TWI360142B - Keyboard assembling method - Google Patents

Keyboard assembling method Download PDF

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Publication number
TWI360142B
TWI360142B TW97108454A TW97108454A TWI360142B TW I360142 B TWI360142 B TW I360142B TW 97108454 A TW97108454 A TW 97108454A TW 97108454 A TW97108454 A TW 97108454A TW I360142 B TWI360142 B TW I360142B
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TW
Taiwan
Prior art keywords
housing
temperature
keyboard
control device
temperature control
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TW97108454A
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Chinese (zh)
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TW200939271A (en
Inventor
Jeng Tai Chen
Ke Yung Wang
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Darfon Electronics Corp
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Application filed by Darfon Electronics Corp filed Critical Darfon Electronics Corp
Priority to TW97108454A priority Critical patent/TWI360142B/en
Priority to US12/265,818 priority patent/US20090116180A1/en
Publication of TW200939271A publication Critical patent/TW200939271A/en
Application granted granted Critical
Publication of TWI360142B publication Critical patent/TWI360142B/en

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  • Input From Keyboards Or The Like (AREA)

Description

1360142 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種鍵盤以及鍵盤組裝方法,並且特別 地,本發明係關於一種使用焊接方式結合之鍵盤及其組裝方 法。 【先前技術】1360142 IX. Description of the Invention: [Technical Field] The present invention relates to a keyboard and a keyboard assembling method, and in particular, to a keyboard using a welding method and an assembling method thereof. [Prior Art]

一般市面上常見的電子健輸人單元(例如電腦或個人數 位助理的鍵盤)係使闕騎固定輸人單元之上蓋以及底板所 組裝而成。為了·輸人單元的翻,所使__釘之尺寸必 須大於-定鮮。然而,近年來由於電子產業趨向小型化, 使用的輸人裝置亦趨向較小面積以及較薄厚度,螺絲釘佔用 的面稽以及厚度將會限制輸入裝置的小型化。 方f,接工作技子元件以及電子設備製程中相 j要的-個壤節。焊接之目的以及方法在於加熱金屬 ΐίίϊϊ便f合。科來,高料#射焊接技術被廣泛運 產ί如汽車工業、祕11具以及電子元件等需要 雷射焊接具有多項伽,例如:不受工件 響,只要雷射光能夠到達處即可烊接雷 中於極小區域’相當適合高精密度之焊接工 於雷轉聽扣塊^因此很 ’ ^太、汽車以及電子王群精密工業。 因此’本翻提供—種額職料,並且_地,使 5 1360142 =蟬接方式組裝而成之鍵盤,以符合小型化以及輕量化 生之殘留應熱ί接工件所產 力已較傳統烊接小,但由於其工件通常接之殘留應 積或厚度,殘留應力造成 2較小之面積、體 而言具有f大影響,_降低產^=件所要求之精密度The common electronic health input unit (such as the keyboard of a computer or personal digital assistant) is usually assembled on the upper cover and the bottom plate of the fixed input unit. In order to turn the input unit, the size of the __ nail must be greater than - fixed. However, in recent years, as the electronics industry has become smaller, the input devices used have also become smaller in size and thinner in thickness, and the surface and thickness occupied by the screws will limit the miniaturization of the input device. Fang f, picking up the work technology components and the phase of the electronic equipment process. The purpose and method of welding is to heat the metal ΐίίϊϊ. Kelai, high material #射焊技术 is widely used in production. For example, the automotive industry, the secret 11 and the electronic components require laser welding to have multiple gamma. For example, it is not subject to the workpiece, as long as the laser light can reach the location. Leizhong in a very small area 'is quite suitable for high-precision welding workers in the thunder to hear the buckle block ^ so very '^ too, the car and electronic Wang Qun precision industry. Therefore, 'this turn provides - the amount of materials, and _ ground, make 5 1360142 = the keyboard assembled by the splicing method, in order to meet the miniaturization and light weight of the residual residue should be hot, the production of the workpiece has been more traditional 烊Smaller, but due to the residue or thickness of the workpiece, the residual stress causes 2 small areas, the body has a large influence on f, _ reduce the precision required for the production

接鍵盤提供—觀助焊接之方法來辅助焊 【發明内容】 =、明之-範#在於提供—_烊接方式結合之 其組裝方法 鍵盤及 根據一具體實施例,本發明之鍵盤 殼體以及複數個按鍵。1中,第—3d戈,、弟- 弟设體包含複數個開口部; ίί& 個f接部。按鍵係屬置於第二殼體上,並The keyboard provides the method of assisting the welding to assist the welding. [Inventive content] =, Mingzhi-Fan# is provided by the method of assembling the keyboard with the assembly method and according to a specific embodiment, the keyboard housing and the plural of the invention Buttons. In 1st, the 3rd day, the younger brother-in-law contains a plurality of openings; ίί& f-joints. The button is placed on the second housing, and

一殼體之開口部卜於本具體實施例中, 卩與第—鐘叫財式結合。此外,第二 ί二如有凸出結構’此凸出結構係以沖壓方式沖壓 接。又_ ^成,並且此凸出結構可抵接第一殼體以幫助焊 以^本if實施财’鍵盤之組裝方法係先挾持第一殼體 焊结使第二殼體之焊接部抵接第一殼體,再利用 接第—殼體以及第二殼體之焊接部以完成鍵盤之 本發明之另一範疇在於提供—種鍵盤組裝方法,用以透 1360142 ϊϊϊίί協助組裝一鍵盤之一外殼結構,並且特別地,本 喊綠祕助魏工狀焊紐紅嚴重形變 根據一具體實施例,本發明之鍵盤組裝方法包含下列步 ϊΐίΐ 1第—控溫裝置維持並且提供第—溫度至鍵盤之 ’以第二控溫裝置維持並且提供第二溫度至 f處之弟—殼體’其中該第—溫度低於該第二溫度;接著, ίϊ控ίΐ置,第二控溫裝置相互配合以挾持第-殼體以 及苐一"又體,使第一殼體以及第二殼體相互貼合;最後,焊 接第一殼體以及第二殼體以完成該外殼結構。 於本具體實施例中,第-殼體以及第二殼體分別 數個第-焊接點以及複數個第二焊接點。當第—ς 焊接點也貼合至相對應的第二焊接點:此 外,苐一控溫裝置進一步包含第一控溫器以及第— 且第一控溫器係用以控制並維持第一本體之溫度,^ 體大致上維持第一溫度;第二控溫裝置進一步包含 器以及第二本體,並且第二控溫器係用以控制並維 體之溫度,使第二本體大致上維持第二溫度。 一 其中,第一控溫裝置之第一本體直接接觸第—殼 且因第一忒體係具有良好導熱率之導熱材料所構成,篦 一殼體大致上可維持第一溫度。此外,第二控溫裝置 本體直接接觸第二殼體,並且因第二殼體係具有良好 之導熱材料所構成,因此第二殼體大致上可維持第二溫度、y' 於本具體實施例中,第一控溫裝置及/或第二控溫 可進一步包含複數個焊接孔洞。藉由這些焊接孔洞,^ 一殼體以及第二殼體上的焊接點進行焊接。 7 1360142 附圖精神相藉由叮的發料述及所 【實施方式】 β閱圖 _係'繪示根據本發明之—具體實施例之 鍵,1的剖面圖。如圖-所示,鍵盤i包含第- 以及複數個按鍵14。其中,第-殼體w進-步包The opening of a casing is combined with the first clock in the present embodiment. In addition, the second structure has a protruding structure. The protruding structure is stamped and stamped. Further, the protruding structure can abut the first casing to help weld the assembly method of the keyboard. The first casing is welded to the first casing and the welded portion of the second casing is abutted. The first housing, which utilizes the welding portion of the first housing and the second housing to complete the keyboard, is another aspect of the present invention to provide a keyboard assembly method for assisting in assembling a housing of a keyboard through 1360142 ϊϊϊίί Structure, and in particular, the present invention, the keyboard assembly method of the present invention comprises the following steps: 1 - the temperature control device maintains and provides the first temperature to the keyboard 'Maintaining and providing a second temperature to the second portion of the temperature control device - the housing 'where the first temperature is lower than the second temperature; then, the second temperature control device cooperates with each other to hold The first housing and the first housing and the second housing are attached to each other; finally, the first housing and the second housing are welded to complete the housing structure. In the specific embodiment, the first housing and the second housing respectively have a plurality of first solder joints and a plurality of second solder joints. When the first ς solder joint is also attached to the corresponding second solder joint: in addition, the first temperature control device further includes a first temperature controller and the first temperature controller is used to control and maintain the first body The temperature substantially maintains the first temperature; the second temperature control device further includes a second body, and the second temperature controller is configured to control the temperature of the body to maintain the second body substantially second temperature. A first body of the first temperature control device directly contacts the first shell and is formed of a heat conductive material having a good thermal conductivity of the first crucible system, and the first housing substantially maintains the first temperature. In addition, the second temperature control device body directly contacts the second housing, and because the second housing has a good thermal conductive material, the second housing can substantially maintain the second temperature, y' in the embodiment. The first temperature control device and/or the second temperature control may further include a plurality of welding holes. Welding is performed by these soldering holes, solder joints on the housing and the second housing. 7 1360142 The spirit of the drawing is described by the 发 发 【 【 【 β β β 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 As shown in the figure - the keyboard i includes a - and a plurality of buttons 14. Wherein, the first-shell w-step package

if=開:;”00 ’第二殼體12則包含複數個焊is =;知鍵Μ分別設置於第二殼體12之上並且容置於開口』 Μ ΐ本f體實施例中’谭接部12G從第二殼體12凸出並且 抵接第-殼體1G,咖焊接方式,可將焊接部12Q 一封 體100結合’亦即,利用焊接方式結合第-殼體10以及第^ f體12。於實務中,可藉由沖㈣二殼體12之-面,可^ 第二殼體12之另一面形成焊接部12〇之凸出結構。 、 於實際應用中,上述之鍵盤1之組裝方法首先挾 一If=open:; 00 'the second casing 12 includes a plurality of welds is=; the known key Μ is respectively disposed on the second casing 12 and accommodated in the opening 』 The joint portion 12G protrudes from the second casing 12 and abuts against the first casing 1G, and the welding portion 12Q can be combined with the body member 100. That is, the first casing 10 and the second casing 10 are joined by welding. f body 12. In practice, the embossed structure of the welded portion 12 形成 can be formed by the other side of the second casing 12 by punching the surface of the second casing 12 . In practical applications, the above keyboard 1 assembly method first

豉體10以及第二殼體12,致使第二殼體12之垾接部12〇 接第一殼體10,接著焊接焊接部12〇以及第一殼體1〇 设體10以及第二殼體12結合而形成鍵盤1之外殼結構。 另外,按鍵14進一步包含鍵帽140、支撐結構142以及 彈性體144。於本具體實施例中,鍵帽14〇具有第一連接 H6,並且第二殼體12上具有第二連接部122。支撐結構 係一剪刀型支撐結構,但於實際應用中,支撐結構可為其他 能限制按鍵移動之任意結構,而不受限於本具體實施例;;透 過第一連接部Μ6以及第二連接部122,支撐結構142可連 結鍵帽140以及第二殼體12,藉以使按鍵14連結於鍵盤工 上。此外,彈性體144設置於鍵帽140以及第二殼體^之 8 < -S) 按鍵14被按壓時彈性體144將會變形,當按壓 ^性體m本身之彈性恢復力則會幫助鍵帽M〇回g原位 告按按鍵14亦可包含開關單元(未繪示於圖中), 田杈鍵14被按壓時會觸發此開關單元並傳送出—訊號。 外,於實務中,第一殼體10以及第二殼體12 ^;署 示於途中),此薄膜電路板與_單ί電ί 按壓錢收開關單元傳送出之訊號,據以判斷按鍵14被 目參閱圖二以及圖三,圖二倾示根據本發明之-具體實施例之鍵盤組裝方法的步驟流程圖; 及ΐ二控溫裝置相互配合狹持= 及第一Λ又體的剖面示意圖。如圖二所示,本具 ,組裝方法係用於協助烊接鍵盤中之·第一殼體以及第二嗖 體二此鍵盤組裝方法包含下列步驟:首先,於步驟幻双 = 並提供第一溫度至第-殼體,並且以第 一控脈裝置維持並提供第二溫度至第二殼體;接著, ,第—控溫裝置以及第二控溫裝置相互配合並且i持 ,一设體以及第二殼體,致使第一殼體貼合第二殼體:最 後,於步驟S24中,烊接第一殼體以及第二殼體。 仙ί注ΐ,於本具體實施例中步驟S22係於執行步驟S2〇 ^ ^ 中’可先執行步驟S22後再執行步驟 以及第㈣置以及第二控溫裝置歧持第一殼體 以及第一欣體後’再力別對第—殼體以及第二殼體控溫。 如圖三所示,第一控溫裝置3〇進一步包含第一 300以及第-本體302 ’而帛二控溫裝f 32 μ進一步^ 二控溫器320以及第二本體322。其巾,第一控溫器遍維 1360142 ΪΐΪΪΪ一溫度至第一本體3〇2,並且,第二控溫器%維 二溫度至第二本體322。於實務上,第-溫度低 請注意,於實務中,“二= ΐ开^以iri體、第二本體、第—控溫器以及第二控溫器 之瓜狀以及位置’可錄據使用者需求而具有不_配置。 赴=本ΐ體實施例中,第—殼體4G上包含複數個第一焊接 L、’苐二殼體42上包含分別對應於複數個第一焊接點 之複數個第二焊接點420。第一控溫裝置3〇及第一 ^置32相互配合以挾持第,體4Q以及第二殼體H 第40以及第二殼體42相互貼合,如圖三所示 外,當第一殼體40與第二殼體汜相互貼合時,各第一 點400也與相對應之第二焊接點420相互貼合。 士於本具體實施例中,第一本體302、第二本體322、第一 ,體恥以及第二殼體42皆使用良好導熱率之導熱材料所製 ^ 1須注意的是,構成上述四者之導電材料不需完全相 舉例而吕’第一殼體4〇以及第二殼體42可以由銘製 執本體302以及第二本體322可以另一種非铭之導 熱材料製成。由於第-本體3〇2、第二本體322、第一殼體 4〇以及第二殼體42均具有良好的導熱率,第 處接”且大致維持第—溫度,第二殼體42 = 第一本體322處接焚並且大致維持第二溫度。 別、nt外’第一控溫装置3〇之第—本體3〇2 &含複數個焊接 ^洞綱。焊接孔洞綱係、分別對應於第一焊接點4〇〇以及 ίϊΐ接點 ’ #第—控㈣置3°以及第二控溫裝置32 *夺第一破,40以及第一殼體42時,各第一焊接點 400以 相對應之第二焊接點42〇可藉由焊接孔洞3〇4接受焊接。 於實務上,尤其是f要較精密之焊接製程時,可使用雷射透The body 10 and the second housing 12 cause the splicing portion 12 of the second housing 12 to be coupled to the first housing 10, and then the soldering portion 12 and the first housing 1 and the second housing 12 combines to form the outer casing structure of the keyboard 1. Additionally, the button 14 further includes a keycap 140, a support structure 142, and an elastomer 144. In the present embodiment, the keycap 14A has a first connection H6 and the second housing 12 has a second connection portion 122 thereon. The supporting structure is a scissor-type supporting structure, but in practical applications, the supporting structure may be any structure that can restrict the movement of the button, and is not limited to the specific embodiment; through the first connecting portion Μ6 and the second connecting portion 122. The support structure 142 can connect the keycap 140 and the second housing 12, so that the button 14 is coupled to the keyboard operator. In addition, the elastic body 144 is disposed on the keycap 140 and the second housing 8<-S). When the button 14 is pressed, the elastic body 144 will be deformed, and when the elastic resilience of the pressing body m itself is pressed, the key is assisted. The cap M can be used to press the button 14 and can also include a switch unit (not shown in the figure). When the field button 14 is pressed, the switch unit is triggered and the signal is transmitted. In addition, in practice, the first housing 10 and the second housing 12 are displayed on the way, and the thin film circuit board and the _ single power supply press the signal transmitted by the money receiving switch unit, thereby determining the button 14 Referring to FIG. 2 and FIG. 3, FIG. 2 is a flow chart showing the steps of the keyboard assembly method according to the embodiment of the present invention; and FIG. 2 is a cross-sectional view of the second temperature control device and the first and second body. . As shown in FIG. 2, the assembly method is used to assist the first housing and the second body in the keyboard. The keyboard assembly method includes the following steps: First, in the step magic double = and provide the first Temperature to the first housing, and maintaining and providing a second temperature to the second housing by the first control device; then, the first temperature control device and the second temperature control device cooperate with each other and The second housing causes the first housing to fit the second housing: Finally, in step S24, the first housing and the second housing are coupled. In the specific embodiment, step S22 is performed in step S2〇^^, and then step S22 may be performed first, then step (4) and second temperature control device may be used to dispose of the first shell and the first After a body, it is not necessary to control the temperature of the first casing and the second casing. As shown in FIG. 3, the first temperature control device 3 further includes a first 300 and a first body 302', and a second temperature control device 32 and a second body 322. The towel has a first temperature controller 1360142, a temperature to the first body 3〇2, and a second temperature controller 2D temperature to the second body 322. In practice, the first temperature is low, please note that in practice, "two = open ^ with iri body, the second body, the first - the temperature controller and the second temperature controller of the melon shape and position ' can be recorded In the embodiment of the present invention, the first housing 4G includes a plurality of first weldings L, and the second housing 42 includes a plurality of first welding points respectively corresponding to the plurality of first welding points. a second soldering point 420. The first temperature control device 3 and the first surface 32 cooperate with each other to hold the first body 4Q and the second housing H 40 and the second housing 42 are attached to each other, as shown in FIG. In addition, when the first housing 40 and the second housing 汜 are attached to each other, each of the first points 400 is also in contact with the corresponding second solder joint 420. In the specific embodiment, the first body 302, the second body 322, the first body, the body shame, and the second casing 42 are all made of a heat conductive material having good thermal conductivity. It should be noted that the conductive materials constituting the above four are not required to be completely exemplified. The first housing 4 and the second housing 42 may be guided by the body 302 and the second body 322 may be another non-instructive guide Made of material. Since the first body 3〇2, the second body 322, the first casing 4〇 and the second casing 42 all have good thermal conductivity, the first portion is connected and substantially maintains the first temperature, the second shell Body 42 = The first body 322 is incinerated and substantially maintains a second temperature. No, nt outside 'the first temperature control device 3 〇 - the body 3 〇 2 & contains a plurality of welding ^ hole class. The welding hole system corresponds to the first welding point 4 〇〇 and the ϊΐ ϊΐ contact ' #第 - control (four) is set to 3 ° and the second temperature control device 32 * takes the first break, 40 and the first casing 42 Each of the first solder joints 400 can be soldered by the soldering holes 3〇4 at the corresponding second solder joints 42〇. In practice, especially when the welding process is more precise, the laser can be used.

S 10 1360142 過焊接孔洞304焊接第一焊接點400以及第二焊接點42〇。 根據另一具體實施例,本具體實施例與上一具體實施例 不同處,在於第二控溫裝置之第二本體包含複數個焊接孔洞 溫裝置之第—本體並無焊接孔洞,這些焊接孔洞分 別對應弟一焊接點以及第二焊接點。藉此,於第一 維持第一溫度並且第二殼體大致維持第二溫度之狀況下,第 及相對應之第二焊接點可藉由第二本體之谭接孔S 10 1360142 The over-weld hole 304 welds the first weld spot 400 and the second weld spot 42〇. According to another embodiment, the specific embodiment is different from the previous embodiment in that the second body of the second temperature control device comprises a plurality of welding holes, and the body has no welding holes, and the welding holes are respectively Corresponding to a weld point and a second weld point. Thereby, in the condition that the first temperature is maintained first and the second casing is substantially maintained at the second temperature, the second and second corresponding solder joints are connected by the tan of the second body

根據另一具體實施例,本具體實施例與上一具體實施例 不同處、’在於第-控溫裝置之第—本體包含複數個第一焊接 孔洞丄並且第二控溫裝置之第二本體包含複數個第二焊接孔 洞这,第一焊接孔洞以及第二焊接孔洞分別對應第一焊接 點,及第二雜點。藉此,於第—殼體大致維持第—溫度並 ii二ΐ體大致維持第二溫度之狀況下,第—焊接點以及相 對應之弟二焊接點可選擇性地藉由第一本體之第一焊接孔洞 及/或第二本體之第二焊接孔洞接受焊接。According to another embodiment, the specific embodiment differs from the previous embodiment in that 'the first body of the first temperature control device comprises a plurality of first welding holes 丄 and the second body of the second temperature control device comprises The plurality of second welding holes, the first welding hole and the second welding hole respectively correspond to the first welding point and the second noise point. Thereby, the first solder joint and the corresponding second solder joint can be selectively used by the first body under the condition that the first shell substantially maintains the first temperature and the second dichlet body maintains the second temperature substantially. A weld hole and/or a second weld hole of the second body is welded.

於實務上,上述各具體實施例之第一殼體以及第二殼體 可包含〒盤之上蓋以及底座。請—併參閱圖—以及圖四,圖 四係緣示根據本發明之—具體實制之鍵盤丨,進行焊接组裝 的不意圖。如圖四所示,鍵盤之上蓋10,係圖一中之第一殼體 並且鍵盤之底座12’係圖一中之第二殼體12。於本具體 實關第-控溫裝置3。,以及第二控溫裝置32,相互配合 1〇’以及底座12’ ’並且上蓋10’由第一控溫裝置30, 並且纽轉第—溫度,底座12,則由第二控溫裳置 32處接受並且大致維持第二溫度。 同樣地,於本具體實施例中,上蓋10,進一步包含複數個 開口邛100,底座12’則包含複數個焊接部〗2(),。按鍵14,分 11 " ° 1205 接二第 接焊接孔洞324,接受焊接(例如雷射焊 助处条丨田卩错由第一控溫裝置3〇’以及第二控溫裝置32,的辅 轉接方式組裝鍵盤Γ並且使㈣Γ之上蓋ω,ΐ 及底座12’大致維持原有形狀。 法,技術’本發’揭露之鍵盤以及鍵盤組裝方 於推接方式焊接鍵盤之上蓋以及底叙組裝鍵盤。 制上蓋以及底座分別維持不同溫度而使兩者 焊接產生的殘留應力而導致嚴重形變,進而影ϊ鍵 藉由以上較佳具體實施例之詳述,係希 述本發明之特徵與精神,而並非以上述所揭 施1 列來對本發明之麟加以限制。相反地,其目的是 涵蓋改變及具相等性的安排於本㈣所欲中請之: ,的範臂内°因此’本發明所申請之專利範圍的範嘴應該^ 據上述的作最寬廣的解釋,以致使其涵蓋 變以及具相等性的安排。 此的改In practice, the first housing and the second housing of each of the above embodiments may include a top cover and a base. Please refer to the drawings, as well as to Fig. 4, which are schematic diagrams showing the welding assembly according to the present invention. As shown in FIG. 4, the upper cover 10 of the keyboard is the first housing of FIG. 1 and the base 12' of the keyboard is the second housing 12 of FIG. In this specific implementation of the first - temperature control device 3. And the second temperature control device 32, which cooperates with each other and the base 12'' and the upper cover 10' is controlled by the first temperature control device 30, and the temperature is turned to the temperature, and the base 12 is placed by the second temperature control device 32. The second temperature is accepted and substantially maintained. Similarly, in the present embodiment, the upper cover 10 further includes a plurality of openings 邛100, and the base 12' includes a plurality of welded portions 2(). The button 14 is divided into 11 " ° 1205 and the second welding hole 324 is connected, and the welding is accepted (for example, the laser welding assisted strip is smashed by the first temperature control device 3 〇 ' and the second temperature control device 32 The transfer method assembles the keyboard Γ and makes the cover ω, ΐ and the base 12' of the (4) 大致 substantially maintain the original shape. The method of the present invention, the keyboard and the keyboard assembly are welded in the push-up manner, and the bottom cover is assembled. The upper cover and the base respectively maintain different temperatures to cause residual stress caused by the welding of the two to cause severe deformation, and the impact key is described in detail by the above preferred embodiments, and the features and spirit of the present invention are described. Rather, the invention is not limited by the above-listed columns. Conversely, the purpose is to cover the changes and equivalence arrangements in the present invention. The scope of the patent scope of the application should be based on the broadest interpretation of the above, so that it covers the changes and the arrangements of equality.

12 < S 1360142 【圖式簡單說明】 圖一係繪示根據本發明之一具體實施例之鍵盤的剖面 圖。 圖二係繪示根據本發明之一具體實施例之鍵盤組裝方法 的步驟流程圖。 圖三係繪示圖三之第一控溫裝置以及第二控溫裝置相互 配合挾持第一殼體以及第二殼體的剖面示意圖。 圖四係繪示根據本發明之一具體實施例之鍵盤進行焊接 組裝的示意圖。 【主要元件符號說明】 1、1,:鍵盤 10 :第一殼體 100、100’ :開口部 12 :第二殼體 120、120’ :焊接部 122 :第二連接部 14、14’ :按鍵 140 :鍵帽 142 :支撐結構 144 :彈性體 146 :第一連接部 S20〜S24 :步驟流程 30、30’ :第一控溫裝置 300 :第一控溫器 302 :第一本體 304、324’ :焊接孔洞 32、32’ :第二控溫裝置 320 :第二控溫器 13 1360142 322 :第二本體 40 : 400 :第一焊接點 42 : 420 :第二焊接點 10, 12’ :底座 第一殼體 第二殼體 :上蓋 1412 <S 1360142 [Schematic Description of the Drawings] Fig. 1 is a cross-sectional view showing a keyboard according to an embodiment of the present invention. 2 is a flow chart showing the steps of a keyboard assembly method according to an embodiment of the present invention. Figure 3 is a schematic cross-sectional view showing the first temperature control device and the second temperature control device of Figure 3 cooperating with the first housing and the second housing. Figure 4 is a schematic illustration of a soldering assembly of a keyboard in accordance with an embodiment of the present invention. [Description of main component symbols] 1, 1, keyboard 10: first housing 100, 100': opening portion 12: second housing 120, 120': soldering portion 122: second connecting portion 14, 14': button 140: key cap 142: support structure 144: elastic body 146: first connecting portion S20 to S24: step flow 30, 30': first temperature control device 300: first temperature controller 302: first body 304, 324' : welding holes 32, 32': second temperature control device 320: second temperature controller 13 1360142 322: second body 40: 400: first solder joint 42: 420: second solder joint 10, 12': base a housing second housing: upper cover 14

Claims (1)

1360142 100年10月3日修正替換頁1360142 October 3, 100 revised replacement page 、申請專利範圍: 一種鍵盤組裝方法,用於協助組裝一鍵盤之一外殼結構, 該鍵盤組裝方法包含下列步驟: (al)以一第一控溫裝置維持並且提供一第一溫度至一第一 殼體,並且以一第二控溫裝置維持並且提供一第二溫度 至一第二殼體,其中該第一溫度低於該第二溫度; 又 (a2)該第一控溫裝置以及該第二控溫裝置相互配合挾持該 第一殼體以及該第二殼體,致使該第一殼體貼合該第二 殼體;以及 D (a3)焊接該第一殼體以及該第二殼體以完成該外殼結構。 2、如申請專利範圍第1項所述之鍵盤組裝方法,其中該第一殼 體進一步包含複數個第一焊接點,並且該第二殼體包含^ 別對應至該等第一焊接點之複數個第二焊接點,當該第一 殼體貼合該第二殼體時,該等第一焊接點分別接觸相對應 之該等第二焊接點。 3、如申請專利範圍第2項所述之鍵盤組裝方法,其中該第一控 μ裝,及/或該第二控溫裝置進一步包含複數個焊接孔洞, 各該#第一焊接點以及相對應之各該等第二焊接點分別薜 由該等焊接孔洞接受焊接。 " 4、如申請專利範圍第1項所述之鍵盤組裝方法,其中該第一控 溫裝置進一步包含: 一第一本體,係由具有良好導熱率之一導熱材料所製 成;以及 ’ 一第一控溫器’用以控制該第一本體之溫度,致使該第 一本體雄持該第一溫度。 、如申研專利範圍第1項所述之鍵盤組裝方法,其.中該第二控 15 1360142 100年10月3日修正替換頁 溫裝置進一步包含: i第2體’係由具有良好導熱率之-導熱材料所製 二控溫器’用以控_第二本體之温度,致使該 二本體維持該第二溫度。 6、 如申請專利範圍第1項所述之鍵盤組裝方法,其中該第一殼 體以及該第一殼體係由具有良好導熱率之一導熱材料所製 成。 ’ 7、 如申請專利範圍第6項所述之鍵盤組裝方法,其中該導熱材 料係鋁。 广 8、 如申請專利範圍第1項所述之鍵盤組裝方法,其中該第一殼 體以及該第二殼體係為該鍵盤之上蓋及底座。' 9、 如申請專利範圍第1項所述之鍵盤組裝方法,其中該第一溫 度包含攝氏20度。 10、 如申請專利範圍第1項所述之鍵盤組裂方法,其中該第二溫 度包含攝氏80度。 11、 如申請專利範圍第1項所述之鍵盤組裝方法,其中該第一殼 體以及該第二殼體係以雷射進行焊接。 12、一種鍵盤組裝方法,用於結合一鍵盤之殼體,該鍵盤包含 一第一殼體、一第二殼體及複數個按鍵,該第一殼體包含 複數個開口部,該第二殼體,具有複數個焊接部,該等複 數個按鍵設置於該第二殼體,且容置於該等開口部,該鍵 盤組裝方法包含下列步驟: (al)挾持該第一殼體以及該第二殼體,致使該第一殼體 貼合該第二殼體;以及 16 1360142 13、 14、 Ο 15 100年10月3日修正替換頁 (a2)焊接該第一殼體以及該第二殼體以完成該外殼結構 如申請專利範圍第12項所述之鍵盤組裝方法,其中該第一 殼體進一步包含複數個第一焊接點,並且該第二殼體包人 刀別對應至該等第一焊接點之複數個第二焊接點,各該 二殼體貼合該.第二殼體時,該等第—焊接點分別 應之該雜二焊接點。 冊嘴相對 如申請專利範圍第12項所述之鍵盤組裝方法,i中該 及該第二殼體係由具有良好導熱率之^熱“戶; 、利範圍第14項所述之鍵盤組裝方法’其中該 導熱 16、 如申請專利範圍第12項所述之鍵盤組裝方法, 设體以及該第二殼體係為該鍵盤之上蓋及底座。δΛ 17、 如申請專利範圍第12項所述之鍵盤組步方 殼體以及該第二殼體係以雷射進行焊接二 八該第 17 1360142 _ 100年10月3日修正替換頁 十一、圖式: 10Patent application scope: A keyboard assembly method for assisting in assembling a shell structure of a keyboard, the keyboard assembly method comprising the following steps: (al) maintaining and providing a first temperature to a first by a first temperature control device a housing, and maintained by a second temperature control device and providing a second temperature to a second housing, wherein the first temperature is lower than the second temperature; (a2) the first temperature control device and the first The second temperature control device cooperates with the first housing and the second housing to cause the first housing to fit the second housing; and D (a3) welds the first housing and the second housing to Complete the outer casing structure. 2. The keyboard assembly method of claim 1, wherein the first housing further comprises a plurality of first solder joints, and the second housing comprises a plurality of corresponding first solder joints And a second soldering point, when the first housing is attached to the second housing, the first soldering points respectively contact the corresponding second soldering points. 3. The method of assembling a keyboard according to claim 2, wherein the first control device, and/or the second temperature control device further comprises a plurality of welding holes, each of the first welding points and corresponding Each of the second weld points is respectively welded by the weld holes. 4. The method of assembling a keyboard according to claim 1, wherein the first temperature control device further comprises: a first body made of a heat conductive material having a good thermal conductivity; and The first temperature controller ' is configured to control the temperature of the first body such that the first body holds the first temperature. The method of assembling a keyboard according to the first aspect of the patent research scope, wherein the second control 15 1360142 is revised on October 3, 100, and the replacement page temperature device further comprises: i the second body 'has a good thermal conductivity The two temperature controllers of the heat conductive material are used to control the temperature of the second body, so that the two bodies maintain the second temperature. 6. The keyboard assembly method of claim 1, wherein the first housing and the first housing are made of a thermally conductive material having a good thermal conductivity. 7. The method of assembling a keyboard according to claim 6, wherein the heat conductive material is aluminum. The keyboard assembly method of claim 1, wherein the first housing and the second housing are the upper cover and the base of the keyboard. 9. The keyboard assembly method of claim 1, wherein the first temperature comprises 20 degrees Celsius. 10. The keyboard splitting method of claim 1, wherein the second temperature comprises 80 degrees Celsius. 11. The method of assembling a keyboard according to claim 1, wherein the first housing and the second housing are welded by laser. 12. A keyboard assembly method for combining a keyboard housing, the keyboard comprising a first housing, a second housing and a plurality of buttons, the first housing comprising a plurality of openings, the second housing The body has a plurality of soldering portions, and the plurality of buttons are disposed in the second housing and are received in the openings. The keyboard assembly method includes the following steps: (al) holding the first housing and the first a second housing that causes the first housing to conform to the second housing; and 16 1360142 13 , 14 , Ο 15 October 3, 100 revised replacement page (a2) to weld the first housing and the second housing The method of assembling a keyboard according to claim 12, wherein the first housing further comprises a plurality of first solder joints, and the second housing package corresponds to the first a plurality of second solder joints of the solder joint, wherein each of the two shells is attached to the second shell, and the first solder joints respectively correspond to the solder joints. The book assembly method is the same as the keyboard assembly method described in claim 12, wherein the second casing is made of a heat-resistant household having a good thermal conductivity; The keyboard assembly method according to claim 12, wherein the housing and the second housing are the upper cover and the base of the keyboard. δΛ17, the keyboard group according to claim 12 The step shell and the second shell are welded by laser. The eighth is the 17th 1360142 _ 100 October 100 correction replacement page eleven, the figure: 10 10 100 Μ - 146 142 140 η 〇 18 I360142 100年10月3日修正替換頁10 100 Μ - 146 142 140 η 〇 18 I360142 October 3, 100 revised replacement page S20 第一控溫裝置維持並提供第一溫度 至第一工件,第二控溫裝置維持並 提供第二溫度至第二工件 S22 第一控溫裝置以及第二控溫裝置相 互配合挾持第一工件以及第二工件 致使第一工件貼合第二工件 S24 _1_? 焊接第一工件以及第二工件S20, the first temperature control device maintains and supplies the first temperature to the first workpiece, and the second temperature control device maintains and supplies the second temperature to the second workpiece S22. The first temperature control device and the second temperature control device cooperate with each other to hold the first workpiece And the second workpiece causes the first workpiece to conform to the second workpiece S24_1_1_? welding the first workpiece and the second workpiece 19 1360142 . _ * . ' 100年10月3日修正替換頁 〇19 1360142 . _ * . ' October 3, 100 revised replacement page 〇 20 1360142 涵20 1360142 Han 21twenty one
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