TWI352559B - Cyclic olefin copolymer fiber with low dielectric - Google Patents

Cyclic olefin copolymer fiber with low dielectric Download PDF

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TWI352559B
TWI352559B TW97143198A TW97143198A TWI352559B TW I352559 B TWI352559 B TW I352559B TW 97143198 A TW97143198 A TW 97143198A TW 97143198 A TW97143198 A TW 97143198A TW I352559 B TWI352559 B TW I352559B
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fiber
dielectric constant
olefin copolymer
cyclic olefin
temperature
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TW97143198A
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TW201019802A (en
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Yung Tan Lin
S P Rwei
Kuang Kuo Sun
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Taiwan Textile Res Inst
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t、發明說明: 【發明所屬之技術領域】 本發明係關於環埽煙共聚物纖維。更具體而言,本發 ^具有齡電常數之環触共㈣纖維、其製造方法、及其 衣成之印刷電路板用的樹脂基板。 八 【先前技術】 近來,隨著電子通訊裝置持續朝高速傳輸發展,於印刷 板(PCB)巾使用高頻元件的需求亦日益提昇。在高頻電路 中,傳輸的速度係取決於絕緣材料之介電常數(ddectric =r,ant)(Dk)和介鶴耗(dieleetrie 1gss)。制高介電常數之絕 =料s’會造成傳輸速度下降、訊號干擾 '訊號齡電損耗增 ‘大:1題;耗代表電場在絕緣材料中能量的損失,數值 損失的祕機秘量。耻,發展能 業界普遍1嫩與介電損耗的材料,已成為 在印刷電路板中,絕緣材料之選用 玻織== ,衣作方法通吊係先將玻璃纖維經 成織物形式的織物增強件之後’加入 2去水t驟开/ 由熱壓將銅fl附著於樹脂基板之t 基板’之後糟 層壓板。 ^側或兩側表面,以形成覆銅 玻璃纖維雖然具有高機械強度與尺寸安定性的優點,但曰 受限於玻璃纖维主成分Si〇2的介電常數為3 9,常見的破= 維的介電常數僅能降至約4.6。另外,製作玻璃纖維的製程^ 使用超過1500 C之溫度進行融:紡絲,而且玻璃纖維在進行 去聚過程中’必須使用高溫以燒掉毅料,使玻纖強度下降約 1/3 ’才能形成玻璃纖維織物。使用高溫製程,由於相對地必 須使製私设備旎夠耐鬲溫,設備費用相對於低溫製程合令 多’而且高溫製程必須消耗大量的能源,在製造成本;七: 屬不利。 〜 因此,業界亟需一種能夠降低介電常數、又能達到盘玻璃 纖維相當之機械強度及尺寸安紐之材料。目奸知的研 現’例如,CN1854173A ’環烯烴共聚物(eydic : copolymer)可以達到前述降低介電常數、又能達到良好 定性之性質Ω j文 具有如下列式1所示 市售環稀共聚物,例如Topas® 之結構式。 [式1]t. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a cyclic smoky copolymer fiber. More specifically, the present invention relates to a ring-contacted (four) fiber having an age constant, a method for producing the same, and a resin substrate for a printed circuit board. Eight [Prior Art] Recently, as electronic communication devices continue to move toward high-speed transmission, the demand for high-frequency components for printed circuit board (PCB) towels has also increased. In high-frequency circuits, the speed of transmission depends on the dielectric constant (ddectric = r, ant) (Dk) and dieleetrie 1gss of the insulating material. The high dielectric constant of the material = s' will cause the transmission speed to drop, the signal interference 'signal age electrical loss increase ‘large: 1 problem; the consumption represents the electric field loss of energy in the insulating material, the secret value of the value loss. Shame, the development of materials that can generally be 1 in the industry and dielectric loss, has become the choice of insulating materials in the printed circuit board, the choice of glass weave ==, the method of clothing through the suspension of the glass fiber into the fabric form of the fabric reinforcement Then, 'Add 2 to remove water t to open / to adhere the copper fl to the t substrate ' of the resin substrate by hot pressing, and then laminate. ^ Side or both sides of the surface to form a copper-clad glass fiber, although it has the advantages of high mechanical strength and dimensional stability, but the enthalpy is limited by the dielectric constant of the glass fiber main component Si 〇 2 is 39, the common break = The dielectric constant of the dimension can only be reduced to about 4.6. In addition, the process of making glass fiber ^ uses a temperature of more than 1500 C for melting: spinning, and the glass fiber in the process of depolymerization must use high temperature to burn off the material, so that the glass fiber strength is reduced by about 1/3 ' A glass fiber fabric is formed. The use of a high-temperature process requires relatively high temperature resistance due to the relatively high temperature resistance of the equipment, and the high-temperature process must consume a large amount of energy at the manufacturing cost. Seven: It is unfavorable. ~ Therefore, there is a need in the industry for a material that can reduce the dielectric constant and achieve comparable mechanical strength and size to the glass fiber. For example, CN1854173A 'eydic olefin copolymer (eydic: copolymer) can achieve the above-mentioned properties of lowering the dielectric constant and achieving good characterization. For example, the structural formula of Topas®. [Formula 1]

5 1352559 質等介電常數、低吸水性、良好的絕緣性 ^ 其屬於職的分子結構,聚合物的柔性不 ill% 維而縣域應51發鮮,触上_她為複雜。 聚物ii的仍/i在以簡單製程製備具有低介電常數之環_共 10 15 20 【發明内容】 本發明之一目的是解決上述與現有技術的問題。 為解決如述問題,本發明之一目的係 聚烯烴之混練(compoundi ),並經由、9 聚物與 卻,使該環烯烴共聚物之之延遲冷 習知技術觸性雜讀點,域雜之,以改善 璃纖維介電常數4.6。 电㊉數传以低於玻 依本發明之一方面,一種低介電常 里為基丰,佔1至7·5重量% ;其中 人截、准之重 遲冷卻,該輯_、使該輯烴絲物_製程之延 成結晶,以獲得具有低於玻璃纖維介c結’但不形 纖維。 *数4·6之介電常數的 在本發明之-些較佳實施例中,以 Θ 聚烯烴係佔2至5重量%。該聚烯烴係混 基準,該 中,使該環烯烴共聚物之分子鏈糾結,但不形烯烴共聚物 該聚烯煙之含量過低,有不的缺點;^^晶,因此, 咼,則可能造成纖維之介電常數不利地變高1♦烯烴之含量過 25 在本發明之一些較佳實施例中,該聚烯烴之分 100,000 JL 300,000 Mw ; weight averaged molecular5 1352559 Qualitative dielectric constant, low water absorption, good insulation ^ Its molecular structure, the flexibility of the polymer is not ill%, and the county should be 51 fresh, touching _ she is complicated. The still/i of the polymer ii is prepared in a simple process for a ring having a low dielectric constant. [Invention] It is an object of the present invention to solve the above problems with the prior art. In order to solve the problems as described above, one of the objects of the present invention is to compound the polyolefin, and to delay the cold-known technical touch miscellaneous reading point of the cyclic olefin copolymer via the 9-mer. To improve the glass fiber dielectric constant of 4.6. The electric tenth pass is lower than one aspect of the invention according to the invention, a low dielectric constant is the base, accounting for 1 to 7.5 wt%; wherein the person is cut and quasi-cooled late, the series _, the The hydrocarbon filaments process is extended into crystals to obtain a fiber that has a lower than that of the glass fiber. *Dielectric Constant of 4.6% In some preferred embodiments of the invention, the polyolefin is 2 to 5% by weight. The polyolefin-based mixing standard, wherein the molecular chain of the cycloolefin copolymer is entangled, but the content of the non-olefin copolymer is low, and there is a disadvantage of not having a crystal; therefore, May cause the dielectric constant of the fiber to be undesirably high. 1♦ The content of olefin is over 25. In some preferred embodiments of the invention, the polyolefin is divided into 100,000 JL, 300,000 Mw; weight averaged molecular

Weig ) ° &崎触妓滅輯祕以混龄式混和在一 整?烯之分子量’可控制其相容性。此外,聚稀烴之 y刀里過南,可能造成纖維之介電常數不利地變高。 聚^烴係指所有由C和Η組成的聚合物。在本發明之一 施例中,該聚烯烴係選自:聚烯、聚酷、聚醯胺、尼 °在本發明之—些較佳實施例中,該聚稀為聚 之*較佳實施例巾,該延遲冷卻(delay quench) j制炼融、、携製程溫度,錄溫度為·。c至3耽,回火 二广至3〇〇°C ’以及冷卻溫度為10(rC至16(fC。延遲 ΐΐί,可避免環烯煙共聚物在撥出形成纖維的過程 中,發生結晶或是斷裂的狀況。 、狂 維之’―種低介電常數之環烯烴共聚物纖 堆之方法,其係包含下列步驟: (a) 由餿料槽加入環稀煙共聚物及聚烯烴,該聚煙佔1 至7·5重量% ; (b) 炫融_該環職共㈣及輯烴,以軸一溶體, 炼融溫度為300。〇至320。〇 ; (0 = 姆體通過具有特定孔徑之紡絲孔喷出,以形成一 、·、糸狀物, (d)=絲狀物通過―回火裝置,回火溫度為·。c至 ⑹=絲狀物通過-冷卻裝置,冷卻溫度為應。0至 MOC ;以及 ω =輸物經過輕的料裝置及 環烯烴共聚物纖維。 n ^ 以織維之重量為基準,該 ,遠聚烯烴之分子量為 在本發明之一些較佳實施例中’ 聚烯烴係佔2至5重量%。 在本發明之一些較佳實施例中 200,000 至 250,〇〇〇 MW。、 在本發明之-些較佳實施例中,該聚稀 =、聚_、聚_、錢、及其混合物。在^^自之二^ 佳實施例中,該聚烯為聚丙烯或聚乙烯。 * 二幸又 依本發明之另-方面,一種印刷電路板用的樹 立 係包含-絕緣樹脂與-織物增餅,該織物增強 ^ ^ 明之低介電常數之環烯烴共聚物纖維所製成。μ δ 在本發明之一些較佳實施例中,該絕緣樹脂係 3氡樹脂、雙馬來酿亞胺三嗪樹脂、聚四氟乙稀樹脂、 及具、mj合物。 :實施方式】 本發明之目的、功能、特徵、和優點能因下文中本發明的 較佳之實施例,配合所附圖式,而得到進一步的了解。 ,。首先’藉由圖1說明本發明環烯烴共聚物纖維的熔融紡絲 製程’ 1係用於製作本發明之低介電常數環稀烴共聚物纖維 的炫融纺絲裝置。 參照圖1,熔融紡絲裝置(100)包含:紡絲泵(1、n)、餵料 才曹(3、13)、擠壓機(5、15)、熔融裝置(17)、回火裴置(19)、冷 卻装置(21)、送絲輪(23、25、27)、及捲取機(29)。 將環烯烴共聚物之原料母粒與聚烯烴之原料母粒分別加 入餵料槽(3、13)中,經過擠壓機(5、15)擠壓之後,藉由紡絲 泵(1、11)進行供給量控制,使兩種原料的使用量以適當的比例 供給至熔融裝置(17)中。 。環烯烴共聚⑧物之原料母粒係選用Ti_公司所販售之商 品名為TOPAS®的轉烴共㈣,其分子量約為8晴〇至 150,000 Mw (重均分子量;―咖 averaged m〇iecuiar 评化叫。 ,烯烴^原料母粒係選自:聚烯、聚酯、聚醯胺、尼龍、 及其混合’。較料聚丙烯絲乙稀。例如,可選用台化公 司所販售之商品’其分子量約為100,000至300,000Mw。 於嫁融裝置(17)中,賴烴共聚物受到高溫溶融而進行聚 合反應卜,聚烯烴在聚合過程中,混摻入環烯烴共聚物中, 以^成環驗共聚物與輯烴之熔體(組合物)。躲裝置(Π) 之溫度控制在兩種原料之融點之上,較佳為兕^^至32〇艺。 —=炼融裝置(17)之下方,設有多數紡絲孔(spinnerette)(未圖 不)’ W#烴共聚物與聚烯烴之熔體(組合物)經過紡絲孔之後, 被擠出成型,以形成環烯烴共聚物之絲狀物。其中,依最終纖 維所需之粗細直徑而異,_孔可具有多種不同孔徑,例如, 〇·2 mm 至 0.25 mm。 、w環烯烴共聚物之絲狀物接著進入回火裝置(19),藉由回火 =之控制’可使環烯烴絲物之絲狀物從高溫之雜狀態, k漸地回到固態。回火溫度之控制,較佳為280°C至300°C。 環烯触雜之絲狀物接著進人冷卻裝置⑼,藉由冷卻 '直二之控!!,使環烯烴共聚物之絲狀物以適當的速度冷卻,而 ^因為突然溫度改變過於迅速,而導致絲狀物斷裂 制’較佳為1〇0。。至160。。。再者,依需求而異’冷卻 我罝(21)可提供風扇或蒸汽,以調整冷卻之速率及效率。 然後、,絲狀物經過適當的導引裝置(23、25、27)及捲取裝 (以獲得本發明之低介電常數環稀烴共聚物纖維。^ 敕纖’例如為導絲輪(23、25、27),其作用主細周 力等。於炼融纺絲裝置(100)中’依需求而異,可 °又夕數導引裝置,該等導引裝置可加溫或為室溫,以使纖維 之張力調整至期望之狀態 [低介電常數環烯烴共聚物纖維] 置⑽)製備之低介電常數環 實例1 以 ΗΞΗΗ== ㈣,栋祕;後错由纺絲泵(1、u)進行供給量 中。於炫5虫梦‘7^1 吏用量以98:2比例供給至溶融裝置(17) ’崎壓該環烯烴共聚物及聚烯烴, 15 孔^之纺射ί ί Ϊ溫度為32(rc。使該炫體通過具有〇·2職 η οΓ、I4孔喷出’以形成絲狀物。使該絲狀物通過回火裝置 ^度為WC。使該絲狀物通過冷卻裝置(21),冷卻 使該絲狀物經過適#的導5丨裝置(23、25、W g取4置(29) ’以獲得環烯烴共聚物纖維。以_觀察纺絲: 實例2 20 重複實例1之步驟及條件,但是使用不同的 =度,回火溫度為彻。c,冷卻溫度為1眺。獲 共聚物纖維,以肉眼觀察紡絲結果。 二 實例3 、重複實例1之步驟及條件,但是使用不同的回火溫戶 卻溫度,回火溫度為3〇〇。。,冷卻溫度為刚。。。獲得^ : 共聚物纖維,以肉眼觀察紡絲結果。 、" 實例4 10 25 Μ,%,複實例i之步驟及條件,但是使用不同的回火溫度和冷 回火溫度為3(KrC,冷卻溫度為。獲得環烯烴 八♦物纖維,以肉眼觀察紡絲結果。 上匕較你》[ I 9爿重里份之裱烯烴共聚物之原料母粒(商品名TOPAS®) 之聚稀烴之原料母粒分別加入餵料槽(3、13)中, fH/5、15)擠壓之後’藉由纺絲系(1、U)進行供給量 ί。於㈣Ϊ原料的使用量以98 : 2比例供給至炼融裝置(17) 以來置(17)中炫融龍該環烯烴共聚物及聚烯烴, if,縣溫度為320t。使該溶體通過具有〇.2麵 ㈣出,以軸絲物。使賴狀物通過回火裝置 溫卢為宮、、^2GGP。使該雜物通過冷卻裝置(21),冷卻 C。使該絲狀物經過適當的導引裝置(23、25、 絲結果 i if取麵29),謂得輯烴共聚物纖維。以肉眼觀察纺 實例1至4與比較例之製程條件及紡絲結果係整理於表】 表1 :Weig) ° & Saki touch annihilation secrets mixed with mixed ages in one whole? The molecular weight of the alkene can control its compatibility. In addition, the south of the y knife of the polythene hydrocarbon may cause the dielectric constant of the fiber to be unfavorably high. Polyhydrocarbon refers to all polymers composed of C and hydrazine. In one embodiment of the present invention, the polyolefin is selected from the group consisting of: polyene, poly, polyamine, and in some preferred embodiments of the present invention, the poly is agglomerated * preferably implemented For example, the delay quench is used to smelt, carry the process temperature, and record the temperature. c to 3 耽, tempering two to 3 ° ° C 'and cooling temperature of 10 (rC to 16 (fC. delay ΐΐ, can avoid the formation of crystallization of cyclomethine copolymer in the process of forming fibers) a method of breaking. The method of "a low-dielectric constant cycloolefin copolymer fiber pile" comprises the following steps: (a) adding a ring-smoke copolymer and a polyolefin from a feed tank, Juicy smoke accounts for 1 to 7.5 wt%; (b) 炫融_ The ring is a total of (4) and hydrocarbons, with a shaft-solution, the melting temperature is 300. 〇 to 320. 〇; (0 = the body passes Spinning holes having a specific pore diameter are ejected to form a squirrel, (d) = filaments are passed through a tempering device, and the tempering temperature is · c to (6) = filament passing-cooling device The cooling temperature is as follows: 0 to MOC; and ω = the feed passes through the light material device and the cyclic olefin copolymer fiber. n ^ based on the weight of the weaving dimension, the molecular weight of the far polyolefin is in some of the present invention In the preferred embodiment, the polyolefin is 2 to 5% by weight. In some preferred embodiments of the invention, 200,000 to 250, 〇〇〇 MW. In some preferred embodiments, the poly-dimer, poly-, poly-, money, and mixtures thereof. In the preferred embodiment, the polyolefin is polypropylene or polyethylene. According to still another aspect of the invention, a slab for a printed circuit board comprises an insulating resin and a woven fabric, and the woven fabric is reinforced by a low dielectric constant cycloolefin copolymer fiber. In some preferred embodiments of the present invention, the insulating resin is a triterpene resin, a bismaleimine triazine resin, a polytetrafluoroethylene resin, and a mj compound. Embodiments of the present invention The functions, features, and advantages of the present invention will be further understood from the following description of the preferred embodiments of the present invention. First, the melt spinning of the cyclic olefin copolymer fibers of the present invention will be described by way of FIG. Silk Process '1 is a spur spinning device for producing the low dielectric constant ring-diffuse copolymer fiber of the present invention. Referring to Figure 1, the melt spinning device (100) comprises: a spinning pump (1, n), Feeding Cao (3, 13), extruder (5, 15), melting device (17), tempering device (19) Cooling device (21), wire feeding wheel (23, 25, 27), and coiler (29). The raw material of the raw material of the cyclic olefin copolymer and the raw material of the polyolefin are respectively added to the feeding tank (3, In 13), after being pressed by the extruder (5, 15), the supply amount is controlled by the spinning pump (1, 11), and the amount of the two raw materials used is supplied to the melting device in an appropriate ratio (17). The raw material masterbatch of the cyclic olefin copolymer 8 is selected from the trans-hydrocarbon (4) sold by Ti_ Company under the trade name of TOPAS®, and its molecular weight is about 8 〇 to 150,000 Mw (weight average molecular weight; ―café averaged) M〇iecuiar is called. The olefinic raw material masterbatch is selected from the group consisting of polyene, polyester, polyamide, nylon, and mixtures thereof. More polypropylene wire is thinner. For example, the merchandise sold by Taihua Company can be selected to have a molecular weight of about 100,000 to 300,000 Mw. In the marshaling device (17), the lysine copolymer is subjected to polymerization at a high temperature, and the polyolefin is mixed into the cyclic olefin copolymer during the polymerization to form a copolymer of the copolymer and the hydrocarbon. Body (composition). The temperature of the hiding device (Π) is controlled above the melting point of the two raw materials, preferably from 兕^^ to 32〇. -= below the smelting device (17), with a plurality of spinnerettes (not shown) 'W# hydrocarbon copolymer and polyolefin melt (composition) after being passed through the spinning hole, extruded Molding to form a filament of a cyclic olefin copolymer. Among them, depending on the thickness of the final fiber, the _ hole may have a plurality of different pore sizes, for example, 〇·2 mm to 0.25 mm. The filament of the w-cycloolefin copolymer then enters the tempering device (19), and by the tempering = control, the filament of the cycloolefin filament can be gradually returned from the high temperature heterogeneous state, k to the solid state. The tempering temperature is preferably controlled from 280 ° C to 300 ° C. The cycloolefin-touched filaments are then placed in a cooling device (9), cooled by the control of 'straight two! The filament of the cyclic olefin copolymer is cooled at an appropriate rate, and because the sudden temperature change is too rapid, the filament breakage is preferably '1'. . To 160. . . Furthermore, depending on the needs of the 'cooling' we (21) can provide fans or steam to adjust the cooling rate and efficiency. Then, the filaments are passed through appropriate guiding means (23, 25, 27) and coiled (to obtain the low dielectric constant ring-diffuse copolymer fiber of the present invention. ^ 敕 fiber' such as a godet ( 23, 25, 27), the role of the main fine force, etc. In the refining spinning device (100) 'depending on the needs, can be ° and the number of guiding devices, these guiding devices can be warmed or Room temperature, in order to adjust the tension of the fiber to the desired state [low dielectric constant cycloolefin copolymer fiber] (10)) Preparation of low dielectric constant ring Example 1 with ΗΞΗΗ == (four), the secret; The pump (1, u) is supplied in the amount. Yu Xuan 5 Insects '7^1 吏 is supplied to the melting device at a ratio of 98:2 (17) 'Saki-pressed the cyclic olefin copolymer and polyolefin, 15 holes ^ spinning ί ί Ϊ temperature is 32 (rc. The glaze is ejected by having a η·2 η ο Γ, I4 hole to form a filament. The filament is passed through a tempering device to a degree of WC. The filament is passed through a cooling device (21), Cooling the filaments through a suitable 5 丨 device (23, 25, W g 4 (29) ' to obtain a cyclic olefin copolymer fiber. To observe the spinning: Example 2 20 Repeat the steps of Example 1. And conditions, but using different = degree, the tempering temperature is complete. c, the cooling temperature is 1 眺. The copolymer fiber is obtained, and the spinning result is observed with the naked eye. Second example 3, the steps and conditions of the example 1 are repeated, but the use Different tempering temperature households have temperature, tempering temperature is 3 〇〇., cooling temperature is just... get ^: copolymer fiber, observe the spinning result with the naked eye. , " Example 4 10 25 Μ,% , the steps and conditions of the example i, but using different tempering temperatures and cold tempering temperature of 3 (KrC, cooling temperature is obtained. The fiber is observed by the naked eye. The raw material of the raw material of the raw material masterbatch (trade name: TOPAS®) of the yttrium olefin copolymer is added to the feed tank. 3, 13), after fH/5, 15) extrusion, 'supply amount 1、 by spinning system (1, U). (4) 使用 raw material usage amount is supplied to the smelting device in a ratio of 98: 2 (17) Since the (17) Zhongxuan Ronglong the cyclic olefin copolymer and polyolefin, if, the county temperature is 320t. The solution is passed through the 〇.2 surface (four) out to the shaft material. The device is warm, and the device is passed through the cooling device (21) to cool the C. The wire is passed through appropriate guiding devices (23, 25, silk results i if face 29), The hydrocarbon copolymer fibers were obtained. The process conditions of the spinning examples 1 to 4 and the comparative examples and the spinning results were visually observed in the table] Table 1:

—1 炫融溫度(°c) 回火溫度(°c) 冷卻溫度(°c) 会方终、结果 實例1 320 280 100 Λ 實例2 320 280 120 Δλ Λ 實例3 320 300 -------- 140 L -Λ D 實例4 320 300 一 ----- 160 〇 比較例 320 200 —------ 1 ——25 -------- X v 、,叫、七研',X :不能紡絲。 ^例i至4與比較例之實驗結果可知,本__ _ 冷部(delay qUench)的方式,可使環烯烴共 之溶體狀態,逐漸地回到固態,並以適當的物 [印刷電路板用的樹脂基板] ‘:=====印刷 tA5 虚量份環烯烴共聚物之原料母粒(商品名T0PAS<8>) 10 11 里77之聚烯經之原料母粒分別加入傲料槽(3、13)中, 、’坐過擠廢機(5、15)擠壓之德與由软絲 押制,姑am π . 之俊错由紡絲泵(1、U)進行供給量 ί。於这替ί料的使用量以98 : 2比例供給至溶融裝置(17) 以开〇7)中’·擠壓該環稀煙共聚物及聚婦烴, /成炫體’溶融溫度為32(rc。使該雜通過具有〇2疆 15 ^之纺絲孔噴出,以形成絲狀物。使該絲狀物通過回火裝置 溫度為WC。使該絲狀物通過冷卻裝置(21),冷卻 Γ^ί壯C。使該絲狀物經過適當的導引裝置(23、25、27) 及捲取扁置(29),以獲得環烯烴共聚物纖維。 20 紡成絲之後的環烯烴共聚物纖維,接著進行上漿及去喂等 ^巧,形成織物形式的織物增強件之後,加入環氧樹脂,^形 f絕緣材料層’紐,藉著黏合多層絕緣材料以形成樹脂基 扳,之後藉由熱壓將銅箔附著於樹脂基板之一側表面,以形成 用於量測介電常數(Dk)值之覆銅層壓板。 使用IPC 2.5.5.9所規範之標準測試方法量測介電當數①让) 值,測得的介電常數(Dk)值為2.5(@1 GHz)。 t #(Dk) 實例6 重複實例5之步驟及紡絲條件,但是使用不同比例的環稀 炫共聚物與聚烯烴。環烯烴共聚物:聚烯烴=95 : 5。依與實例 12 25 ^之職方法輯,稱的介電常數㈣值為 GHz) 〇 3.6(@1—1 亮融温度(°c) tempering temperature (°c) Cooling temperature (°c) will end, result example 1 320 280 100 Λ Example 2 320 280 120 Δλ Λ Example 3 320 300 ------ -- 140 L -Λ D Example 4 320 300 一----- 160 〇Comparative Example 320 200 —------ 1 ——25 -------- X v ,,叫,七研', X: Can't be spun. ^Examples i to 4 and the experimental results of the comparative examples show that the __ _ cold part (delay qUench) can make the cyclic olefins in a solution state, gradually return to the solid state, and appropriate materials [printed circuit Resin substrate for board] ':=====Printing tA5 Raw material masterbatch of virgin cycloolefin copolymer (trade name T0PAS<8>) 10 11 The raw material of the polyolefin of 77 is added to the raw material. In the trough (3, 13), the 'squeezing of the crushing machine (5, 15) is forced by the soft wire, and the hammer is supplied by the spinning pump (1, U). ί. The amount of the material used is supplied to the melting device (17) in a ratio of 98:2 to open the crucible and the polystyrene in the opening 7), and the melting temperature is 32. (rc. The waste is ejected through a spinning hole having a diameter of 15 , to form a filament. The filament is passed through a tempering device at a temperature of WC. The filament is passed through a cooling device (21), Cooling ί ^ 壮 C. The filaments are passed through appropriate guiding means (23, 25, 27) and coiled flat (29) to obtain a cyclic olefin copolymer fiber. 20 Cycloolefin after spinning into a filament The copolymer fiber, followed by sizing and de-feeding, to form a fabric reinforcement in the form of a fabric, adding an epoxy resin, a layer of insulating material, to form a resin matrix by bonding a plurality of layers of insulating material. Thereafter, the copper foil is attached to one side surface of the resin substrate by hot pressing to form a copper clad laminate for measuring a dielectric constant (Dk) value. The standard test method specified in IPC 2.5.5.9 is used for measurement and measurement. The electrical value is 1 and the measured dielectric constant (Dk) is 2.5 (@1 GHz). t #(Dk) Example 6 The procedure of Example 5 and the spinning conditions were repeated, but using different proportions of the ring-diffusing copolymer and polyolefin. Cyclic olefin copolymer: polyolefin = 95: 5. According to the example 12 25 ^ job method, the dielectric constant (four) is called GHz) 〇 3.6 (@1

tM 烴共步ΐ5ϊ:ΐ: ’但是使用不_的_ 實似< 婶 烯共聚物:聚烯烴=92.5:7.5。依與 GHz)。目5之測试方法測試測得的介電常數(Dk)值為4.8卿 tM8 10 炉5之步驟及纺絲條件’但是使用不同比例的環稀 ϋ物與聚烯烴。環_共聚物:聚烯烴=9G: 1G。依與實 GHz)相同之測試方法測試,測得的介f常數(Dk)值為8·4(@1 ΜΜΜ 15 之玻璃纖維基板,依與實例5相同之測試方法測試, 測传的介電常數(Dk)值為46〜4 8(@1 GHz)。 果係與對照例之製程條件及介電常數(Dk)值量測結 表2 : 纖維中之環烯 fe共聚物之重 量份 纖維中之聚烯 烴之重量份 玻璃纖維之重 量份 Dk值 (@1 GHz)The tM hydrocarbon is a total of 5 ϊ: ΐ: ‘but _ _ 实 实 实 实 聚烯烃 婶 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃 聚烯烃. According to GHz). The test method for the test method of the test 5 has a dielectric constant (Dk) value of 4.8 qing tM8 10 furnace 5 and spinning conditions' but using different proportions of ring slag and polyolefin. Ring copolymer: polyolefin = 9G: 1G. Tested according to the same test method as real GHz, the measured f-constant value (Dk) value is 8.4 (@1 ΜΜΜ 15 glass fiber substrate, tested according to the same test method as in Example 5, measured dielectric The constant (Dk) value is 46 to 4 8 (@1 GHz). The process conditions and dielectric constant (Dk) values of the fruit and the control are measured. Table 2: The weight of the cycloolefin copolymer in the fiber The weight of the polyolefin in the weight of the glass fiber Dk value (@1 GHz)

13 1352559 表2的結果’介電常數⑽)值隨 曰 份增加,略有增加的趨勢。因此,雖 ^ f 之實例可被錢。此等均等變化對於,ί習此 技藝者來說是顯而易見的。 …'為此13 1352559 The results of Table 2 'dielectric constant (10)) increased slightly with the increase of 曰, a slight increase trend. Therefore, although the instance of ^ f can be used for money. Such equal changes are obvious to those skilled in the art. …'to this end

一再者,影響樹脂基板之介電常數(Dk)值的因素,除了聚 烴之添加量之外,射其他时,例如所加人之職樹脂的介 電常數(Dk)值以縣婦烴本身的介電常數(Dk)值等,在實際應 用f面’可以選擇介電常數(Dk)值較低的絕緣樹脂,亦或調整 聚烯烴之分子量,關整最後獅烴共聚物麟製成樹脂基板 15 的介電常數(Dk)值。此等均等變化對於熟習此技藝者來說是顯 而易見的。 除了介電常數(Dk)值之外,本發明實例5之環烯烴共聚物 纖維製成樹脂基板之後’亦進行吸水性、尺寸安定性、絕緣性、 玻璃轉移溫度等量測,其結果相較於印刷電路基板的規格,整 理於表3。Again, the factor affecting the dielectric constant (Dk) value of the resin substrate, in addition to the addition amount of the polyhydrocarbon, when other is applied, for example, the dielectric constant (Dk) value of the resin of the added person is the county hydrocarbon itself. The dielectric constant (Dk) value, etc., in the actual application of the f-face 'can select the dielectric resin with a lower dielectric constant (Dk) value, or adjust the molecular weight of the polyolefin, and close the final lion hydrocarbon copolymer to form a resin. The dielectric constant (Dk) value of the substrate 15. Such equal variations are readily apparent to those skilled in the art. In addition to the dielectric constant (Dk) value, after the cyclic olefin copolymer fiber of Example 5 of the present invention was formed into a resin substrate, the water absorption, dimensional stability, insulation, glass transition temperature, and the like were also measured, and the results were compared. The specifications of the printed circuit board are summarized in Table 3.

1414

表3 :table 3 :

〇.優於規格;△:相當於規格。 縣之可知’相較於習知以玻璃纖維製成的印刷電 5〇. Better than specifications; △: equivalent to specifications. It is known from the county that compared to the conventional printed electricity made of glass fiber 5

%吊數;|穿、吸水率、熱應力、及玻璃 iii於印刷電路基板規格的結果,在介電損耗、線性ΐ膨脹 係數方面财相當於印刷電路絲規格的結果。·、、、、 在80°C至18〇。匚 將纖維放在熱水 短的長度占原來 此外,針對實例5 ' 6、8之COC纖維, 分別進行熱水收縮率的試驗。熱水收縮率係指 中處理30分鐘,暗乾後,量測加熱後纖維縮 長度的百分率。其結果整理於表4。 10 表4 : 140°C 熱 水收縮 8〇°C 熱 水收縮 率(%) 1〇〇〇c 熱 水收縮 £(%) 160°C 熱 水收縮 率(%) 180°C 熱 水收縮 率(%)% hangs; |wear, water absorption, thermal stress, and glass iii. As a result of printed circuit board specifications, the dielectric loss and linear ΐ expansion coefficient are equivalent to the results of printed circuit wire specifications. ·, ,,, at 80 ° C to 18 〇.匚 Put the fiber in the hot water for a short length. In addition, the COC fiber of Example 5'6, 8 was tested for hot water shrinkage. The hot water shrinkage rate refers to the percentage of the fiber shrinkage length after heating for 30 minutes and after drying. The results are summarized in Table 4. 10 Table 4: 140°C hot water shrinkage 8〇°C hot water shrinkage rate (%) 1〇〇〇c hot water shrinkage £ (%) 160°C hot water shrinkage rate (%) 180°C hot water shrinkage rate (%)

I ft之結果可知,實例5、6之CC)C纖維之熱水收縮率 120〇C 熱 水收縮 率'仍』轉移溫mTg)178°C之情況下,熱水收縮 ffl 表示紡絲成形過程中,未受到較大的抽伸作 應力小,有驗提供驗_基板後的 量密ϋΐίίΓ明實例5製成之纖維布與玻璃纖維布的質 纏維八^組直^10.2 mm之實例5之纖維與直徑0.2 mm之玻璃 璃纖同t之實例5製成之纖維布與玻 产約為34 V / 3二一重里。只驗結果顯不,玻璃纖維布的密 ΐί Γ :5=::二(Ϊ2 r 基; 為對以下,:巧:使用以圖式 這些用語並不是_性和絕_。打,敎摘性的文字。 用已利用上述之較佳之實例詳細揭示,然其並非 和範圍内可χ作各ί 技藝者,在不脫離本發明之精神 作後附之申糊範此綱刪範圍當視 16 1352559 【圖式簡單說明】 圖1係用於製作本發明之低介電常數環烯烴共聚物纖維 的熔融紡絲裝置。 【主要元件符號說明】 10The results of I ft show that the hot water shrinkage rate of the C) fiber of Example 5 and 6 is 120 〇 C. The hot water shrinkage rate is still 'transfer temperature mTg) 178 ° C, the hot water shrinkage ffl indicates the spinning forming process. In the middle, the stress is not affected by the large drawing, and the test is provided. The amount of the substrate is ϋΐ Γ Γ Γ Γ 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例 实例The fiber cloth and the glass fiber produced in Example 5 of the fiber and the diameter of 0.2 mm of the glass fiber were about 34 V / 3 two-fold. The result of the test is not obvious. The denseness of the fiberglass cloth Γ :5=::2 (Ϊ2 r base; for the following,: Q: The use of the words is not _ sex and _ _. The detailed description of the preferred embodiments of the present invention is not intended to be limited to the scope of the invention, and the scope of the invention is as follows: 16 1352559 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a melt spinning apparatus for producing a low dielectric constant cyclic olefin copolymer fiber of the present invention.

15 1 ' 11 3、13 5 ' 15 17 19 21 23 ' 29 100 25、27 紡絲泵 餵料槽 擠壓機 熔融裝置 回火裝置 冷卻裝置 送絲輪、導引裝置 捲取機、捲取裝置 熔融紡絲裝置15 1 ' 11 3,13 5 ' 15 17 19 21 23 ' 29 100 25,27 Spinning pump feed trough extruder Melting device tempering device Cooling device Feeding wheel, guiding device coiler, take-up device Melt spinning device

1717

Claims (1)

1352559 七、申請專利範圍: 1.,低介電常數之環烯料聚物麟,其 核烯烴共聚物;及 烴j以纖維之重量為基準,佔1至7.5重量% ; i it^融紡絲製程之延遲冷卻,該聚烯烴係使該環烯 子鏈糾結’但不形成結晶’以獲得具有低於玻 肖,義維;I電常數4·6之介電常數的纖維。 2 Hi概圍第1項之低介電常數之環馳共聚物纖 μ八中,以纖維之重量為基準,該聚烯烴係佔2至5 f % 〇 3· ^申ίί利範圍第1項之低介電常數之環烯烴共聚物纖 难’具中’該聚稀烴之分子量為至細,⑻〇論。 4. ^申她圍第1項之低介電常數之輯烴共聚物纖 聚烯烴係選自:聚烯、聚醋、聚》、尼龍、 及具混合物。 5' 第4項之低數之環烯烴共聚物纖 維,其中,s亥聚烯為聚丙烯或聚乙烯。 6. 項之低介電常數之環稀烴共聚物纖 i 控獅融纺絲製程溫度,溶融溫度 為300C至320C,回火溫度為280〇c至3 溫度為100°C至160。(:。 常數之環烯烴共聚物纖維之製造方法,其係包 ⑻由艘料槽加入環烯烴共聚物及聚歸烴,該聚稀煙佔i 18 1352559 至7.5重量% ; (b) 炼融擠壓該環烯烴共聚物及聚烯烴,以形成一熔體, 炫融溫度為300°C至320°C ; (c) 使該炫體通過具有特定孔徑之紡絲孔喷出,以形成一 絲狀物; (d) 使該絲狀物通過一回火裝置,回火溫度為280。〇至 30〇t ; (e) 使該絲狀物通過一冷卻裝置,冷卻溫度為i〇〇〇c至 160°C ;以及 (f) 使該絲狀物經過適當的導引裝置及捲取裝置,以獲得 環烯烴共聚物纖維。 8. 如申請專利範圍第7項之製造方法,其中,以纖維之重量 為基準,該聚稀烴係佔2至5重量%。 9. 如申請專利範圍第7項之製造方法,其中,該聚烯烴之分 子量為 20〇,〇〇〇 至 25〇,〇〇〇 Mw。 川.如申請專利範圍第7項之製造方法,其中,該聚烯烴係選 自:聚烯、聚烴、聚酯、聚醯胺、尼龍、及其混合物。 U.如申請專利範圍第10項之製造方法,其中,該聚烯為聚丙 錄或聚乙烯。 U· —種印刷電路板用的樹脂基板’其係包含一絕緣樹脂與一 織物增強件,該織物增強件係由申請專利範圍第丨至5項 中任一項之低介電常數之環烯烴共聚物纖維所製成。 =申請專利範圍第12項之印刷電路板用的翻旨基板,其中 该絕緣樹脂係選自:環氧樹脂、聚苯氧樹脂、雙馬來醯亞 19 13 1352559 胺三嗪樹脂、聚四氟乙烯樹脂、及其混合物。1352559 VII. Patent application scope: 1. The low dielectric constant cycloolefin polymer rib, its nuclear olefin copolymer; and hydrocarbon j based on the weight of the fiber, accounting for 1 to 7.5% by weight; i it^ Delayed cooling of the silk process, the polyolefin entangles the ring olefin chain 'but does not form a crystal' to obtain a fiber having a dielectric constant lower than that of the glass, I, and 4. 2 Hi is the lowest dielectric constant of the ring-like copolymer fiber in the first item, based on the weight of the fiber, the polyolefin system accounts for 2 to 5 f % 〇3· ^申ίίί range 1 The low dielectric constant of the cyclic olefin copolymer fiber is difficult to have the molecular weight of the polythene hydrocarbon to be fine, (8) paradox. 4. The base of the low dielectric constant of the hydrocarbon copolymer fiber of the first item is selected from the group consisting of polyene, polyester, poly, nylon, and mixtures. 5' The lower number of cyclic olefin copolymer fibers of item 4, wherein the s-heteropolyene is polypropylene or polyethylene. 6. The low dielectric constant of the ring-diffuse copolymer fiber i The temperature of the lion-spun spinning process is 300C to 320C, the tempering temperature is 280〇c to 3, and the temperature is 100°C to 160°. (: A method for producing a constant cyclic olefin copolymer fiber, wherein the package (8) is added to a cyclic olefin copolymer and a poly-hydrocarbon by a tank, and the poly-smoke accounts for i 18 1352559 to 7.5% by weight; (b) smelting Extruding the cyclic olefin copolymer and polyolefin to form a melt having a smelting temperature of 300 ° C to 320 ° C; (c) ejecting the glare through a spinning hole having a specific pore diameter to form a filament (d) passing the filament through a tempering device at a tempering temperature of 280 〇 to 30 〇t; (e) passing the filament through a cooling device at a cooling temperature of i〇〇〇c And (f) passing the filament through a suitable guiding device and a winding device to obtain a cyclic olefin copolymer fiber. 8. The manufacturing method according to claim 7, wherein the fiber is made of fiber The poly-hydrocarbon system is 2 to 5% by weight based on the weight of the polymer. The method of claim 7, wherein the polyolefin has a molecular weight of 20 〇, 〇〇〇 to 25 〇, 〇〇 The manufacturing method of claim 7, wherein the polyolefin is selected from the group consisting of polyenes and polyhydrocarbons. The polyester, polyamine, nylon, and a mixture thereof. The method of claim 10, wherein the polyene is a polypropylene or polyethylene. U. A resin substrate for a printed circuit board. 'Equipped with an insulating resin and a fabric reinforcement made of a low dielectric constant cycloolefin copolymer fiber according to any one of claims 5 to 5. Item 12: The substrate for a printed circuit board, wherein the insulating resin is selected from the group consisting of epoxy resin, polyphenylene oxide resin, double Malayan 19 13 1352559 amine triazine resin, polytetrafluoroethylene resin, and Its mixture. 2020
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