1360080 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種控制機制，尤指用於多功能晶片的控制機 制。 〜 【先前技術】 # 〜 ' 隨著行動通訊與資訊流通需求日益增加的時代來臨，通訊裝 置上資料(例如通訊錄)存取的方便性成為一個重要的發展議題。 目前市面上的通訊裝置之主流存取介面，主要為SIM卡介面 與SD/MMC卡介面這兩大類。在sim卡介面中，siM(IS0 7816)卡 屬於一種微處理器卡（Microprocessor Card)，由於其可用的儲 存空間及計算單疋的能力因其規格而受限制，因此無法提供大容 • 量儲存空間。其主要功能為全球行動通訊系統(GSM)的存取媒體。 SD/MMC相為目社流❹舰手機之婦介面，並在行動影音 槽案内容下載日漸盛行，帶動通訊裝置記㈣容量需求跟著加曰 大。為了滿足這方_需求，各大手機廠_推出多款外接記憶 卡手機’這使得SD/MMC卡對於通訊褒置已成為主要標準儲存介面。 在目前的通訊裝置上，普遍採用SIM卡作為通訊介面，並且 若需配合s_卡為其储存介面時，雖然可利用s_c卡作為 大容量之儲存介面，但卻需要硬體額外提供SD/MMC控制晶片及存 5 1360080 取蘭，這不但增加製造成本，也會延卿發時程。 由於SIMCIS0 7816)卡是手機專用元件，不易與電腦或其他行 動裝置連結。若需要存取sm卡中的檔案資料時，必須倚靠裝置 讀取献網路傳送。耻，除了 sm卡介面與SD/卡介面以外， 為了大幅增大SIM卡的齡容量，以應付通喊置的大容量記憶 體的需求’同時提供更便利的操作方式，M-Systeras公司特別推^ 癱了新架構的㈣囊™通訊裝置存取介^在Meg看中，主要以 -通贿置中的sm⑽娜)卡㈣構，再加上s_G卡之規格， 所共同構成出整合介面。 在MegaSIM™的新架構中，除了保有基本SIM卡之架構提供 完整通訊魏，有絲射特_，也可配合裝置，提 供更便利的操作模式’減少硬體成本，同時提供高速介面，加密 技術及高容量的快閃式儲存空間，可提供安全、可卸除式、標準 鲁化且隨時存取之特性。MegasI_這些特點降低了在多媒财機 另設SD/K卡機級軸本，並且提高好機场存 的必要性。 然而’_在同—時間只能對辩介面或SD/MMC介面 擇一進行齡的下達或資料的存取，意即在對㈣卡進行存取動 作時’除非結束對此介面的動作，否則在當中是無法對S_卡 介面進行下達指令·取資料_作。此—關，在對於軟體上 的應用及硬體上的控制，將會造成—定程度上的不便利。 6 1360080 在MegaSir架構中，針對SIM卡與s_c卡的儲存需求，事 實上還是分別_ 了不同的記憶贿組與控制器（針對⑽卡提供 了 EEPR0M及其記憶體控制器；針對SD/_C卡則提供了快閃記情 體及其記憶體控繼）。在此架構中，由於多了—組記憶控制器， 不但會佔賴多的郎’更是增加了魏消耗率。同時⑽卡所 需的儲存容量還是受隨EEP_的容量大小，而無法儲存至可外 加擴充的快閃記憶體。 【發明内容】 本發明之主要目的在提供一種用於多功能晶片的控制機制， 藉著接獲不同㈣功麟預定職的操作職時，轉操作訊號 的要求存取在記憶體模組中相對應的儲存區域，而無須針對不同 操作功能設置不同的記憶體模組與記憶體控制器，而達到省電與 微小化的目的。 本發明之次要目的在提供一種用於多功能晶片的控制機制， 藉著調整記憶體模組中每個儲存區域的位址範圍，以達到調整不 同操作功能所能使用到的記憶體容量。 本發明之次要目的在提供一種用於多功能晶片的控制機制， 藉著可擴充的快閃記憶體作為記憶體模組，而達到無限制擴充電 子裝置的記憶體容量。 舉例來說，MegaSIM的多功能晶片整合了複數種操作功能(例 7 1360080 與1sg 78i6) ’而每—操作1 力能以不同的通訊協定藉著 個脱、㈣預定腳位提供操作訊號。例如MegasiM的⑽、 vpp/cm ακ、RST、Vcc 腳位屬於 7816，而⑽、Μ”、1360080 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a control mechanism, and more particularly to a control mechanism for a multifunction wafer. ~ [Prior Art] # 〜 ' With the advent of the growing demand for mobile communications and information, the convenience of access to information (such as address books) on communication devices has become an important development issue. At present, the mainstream access interfaces of communication devices on the market are mainly two types of SIM card interface and SD/MMC card interface. In the sim card interface, the siM (IS0 7816) card is a microprocessor card. Due to its available storage space and the ability to calculate the unit, it is limited by its specifications, so it cannot provide large capacity and quantity storage. space. Its main function is the access medium of the Global System for Mobile Communications (GSM). The SD/MMC phase is the interface of the mobile phone of the mobile phone, and the content downloading of the action video and audio slot is becoming more and more popular, driving the communication device to record (4) the capacity demand is increasing. In order to meet this demand, major mobile phone manufacturers _ launch a variety of external memory card mobile phones. This makes the SD / MMC card has become the main standard storage interface for communication devices. In the current communication device, the SIM card is generally used as the communication interface, and if the s_ card is used as the storage interface, although the s_c card can be used as the large-capacity storage interface, the hardware is additionally required to provide the SD/MMC. Control the chip and save 5 1360080 to take the blue, which not only increases the manufacturing cost, but also delays the time course. Since the SIMCIS0 7816) card is a dedicated component for mobile phones, it is not easy to connect to a computer or other mobile device. If you need to access the files in the sm card, you must rely on the device to read the network transmission. Shame, in addition to the sm card interface and the SD/card interface, in order to greatly increase the age capacity of the SIM card to cope with the demand for large-capacity memory that is screaming, while providing more convenient operation, M-Systeras ^ 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在In the new architecture of MegaSIMTM, in addition to the architecture of the basic SIM card to provide complete communication Wei, there is a ray, can also be combined with the device to provide a more convenient operating mode 'reduce hardware costs, while providing high-speed interface, encryption technology And high-capacity flash storage space provides secure, removable, standard-lubricated and ready-to-access features. MegasI_ These features reduce the need to set up an SD/K card-level axis in the multi-media machine and improve the need for airport storage. However, '_ in the same time can only choose the age of the interface or the SD/MMC interface to access or access the data, that is, when accessing the (four) card, 'unless the action of this interface is ended, otherwise In this case, it is impossible to issue an instruction to the S_ card interface. This - off, in the application of software and hardware control, will result in a certain degree of inconvenience. 6 1360080 In the MegaSir architecture, the storage requirements for SIM cards and s_c cards are actually different. Different memory bribes and controllers (providing EEPR0M and its memory controller for (10) cards; for SD/_C cards It provides a flash memory and its memory control. In this architecture, because of the more-group memory controller, not only will it account for Lai's, but it will increase the Wei consumption rate. At the same time, the storage capacity required by the (10) card is still limited by the capacity of the EEP_ and cannot be stored to the flash memory that can be expanded. SUMMARY OF THE INVENTION The main object of the present invention is to provide a control mechanism for a multi-function wafer, which can access the memory module by requesting the operation of the different (4) Gonglin. The corresponding storage area does not need to set different memory modules and memory controllers for different operation functions, thereby achieving the purpose of power saving and miniaturization. A secondary object of the present invention is to provide a control mechanism for a multi-function wafer by adjusting the address range of each storage area in the memory module to achieve the memory capacity that can be used to adjust different operational functions. A secondary object of the present invention is to provide a control mechanism for a multi-function wafer that utilizes an expandable flash memory as a memory module to achieve an unlimited expansion of the memory capacity of the electronic device. For example, MegaSIM's multifunction chip integrates multiple operational functions (eg, 7 1360080 and 1sg 78i6) and each operation 1 can provide operational signals via a different communication protocol through a separate (4) predetermined pin. For example, the (10), vpp/cm ακ, RST, and Vcc pins of MegasiM belong to 7816, and (10), Μ”,
Vpp/CLK腳位屬於sd/顚c。The Vpp/CLK pin belongs to sd/顚c.
4基於上述目的，本發明用於多功能晶片的控制機制主要包含 ^憶體模_戦運算輪。記憶職_來鱗㈣，並針對 母一操作功能定義出相對應的儲存區域。邏輯運算單位則分別電 性連接至屬於每—操作功能中至少—個預定腳位，並在接獲相對 於#作魏的預定腳位輯作訊號時，依據操作峨的要求存取 在記憶體模組中相對應的儲存區域。 關於本㈣之優點與精神可吨由以下的發明詳述及所附圖 式得到進一步的瞭解。 【實施方式】 °月參閱第1圖’第1圖為本發明多魏晶片之實施範例示意 圖如第1圖所不，舉例來說，MegaSIM的多功能晶片1〇整合了 设數種操作功能（例如SD/MMC與腳丽）’而每—操作功能以不 同的通訊協定藉著侧或翻的預定腳位提供操作訊號。例如 MegaSIM 的 I/O、Vpp/CLK、_、ακ、脱、Vcc 腳位屬於觀， 而 Cmd、Data 0、Vpp/CLK 腳位屬於 SD/MMC。 »月參閱第2圖’第2圖為本發明用於多功能晶片的控制機制 8 之不思圖。如第2圖所示，本發明用於多功能晶片的控制機制主 要包含冗憶體模組14與邏輯運算單位12，以便提供多功能晶片 的儲存讀的需求。這其巾，邏輯運算單位12分別電性連接至 屬於每操作功能中至少—個預定腳位，以構成 ISO 7816與 SD/MMC介面。舉例來說，ISO 7816介面為MegaSIM的1/〇、 Vpp/ακ、GND、ακ、RST、Vcc 腳位’而 SD/MMC：介面則為 Cn]d、 Data 0、vpp/CLK腳位。舉例來說，邏輯運算單位i2使記憶體模 、’且14中預定範圍内的記憶體實體位址提供給如iS〇 7816與 SD/MMC的操作功能，以針對如IS〇 7816與SD/MMC的操作功能定 義出相對的儲存區域14a與14b。 需注意的是，多功能晶片10的SD/MMC與ISO 7816介面相對 於上述個別或共用的腳位，同時還可進一步電性連接USB介面以 及進一步包含微控制器（MCU)、RAM、ROM以及負責控制SD/MMC及 7816介面的邏輯運算單位(L〇gic Unit)。邏輯運算單位包含演算 機制，負責因應通訊裝置透過SD/MMC介面及7816介面對於記憶 體的存取。 簡單來說，本發明用於多功能晶片的控制機制在接獲不同操 作功能的預定腳位的操作訊號時，依據操作訊號的要求存取在記 隐體核組14中相對應的儲存區域14a或14b ’而無須針對不同操 作功能設置不同的記憶體模組與記憶體控制器，而達到省電與微 小化的目的。同時，原本所需的兩種介面各自獨立的控制機制， 1360080 經由本發明的演算法，將只需 面及麵介面進行指令㈣== 可嗔對7816介 二第3A'_為本發明用於多功能晶片的 徑制機制之實細*不思圖。如篆qA on 口如弟3A~3B圖所示，本發明用於多功能 晶片__仍主要包含記憶體模組14與邏輯運算單位12。 如第3A騎示’舉例來說，當包含有本發明_功能晶片4 Based on the above object, the control mechanism of the present invention for a multi-function wafer mainly comprises a memory model. Memory _ _ scale (four), and define a corresponding storage area for the mother-operating function. The logic operation unit is electrically connected to at least one predetermined pin position belonging to each operation function, and is accessed in the memory according to the operation 峨 when receiving the predetermined foot position signal relative to #为魏. The corresponding storage area in the module. The advantages and spirit of this (4) can be further understood from the following detailed description of the invention and the drawings. [Embodiment] FIG. 1 is a schematic view showing an example of implementation of a multi-wei wafer according to the present invention. As shown in FIG. 1, for example, the multi-function chip of MegaSIM integrates several operational functions ( For example, the SD/MMC and the footsteps'' each operation function provides operation signals by a side or a predetermined predetermined position with different communication protocols. For example, MegaSIM's I/O, Vpp/CLK, _, ακ, 脱, Vcc pins belong to the view, while the Cmd, Data 0, and Vpp/CLK pins belong to SD/MMC. »Monthly referring to Fig. 2' Fig. 2 is a schematic view of the control mechanism for the multi-function wafer 8 of the present invention. As shown in Fig. 2, the control mechanism of the present invention for a multifunction wafer mainly includes a redundancy module 14 and a logical operation unit 12 to provide a storage read requirement for the multifunction wafer. In this case, the logical operation unit 12 is electrically connected to at least one predetermined position in each operation function to form an ISO 7816 and SD/MMC interface. For example, the ISO 7816 interface is MegaSIM's 1/〇, Vpp/ακ, GND, ακ, RST, and Vcc pins' while the SD/MMC: interface is Cn]d, Data 0, and vpp/CLK pins. For example, the logical unit of operation i2 provides memory phantoms, and the memory entity addresses within a predetermined range of 'and 14' to the operational functions such as iS〇7816 and SD/MMC, for eg IS〇7816 and SD/MMC The operational functions define opposing storage areas 14a and 14b. It should be noted that the SD/MMC and ISO 7816 interfaces of the multi-function chip 10 are further connected to the above-mentioned individual or shared pins, and can further electrically connect the USB interface and further include a microcontroller (MCU), a RAM, a ROM, and Responsible for controlling the logical unit (L〇gic Unit) of the SD/MMC and 7816 interfaces. The logic unit includes a calculation mechanism that is responsible for accessing the memory by the communication device through the SD/MMC interface and the 7816 interface. Briefly, the control mechanism for the multi-function wafer accesses the corresponding storage area 14a in the crypto core set 14 according to the requirements of the operation signal when receiving the operation signal of the predetermined position of the different operation functions. Or 14b ' without having to set different memory modules and memory controllers for different operating functions, to achieve power saving and miniaturization. At the same time, the two interfaces required to be independent of each other, 1360080 through the algorithm of the present invention, will only need to face and face interface instructions (four) == can be used to 7816 two 2A ' _ for the invention The actual size of the multi-function wafer is not considered. As shown in the figure of FIG. 3A~3B, the present invention for the multi-function chip __ still mainly includes the memory module 14 and the logical operation unit 12. As shown in FIG. 3A, for example, when the present invention is included
的控制機制^通訊裝置，希望以_介面進行存取記憶體模組U 夺邏輯運算單位12之次异法將傳入的資料經過處理後映射至記 憶體模組Μ之實體位址（即儲存區域Ua)。換言之，凡是經由鳩 介面之資料傳輸，都將於指定之實體位址的區域内存取。舉例來 說’若透過而介面存取的動作，演算法將其存取之記憶體實體 位址指定為議至_。錢行齡或讀树，演紐會將資料 由指定之實體位址區_存人或讀出。反之，蚊的實體記憶體 區域之外’將是保留給另-介面(SD/聽)所錢的區域。 如第3B圖所示’舉例來說，以SD/MMC介面進行存取記憶體 模組14之動作時，邏輯運算單位12之演算法將傳入的資料經過 處理後映射纽之實體紐（即儲存區域⑽。射之，凡是 經由SD/MMC介面之資料傳輸’都將於指定之實體位址的區域内存 取。舉例來說，若是透過SD/MMC介面存取的動作，演算法將其存 取之記憶體實體位址指定為0x00至〇x〇c。在進行儲存時，演算法 會將資料存放於指定之實體紐區_。反之，在讀取時，亦於 1360080 指定之區域將資料取出。 此外’⑽魏介面的儲存容量需要擴大時，只要透過邏輯 運轉位12調整記憶體模組14中每個儲存區域14a、14b的記憶 體^體位址_疋賴’就可達_整不哪作功能所能使用到 的記憶體容量。 Μ “上所述’在本發_於多功能晶片的控制機制所提出的演 A 4射纟魏如处崎的树面整合，峨me«細（即記憶 ^體模組⑷為兩種介面的儲存媒介，這使得無論是7816介面或是 SD/MMC ;|面ό細算域理後安排置放於指定的實體記憶體區域 中’以達到更方便、多工及快速的目的。 藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本 發明之特徵與精神，而並非以上述所揭露的較佳具體實施例來對 本發明之範缚加以限制。相反地，其目的是希望能涵蓋各種改變 鲁 及具相等性的安排於本發明所欲申請之專利範圍的範轉内。 【圖式簡單說明】 第1圖為本發明多功能晶片之實施範例示意圖。 第2圖為本發明用於多功能晶片的控制機制之示意圖。 第3Α〜3Β圖為本發明用於多功能晶片的控制機制之實施示意 圖。 1360080 【主要元件符號說明】 10多功能晶片 12邏輯運算單位 14記憶體模組 14a、14b儲存區域The control mechanism ^ communication device, hopes to use the _ interface to access the memory module U to take the logical operation unit 12 different methods to process the incoming data to the physical address of the memory module (ie, storage Area Ua). In other words, any data transmission via the interface will be accessed in the area of the specified physical address. For example, if the interface accesses through the action, the algorithm specifies the memory entity address to which it accesses to _. Qian Xiling or reading the tree, the performance will be stored or read from the designated physical address area. Conversely, the area outside the physical memory area of the mosquito will be the area reserved for the other interface (SD/listening). As shown in FIG. 3B, for example, when the operation of the memory module 14 is performed by the SD/MMC interface, the algorithm of the logical operation unit 12 passes the processed data to the entity of the processed map (ie, The storage area (10). Shooting, any data transmission via the SD/MMC interface will be accessed in the area of the specified physical address. For example, if the operation is accessed through the SD/MMC interface, the algorithm will save it. The memory entity address is specified as 0x00 to 〇x〇c. When storing, the algorithm stores the data in the specified entity button _. Conversely, when reading, the data is also specified in the area specified by 1360080. In addition, when the storage capacity of the (10) Wei interface needs to be expanded, it is only necessary to adjust the memory address of each storage area 14a, 14b in the memory module 14 through the logic operation bit 12. The memory capacity that can be used for the function. Μ "The above description" is based on the control mechanism of the multi-function wafer, and the A 4 shot of Wei Ruqi's tree surface is integrated, 峨me« (ie memory module (4) is the storage of two interfaces Media, which makes it possible to place it in the specified physical memory area, whether it is 7816 interface or SD/MMC; | to achieve more convenient, multiplex and fast purposes. The detailed description of the preferred embodiments of the present invention is intended to be illustrative of the invention and the invention The various modifications and equivalent arrangements are included in the scope of the patent application scope of the present invention. [Simplified Description of the Drawings] Fig. 1 is a schematic view showing an example of the implementation of the multifunctional wafer of the present invention. Schematic diagram of the control mechanism for the multi-function wafer. The third to third diagrams are schematic diagrams of the implementation of the control mechanism for the multi-function wafer of the present invention. 1360080 [Major component symbol description] 10 multi-function wafer 12 logic operation unit 14 memory phantom Group 14a, 14b storage area