TWI350137B - Circuit board structure and method thereof - Google Patents

Circuit board structure and method thereof

Info

Publication number
TWI350137B
TWI350137B TW096122847A TW96122847A TWI350137B TW I350137 B TWI350137 B TW I350137B TW 096122847 A TW096122847 A TW 096122847A TW 96122847 A TW96122847 A TW 96122847A TW I350137 B TWI350137 B TW I350137B
Authority
TW
Taiwan
Prior art keywords
circuit board
board structure
circuit
board
Prior art date
Application number
TW096122847A
Other languages
Chinese (zh)
Other versions
TW200901846A (en
Inventor
Chao Wen Shih
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW096122847A priority Critical patent/TWI350137B/en
Publication of TW200901846A publication Critical patent/TW200901846A/en
Application granted granted Critical
Publication of TWI350137B publication Critical patent/TWI350137B/en

Links

TW096122847A 2007-06-25 2007-06-25 Circuit board structure and method thereof TWI350137B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096122847A TWI350137B (en) 2007-06-25 2007-06-25 Circuit board structure and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096122847A TWI350137B (en) 2007-06-25 2007-06-25 Circuit board structure and method thereof

Publications (2)

Publication Number Publication Date
TW200901846A TW200901846A (en) 2009-01-01
TWI350137B true TWI350137B (en) 2011-10-01

Family

ID=44721754

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096122847A TWI350137B (en) 2007-06-25 2007-06-25 Circuit board structure and method thereof

Country Status (1)

Country Link
TW (1) TWI350137B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418265B (en) * 2011-05-13 2013-12-01 Unimicron Technology Corp Package structure and method of making same
TWI727651B (en) * 2020-02-10 2021-05-11 仁寶電腦工業股份有限公司 Multilayer circuit board
CN118676109A (en) * 2024-08-21 2024-09-20 芯爱科技(南京)有限公司 Package substrate and method for fabricating the same

Also Published As

Publication number Publication date
TW200901846A (en) 2009-01-01

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