1356464 九、發明說明： '【發明所屬之技術領域】 本發明係有關於一種封裝基板製法，更詳而言之，係 有關於一種具強化結構之封裝基板製法。 ” 【先前技術】 自IBM公司在I960年早期引入覆晶封裝（FUp cMp package)技術以來’相較於打線接合（Wire b〇nd)技術， 該覆晶技術之特徵在於半導體晶片與封裝基板之間的電 性連接係藉由焊錫凸塊取代打線接合之金線；而該覆晶 技術具有提高封裝密度以降低封裝元件尺寸之優點，同時 不需使用長度較長之金屬導線作為電流傳導路徑，故可提 高電性性能，以滿足高線路密度、高速度之半導體裝置需 求。請參閱第1圖，在現行覆晶（flip chip)技術中，係 將金屬凸塊π形成於半導體晶片1〇之電極墊1〇1上以 及由焊料所製成之導電元件12形成於該封裝基板13之電 •性連接墊131 i ’以將該半導體晶片1〇之金屬凸塊" 對應該封裝基板13之導電元件12,並在；i以使該導電元 件12熔融之迴焊溫度條件下，將該導電元件^迴焊至相 ’子應之金屬凸塊1卜使該半導體晶片1 Q電性連接該封裝 基板13;其中，該導電元件12之形成計有植球、印刷 (Pnntlng)或電鐘⑻咖。〜如）等方式，該植球方 式係於封裳基板之電性連接塾上置入錫球（Μ如^⑴ 後再、二由迴焊（Ref i 〇w)製程使錫球炫融後而接置於電性 連接塾上；該印刷方式«teneil Printing)係以網板印 110539 5 1356464 刷將錫膏印刷於封裝基板 •(油0W)以形成該導 U接塾上’再經迴焊 .基板上先形成導電層以作：後：：電鍍方式係於該封裳 '流傳導_，然後形成阻層，再材料所需之電 錫材料，最後移除阻層及1 Ά电層上電#形成痒 料電鍍於該封裝美板^1 /盖之導電層’俾將厚錫材 形成該導電=板之电性連接塾上，之後再進形迴焊以 另’為因應半導體封震件的微型化之 漸趨r薄型化’然而該封裝基板愈薄，愈易造成= 二;page)或變形的現象’此對於需要求精準對位的4 體製程及良料較為㈣，且軸録板太的^ 在後段製程傳送及固定灼兀足^4p 崎才匆又水， 亦合…旱握；如切割(Saw)製程， 亦曰對封#基板產生麵曲或變形，而藉由該 置支撲架（Stlfiener)強化該封裝基板結構以避免產生勉又 曲0 # 請茶閱第2A至2G圖，係為習知具強化封裝基板之势 法剖視示意圖；首先，係提供一表面具有線路層2〇ι之‘ 載板20，該線路層201並具有複數個電性連接墊2〇2，且 於該承載板20及線路層201上形成有絕緣保護層21，經 曝光、顯影製程形成有複數開孔21〇以對應露出二電性= 接墊202之部分表面（如第2Α圖所示）；接著，提供一具 有開孔220之印刷網板（stenci 1 )22置於該絕緣保護層21 上，且該印刷網板22之開孔220對應該絕緣保護層θ 21 之開孔210(如第2B圖所示）；以印刷方式（Stencil 110539 6 1356464 - hnting)將錫膏23填入該開孔22〇中（如第％圖所 •不）；再將該印刷網板22移除（如第2D圖所示)；經由迴 谭製程使該錫膏23融炫形成導電元件23，而與下方之各 電性連接塾202相互電性連接（如第2£圖所示）；之後切 割（SaW)該承載板2G，以分割成複數個封裝基板20a，且 。亥封裝基板2Ga上各具有複數個導電元件23，（如第2{?圖 所示）；最後，再於該封裝基板2〇a之部分絕緣保護層21 上以點著方式接置支撐架24，藉以強化該封裝基板他， 豸支撐架24係具有開口 24〇以露出該導電元件23，（如第 2G圖所不）。另裝設該支撐架％之製程亦可於切割 步驟=進行，依預定位置設置該支樓架24(如第2F，圖所 不）’最後再進行切割以分隔成具有支撐架24之封裝基板 2〇a(如第2G圖所示）。 然而，上述以印刷方式製作預銲錫結構的方法良率較 低且印刷網板成本而昂，另該承載板係於形成導電元件後 ⑩再切割（Saw)，而切割製程易造成封裝基板產生翹曲繼而 衫響後續设置該支撐架（Stiffener)，但若先進行置設該 支撐架再進行印刷，則又因該支撐架係因突起，網板覆蓋 之密合度不佳而影響製作導電元件白勺良率，故如何有效降 低基板的翹曲與變形來提高製程良率，以及克服先置設支 撐架後再於封裝基板上以低成本製作導電元件為當今亟 待思考之課題。 【發明内容】 鑒於以上所述習知技術之不足，本發明之一目的在於 110539 7 1356464 種具強化結構之料基板製法，能有 翹曲與變形，以提高製程良率。 极 夷板目的在於提供—種具強化結構之封裳 土〜’咸減少基板變形而增加製程.穩定性及良率。 美板明之又—目的在於提供—種具強化結構之封裝 :板衣法’能以低成本方式於強化之基板上製作導電元 件0 為達上揭目的’本發明提供—種具㈣結構之封裝基 反乂法’係包括:提供至少-表面具有電性連接塾之承載 反，並於該承載板及電性連接塾上形成絕緣保護層，且該 絕緣保護層形成有開孔以露出該電性連接墊之部分表 面，於該絕緣保護層上設置具有開口之支樓架，並露出該 部分絕緣㈣層及該些電性連接墊；於該絕、緣保護層之 開孔中置入錫球，使該錫球設於各電性連接塾表面；進行 =焊製程使該錫球電性連接該電性連接塾；以及切割該 叹置有切架之承餘，以形成複數具有支撐架之封裝基 板。 發明復提供-種具強化結構之封裝基板製法，係包 括：提供至少一表面具有電性連接墊之承載板並於該承 載板及电性連接墊上形成絕緣保護層，且該絕緣保護層形 ^有開孔以露出該電性連接墊之部分表面；於該絕緣保 。蒦層上叹置具有開口之支樓架，並露出言亥部分絕緣保護層 及^些電性連接墊；切割該設置有支撑架之承載板，以形 成複數具有支榜架之封裝基板；力該絕緣保護層之開孔 】10539 8 中置入錫球，使該錫球設於各電性連接墊表面；以及進行 迴焊製程使該錫球電性連接該電性連接墊。 依上述之製法，該承載板係為絕緣板及具有線路層之 電路板之其中—者；復包括於該絕緣保護層表面及電性 連接墊表面形成一助焊劑；該支撐架係為金屬、陶曼及金 ^複合^料之其中-者’且該支撐架以係為環氧樹脂接合 洌之黏著劑結合於該絕緣保護層上。1356464 IX. Description of the invention: '[Technical field to which the invention pertains] The present invention relates to a method of manufacturing a package substrate, and more particularly to a method of manufacturing a package substrate having a reinforced structure. [Prior Art] Since the introduction of the FUp cMp package technology by IBM in the early 1960s, the flip chip technology is characterized by a semiconductor wafer and a package substrate. The electrical connection is replaced by a solder bump to replace the wire bonding gold wire; and the flip chip technology has the advantages of increasing the package density to reduce the size of the package component, and does not require the use of a long metal wire as a current conduction path. Therefore, the electrical performance can be improved to meet the requirements of high-density, high-speed semiconductor devices. Referring to FIG. 1, in the current flip chip technology, metal bumps π are formed on a semiconductor wafer. The electrode pad 1 〇 1 and the conductive member 12 made of solder are formed on the electrical connection pad 131 i ' of the package substrate 13 to align the metal bump of the semiconductor wafer with the package substrate 13 Conducting element 12, and re-welding the conductive element to the metal bump 1 of the phase in the reflow temperature of the conductive element 12, so that the semiconductor wafer 1 Q The connection of the conductive substrate 12 is performed by a ball bonding, printing (Pnntlng) or electric clock (8) coffee, etc., and the ball bonding method is connected to the electrical connection of the sealing substrate. Put a solder ball on it (such as ^(1) and then Ref i 〇w) to make the solder ball melt and then connect it to the electrical connection; the printing method «teneil Printing" is a net Plate printing 110539 5 1356464 The solder paste is printed on the package substrate • (Oil 0W) to form the U-connector' and then re-welded. The conductive layer is first formed on the substrate for: Post:: Electroplating method is attached to the seal The skirt 'flow conduction _, then form a resist layer, and then the material required for the tin material, and finally remove the resist layer and 1 Ά electric layer on the power # form itch material plating on the package of the beauty board ^ 1 / cover conductive layer '俾The thick tin material is formed on the electrical connection of the conductive plate, and then the reflow is performed to further reduce the thickness of the semiconductor sealing device. However, the thinner the package substrate, the more Easy to cause = two; page) or deformation phenomenon 'This is for the need to require accurate alignment of the 4 institutional process and better (four), and the axis recorded Too ^ In the latter part of the process to transfer and fix the burning foot ^ 4p Saki is in a hurry and water, also ... dry grip; such as the cutting (Saw) process, also to the surface of the sealing #面面 or deformation, and by the The Stlfiener strengthens the structure of the package substrate to avoid the occurrence of 勉 曲 曲 0 # Please read the 2A to 2G drawings, which is a schematic cross-sectional view of a modified package substrate; firstly, a surface is provided a circuit board 2 〇 '' carrier board 20, the circuit layer 201 has a plurality of electrical connection pads 2 〇 2, and an insulating protection layer 21 is formed on the carrier board 20 and the circuit layer 201, and is exposed and developed. Forming a plurality of openings 21 〇 to correspondingly expose a portion of the surface of the pad = 202 (as shown in FIG. 2); then, providing a printed stencil (stenci 1 ) 22 having the opening 220 is placed in the insulation The protective layer 21, and the opening 220 of the printing screen 22 corresponds to the opening 210 of the insulating layer θ 21 (as shown in FIG. 2B); the solder paste 23 is printed (Stencil 110539 6 1356464 - hnting) Filling the opening 22 (as shown in Figure IF); then removing the printing stencil 22 ( 2D); the solder paste 23 is melted to form a conductive element 23 via a return process, and is electrically connected to each of the underlying electrical connections 202 (as shown in FIG. 2); SaW) The carrier board 2G is divided into a plurality of package substrates 20a. Each of the package substrates 2Ga has a plurality of conductive elements 23 (as shown in FIG. 2); finally, the support frame 24 is attached to the insulating protective layer 21 of the package substrate 2a in a dotted manner. In order to strengthen the package substrate, the support frame 24 has an opening 24 to expose the conductive member 23 (as shown in FIG. 2G). The process of installing the support frame % can also be performed in the cutting step = proceeding, and the branch frame 24 is set according to the predetermined position (such as the 2F, the figure is not) 'final cutting to divide into the package substrate with the support frame 24 2〇a (as shown in Figure 2G). However, the above method for manufacturing a pre-solder structure by printing is low in yield and the cost of the printed screen is high, and the carrier sheet is then cut (Saw) after forming the conductive member, and the cutting process is liable to cause warpage of the package substrate. The support frame (Stiffener) is set up after the song is followed by the shirt, but if the support frame is set and then printed, the conductive frame is made to be affected by the protrusion of the support frame and the poor coverage of the screen cover. The yield of the spoon, so how to effectively reduce the warpage and deformation of the substrate to improve the process yield, and overcome the need to pre-set the support frame and then make conductive components on the package substrate at low cost is an urgent issue to be considered. SUMMARY OF THE INVENTION In view of the above-mentioned deficiencies of the prior art, one of the objects of the present invention is a method for manufacturing a substrate having a reinforced structure of 110539 7 1356464, which can be warped and deformed to improve process yield. The purpose of the pole is to provide a kind of reinforced structure with a reinforced structure ~ 'salt to reduce the deformation of the substrate to increase the process. Stability and yield. The purpose of the US board is to provide a package with a reinforced structure: the board method can make conductive elements on the reinforced substrate in a low cost manner. The base 乂 method includes: providing at least a surface having an electrical connection 塾, and forming an insulating protective layer on the carrier and the electrical connection, and the insulating protection layer is formed with an opening to expose the electricity a part of the surface of the connecting pad, the branching frame having an opening is disposed on the insulating protective layer, and the partially insulating (four) layer and the electrical connecting pads are exposed; and the tin is placed in the opening of the insulating layer a ball, the solder ball is disposed on a surface of each of the electrical connections; performing a welding process to electrically connect the solder ball to the electrical connection port; and cutting the sling with a cutout to form a plurality of support frames The package substrate. The invention provides a method for manufacturing a package substrate with a reinforced structure, comprising: providing a carrier board having at least one surface having an electrical connection pad, and forming an insulation protection layer on the carrier board and the electrical connection pad, and the insulation protection layer is formed. There is an opening to expose a part of the surface of the electrical connection pad; The truss layer is slanted with a branch frame having an opening, and a part of the insulating protective layer and some electrical connection pads are exposed; the carrier plate provided with the support frame is cut to form a plurality of package substrates having the support frame; The opening of the insulating protective layer] 10539 8 is placed in the solder ball, so that the solder ball is disposed on the surface of each electrical connecting pad; and the solder reflow process is performed to electrically connect the solder ball to the electrical connecting pad. According to the above method, the carrier board is an insulating board and a circuit board having a circuit layer; the flux is formed on the surface of the insulating protective layer and the surface of the electrical connection pad to form a flux; the support frame is metal and ceramic One of the MANN and Mn composite materials, and the support frame is bonded to the insulating protective layer by an adhesive which is an epoxy resin bonded ruthenium.
又依上述之製法，該錫球係以機械手臂之直接植球方 式置於該絕緣保護層之開孔中；或該錫球係以植球板將 錫球以批次方式置於該絕緣保護層之開孔中，其中該植球 板係由上鋼板及下鋼板袓忐， _ , 「驷极，、且成，且该上、下鋼板並具有相對 應之開孔，於該上鋼板之開孔中置人有該錫球，藉由推移 该下鋼板，藉由該上、下鋼板相對活動，使該上、下鋼板 之開孔相互對位或錯位排列以批次將錫球置人於該絕緣 保護層之開孔中。 # 本發明㈣承載板上設有支料⑻⑴咖）以解決 板產生_或變形的問題，俾以避免因封裝基板輕 曲與變Γ影響製程良率，且該支樓架置設係於形成導電 =件之則’以降低封裝基板變形，並增加製程穩定性及良 .率，且以直接植球或批次植球將錫球（Solder Ba⑴置入 ”玄包性連接塾上，再經由迴烊製程使該錫球電性 性連接塾，俾以達降低成本之製程。 【實施方式】 以下請配合圖式說明本發明 之具體實施例，以使所屬 110539 9 丄 D6464 •偽=、八有通常知識者可輕易地瞭解本發明之技術特徵 興達成功效。 [第一實施例] ，閱第3A至3G圖’係為本發明具強化結構之封裝 土板製法之剖視示意圖。 、 如第3A圖所示，首先，提供至少一表面具有線路層 之承載板30,且該線路層3〇1具有複數個電性連接墊 02 ’其中，該承載板30係為絕緣板及具有線路層之電路 板之其中一者，並於該承载板30及電性連接墊3〇2上形 ^有-絕緣保護層3卜經曝光顯影製程形成開孔31〇以 露出該電性連接墊302之部分表面。 如第3B圖所示，於該絕緣保護層31上接置支撐架 =，該支撐架32係具有開口 320以露出該部分之絕^二 護層31及該些電性連接墊3〇2;其中，該支撐架犯之材 料係為金m或金屬複合材料，並㈣為環氧樹脂接 丨合劑之黏著劑結合於該絕緣保護層31上，藉由該支撐架 32以提高該承載板3〇強度，進而避免產生龜曲。 如第3C圖所示，於該絕緣保護層31及電性連接墊 302表面形成一助焊劑33，此製程步驟得選擇性進行。 如第3D圖所示’於該絕緣保護層31之開孔3ι〇Τ中置 入錫球（Solder Bal〇34’使該錫球34設於各電性連接墊 302表面，該錫球34係以直接植球方式置入，如利用機 械手臂單次吸取固定量的錫球34後，將其置於該開孔〇 中。 Π0539 10 1356464 • ’ 如第3E圖所示’之後進行迴焊製程使該錫球34及助 •焊劑33熔融後以形成導電元件34，，進而使該導電元件 34’電性連接該電性連接墊3〇2。 如第3F圖所示’移除該絕緣保護層31表面之助焊劑 33，即於該承載板30之電性連接墊3〇2表面形成外露之 導電元件34’。 最後，如第3G圖所示，進行切割（Saw)製程以將該 具有支撐架32之承載板30分切成複數個具有支撐架32 _之封裝基板30a。 [第二實施例] 請另參閱第4A至4F圖，係為本發明具強化結構之封 裝基板製法之另一製法剖視示意圖。 如第4A圖所示，首先，提供一係如第3A圖所示之結 構，於該絕緣保護層31上接置該具有開口 32〇之支撐架 32，且該支撐架32之開口 32〇並露出該部分絕緣保護層 鲁31及該些電性連接墊302。 如第4B圖所示，進行切割（Saw)製程以將該具有支撐 架32之承載板3〇分切成複數封裝基板3〇a。 如第4C圖所示，於該封裝基板3〇a之絕緣保護層31 及電性連接墊302上形成一助焊劑33，此製程步驟得選 擇性進行。 ^如第4D圖所示，以直接植球方式，利用機械手臂單 -人吸取固定量的錫球34後，於該絕緣保護層31之複數個 開孔310中各置入錫球34 ’使該錫球34設於各電性連接 110539 11 1356464 '塾302上。 如» 4E圖所示，經由迴焊製程使該錫球心 33熔融後以形成一導電元 卜^ 包兀件.34 ，進而使該導電元件 •电性連接該電性連接墊3〇2。 4 最後，如# 4F圖所示，移除該絕緣保護層 助焊劑33。 之 [第三實施例] 請再參閱第5 A i 5 E圖，係為本發明具強化結構 裝基板製法之又-製法剖視示意圖；與前述製法不同之 處在於此餘W峰:域球方切制軸護層 數個開孔中置入錫球。 如第5A圖所示，提供具有支撐架32之封裝基板 30a，並於該絕緣保護層31及電性連接塾3〇2表面形二 一助焊劑33’另設一植球板35,該植球板35係由上鋼板 35a及下鋼板35b組成，且該上、下鋼板35a 35b係避開 籲該突起之支撐架32而定位於該絕緣保護層31及支撐架 32上方，又該上、下鋼板35a，35b對應該絕緣保護層3 j 之開孔310並設有開孔35ia，351b，且該上、下鋼板 35a，35b之開孔351a，351b為相互錯位排列而呈封閉狀 悲’又於该上鋼板35a之開孔351 a中已排入有錫球34。 如第5B圖所示’之後移動該上鋼板35a以使tk開孔 351 a對齊該下鋼板35b之開孔351 b，此時該錫球34自上 鋼板35a之開孔351a中穿過該下鋼板35b之開孔351b 而掉入該絕緣保護層31之開孔310中，使該錫球34設於 Π0539 12 〜〇464 電性連接墊302及助焊劑33上。 如第5C圖所示’移開該植球板託。 如第5D圖所示’經由迴焊製程使該錫球3技助焊劑 33'融形成導電元件34，’並電性連接該電性連接塾3〇2。 θ取後’如第5E圖所示’移除該絕緣保護層31表面之 33 ’即於該封裝基板咖之電性連接墊3⑽表面 形成外露之導電元件34,。 ^發明係於承載板上置設支撑架（如…槪）以解決 產生翹曲或變形的問題’避免因封裝基板 而影響製程良率，且於形成導電元件之前先設置 #. ^乂、以減》封裝基板變形而增加製程穩定性及良 率’且改以植‘球之方式來製作带 批次植料件’並以直接植球或 植東將6亥錫球直接置於該電性連接塾上，再經迴 球㈣後以電性連接該電性連接墊，以達到降低 成本並於強化之封裝基板上形成導電元件之目的。- 、成置^支撐架讀供該承載板支撑力，再 置設！二以免除習知以印刷方式形成導電元件後再 板二生：二之缺失’相較之下本發明之製程可減少封裝基 而增加製程穩定性及良率，且本發明係以 广導m除了植球製程具彈性可為直接植 =批:人植球外，亦省略了以印刷方式製作導電 印刷網板之昂貴成本。 斤而 點及2上所述之具體實施例，僅係用以例釋本發明之特 ‘ > ，而非用以限定本發明之可實施範轉，在未脫離 110539 13 1356464 本發明上揭之精神與技術範疇下，任何運用本發明所揭示 内合而元成之等效改變及修飾，均仍應為下述之申請專利 範圍所涵蓋。 【圖式簡單說明】 第1圖係為習知覆晶結構之剖面示意圖； 第2A至2G圖係顯示習用強化封裝基板之製程示意 第2F’圖係為第2F圖之另一實施製程示意圖； 、第3 A至3 G圖係、顯示本發明具強化結構之封裝基板製 法之剖面示意圖； 第4A至4F®係顯*本發明具結構之封裝基板 法之另一製法剖面示意圖；以及 之又一製法剖面示意圖。 【主要元件符號說明】 10 半導體晶片 101 電極塾 11 金屬凸塊 12 、 23, 、 34， 導電元件 13 封裝基板 131 電性連接墊 20 ' 30 承载板 20a > 30a 封裝基板 201 、 301 線路層According to the above method, the solder ball is placed in the opening of the insulating protective layer by direct balling of the robot arm; or the solder ball is placed in the insulating manner by the ball ball in a batch manner. In the opening of the layer, the ball plate is made of an upper steel plate and a lower steel plate, _, "dip pole, and is formed, and the upper and lower steel plates have corresponding openings, and the upper steel plate is The tin ball is placed in the opening, and the lower steel plate is moved, and the upper and lower steel plates are relatively moved, so that the openings of the upper and lower steel plates are aligned or misaligned, and the solder balls are placed in batches. In the opening of the insulating protective layer. # The invention (4) is provided with a supporting material (8) (1) coffee on the carrying plate to solve the problem of plate generation or deformation, so as to avoid the process yield rate due to the softness and deformation of the package substrate. And the support is placed in the form of a conductive member to reduce the deformation of the package substrate, and increase the stability and yield of the process, and the solder ball (Solder Ba (1) is placed by direct ball or batch ball. "The mysterious connection is connected to the cymbal, and then the solder ball is electrically connected via the retanning process, 俾[Embodiment] Hereinafter, a specific embodiment of the present invention will be described with reference to the drawings so that the technical characteristics of the present invention can be easily understood by those who have the general knowledge of 110539 9 丄 D6464 • Pseudo = [First Embodiment], FIG. 3A to FIG. 3G are schematic cross-sectional views showing a method of manufacturing a packaged soil plate having a reinforced structure according to the present invention. As shown in FIG. 3A, first, at least one surface is provided with a circuit layer. The carrier layer 30, and the circuit layer 3〇1 has a plurality of electrical connection pads 02', wherein the carrier board 30 is one of an insulating board and a circuit board having a circuit layer, and the carrier board 30 and The electrical connection pad 3〇2 has an insulating protective layer 3 formed by the exposure and development process to form an opening 31〇 to expose a part of the surface of the electrical connection pad 302. As shown in FIG. 3B, the insulating protective layer 31 is connected to the support frame=, the support frame 32 has an opening 320 to expose the portion of the second protective layer 31 and the electrical connection pads 3〇2; wherein the support frame is made of gold m Or a metal composite, and (4) an epoxy resin joint The adhesive of the agent is bonded to the insulating protective layer 31, and the support frame 32 is used to increase the strength of the carrier plate 3, thereby avoiding the occurrence of tortuosity. As shown in FIG. 3C, the insulating protective layer 31 and the electrical property are provided. A flux 33 is formed on the surface of the connection pad 302, and the process step is selectively performed. As shown in FIG. 3D, a solder ball is placed in the opening 3 of the insulating protective layer 31 (Solder Bal〇34' makes the tin The ball 34 is disposed on the surface of each of the electrical connection pads 302. The solder balls 34 are placed in a direct balling manner. If a fixed amount of the solder balls 34 is sucked by a single arm by a robot arm, it is placed in the opening. Π 0539 10 1356464 • 'After shown in FIG. 3E', a reflow process is performed to melt the solder ball 34 and the flux 33 to form a conductive member 34, thereby electrically connecting the conductive member 34' to the electrical connection. Pad 3〇2. The flux 33 on the surface of the insulating protective layer 31 is removed as shown in Fig. 3F, i.e., the exposed conductive member 34' is formed on the surface of the electrical connection pad 3〇2 of the carrier 30. Finally, as shown in Fig. 3G, a Saw process is performed to divide the carrier sheet 30 having the support frame 32 into a plurality of package substrates 30a having support frames 32. [Second embodiment] Please refer to Figs. 4A to 4F, which are schematic cross-sectional views showing another method of manufacturing the package substrate having the reinforced structure of the present invention. As shown in FIG. 4A, firstly, a structure as shown in FIG. 3A is provided, and the support frame 32 having the opening 32 is attached to the insulating protective layer 31, and the opening 32 of the support frame 32 is folded. The portion of the insulating protective layer ru 31 and the electrical connecting pads 302 are exposed. As shown in Fig. 4B, a Saw process is performed to divide the carrier sheet 3 having the support frame 32 into a plurality of package substrates 3A. As shown in Fig. 4C, a flux 33 is formed on the insulating protective layer 31 and the electrical connection pad 302 of the package substrate 3a, and the process step is selectively performed. ^ As shown in FIG. 4D, after a fixed amount of solder balls 34 are sucked by the robot arm by a single ball, a solder ball 34' is placed in each of the plurality of openings 310 of the insulating protective layer 31. The solder ball 34 is disposed on each of the electrical connections 110539 11 1356464 '塾302. As shown in FIG. 4E, the solder ball core 33 is melted by a reflow process to form a conductive material package member 34. The conductive element is electrically connected to the electrical connection pad 3〇2. 4 Finally, as shown in #4F, the insulating protective layer flux 33 is removed. [Third Embodiment] Please refer to the fifth A i 5 E diagram, which is a schematic cross-sectional view of the method for manufacturing a substrate with a reinforced structure according to the present invention; the difference from the above-mentioned method is that the W peak: the domain ball Tin balls are placed in several openings of the square cut shaft sheath. As shown in FIG. 5A, a package substrate 30a having a support frame 32 is provided, and a ball-spreading plate 35 is further disposed on the surface of the insulating protective layer 31 and the electrical connection 塾3〇2. The ball plate 35 is composed of an upper steel plate 35a and a lower steel plate 35b, and the upper and lower steel plates 35a to 35b are positioned above the insulating protective layer 31 and the support frame 32 so as to avoid the support frame 32 of the protrusion. The lower steel plates 35a, 35b correspond to the openings 310 of the insulating layer 3j and are provided with openings 35ia, 351b, and the openings 351a, 351b of the upper and lower steel plates 35a, 35b are arranged in a misaligned arrangement and are closed. Further, a solder ball 34 is placed in the opening 351a of the upper steel plate 35a. The upper steel plate 35a is moved as shown in Fig. 5B to align the tk opening 351a with the opening 351b of the lower steel plate 35b, at which time the solder ball 34 passes through the opening 351a of the upper steel plate 35a. The opening 351b of the steel plate 35b is dropped into the opening 310 of the insulating protective layer 31, and the solder ball 34 is disposed on the 5390539 12 〇 464 electrical connection pad 302 and the flux 33. The ball plate holder is removed as shown in Fig. 5C. As shown in Fig. 5D, the solder ball 3 flux 14' is melted to form a conductive member 34 via a reflow process, and electrically connected to the electrical connector 〇3〇2. After θ is taken, as shown in Fig. 5E, the surface of the insulating protective layer 31 is removed, that is, the exposed conductive member 34 is formed on the surface of the electrical connection pad 3 (10) of the package substrate. The invention is based on the mounting plate to provide a support frame (such as ... 以) to solve the problem of warpage or deformation 'avoiding the process yield due to the package substrate, and before setting the conductive element, set #. ^乂, Reduce the deformation of the package substrate to increase the process stability and yield 'and make a batch of plant parts by means of planting 'balls' and directly place the 6-sea tin ball directly on the electrical After connecting the cymbal and then returning the ball (4), the electrical connection pad is electrically connected to achieve the purpose of reducing the cost and forming a conductive element on the reinforced package substrate. -, set the support frame to read the support force of the carrier plate, and then set! Secondly, in order to avoid the conventional formation of conductive elements by printing, the second board is used: the second one is missing. In contrast, the process of the present invention can reduce the package base and increase the process stability and yield, and the present invention is broadly guided. In addition to the flexibility of the ball-making process, it can be directly implanted: batch: human ball, and the expensive cost of making conductive printed screens by printing is also omitted. The specific embodiments described above are merely used to exemplify the invention, and are not intended to limit the implementation of the invention, without departing from the invention of 110539 13 1356464. In the spirit and technology, any equivalent changes and modifications made by the present invention will still be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a conventional flip-chip structure; FIGS. 2A to 2G are diagrams showing a process schematic diagram of a conventional reinforced package substrate; FIG. 2F is another schematic process diagram of FIG. 3A to 3G, showing a schematic cross-sectional view of a method for manufacturing a package substrate having a reinforced structure according to the present invention; and 4A to 4F® showing a cross-sectional view of another method of the package substrate having the structure of the present invention; A schematic diagram of a process. [Main component symbol description] 10 Semiconductor wafer 101 Electrode 塾 11 Metal bumps 12, 23, 34, Conductive components 13 Package substrate 131 Electrical connection pads 20 ' 30 Carrier board 20a > 30a Package substrate 201, 301 Circuit layer
110539 14 1356464 • 202 、 302 電性連接墊 21 ' 31 絕緣保護層 210 、 310 開孔 22 印刷網板 220 開孔 23 錫·.膏 24、32 支撐架 240 、 320 開口 • 35a 上鋼板 35b 下鋼板 351a 、 351b 開孔 33 助焊劑 34 錫球 35 植球板 15 110539110539 14 1356464 • 202, 302 Electrical connection pads 21 ' 31 Insulation protection layer 210, 310 Opening 22 Printing stencil 220 Opening 23 Tin.. Paste 24, 32 Support frame 240, 320 Opening • 35a Upper steel plate 35b Lower steel plate 351a, 351b opening 33 flux 34 solder ball 35 ball board 15 110539