TWI366694B - Packaging tool for lens module and packaging method using the same - Google Patents
Packaging tool for lens module and packaging method using the sameInfo
- Publication number
- TWI366694B TWI366694B TW097104038A TW97104038A TWI366694B TW I366694 B TWI366694 B TW I366694B TW 097104038 A TW097104038 A TW 097104038A TW 97104038 A TW97104038 A TW 97104038A TW I366694 B TWI366694 B TW I366694B
- Authority
- TW
- Taiwan
- Prior art keywords
- packaging
- same
- lens module
- tool
- packaging method
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B13/00—Bundling articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B23/00—Packaging fragile or shock-sensitive articles other than bottles; Unpacking eggs
- B65B23/20—Packaging plate glass, tiles, or shingles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/109—Embedding of laminae within face of additional laminae
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097104038A TWI366694B (en) | 2008-02-01 | 2008-02-01 | Packaging tool for lens module and packaging method using the same |
US12/357,593 US7943002B2 (en) | 2008-02-01 | 2009-01-22 | Tool and method for packaging lens module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097104038A TWI366694B (en) | 2008-02-01 | 2008-02-01 | Packaging tool for lens module and packaging method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200935112A TW200935112A (en) | 2009-08-16 |
TWI366694B true TWI366694B (en) | 2012-06-21 |
Family
ID=40930507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097104038A TWI366694B (en) | 2008-02-01 | 2008-02-01 | Packaging tool for lens module and packaging method using the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US7943002B2 (zh) |
TW (1) | TWI366694B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201314290A (zh) * | 2011-09-16 | 2013-04-01 | Hon Hai Prec Ind Co Ltd | 鏡頭模組組裝方法 |
TWI545328B (zh) * | 2012-07-10 | 2016-08-11 | 鴻海精密工業股份有限公司 | 鏡頭模組測試裝置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3980933B2 (ja) * | 2002-05-23 | 2007-09-26 | ローム株式会社 | イメージセンサモジュールの製造方法 |
US7575955B2 (en) * | 2004-01-06 | 2009-08-18 | Ismat Corporation | Method for making electronic packages |
CN2935188Y (zh) | 2006-08-07 | 2007-08-15 | 昆山钜亮光电科技有限公司 | 镜头模组的组装专用治具 |
US8013289B2 (en) * | 2006-11-15 | 2011-09-06 | Ether Precision, Inc. | Lens array block for image capturing unit and methods of fabrication |
-
2008
- 2008-02-01 TW TW097104038A patent/TWI366694B/zh active
-
2009
- 2009-01-22 US US12/357,593 patent/US7943002B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20090194227A1 (en) | 2009-08-06 |
US7943002B2 (en) | 2011-05-17 |
TW200935112A (en) | 2009-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2383807A4 (en) | LIGHT EMITTING DEVICE ENVELOPE AND METHOD FOR PRODUCING SAME | |
EP2215667A4 (en) | LED ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME | |
EP2332691A4 (en) | PRODUCTION LINE MODULE AND PRODUCTION PLANT | |
ZA200905023B (en) | Packaging machine and method | |
SG2014012777A (en) | Method and system for manufacturing integratedfluidic chips | |
EP2287577A4 (en) | SPECTRAL MODULE AND METHOD FOR MANUFACTURING A SPECTRAL MODULE | |
EP2112532A4 (en) | ELECTROBONDING DEVICE AND MANUFACTURING METHOD THEREFOR | |
EP2248398A4 (en) | SYSTEM AND METHOD FOR SEPARATING INTEGRATED WAVEGUIDE | |
EP2326155A4 (en) | SUBSTRATE MODULE AND METHOD FOR THE PRODUCTION THEREOF | |
PL2262607T3 (pl) | Urządzenie i sposób obróbki laserowej | |
EP2210285A4 (en) | LUMINAIRE ELEMENT CAPSULATION AND METHOD FOR THE PRODUCTION THEREOF | |
TWI350393B (en) | Curved optical device and method for making the same | |
TWI349179B (en) | Modularized device and method for assembling the modularized device | |
EP2238490A4 (en) | METHODS AND SYSTEMS FOR ALIGNING OPTICAL HOUSINGS | |
EP2188848A4 (en) | LUMINAIRE ELEMENT CAPSULATION AND METHOD FOR THE PRODUCTION THEREOF | |
EP2589216A4 (en) | CAMERA MODULE AND DRIVE PROCESS THEREFOR | |
GB0803527D0 (en) | Tool and method | |
HK1136274A1 (en) | Method for producing optically active amine | |
EP2169792A4 (en) | SEMICONDUCTOR LASER AND METHOD FOR THE PRODUCTION THEREOF | |
TWI366694B (en) | Packaging tool for lens module and packaging method using the same | |
EP2216623A4 (en) | DEVICE FOR MARKING LASER LINES | |
PL2222573T3 (pl) | Opakowanie oraz sposób pakowania | |
EP2290340A4 (en) | METHOD FOR MANUFACTURING A SPECTRAL MODULE AND SPECTRAL MODULE | |
GB0715063D0 (en) | Semiconductor laser device and method | |
TWI365349B (en) | Lens module and assembling method for the same |