Claims (1)
1364694 日傪正替換頁 十、申請專利範圍： 組合丄電理晶片之觸控式面板^^ 裝置的液日日顯不幕上，該結構包括· 條之第一觸==有一基板，該基板正面上具有複數 電極㈣第；二=複數條之第二電極線，該第- 電性連::第:二Γί 應，並於該第—電極線-端 該基板f面的第m端電 複數；=3面的複數第二傳輸導線’該基板背面的 ^ 端與該基板側邊具有之複數條跨接導 、，“性連結，該跨接導線的另一端與該基板正面的第二傳 輸導線電性連結，使㈣二傳輸導、線由該基板背面延伸至 基板正面上； 一晶片，為感測晶片，係設於該基板之正面上，與位 於該基板正面的該第一、二傳輸導線電性連結； 一軟性薄膜電路板，係與該晶片電性連結；及， 一第三傳輸導線，係與該晶片及該軟性薄膜電路板電 性連結。 2、 如申請專利範圍第1項所述之具有訊號處理晶片 之觸控式面板結構，其中，該基板為玻璃材質。 3、 如申請專利範圍第1項所述之具有訊號處理晶片 之觸控式面板結構，其中’該第一、二電極線及第一、 二、三傳輸導線及跨接導線為透明的ΙΤΟ材料。 4、 如申請專利範圍第1項所述之具有訊號處理晶片 之觸控式面板結構’其中，該第一、二傳輪導線與晶片電 14 1364694 1364694 ι〇ο年 月y曰修正替換頁 性連結處之間設有—層異方性導電膠。 之網h、如申專利圍第1項所述之具有訊號處理晶片 里^控t面板結構，其中，該第三傳輸導線兩端設有-層 Μ ㈣’該異方性導轉與該W及軟性薄膜電路 板電性連結。 夕締細.如申。月專利乾圍第1項所述之具有訊號處理晶片 觸控式面板結構’其中，該感測晶片包括： —電源輸入埠，用以連結電源； 訊戒輸人槔’係與該基板上的第一傳輸線及第二傳 輸線電性連結，用以輸人-並列資料； 入枝帝類比/數位轉換11，係與該電源輸人埠及該訊號輸 “性連結’用以將訊號輸人埠所輸人的類比訊號轉換 成一數位訊號輪出； —時序控制器，係、與該類比/數位轉換器電性連結， 用以產生時序訊號傳輸至該類比/數位轉換器中；及， 一並列資料轉換串列資料輸出電路，係與該類比/數 4轉換器電f生連接’將訊號輸人埠輸人的並列資料經類比 數4轉換為轉換成數位訊號後，再轉換成串列資料輸 出； 一訊號輸出埠’係與該並列資料轉換串列資料輸出電 路及軟性薄膜電路板電性連結。 7 種具有讯號處理晶片之觸控式面板結構，用以 組合在电子裝置的液晶顯示幕上，該結構包括： 一觸控板，其具有—基才反，該基板正面上設有複數個 1364694 月71日修正替換頁 ^-電極塊’祕㈣面設有複㈣m二 弟-電極塊與該每個第二電極塊對應配置，該每個第 =電性連結有-第一傳輸導線，該第一傳輸導線延伸於 遠基板之—側邊設置且位於該基板之正面上，該每個第二 2塊電性連結一第二傳輸導線，該第二傳輸導線一端盥 遠基板側邊之跨接導線電性連結，使該第二傳輸導線延伸 於韻板正面上游走’並延伸於該基板之另一側邊設置且 位於該基板之正面上； 一晶片，為感測晶片，係設於該基板之正面上，盥位 於該基板正面的該第―、二傳輸導線電性連結；’、 一軟性薄膜電路板，係與該晶片電性連結；及， 第一傳輸‘線，係與該晶片及該軟性薄膜電路板電 性連結。 8、 如申請專利範圍 之觸控式面板結構，其中 9、 如申請專利範圍 之觸控式面板結構，其中 一、三傳輸導線及跨接導 10、 如申請專利範圍 之觸控式面板結構，其中 性連結處之間設有—層異 11、 如申請專利範圍 之觸控式面板结構，其中 異方性導電膠，該異方性 第7項所述之具有訊號處理晶片 ’ 5亥基板為玻璃材質。 第7項所述之具有訊號處理晶片 ，該第一、二電極塊及第一、 線為透明的ITO材料。 第7項所述之具有訊號處理晶片 ’該第一、二傳輸導線與晶片電 方性導電膠。 第7項所述之具有訊號處理晶片 ’該第三傳輸導線兩端設有一層 導電膠與該晶片及軟性薄膜電路 16 1364694 板電性連結。 月叫曰修正替 12、如申請專利範圍第7項所 。 之觸控八有訊號處理晶片 式面板結構，其中，該感測晶片包括： 一電源輸入埠，用以連結電源； 一訊號輸入埠，係與該基板 給叆雪叫4认 低上的弟一傳輸線及第二傳 輸線電性連結，用以輸入一並列資料丨 号 -類比/數位轉換器，係與該電源輸入埠及該 ^ ^性連結，心將訊號輸人埠所輸人的類比 成一數位訊號輸出； π# 、-時序控制器，係與該類比/數位轉換器電性連結， 用以產生日t序訊號傳輸至該類比/數位轉 -並列資料轉換串列資料輸出電路，係與：二數 位轉換裔電性連接，將訊號輸人埠輸人的並列資料經類比 /數位轉換裔轉換成數位訊號後，再轉換成串列資料輸 出； 、， 一訊號輸出埠，係與該並列資料轉換串列資料輪出電 路及軟性薄膜電路板電性連結。1364694 傪 傪 替换 替换 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 a plurality of electrodes (four) on the front side; a second electrode line of the second plurality of electrodes, the first electrical connection:: the second electrode, and the mth end of the substrate f side of the first electrode line a plurality of second transmission wires of the three sides of the substrate, the end of the back surface of the substrate and the plurality of strips of the side of the substrate, "sexual connection, the other end of the jumper wire and the second side of the substrate The transmission wire is electrically connected such that the (four) two transmission guides and wires extend from the back surface of the substrate to the front surface of the substrate; a wafer, which is a sensing wafer, is disposed on the front surface of the substrate, and the first portion located on the front surface of the substrate The second transmission line is electrically connected to the wafer; and a third transmission line is electrically connected to the wafer and the flexible film circuit board. Signal processing crystal according to item 1 The touch panel structure, wherein the substrate is made of glass. 3. The touch panel structure with signal processing chip according to claim 1, wherein the first and second electrode lines and the first The second and third transmission wires and the jumper wires are transparent germanium materials. 4. The touch panel structure with signal processing chip according to claim 1, wherein the first and second pass wires and Wafer electricity 14 1364694 1364694 ι〇ο年月 y曰 Correction Replacement page-links are provided with a layer of anisotropic conductive adhesive. The net h, as described in the patent claim 1 of the patent processing wafer ^ The t-panel structure is controlled, wherein the third transmission wire is provided with a layer 两端 (4) at both ends of the wire. The anisotropic conduction is electrically connected to the W and the flexible film circuit board. The signal processing chip touch panel structure described in the first aspect, wherein the sensing chip comprises: a power input port for connecting a power source; a signal input line and a first transmission line on the substrate and Second transmission line The knot is used to input the person-parallel data; the analog-to-class analog/digital conversion is entered into the analogy with the power input and the signal is used to convert the analog signal of the signal input into a digit. The signal is rotated; the timing controller is electrically coupled to the analog/digital converter for generating a timing signal to be transmitted to the analog/digital converter; and, a parallel data conversion serial data output circuit Connected with the analog/number 4 converter, the parallel data of the input and output of the signal is converted into a digital signal by analogy 4, and then converted into serial data output; a signal output 埠' The parallel data conversion serial data output circuit and the flexible thin film circuit board are electrically connected. 7 touch panel structures having signal processing chips for combining on a liquid crystal display screen of an electronic device, the structure comprising: a touch panel having a base and a counter, the plurality of front sides of the substrate being provided 1364694 Modified on the 71st of the month of the ^^ electrode block 'secret (four) face is provided with a complex (four) m two brother-electrode block corresponding to each of the second electrode block, each of the = electrical connection with - first transmission wire, The first transmission wire extends from the side of the remote substrate and is disposed on the front surface of the substrate. Each of the second two wires is electrically connected to a second transmission wire, and the second transmission wire is connected to the side of the substrate. The jumper wire is electrically connected so that the second transmission wire extends upstream of the front side of the board and extends on the other side of the substrate and is located on the front side of the substrate; a wafer is a sensing chip, Provided on the front surface of the substrate, the first and second transmission wires on the front surface of the substrate are electrically connected; ', a flexible thin film circuit board is electrically connected to the wafer; and, the first transmission 'line, With the wafer and the soft The thin film circuit board is electrically connected. 8. The touch panel structure as claimed in the patent application, wherein, 9, the touch panel structure of the patent application scope, wherein the one or three transmission wires and the jumper guide 10, such as the touch panel structure of the patent application scope, There is a layer-to-layer 11 between the neutral joints, such as the touch panel structure of the patent application scope, wherein the anisotropic conductive adhesive, the signal processing wafer described in item 7 of the anisotropy is 5 Glass material. The signal processing chip according to item 7 is characterized in that the first and second electrode blocks and the first and second wires are transparent ITO materials. The signal processing chip of the seventh item has the first and second transmission wires and the wafer electrical conductive paste. The signal processing chip described in item 7 has a layer of conductive adhesive on both ends of the third transmission wire and is electrically connected to the chip and the flexible film circuit 16 1364694. The month is called 曰 曰 替 = 12, as in the scope of patent application No. 7. The touch-sensitive eight-signal processing chip-type panel structure, wherein the sensing chip comprises: a power input port for connecting the power source; a signal input port, and the substrate is given to the substrate The transmission line and the second transmission line are electrically connected to input a parallel data nickname-analog/digital converter, and the power input and the ^^-sex connection are connected to each other, and the analogy of the signal input to the input is a digit. Signal output; π#, - timing controller is electrically connected to the analog/digital converter for generating a daily t-sequence signal transmission to the analog/digital conversion-parallel data conversion serial data output circuit, and is: The two-digit conversion is electrically connected, and the parallel data of the input and output of the signal is converted into a digital signal by analog/digital conversion, and then converted into serial data output; ,, a signal output, and the parallel data The serial data round circuit and the flexible thin film circuit board are electrically connected.