TWI349517B - - Google Patents

Info

Publication number
TWI349517B
TWI349517B TW096129477A TW96129477A TWI349517B TW I349517 B TWI349517 B TW I349517B TW 096129477 A TW096129477 A TW 096129477A TW 96129477 A TW96129477 A TW 96129477A TW I349517 B TWI349517 B TW I349517B
Authority
TW
Taiwan
Application number
TW096129477A
Other versions
TW200814918A (en
Inventor
Dong Kwon Kim
Tae Young Kim
Sung Jin Kim
Original Assignee
Korea Advanced Inst Sci & Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Advanced Inst Sci & Tech filed Critical Korea Advanced Inst Sci & Tech
Publication of TW200814918A publication Critical patent/TW200814918A/zh
Application granted granted Critical
Publication of TWI349517B publication Critical patent/TWI349517B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F5/00—Elements specially adapted for movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW096129477A 2006-08-10 2007-08-09 Installation fins and installation structure of fins and a heat sink with moving fins inserted between cooling fins TW200814918A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060075721A KR100743268B1 (ko) 2006-08-10 2006-08-10 방열핀과 방열핀의 배치구조 및 고정된 핀 사이의 공간에 움직이는 핀을 삽입한 히트싱크
PCT/KR2007/003761 WO2008018723A1 (en) 2006-08-10 2007-08-04 Installation fins and installation structure of fins and a heat sink with moving fins inserted between cooling fins

Publications (2)

Publication Number Publication Date
TW200814918A TW200814918A (en) 2008-03-16
TWI349517B true TWI349517B (zh) 2011-09-21

Family

ID=38499698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096129477A TW200814918A (en) 2006-08-10 2007-08-09 Installation fins and installation structure of fins and a heat sink with moving fins inserted between cooling fins

Country Status (5)

Country Link
US (1) US8201616B2 (zh)
KR (1) KR100743268B1 (zh)
CN (1) CN101331817B (zh)
TW (1) TW200814918A (zh)
WO (1) WO2008018723A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7826227B2 (en) * 2008-02-13 2010-11-02 Inventec Corporation Heat dissipation device
US20100170657A1 (en) * 2009-01-06 2010-07-08 United Technologies Corporation Integrated blower diffuser-fin heat sink
CN104936422B (zh) * 2011-01-18 2017-07-11 技嘉科技股份有限公司 磁动力散热模组
US9507391B2 (en) 2011-11-28 2016-11-29 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Heat sink with orientable fins
EP3158271B1 (en) 2014-06-20 2021-09-22 Nortek Air Solutions Canada, Inc. Systems and methods for managing conditions in enclosed space
US11092349B2 (en) 2015-05-15 2021-08-17 Nortek Air Solutions Canada, Inc. Systems and methods for providing cooling to a heat load
US11143430B2 (en) 2015-05-15 2021-10-12 Nortek Air Solutions Canada, Inc. Using liquid to air membrane energy exchanger for liquid cooling
CN105032051B (zh) * 2015-07-31 2016-12-21 盐城市隆祥机械制造厂 一种能快速降温的废气处理装置
CA3010515C (en) 2016-01-08 2023-03-21 Nortek Air Solutions Canada, Inc. Integrated make-up air system in 100% air recirculation system
CN106527630A (zh) * 2016-10-14 2017-03-22 合肥星服信息科技有限责任公司 一种具有高效散热除尘结构的计算机外壳内置系统
CN107087377B (zh) 2017-04-28 2019-04-26 华为技术有限公司 散热装置、散热器、电子设备及散热控制的方法
CN109491470B (zh) * 2018-12-24 2024-06-21 南方电网科学研究院有限责任公司 一种计算机存储装置
CN114867287B (zh) * 2022-02-25 2023-11-24 太仓陶氏电气有限公司 一种上下间距调节型散热器及其工作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2834582A (en) * 1953-06-24 1958-05-13 Kablitz Richard Plate heat exchanger
US3844341A (en) * 1972-05-22 1974-10-29 Us Navy Rotatable finned heat transfer device
US5000254A (en) * 1989-06-20 1991-03-19 Digital Equipment Corporation Dynamic heat sink
US5385645A (en) * 1991-06-17 1995-01-31 Y. T. Li Engineering, Inc. Heat transfer apparatus with positive drive orbital whip rod
US5513698A (en) * 1994-06-20 1996-05-07 Paul Mueller Company Balanced drive for orbital tube whip rod heat exchanger
US5946190A (en) * 1997-08-29 1999-08-31 Hewlett-Packard Company Ducted high aspect ratio heatsink assembly
US5971061A (en) * 1998-09-21 1999-10-26 Y.T. Li Engineering, Inc. Edge-hanging orbital rod support and drive for vertical tube-type heat exchanger
JP2000228473A (ja) * 1999-02-08 2000-08-15 Showa Alum Corp 電子部品の放熱装置
KR20010009449A (ko) * 1999-07-09 2001-02-05 구자홍 공기조화기의 방열구조 및 그 제조방법
CN2501282Y (zh) * 2001-08-13 2002-07-17 聚亨企业股份有限公司 刀削式鳍片散热器
CN2672861Y (zh) * 2003-11-04 2005-01-19 技嘉科技股份有限公司 一种散热鳍片模块

Also Published As

Publication number Publication date
KR100743268B1 (ko) 2007-07-27
US8201616B2 (en) 2012-06-19
CN101331817A (zh) 2008-12-24
TW200814918A (en) 2008-03-16
CN101331817B (zh) 2012-04-25
WO2008018723A1 (en) 2008-02-14
US20090205807A1 (en) 2009-08-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees