TWI351217B - Imageing module - Google Patents

Imageing module

Info

Publication number
TWI351217B
TWI351217B TW096115000A TW96115000A TWI351217B TW I351217 B TWI351217 B TW I351217B TW 096115000 A TW096115000 A TW 096115000A TW 96115000 A TW96115000 A TW 96115000A TW I351217 B TWI351217 B TW I351217B
Authority
TW
Taiwan
Prior art keywords
imageing
module
imageing module
Prior art date
Application number
TW096115000A
Other languages
Chinese (zh)
Other versions
TW200843495A (en
Inventor
ying cheng Wu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW096115000A priority Critical patent/TWI351217B/en
Publication of TW200843495A publication Critical patent/TW200843495A/en
Application granted granted Critical
Publication of TWI351217B publication Critical patent/TWI351217B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
TW096115000A 2007-04-27 2007-04-27 Imageing module TWI351217B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096115000A TWI351217B (en) 2007-04-27 2007-04-27 Imageing module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096115000A TWI351217B (en) 2007-04-27 2007-04-27 Imageing module

Publications (2)

Publication Number Publication Date
TW200843495A TW200843495A (en) 2008-11-01
TWI351217B true TWI351217B (en) 2011-10-21

Family

ID=44822297

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096115000A TWI351217B (en) 2007-04-27 2007-04-27 Imageing module

Country Status (1)

Country Link
TW (1) TWI351217B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425825B (en) * 2009-12-31 2014-02-01 Kingpak Tech Inc Image sensor package structure with predetermined focus

Also Published As

Publication number Publication date
TW200843495A (en) 2008-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees