Critical patent/TWI366897B/en
Publication of TW201013863A publication Critical patent/TW201013863A/en
Application granted granted Critical
Publication of TWI366897B publication Critical patent/TWI366897B/en

Links

TW097135701A 2008-09-17 2008-09-17 Structure and process of heat dissipation substrate TWI366897B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097135701A TWI366897B (en) 2008-09-17 2008-09-17 Structure and process of heat dissipation substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097135701A TWI366897B (en) 2008-09-17 2008-09-17 Structure and process of heat dissipation substrate

Publications (2)

Publication Number Publication Date
TW201013863A TW201013863A (en) 2010-04-01
TWI366897B true TWI366897B (en) 2012-06-21

Family

ID=44829483

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097135701A TWI366897B (en) 2008-09-17 2008-09-17 Structure and process of heat dissipation substrate

Country Status (1)

Country Link
TW (1) TWI366897B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109935556B (en) * 2017-12-15 2020-11-24 光宝科技股份有限公司 Light emitting diode packaging structure, heat dissipation substrate and manufacturing method of heat dissipation substrate
TWI692846B (en) 2019-03-21 2020-05-01 旭德科技股份有限公司 Heat dissipation substrate and fabricating method thereof

Also Published As

Publication number Publication date
TW201013863A (en) 2010-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees