TWI349962B - Sawing method for a semiconductor element with a microelectromechanical system - Google Patents

Sawing method for a semiconductor element with a microelectromechanical system

Info

Publication number
TWI349962B
TWI349962B TW096129740A TW96129740A TWI349962B TW I349962 B TWI349962 B TW I349962B TW 096129740 A TW096129740 A TW 096129740A TW 96129740 A TW96129740 A TW 96129740A TW I349962 B TWI349962 B TW I349962B
Authority
TW
Taiwan
Prior art keywords
semiconductor element
microelectromechanical system
sawing method
sawing
microelectromechanical
Prior art date
Application number
TW096129740A
Other languages
English (en)
Other versions
TW200908116A (en
Inventor
Wei Min Hsiao
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW096129740A priority Critical patent/TWI349962B/zh
Priority to US12/051,896 priority patent/US7674688B2/en
Publication of TW200908116A publication Critical patent/TW200908116A/zh
Application granted granted Critical
Publication of TWI349962B publication Critical patent/TWI349962B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
TW096129740A 2007-08-10 2007-08-10 Sawing method for a semiconductor element with a microelectromechanical system TWI349962B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096129740A TWI349962B (en) 2007-08-10 2007-08-10 Sawing method for a semiconductor element with a microelectromechanical system
US12/051,896 US7674688B2 (en) 2007-08-10 2008-03-20 Sawing method for a semiconductor element with a microelectromechanical system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096129740A TWI349962B (en) 2007-08-10 2007-08-10 Sawing method for a semiconductor element with a microelectromechanical system

Publications (2)

Publication Number Publication Date
TW200908116A TW200908116A (en) 2009-02-16
TWI349962B true TWI349962B (en) 2011-10-01

Family

ID=40346933

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096129740A TWI349962B (en) 2007-08-10 2007-08-10 Sawing method for a semiconductor element with a microelectromechanical system

Country Status (2)

Country Link
US (1) US7674688B2 (zh)
TW (1) TWI349962B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109081301A (zh) * 2018-08-09 2018-12-25 烟台睿创微纳技术股份有限公司 一种mems晶圆切割方法
CN112366170A (zh) * 2020-11-25 2021-02-12 绍兴同芯成集成电路有限公司 一种晶圆切割工艺与玻璃载板
CN112492490A (zh) * 2020-12-22 2021-03-12 苏州敏芯微电子技术股份有限公司 Mems器件与mems麦克风的制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4051884B2 (ja) * 1999-03-31 2008-02-27 セイコーエプソン株式会社 半導体装置の製造方法、狭ピッチ用コネクタ、静電アクチュエータ、圧電アクチュエータ、インクジェットヘッド、インクジェットプリンタ、マイクロマシン、液晶装置、電子機器
TWI241674B (en) * 2001-11-30 2005-10-11 Disco Corp Manufacturing method of semiconductor chip
TWI222173B (en) * 2003-08-20 2004-10-11 Advanced Semiconductor Eng Method of making a package structure by dicing a wafer from the backside surface thereof
US20050064683A1 (en) * 2003-09-19 2005-03-24 Farnworth Warren M. Method and apparatus for supporting wafers for die singulation and subsequent handling
US20050126686A1 (en) * 2003-12-11 2005-06-16 Cheong Yew W. Combination back grind tape and underfill for flip chips
TWI260938B (en) * 2004-10-01 2006-08-21 Ind Tech Res Inst Dynamic pressure sensing structure

Also Published As

Publication number Publication date
TW200908116A (en) 2009-02-16
US7674688B2 (en) 2010-03-09
US20090042367A1 (en) 2009-02-12

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