TWI355846B - Digital still camera module and a lens used therei - Google Patents
Digital still camera module and a lens used therei Download PDFInfo
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- TWI355846B TWI355846B TW94134352A TW94134352A TWI355846B TW I355846 B TWI355846 B TW I355846B TW 94134352 A TW94134352 A TW 94134352A TW 94134352 A TW94134352 A TW 94134352A TW I355846 B TWI355846 B TW I355846B
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1355846 100年10月19日核正替換頁 六、發明說明: 【發明所屬之技術領域】 [0001]本發明係關於一種數位相機模組及其透鏡,尤其係關於 一種小型數位相機模組及其透鏡。 【先前技術】 _]隨著數位時代之到來,具數㈣機模組之行動電話等便 攜式電子裝i已曰漸普及。具數位相機模組之行動電話 等便攜式電子裝置向著輕、薄、短、小之方向發展,以1355846 October 19, 100 Nuclear Replacement Page 6 Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a digital camera module and a lens thereof, and more particularly to a compact digital camera module and lens. [Prior Art] _] With the advent of the digital era, portable electronic devices such as mobile phones with a number of (four) machine modules have become popular. Portable electronic devices such as mobile phones with digital camera modules are moving toward light, thin, short, and small,
便於使用者攜帶。傳統具數位相機模組之行動電話之數 位相機模組為提升其之鏡頭成像品f,通常包含複數鏡 片。然,由於該鏡片數量較多,裝配過程較複雜,且在 裝配過程各鏡#之光軸較難對準,因而會影響該數 位相機模組之成像品質。 【發明内容】 [0003] 有鑑於此,提供一錄占後。新± 八種成像質較咼且較易裝配之小塑數 位相機模組實為必要。 [0004] 另外’运有必要提供-種適用於該小型數位相機模組之 透鏡。Easy for users to carry. The digital camera module of a conventional mobile phone with a digital camera module is used to enhance the lens image of the lens, and usually includes a plurality of lenses. However, due to the large number of lenses, the assembly process is complicated, and the optical axis of each mirror # is difficult to align during assembly, which affects the imaging quality of the digital camera module. SUMMARY OF THE INVENTION [0003] In view of this, a record is provided. New ± eight small-sized digital camera modules that are more compact and easier to assemble are necessary. [0004] In addition, it is necessary to provide a lens suitable for the compact digital camera module.
L_5J 094134352 1数位相機模組,其包括-鏡筒、-透鏡及影像感測 二封裝1¾鏡筒呈半封閉筒狀,具有一側壁,該側璧上 设有2光孔;該透鏡被收容於鏡筒内,包括-第^表 面、-第二表面及一第三表面;該第一表面係—曲面, 與二先孔相對應,接收輕射由人光孔射人之光線;該 t表面與第—表面相連接且相對應,接收並反射由〆 折射之光線,該第三表面係一曲面,與第二表 表單編號咖 ^ 4 I/* 17 w 、 1〇〇3382973- 1355846 100年.10月19日修:正替換頁 面相對應且與第一表面及第二表面均相連接,接收並透 射由第二表面反射之光線;其中,該鏡筒及該透鏡均固 設於該影像感測器封裝上,且該影像感測器封裝接收由 第三表面射出之光線。L_5J 094134352 1 digital camera module, comprising: a lens barrel, a lens and an image sensing two package 13⁄4 lens barrel in a semi-closed cylinder shape, having a side wall with 2 light holes; the lens is received in The lens barrel includes a first surface, a second surface, and a third surface; the first surface is a curved surface corresponding to the two first holes, and receives light rays that are lightly emitted by the human light hole; the t surface Corresponding to and corresponding to the first surface, receiving and reflecting the light refracted by the crucible, the third surface is a curved surface, and the second table form number is 4 I/* 17 w, 1〇〇3382973- 1355846 100 years October 19th repair: the replacement page corresponds to and is connected to the first surface and the second surface, receiving and transmitting the light reflected by the second surface; wherein the lens barrel and the lens are fixed on the image The sensor package is mounted, and the image sensor package receives light emitted by the third surface.
[0006] 一種透鏡,包括一第一表面,其接收並匯聚入射之光線 ;一第二表面,與第一表面相連接且相對應,接收並反 射由一第一表面折射之光線;一第三表面,其與第二表 面相對應且與第一表面及第二表面均相連接,接收並透 射由第二表面反射之光線;其中,該第一表面 '第二表 面及第三表面之光學設計滿足以下光學矩陣: [0007] 文 j 0、 η 1 /. -2 ο ι ο « Λ [0008] ^ΪΜΡ ^iMPxy[0006] A lens comprising a first surface that receives and converges incident light; a second surface coupled to the first surface and corresponding to receive and reflect light refracted by a first surface; a surface corresponding to the second surface and connected to both the first surface and the second surface to receive and transmit the light reflected by the second surface; wherein the optical design of the second surface and the third surface of the first surface The following optical matrix is satisfied: [0007] text j 0, η 1 /. -2 ο ι ο « Λ [0008] ^ΪΜΡ ^iMPxy
’ι1』ka3X 乂 [0009] 其中,n〇係空氣之折射率;以系透鏡之 表面之像高;—之像高、峨= 象面 上之像南’係第-表面上入射光之入射角;《3χ係第 :表面上入射光之入射角;、透鏡之成像面Γ入射 光之入射角,、係第—表面之曲率半徑係第二表面 之曲率半役,、係第三表面之曲率半徑係第一表面 之光子中〜與第—表面之光學中心之距離,、係第二表 面之光子中〜與第二表面之光學中心之距離;及d係第 094134352 表單編號A0101 第5頁/共17頁 1003382973-0 1355846 100年10月19日修正替换頁 三表面之光學中心與透鏡之成像面之垂直距離。 [0010] 相較習知技術,所述數位相機模組藉由所述透鏡用於成 像,其係於兩垂直方向設置光學透鏡,可減小該數位相 機模組於同一方向上之高度;且由於該透鏡將三個光學 表面整合於一透鏡上,減少了光學元件之數量,由此則 降低了該數位相機模組在裝配時對心之難度,提高了該 數位相機模組之成像品質。 【實施方式】 [0011] 請參閱第一圖所示,本發明數位相機模組一較佳實施例 包括一鏡筒10、一透鏡20及一影像感測器封裝30。 [0012] 該鏡筒10呈半封閉之筒狀,其用於收容該透鏡20。該鏡 筒10 —側壁上開有一入光孔12。該入光孔12内嵌有一透 明板14,其用於封閉該入光孔12以避免灰塵等雜質進入 鏡筒10污染透鏡20。 [0013]'ι1』ka3X 乂[0009] where n〇 is the refractive index of the air; the image height of the surface of the lens; the image height, 峨 = the image on the image surface of the south surface of the incident Angle; "3χ system: incident angle of incident light on the surface; angle of incidence of incident light on the imaging surface of the lens, radius of curvature of the first surface is the curvature of the second surface, and is the third surface The radius of curvature is the distance between the photons of the first surface and the optical center of the first surface, the distance between the photons of the second surface and the optical center of the second surface; and the d system 094134352 Form No. A0101 Page 5 / Total 17 pages 1003382973-0 1355846 On October 19, 100, the vertical distance between the optical center of the three surfaces of the replacement page and the imaging surface of the lens was corrected. [0010] Compared with the prior art, the digital camera module is used for imaging by the lens, and the optical lens is disposed in two vertical directions, which can reduce the height of the digital camera module in the same direction; Since the lens integrates the three optical surfaces on one lens, the number of optical components is reduced, thereby reducing the difficulty of the digital camera module during assembly and improving the imaging quality of the digital camera module. [Embodiment] Referring to the first embodiment, a preferred embodiment of the digital camera module of the present invention includes a lens barrel 10, a lens 20 and an image sensor package 30. [0012] The lens barrel 10 has a semi-closed cylindrical shape for housing the lens 20. The lens barrel 10 has a light entrance hole 12 formed in the side wall. The light-receiving hole 12 is embedded with a transparent plate 14 for closing the light-incident hole 12 to prevent impurities such as dust from entering the lens barrel 10 to contaminate the lens 20. [0013]
該透鏡20係一似三棱鏡,其具有一第一表面22、一第二 表面24及一第三表面26,該三表面22、24、26可以為球 面或非球面,且該三表面22、24、26均為非對稱的曲面 。其中,該第一表面22之光學中心與該入光孔12中心相 對應,接收並匯聚由入光孔12而進入之光線。該第二表 面24與該第一表面22相連接並且相對應,其具有高反射 率,該第二表面24接收並反射由第一表面22匯聚之光線 。該第三表面26與該第一表面22及第二表面24均相連接 且其與第二表面24相對應,其接收並射出由第二表面24 反射之光線。該第三表面26與第一表面22以及第三表面 26與第二表面24相連接處形成一固持部261,該固持部 094134352 表單编號A0101 第6頁/共17頁 1003382973-0 1355846 ~; 100年.10月19日核正替換頁 ’ 261用於將該透鏡20與該影像感測器封裝30相配合。 [0014] 該透鏡20係用光學塑膠材料以射出成型方式加工製成。 請參閱第二圖所示,該透鏡2 0之第一表面22、第二表面 24及第三表面26之光學設計需滿足以下光學矩陣: [0015] (1 0 n-riQ n_ -nR3X n0 ^ (Λ 2 °Vl o 1The lens 20 is a triangular prism having a first surface 22, a second surface 24 and a third surface 26. The three surfaces 22, 24, 26 may be spherical or aspherical, and the three surfaces 22, 24 26 is an asymmetrical surface. The optical center of the first surface 22 corresponds to the center of the light entrance hole 12, and receives and converges the light entering through the light entrance hole 12. The second surface 24 is coupled to and corresponds to the first surface 22, which has a high reflectivity, and the second surface 24 receives and reflects the light concentrated by the first surface 22. The third surface 26 is coupled to both the first surface 22 and the second surface 24 and corresponds to the second surface 24 that receives and emits light reflected by the second surface 24. The third surface 26 and the first surface 22 and the third surface 26 and the second surface 24 are joined to form a holding portion 261, the holding portion 094134352 Form No. A0101 Page 6 / 17 pages 1003382973-0 1355846 ~; The 100th. October 19th nuclear replacement page '261 is used to mate the lens 20 with the image sensor package 30. [0014] The lens 20 is processed by injection molding using an optical plastic material. Referring to the second figure, the optical design of the first surface 22, the second surface 24, and the third surface 26 of the lens 20 needs to satisfy the following optical matrix: [0015] (1 0 n-riQ n_ -nR3X n0 ^ (Λ 2 °Vl o 1
^2X 1 0 n〇-n n〇_ -n^ix « [0016] IMP ·* ri ^¥;x3 •« 、[〇 l^2X 1 0 n〇-n n〇_ -n^ix « [0016] IMP ·* ri ^¥;x3 •« ,[〇 l
[0017] 其中,%係空氣之折射率; [0018] η係透鏡20之折射率; [0019] Χι 係第一表面22之像高; [0020] X3 係第三表面26之像高; [0021] XIMp係透鏡20之成像面上之像高; [0022] a 1χ係第一表面22上入射光之入射角; [0023] a 3χ係第三表面26上入射光之入射角; [0024] a ΙΜρχ係透鏡20之成像面上入射光之入射角 [0025] Ri χ係第一表面22之曲率半徑; [0026] R 係第二表面24之曲率半徑; L· X [0027] R3 χ係第三表面26之曲率半徑; 表單編號A0101 第7頁/共17頁 094134352 1003382973-0 1355846 __ 100年10月19日修正替換頁 [0028] \係第一表面22之光學中心與第二表面24之光學中心之 距離; [0029] d2係第二表面24之光學中心與第三表面26之光學中心之 距離;及 [0030] d3係第三表面26之光學中心與透鏡20之成像面之垂直距 離。 [0031] 該影像感測器封裝30包括一承載體31、一影像感測晶片Wherein % is the refractive index of the air; [0018] the refractive index of the η-based lens 20; [0019] Χι is the image height of the first surface 22; [0020] X3 is the image height of the third surface 26; 0021] the image height of the imaging surface of the XIMp lens 20; [0022] a 1 χ is the incident angle of incident light on the first surface 22; [0023] a 3 χ is the incident angle of incident light on the third surface 26; [0024] a ΙΜρχ incident angle of incident light on the imaging surface of the lens 20 [0025] Ri radius of curvature of the first surface 22 of the system; [0026] radius of curvature of the second surface 24 of the R system; L·X [0027] R3 χ The radius of curvature of the third surface 26; Form No. A0101 Page 7 of 17 094134352 1003382973-0 1355846 __ October 19, revised correction page [0028] \ is the optical center and second surface of the first surface 22 The distance from the optical center of 24; d2 is the distance between the optical center of the second surface 24 and the optical center of the third surface 26; and [0030] d3 is the optical center of the third surface 26 and the imaging surface of the lens 20. vertical distance. [0031] The image sensor package 30 includes a carrier 31 and an image sensing chip.
33及複數焊線35。該承載體31包括一底部312及一由底 部312外圍向一側突起之側壁314。該承載體31之底部 312頂面佈設有複數焊墊315。該側壁314具有一凸緣316 及一第一頂面317,該凸緣316由第一頂面317外圍向上 延伸,使側壁314之内壁呈階梯狀。該凸緣316之内壁輪 廓大於透鏡20之第三表面26之輪廓,且該第一頂面317之 内邊輪廓小於透鏡之第三表面26之輪廓。該底部312之頂 面與該側壁314之内壁圍成一階梯狀容室318。該影像感 測晶片33位於容室318内,且其固設於承載體31底部312 之頂面。該影像感測晶片33頂面設置有一感測區331及複 數晶片焊墊333。該複數焊線35之一端固定電連接該複數 晶片焊墊333,其另一端則與承載體31底部31 2頂面之複 數焊墊31 5相電連接。該影像感測器封裝30之承載體31底 部312之底面設有複數用以與其他電路板相電連接之焊墊 (圖未示),且該複數焊墊與底部312頂面之焊墊315相電 連接。 [0032] 該透鏡20之第三表面26之光軸與影像感測晶片33感測區 1003382973-0 094134352 表單编號A0101 第8頁/共17頁 1355846 » -* "ϊ〇〇年10B 19日後正 3 31之中心相對應且影像感測晶片3 3之頂面位於該透鏡2 0 之成像面(Image Plane,簡稱IMP)上。該透鏡20之固 持部261藉由黏膠固設於承載體31之第一頂面317上。該 透鏡20將影像感測晶片33封閉於容室318内,以避免粉塵 等雜質進入容室318而污染影像感測晶片33。該鏡筒10套 設於透鏡20外且其固定設置於承載體31凸緣316上,其入 光孔12之中心與透鏡20之第一表面22之光學中心相對應 φ [0033] 可以理解,該數位相機模組還可進一步包括其他的用於 成像之鏡片,此時,該透鏡20係作為中繼透鏡與其他鏡 片作為一整體來成像。 [0034] 本發明數位相機模組之較佳實施例藉由一透鏡2〇用於成 像’其係於兩垂直方向設置光學表面,可減小該數位相 機模組於同一方向上之高度;且由於該透鏡係將三個光 學表面整合於一透鏡上,減少了光學元件之數量,由此 則降低了該數位相機模組在裝配時對心之難度,提高了 • 該透鏡之成像品質。 闕综上所述,本發明符合發明專利要件,紐法提出專利 申π。惟,以上所述者僅為本發明之較佳實施例,舉凡 熟悉本案技藝之人士 ’在、援依本案發明精神所作之等 效修飾或變化’皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 剛第-圖係本發明之數位相機模組1㈣㈣之剖視圖 094134352 表單編號Α0101 1003382973-0 1355846 100年10月19日修正替換頁 [0037] 第二圖係本發明之數位相機模組之透鏡之光學設計不意 圖。 【主要元件符號說明】 [0038] 鏡筒:10 [0039] 入光孔:12 [0040] 透明板:14 [0041] 透鏡:20 [0042] 第一表面:22 [0043] 第二表面:24 [0044] 第三表面:26 [0045] 固持部:261 [0046] 影像感測器封裝:30 [0047] 承載體:31 [0048] 底部:312 [0049] 側壁:314 [0050] 底部焊墊:315 [0051] 凸緣:316 [0052] 第一頂面:317 [0053] 容室:318 [0054] 影像感測晶片:33 表單编號A010133 and a plurality of bonding wires 35. The carrier 31 includes a bottom portion 312 and a side wall 314 that protrudes from one side of the bottom portion 312 toward one side. A plurality of pads 315 are disposed on the top surface of the bottom portion 312 of the carrier 31. The side wall 314 has a flange 316 and a first top surface 317 extending upwardly from the periphery of the first top surface 317 such that the inner wall of the side wall 314 is stepped. The inner wall profile of the flange 316 is larger than the contour of the third surface 26 of the lens 20, and the inner edge profile of the first top surface 317 is smaller than the contour of the third surface 26 of the lens. The top surface of the bottom portion 312 and the inner wall of the side wall 314 enclose a stepped chamber 318. The image sensing wafer 33 is located within the chamber 318 and is secured to the top surface of the bottom 312 of the carrier 31. A sensing area 331 and a plurality of wafer pads 333 are disposed on the top surface of the image sensing wafer 33. One end of the plurality of bonding wires 35 is fixedly electrically connected to the plurality of die pads 333, and the other end thereof is electrically connected to the plurality of pads 31 5 of the top surface of the bottom portion 31 2 of the carrier 31. A bottom surface of the bottom portion 312 of the carrier 31 of the image sensor package 30 is provided with a plurality of pads (not shown) for electrically connecting with other circuit boards, and the plurality of pads and the top surface of the bottom portion 312 are solder pads 315. Phase electrical connection. [0032] The optical axis of the third surface 26 of the lens 20 and the image sensing wafer 33 sensing area 1003382973-0 094134352 Form No. A0101 Page 8 of 17 1355846 » -* "ϊ〇〇年10B 19 In the future, the center of the positive 31 is corresponding and the top surface of the image sensing wafer 3 3 is located on the image plane (IMP) of the lens 20. The holding portion 261 of the lens 20 is fixed to the first top surface 317 of the carrier 31 by an adhesive. The lens 20 encloses the image sensing wafer 33 in the chamber 318 to prevent impurities such as dust from entering the chamber 318 and contaminating the image sensing wafer 33. The lens barrel 10 is sleeved on the outside of the lens 20 and fixedly disposed on the flange 316 of the carrier 31. The center of the light entrance hole 12 corresponds to the optical center of the first surface 22 of the lens 20. [0033] It can be understood that The digital camera module may further include other lenses for imaging, in which case the lens 20 is imaged as a relay lens and other lenses as a whole. [0034] A preferred embodiment of the digital camera module of the present invention reduces the height of the digital camera module in the same direction by using a lens 2 for imaging 'the optical surface is disposed in two perpendicular directions; Since the lens integrates three optical surfaces on a lens, the number of optical components is reduced, thereby reducing the difficulty of the digital camera module during assembly and improving the imaging quality of the lens. In summary, the present invention complies with the requirements of the invention patent, and Newfa proposes a patent application π. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and those skilled in the art that are skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a digital camera module 1 (four) (four) of the present invention. 094134352 Form No. 1010101 1003382973-0 1355846 October 19, 100 Revision Replacement Page [0037] The second figure is a digital camera of the present invention The optical design of the lens of the module is not intended. [Main component symbol description] [0038] Lens barrel: 10 [0039] Light entrance hole: 12 [0040] Transparent plate: 14 [0041] Lens: 20 [0042] First surface: 22 [0043] Second surface: 24 [0044] Third surface: 26 [0045] Holder: 261 [0046] Image sensor package: 30 [0047] Carrier: 31 [0048] Bottom: 312 [0049] Sidewall: 314 [0050] Bottom pad : 315 [0051] Flange: 316 [0052] First top surface: 317 [0053] Room: 318 [0054] Image sensing wafer: 33 Form No. A0101
094134352 第10頁/共17頁 1003382973-0 100年.10月19日修正替換頁 1355846 ' [0055]感測區:331 ' [0056] 晶片焊墊:333 [0057]焊線:35094134352 Page 10 of 17 1003382973-0 100 years. October 19th revised replacement page 1355846 '[0055] Sensing area: 331 ' [0056] Wafer pad: 333 [0057] Wire bond: 35
094134352 表單編號A0101 第11頁/共17頁 1003382973-0094134352 Form No. A0101 Page 11 of 17 1003382973-0
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2005
- 2005-09-30 TW TW94134352A patent/TWI355846B/en not_active IP Right Cessation
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TW200714040A (en) | 2007-04-01 |
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