TWI349175B - Resistivity-controlling system for ultrapure water - Google Patents

Resistivity-controlling system for ultrapure water

Info

Publication number
TWI349175B
TWI349175B TW096109807A TW96109807A TWI349175B TW I349175 B TWI349175 B TW I349175B TW 096109807 A TW096109807 A TW 096109807A TW 96109807 A TW96109807 A TW 96109807A TW I349175 B TWI349175 B TW I349175B
Authority
TW
Taiwan
Prior art keywords
resistivity
ultrapure water
controlling system
controlling
ultrapure
Prior art date
Application number
TW096109807A
Other languages
English (en)
Other versions
TW200839472A (en
Inventor
Chin Sheng Chen
Original Assignee
Liao Lih Shen
Yeh I Ling
Wang Hsiao Pei
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liao Lih Shen, Yeh I Ling, Wang Hsiao Pei filed Critical Liao Lih Shen
Priority to TW096109807A priority Critical patent/TWI349175B/zh
Priority to KR1020080026177A priority patent/KR100972889B1/ko
Publication of TW200839472A publication Critical patent/TW200839472A/zh
Application granted granted Critical
Publication of TWI349175B publication Critical patent/TWI349175B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F21/00—Dissolving
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW096109807A 2007-03-21 2007-03-21 Resistivity-controlling system for ultrapure water TWI349175B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096109807A TWI349175B (en) 2007-03-21 2007-03-21 Resistivity-controlling system for ultrapure water
KR1020080026177A KR100972889B1 (ko) 2007-03-21 2008-03-21 저항조절시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096109807A TWI349175B (en) 2007-03-21 2007-03-21 Resistivity-controlling system for ultrapure water

Publications (2)

Publication Number Publication Date
TW200839472A TW200839472A (en) 2008-10-01
TWI349175B true TWI349175B (en) 2011-09-21

Family

ID=40025725

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109807A TWI349175B (en) 2007-03-21 2007-03-21 Resistivity-controlling system for ultrapure water

Country Status (2)

Country Link
KR (1) KR100972889B1 (zh)
TW (1) TWI349175B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI630953B (zh) * 2015-03-30 2018-08-01 上海納諾巴伯納米科技有限公司 氣體溶液的製備裝置及提高氣體在液體中溶存度的方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101342147B1 (ko) * 2012-09-06 2013-12-13 주식회사 디엠에스 세정액 공급장치
KR102303107B1 (ko) * 2020-03-31 2021-09-16 주식회사 디엠에스 이산화탄소 용해모듈 및 이를 포함한 기판처리장치
DE102021133311A1 (de) * 2021-12-15 2023-06-15 Burkert Singapore Pte Ltd Verfahren und Vorrichtung zur kontinuierlichen Herstellung von Reinstwasser, dessen Verwendung und Einrichtung zum Schneiden von Teilen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000070887A (ja) 1998-09-03 2000-03-07 Dainippon Screen Mfg Co Ltd 炭酸ガス溶存純水供給方法及び炭酸ガス溶存純水供給ユニット並びにそれを備えた基板処理装置
KR100519391B1 (ko) * 1998-11-17 2005-12-12 다이닛뽄 잉크 앤드 케미칼즈, 인코포레이티드 이산화탄소가스를초순수에첨가하는장치및그방법
JP2004344821A (ja) 2003-05-23 2004-12-09 Nomura Micro Sci Co Ltd 超純水又は純水の帯電防止方法及び帯電防止装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI630953B (zh) * 2015-03-30 2018-08-01 上海納諾巴伯納米科技有限公司 氣體溶液的製備裝置及提高氣體在液體中溶存度的方法

Also Published As

Publication number Publication date
KR100972889B1 (ko) 2010-07-28
TW200839472A (en) 2008-10-01
KR20080086383A (ko) 2008-09-25

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