TWI349352B - Low melting point metal thermal interface material and thermal module applied the same - Google Patents

Low melting point metal thermal interface material and thermal module applied the same

Info

Publication number
TWI349352B
TWI349352B TW096133111A TW96133111A TWI349352B TW I349352 B TWI349352 B TW I349352B TW 096133111 A TW096133111 A TW 096133111A TW 96133111 A TW96133111 A TW 96133111A TW I349352 B TWI349352 B TW I349352B
Authority
TW
Taiwan
Prior art keywords
melting point
same
low melting
point metal
interface material
Prior art date
Application number
TW096133111A
Other languages
Chinese (zh)
Other versions
TW200849517A (en
Inventor
Yuan Chang Fann
C M Chen
Jiann Jong Su
Cheng Chou Wong
Jen Dong Hwang
Fuh Yuarn Shiau
Chen Chuan Lin
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW096133111A priority Critical patent/TWI349352B/en
Publication of TW200849517A publication Critical patent/TW200849517A/en
Application granted granted Critical
Publication of TWI349352B publication Critical patent/TWI349352B/en

Links

TW096133111A 2007-06-05 2007-09-05 Low melting point metal thermal interface material and thermal module applied the same TWI349352B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096133111A TWI349352B (en) 2007-06-05 2007-09-05 Low melting point metal thermal interface material and thermal module applied the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW96120203 2007-06-05
TW096133111A TWI349352B (en) 2007-06-05 2007-09-05 Low melting point metal thermal interface material and thermal module applied the same

Publications (2)

Publication Number Publication Date
TW200849517A TW200849517A (en) 2008-12-16
TWI349352B true TWI349352B (en) 2011-09-21

Family

ID=44824170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096133111A TWI349352B (en) 2007-06-05 2007-09-05 Low melting point metal thermal interface material and thermal module applied the same

Country Status (1)

Country Link
TW (1) TWI349352B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761227B (en) * 2021-06-08 2022-04-11 遠東科技大學 Composite material manufactured by combining aluminum base material with indium-bismuth alloy and method for manufacturing the same
US11795529B1 (en) 2022-06-20 2023-10-24 Industrial Technology Research Institute Low-melting-point alloy composite material and composite material structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI726529B (en) * 2019-12-11 2021-05-01 遠東科技大學 Thinning process of indium bismuth alloy

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761227B (en) * 2021-06-08 2022-04-11 遠東科技大學 Composite material manufactured by combining aluminum base material with indium-bismuth alloy and method for manufacturing the same
US11795529B1 (en) 2022-06-20 2023-10-24 Industrial Technology Research Institute Low-melting-point alloy composite material and composite material structure

Also Published As

Publication number Publication date
TW200849517A (en) 2008-12-16

Similar Documents

Publication Publication Date Title
EP2121231A4 (en) High temperature solder materials
EP2065932A4 (en) Thermal interface structure and method for manufacturing the same
TWI372174B (en) Thermal setting type die bonding film and die-donding film
TWI370479B (en) Thermal fuse employing thermosensitive pellet
EP2178094A4 (en) Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
HK1168843A1 (en) Substituted-quinoxaline-type-piperidine compounds and the uses thereof
GB2440570A8 (en) Antenna and heat sink
EP2383236A4 (en) Glass composition and member having the same on substrate
EP2279826A4 (en) Brazing repair material and brazing repair method using the brazing repair material
EP2051054A4 (en) Bearing temperature-monitoring device and bearing device with the same
HK1150058A1 (en) Low application temperature hot melt adhesive composition and articles including the same
EP1878809A4 (en) Al-Ni-B ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME
EP2203524A4 (en) Thermal conductive polymer composite and article using the same
PL2174921T3 (en) Bonding material for honeycomb structure and honeycomb structure utilizing the material
EP2123616A4 (en) Graphite material and method for manufacturing the same
EP2181853A4 (en) Thermal recording material
EP2177546A4 (en) Resin material for optical purposes, and optical element utilizing the same
EP2197755A4 (en) Tab and can end employing the same
PL2021722T5 (en) Radiator element and cap
EP2061097A4 (en) Thermoelectric material, method for producing the same, and thermoelectric converter
PL2069701T3 (en) Cooling element
TWI349352B (en) Low melting point metal thermal interface material and thermal module applied the same
GB2452462B (en) Weld cooling
EP2069697A4 (en) Cooling element
HU0800625D0 (en) Reducing the helting point of modified moru-hightemperature solder